Electron beam evaporation coating device

Abstract

The utility model provides an electron beam evaporation coating device, and relates to the technical field of vacuum coating, the electron beam evaporation coating device comprises a cooling disc used for heat dissipation and a crucible used for placing an evaporation material, the cooling disc is provided with a containing groove used for placing the crucible, and therefore the stability and the effective heat dissipation function of the cooling disc are ensured. The heat conduction structures are arranged on the bottom wall of the containing groove at intervals, the bottom wall of the crucible is placed on the heat conduction structures, the crucible and / or the heat conduction structures are driven to move relatively, and therefore the contact area of the crucible and the heat conduction structures can be flexibly adjusted. The heat dissipation capacity of the crucible is adjusted by changing the contact area, and then the stability of the evaporation temperature is adjusted. According to the scheme, temperature optimization and uniform evaporation of materials in the coating process are achieved by controlling heat loss of the crucible. According to the mode of dynamically adjusting the contact area of the crucible and the heat conduction structure, the defect that the heat dissipation effect of a traditional fixing structure cannot be adjusted is overcome, and the device can achieve the optimal coating effect under different operation conditions.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vacuum coating, in particular to an electron beam evaporation coating device. BACKGROUND

[0002] Vacuum coating is a common thin film material preparation technology, the core of which is to form a solid thin film by controlling the evaporation and deposition of substances in a vacuum environment. Electron beam evaporation is a way of vacuum coating, which is a method of using an electron beam to directly heat and evaporate materials in a vacuum environment, so that the evaporated materials vaporize and transport to the substrate, and then condense on the substrate to form a thin film. In the electron beam heating device, the heated evaporated material is placed in a cooled crucible, which can avoid the local temperature of the crucible being too high, causing the crucible to melt or vaporize and contaminate the material, affecting the quality of the thin film. Therefore, the electron beam evaporation deposition method can be widely used in the preparation of high-purity thin films and conductive glass and various optical material thin films.

[0003] In the prior art, the coating efficiency is mainly improved by the following two ways: the first way is to increase the electron beam power: by increasing the power of the electron beam, the material in the crucible can quickly reach the evaporation temperature, thereby increasing the evaporation speed and coating efficiency. However, when the electron beam power is too high, the difficulty of controlling the electron beam increases, which can easily lead to uneven evaporation or excessive evaporation. In addition, the energy consumption of high-power equipment increases significantly, and the operation cost and maintenance difficulty of the equipment also increase, which limits the wide application of this method. The other way is to adjust the heat dissipation of the crucible: by designing crucibles with different contact areas, the heat exchange efficiency between the crucible and the cooling device is adjusted, thereby indirectly adjusting the evaporation temperature of the material. This method can achieve temperature control without changing the electron beam power. However, in actual operation, due to the continuity of the coating process, the crucible cannot be replaced once it enters the coating process. Therefore, this method has poor flexibility and cannot adjust the crucible according to different process requirements or material characteristics in the same coating process. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide an electron beam evaporation coating device to overcome the deficiencies in the prior art.

[0005] To achieve the above purpose, the technical solutions adopted by the embodiments of the present application are as follows:

[0006] The embodiments of the present application provide an electron beam evaporation coating device, which comprises a cooling disc and a crucible for placing evaporated materials. The cooling disc has a containing groove for placing the crucible. A heat conduction structure is arranged at the bottom wall of the containing groove. The bottom wall of the crucible is placed on the heat conduction structure. The crucible and / or the heat conduction structure are driven to move relatively to adjust the contact area between the crucible and the heat conduction structure.

[0007] Optionally, the heat-conducting structure is a plurality of first protrusions arranged in an array on the bottom wall of the accommodating groove, and the crucible includes a pot body and a plurality of second protrusions protruding from the bottom of the pot body and toward the bottom wall of the accommodating groove, the plurality of first protrusions and the plurality of second protrusions being arranged in a staggered manner.

[0008] Optionally, the first protrusion is a cuboid structure, and a top surface of the cuboid structure is perpendicular to the bottom wall of the crucible, and the crucible is driven to move relative to the first protrusion along the insertion direction.

[0009] Optionally, the side wall of the pot body has a gap with the side wall of the accommodating groove, the first protrusion is a zigzag structure, the zigzag structure has an inclined surface, and the crucible is driven to move relative to the first protrusion along the inclined surface.

[0010] Optionally, at least part of the first protrusion is driven to move toward or away from the second protrusion.

[0011] Optionally, the electron beam evaporation coating device further includes a driving assembly, the driving assembly including a driving member and a screw rod, and the driving member is drivingly connected with the crucible and / or the heat-conducting structure through the screw rod.

[0012] Optionally, a through hole is formed in the side wall and / or the bottom wall of the accommodating groove, and the screw rod is drivingly connected with the crucible and / or the heat-conducting structure through the through hole.

[0013] Optionally, the electron beam evaporation coating device further includes a driving assembly, the driving assembly being drivingly connected with the bottom wall of the pot body.

[0014] Optionally, the electron beam evaporation coating device further includes a driving assembly, the driving assembly being drivingly connected with the side wall of the pot body.

[0015] Optionally, the electron beam evaporation coating device includes a controller, the controller being electrically connected with the driving assembly.

[0016] The beneficial effects of the present application include:

[0017] The present application provides an electron beam evaporation coating device, which includes a cooling disc for heat dissipation and a crucible for placing evaporation materials, the cooling disc having an accommodating groove for placing the crucible, thereby ensuring its stability and effective heat dissipation function. A heat-conducting structure is arranged at the bottom wall of the accommodating groove, the bottom wall of the crucible is placed on the heat-conducting structure, and the crucible and / or the heat-conducting structure are driven to move relative to each other, so that the contact area between the crucible and the heat-conducting structure can be flexibly adjusted. By adjusting the contact area, the heat dissipation capacity of the crucible is adjusted, and the stability of the evaporation temperature is adjusted. By controlling the heat loss of the crucible, the temperature optimization and uniform evaporation of materials in the coating process are achieved. This way of dynamically adjusting the contact area between the crucible and the heat-conducting structure overcomes the defect that the traditional fixed structure cannot adjust the heat dissipation effect, so that the device can achieve the best coating effect under different operating conditions. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor.

[0019] Figure 1 Structure schematic diagram of the first electron beam evaporation coating device provided by the embodiments of the present application;

[0020] Figure 2 Structure schematic diagram of the second electron beam evaporation coating device provided by the embodiments of the present application;

[0021] Figure 3 Structure schematic diagram of the second electron beam evaporation coating device provided by the embodiments of the present application;

[0022] Figure 4 Structure schematic diagram of the second electron beam evaporation coating device provided by the embodiments of the present application;

[0023] Figure 5 Structure schematic diagram of the third electron beam evaporation coating device provided by the embodiments of the present application;

[0024] Figure 6 Structure schematic diagram of the third electron beam evaporation coating device provided by the embodiments of the present application.

[0025] Figures: 10-cooling disc; 20-evaporation material; 30-crucible; 31-pot body; 32-second protrusion; 40-heat conduction structure; 51-driving member; 52-screw rod; 60-controller; 70-human-computer interaction interface. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. It should be noted that each feature in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the protection scope of the present application without conflict.

[0028] It should be noted that like reference numerals and characters refer to like elements throughout the following description with like reference numerals and characters referring to like elements throughout the following description and across all drawings. It should be noted that like reference numerals and characters refer to like elements throughout the following description with like reference numerals and characters referring to like elements throughout the following description and across all drawings.

[0029] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed during use, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0030] In addition, the terms "horizontal", "vertical", and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that it is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0031] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "set", "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] The electronic beam evaporation coating device provided by the embodiment of the present application has the core design goal of optimizing the heating and evaporation process of the evaporation material 20 by effectively controlling the heat conduction efficiency between the crucible 30 and the cooling disc 10. As shown in FIG. 1, the electronic beam evaporation coating device provided by the embodiment of the present application comprises a cooling disc 10, a crucible 30, an evaporation material 20, a heating device 40, and a control device 50. Figures 1 to 6As shown, the device includes a cooling plate 10 for heat dissipation and a crucible 30 for placing the evaporation material 20. The cooling plate 10 is designed with a receiving groove for placing the crucible 30, which can provide a stable placement position for the crucible 30 and ensure that the crucible 30 can be maintained in a suitable position during the coating process. At the same time, in order to further improve the heat dissipation capacity of the device, heat conduction structures 40 are arranged at the bottom structure of the receiving groove to adjust the heat exchange efficiency between the crucible 30 and the cooling plate 10. The interval arrangement of the heat conduction structures 40 can effectively avoid the direct large-area contact between the bottom of the crucible 30 and the cooling plate 10, prevent temperature fluctuations caused by rapid heat loss, and thus help to maintain the uniformity of the evaporation material 20.

[0033] During operation, the bottom wall of the crucible 30 is directly placed on the heat conduction structure 40, so that the excess heat in the crucible 30 can be timely taken away by the cooling plate 10, preventing the crucible 30 from overheating and causing excessive evaporation or temperature runaway of the evaporation material 20. At the same time, in order to achieve fine temperature regulation, the crucible 30 and the heat conduction structure 40 are designed to be relatively movable to adjust the contact area therebetween. By adjusting the contact area, the heat exchange efficiency between the crucible 30 and the cooling plate 10 can be flexibly controlled, thereby indirectly adjusting the evaporation speed and temperature of the material in the crucible 30. This design enables the device to accurately control the evaporation process without changing the electron beam power.

[0034] In actual operation, the relative movement mode of the crucible 30 and the heat conduction structure 40 can be adjusted according to the thermal sensitivity of different materials and the specific requirements of the coating process. For example, when rapid heating is required, the contact area between the crucible 30 and the heat conduction structure 40 can be reduced to reduce the heat exchange efficiency and rapidly increase the temperature of the material in the crucible 30; conversely, when it is necessary to reduce the evaporation speed or control the stability of material evaporation, the contact area between the crucible 30 and the heat conduction structure 40 can be increased to enhance the cooling effect and avoid excessive or uneven evaporation. Through this flexible adjustment mechanism, the device can adapt to the requirements of different process conditions and improve the quality and efficiency of coating.

[0035] Overall, the electron beam evaporation coating device can significantly improve the temperature control accuracy of the entire coating process by introducing the heat conduction structure 40 between the crucible 30 and the cooling device, while reducing the complexity and cost of operation. This scheme can provide more flexible technical solutions while achieving efficient coating, and can meet multiple requirements for coating quality, efficiency and cost in different application scenarios.

[0036] Optionally, as Figures 1 to 6As shown, the heat-conducting structure 40 is an array of first protrusions arranged on the bottom wall of the accommodating groove to provide contact points with the bottom of the crucible 30, thereby optimizing the heat conduction efficiency between the crucible 30 and the cooling disc 10. The crucible 30 includes a pot body 31 and a plurality of second protrusions 32 protruding from the bottom of the pot body 31 towards the bottom wall of the accommodating groove, and the first protrusions and the second protrusions 32 are arranged in a staggered manner. The staggered arrangement of the first protrusions and the second protrusions 32 ensures that there are multiple discrete contact points between them, effectively preventing the complete fitting between the crucible 30 and the cooling disc 10. Through this dispersed contact mode, a uniform heat conduction channel can be formed, so that the heat in the crucible 30 can be more effectively transferred to the cooling disc 10, preventing the problem of local overheating or uneven heat dissipation. This heat conduction mode not only improves the overall heat dissipation efficiency, but also improves the temperature control of the evaporated material 20 in the crucible 30, thereby improving the precision and consistency of the coating process.

[0037] In addition, the staggered fitting structure greatly improves the relative stability of the crucible 30 and the cooling disc 10. Through the physical fitting of the first protrusions and the second protrusions 32, the positioning of the crucible 30 in the accommodating groove is more firm, avoiding the risk of displacement or loosening of the crucible 30 during operation due to vibration or other external forces. This stability can ensure the continuity and reliability of the coating process, and also reduce the wear and tear and the decrease of heat conduction efficiency between the crucible 30 and the accommodating groove caused by relative movement.

[0038] More importantly, the first protrusions and the second protrusions 32 can be driven to move relative to each other by external force. As the first protrusions and the second protrusions 32 move relative to each other, the contact area between them can change, thereby directly affecting the heat dissipation effect of the crucible 30. For example, when the crucible 30 needs to be quickly heated, reducing the contact area between the first protrusions and the second protrusions 32 can reduce the heat conduction efficiency, helping to maintain a higher temperature inside the crucible 30; while when it is necessary to reduce the temperature of the crucible 30 or slow down the evaporation speed of the evaporated material 20, increasing the contact area can speed up heat dissipation, ensuring that the temperature of the crucible 30 is maintained within a lower range.

[0039] Optionally, as shown in Figure 1 and Figure 2 , the first protrusions are cuboid structures arranged on the bottom wall of the accommodating groove and cooperated with the second protrusions 32 on the bottom of the crucible 30. Correspondingly, the second protrusions 32 on the bottom of the crucible 30 are also cuboid structures, and the side surfaces of the two are embedded with each other, thereby ensuring the stable heat conduction between the crucible 30 and the cooling disc 10, while providing high structural fitting precision and contact surface control ability.

[0040] Specifically, the top surface of the cuboid structure of the first protrusion is directly opposite the bottom wall of the crucible 30 and is in close thermal contact with the second protrusion 32 of the crucible 30. Since the shapes and sizes of the first protrusion and the second protrusion 32 match each other, their side surfaces can achieve a relatively close physical fit. This design not only improves the contact efficiency between the crucible 30 and the cooling disc 10, but also ensures that the crucible 30 remains stable during operation through precise contact control, thereby preventing process interruption or heat conduction efficiency reduction caused by displacement or shaking.

[0041] During operation, the crucible 30 can move vertically relative to the first protrusion in the insertion direction (i.e., the vertical direction) when driven, thereby adjusting the contact area between the first protrusion and the second protrusion 32 by changing the relative position between them, and providing a flexible temperature control means. When the crucible 30 moves upward, the contact area between the first protrusion and the second protrusion 32 decreases, the heat dissipation efficiency decreases, and the temperature in the crucible 30 can rise more quickly; on the contrary, when the crucible 30 moves downward, the contact area increases, the heat dissipation efficiency improves, and the temperature in the crucible 30 decreases, thereby effectively controlling the evaporation speed.

[0042] This vertical insertion movement can bring a relatively uniform contact pressure distribution. Since the top and bottom surfaces of the first protrusion and the second protrusion 32 are both planar structures, their contact during vertical movement is linear and stable, which makes the contact process between the crucible 30 and the cooling disc 10 more stable and less likely to have irregular contact or local overheating. Through this fine motion control, the heat dissipation efficiency can be effectively managed, the internal temperature of the crucible 30 can be accurately adjusted, and the uniformity of the evaporation process can be ensured.

[0043] Optionally, the electron beam evaporation coating device further comprises a driving assembly, and the driving assembly is drivingly connected with the bottom wall of the pot body 31, so that the crucible 30 can be accurately controlled to move, and the driving force can be effectively transmitted to the crucible 30 to keep it moving stably during coating.

[0044] Specifically, the driving assembly is drivingly connected with the bottom wall of the pot body 31, so that the driving assembly can directly apply a vertical pushing force or pulling force to push the crucible 30 to move vertically in the accommodating groove, thereby dynamically adjusting the contact area between the crucible 30 and the cooling disc 10. When it is necessary to quickly increase the internal temperature of the crucible 30 to speed up the evaporation speed, the driving assembly can reduce the contact area between the first protrusion and the second protrusion 32 to reduce the heat dissipation efficiency of the crucible 30, thereby achieving higher heating efficiency. On the contrary, when the evaporation speed is too fast or the temperature of the evaporation material 20 needs to be controlled, the driving assembly can increase the contact area to improve the heat conduction effect, thereby helping the crucible 30 to cool down and maintain an appropriate evaporation rate.

[0045] The connection between the driving assembly and the crucible 30 needs to ensure that the stability of the material inside the crucible 30 is not affected during the movement. Generally, the driving assembly is connected to the bottom wall of the crucible 30 through a series of support structures and buffer structures, which can not only ensure the stability during transmission, but also avoid excessive relative displacement of the crucible 30 due to vibration or impact, thereby affecting the uniformity during the coating process. In addition, the structural design of the driving assembly also needs to consider the simplicity of operation, so as to facilitate quick adjustment according to different process requirements.

[0046] Optionally, as shown in Figure 3 and Figure 4 , the first protrusion is designed as a sawtooth structure, and correspondingly, the second protrusion 32 also adopts the same sawtooth structure. Both sawtooth structures have inclined surfaces, and the two inclined surfaces are in close contact with each other, so that the crucible 30 can be driven to move upward or downward along the inclined surface, thereby realizing the dynamic adjustment of the contact area between the crucible 30 and the cooling disc 10.

[0047] Specifically, the first protrusion and the second protrusion 32 both adopt a sawtooth structure, the purpose of which is to control the contact angle and contact area between the crucible 30 and the cooling disc 10 through the inclined surfaces in close contact with each other. As the crucible 30 moves up and down along the inclined surface, the contact area is dynamically adjusted according to the change of the movement direction. When the crucible 30 moves upward along the inclined surface, the contact area gradually decreases, which will reduce the heat dissipation efficiency of the crucible 30, thereby increasing the temperature inside the crucible 30, and thus accelerating the heating and evaporation speed of the evaporated material 20. Conversely, when the crucible 30 moves downward along the inclined surface, the contact area increases, and heat can be more quickly conducted to the cooling disc 10, thereby effectively improving the heat dissipation effect of the crucible 30, avoiding excessive heating of the material, and ensuring the stability of the evaporation process.

[0048] In order to ensure that the crucible 30 can smoothly perform the tilting movement, a sufficient gap must be reserved between the side wall of the pot body 31 and the side wall of the accommodating groove to provide the movement space for the crucible 30. This gap is set to avoid the problem of jamming or friction of the crucible 30 during the tilting movement due to limited space. The gap not only provides the spatial freedom degree for the tilting movement of the crucible 30, but also ensures that the crucible 30 will not generate excessive lateral pressure on the side wall of the accommodating groove during the movement, thereby maintaining the overall structural stability of the device.

[0049] Optionally, the driving assembly is drivingly connected with the side wall of the pot 31. At this time, through the driving connection of the side wall, the driving assembly can apply a pushing force from the side to push the crucible 30 to move along the inclined surface of the first protrusion. Since the inclined surface has a certain slope, the crucible 30 will gradually slide along the inclined surface after being forced, adjusting the contact angle and contact area with the cooling disc 10. In this way, the crucible 30 can not only move up and down along the inclined surface, but also can avoid the limitations brought by the traditional vertical movement. As known from the foregoing, for different movement trajectories, the driving force of the driving assembly needs to be accurately applied to the appropriate position of the crucible 30 to achieve the best transmission effect and ensure smooth and precise control of the movement.

[0050] Optionally, as shown in Figure 5 and Figure 6 , the crucible 30 remains stationary, and the driving of at least part of the first protrusion is relative to the second protrusion 32 to achieve dynamic adjustment of the contact area. The first protrusion can move towards the direction of approaching or moving away from the second protrusion 32 at the bottom of the crucible 30, and the contact area is increased or decreased to adapt to different temperature control requirements.

[0051] When it is necessary to reduce the contact area between the crucible 30 and the cooling disc 10, part or all of the first protrusion can be directly removed by mechanical means. In this way, the contact area is reduced, and the heat conduction efficiency between the crucible 30 and the cooling disc 10 is also reduced, thereby slowing down the cooling speed of the crucible 30. This scheme is particularly suitable for the case where the evaporated material 20 needs to be kept at a high temperature for a long time under certain process requirements. Moreover, the crucible 30 remains stationary during the entire evaporation process, which can avoid mechanical wear or movement errors caused by the movement of the crucible 30. On the contrary, the movement of the first protrusion can be realized by a simple mechanical or electric control system, which can not only maintain the overall stability of the system, but also ensure the flexibility of adjustment.

[0052] It should be noted that the material of the first protrusion can be selected as the same material as the crucible 30 to ensure that there is no adverse reaction or difference in heat conduction efficiency between the two during contact. Generally, the crucible 30 is made of tungsten material, which has excellent high-temperature resistance and high-strength performance, and is suitable for long-term high-temperature evaporation process requirements. The cooling disc 10 can be made of copper material, which can effectively remove the heat conducted from the crucible 30 due to its excellent heat conduction performance, maintaining the heat balance of the system.

[0053] Optionally, as shown in Figures 1 to 4As shown, the driving assembly is responsible for adjusting the relative position between the crucible 30 and the heat-conducting structure 40, thereby achieving precise control of temperature and heat dissipation. The driving assembly includes a driving member 51 and a screw rod 52, and the driving member 51 is drivingly connected with the crucible 30 and / or the heat-conducting structure 40 through the screw rod 52, making the whole adjustment process more flexible and controllable.

[0054] Specifically, the driving member 51 can be an electric motor, a pneumatic device, or a hydraulic drive device, and its core function is to provide stable driving force for the system. When the driving member 51 is started, it generates a rotary motion through mechanical connection with the screw rod 52. The screw rod 52 converts the rotary motion into linear motion through screw transmission, thereby pushing the crucible 30 and / or the heat-conducting structure 40 to move up and down or left and right accordingly. The transmission precision of the screw rod 52 is high, and it can realize micro displacement adjustment, which is particularly suitable for coating processes that require high precision.

[0055] During operation, the screw rod 52 can be fixedly connected with the crucible 30 and / or the heat-conducting structure 40 through mechanical structure. If the movement of the crucible 30 needs to be adjusted, the driving member 51 will push the crucible 30 to move along the vertical direction or the inclined surface through the screw rod 52. When the heat-conducting structure 40 needs to be adjusted in the design, the driving member 51 drives the first protrusion on the cooling disc 10 to move relatively through the screw rod 52, thereby changing the contact between the first protrusion and the crucible 30. This flexible transmission mode not only makes the temperature control more precise, but also adapts to different process requirements.

[0056] It should be understood that, according to the movement trajectory of the crucible 30, the driving assembly can be installed at the bottom or side of the crucible 30 to adapt to displacement requirements in different directions. When the crucible 30 moves along the vertical direction, the driving assembly is usually located at the bottom, and the pushing force is applied to the bottom wall of the crucible 30 through the screw rod 52, ensuring that it moves stably up and down along the vertical direction. When the crucible 30 needs to move along the inclined surface, the driving assembly is installed on the side, and the screw rod 52 pushes the side wall of the crucible 30 to make it slide smoothly on the inclined surface.

[0057] Optionally, a through hole is formed in the side wall and / or the bottom wall of the accommodating groove, and the through hole can provide a necessary passage for the installation of the screw rod 52, so that the screw rod 52 can pass through the through hole and be drivingly connected with the crucible 30 and / or the heat-conducting structure 40.

[0058] Specifically, through this design, the driving force of the screw rod 52 can be directly transmitted to the crucible 30 or the heat-conducting structure 40, thereby effectively pushing the crucible 30 or the heat-conducting structure 40 to move along the set trajectory. Moreover, the screw rod 52 is directly connected with the crucible 30 or the heat-conducting structure 40 through the through hole, which can reduce the number of intermediate mechanical components, thereby reducing energy loss and improving the operation efficiency of the equipment. It should be noted that the through hole can be accurately machined according to the diameter of the screw rod 52 to ensure that the screw rod 52 can pass smoothly, while avoiding energy loss or shaking due to the excessively large aperture.

[0059] Optionally, as shown in Figures 1 to 4 The electron beam evaporation coating device includes a controller 60 electrically connected with the driving assembly, which can realize accurate displacement control of the crucible 30 and / or the heat-conducting structure 40. The controller 60 uses a programmable logic controller (PLC) as a core control unit, and the operator inputs corresponding displacement parameters through a human-computer interaction interface 70, thereby indirectly realizing accurate movement of the crucible 30 and / or the heat-conducting structure 40.

[0060] Specifically, the controller 60 is connected with the driving assembly through a circuit and undertakes the functions of sending and feedback receiving of driving signals. The PLC as a core controller can receive and process displacement instructions input from the human-computer interaction interface 70. For example, when the operator inputs the required displacement value (such as 3 mm or 5 mm) on the human-computer interaction interface 70, the PLC will send corresponding control signals to the driving assembly according to the input displacement value. Subsequently, the driving assembly drives the crucible 30 and / or the heat-conducting structure 40 to move accurately according to the specified displacement amount according to the instructions sent by the PLC. This automatic control can greatly improve the operation efficiency and reduce human errors, and especially in the preparation of precision thin films, the high-precision adjustment of this control system is particularly important.

[0061] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electron beam evaporation coating apparatus, characterized by comprising: The cooling disc (10) has a receiving groove for placing the crucible (30), a heat conduction structure (40) is arranged at the bottom wall of the receiving groove, the bottom wall of the crucible (30) is placed on the heat conduction structure (40), and the crucible (30) and / or the heat conduction structure (40) are driven to move relatively to adjust the contact area of the crucible (30) and the heat conduction structure (40).

2. The electron beam evaporation coating device according to claim 1, characterized in that The heat conduction structure (40) is a plurality of first protrusions arranged in an array on the bottom wall of the receiving groove, the crucible (30) includes a pot body (31) and a plurality of second protrusions (32) located at the bottom of the pot body (31) and protruding towards the bottom wall of the receiving groove, and the plurality of first protrusions and the plurality of second protrusions (32) are arranged in a staggered manner.

3. The electron beam evaporation coating device according to claim 2, characterized in that The first protrusion is a cuboid structure, the top surface of the cuboid structure is perpendicular to the bottom wall of the crucible (30), and the crucible (30) is driven to move relative to the first protrusion along the insertion direction.

4. The electron beam evaporation coating device according to claim 2, characterized in that The side wall of the pot body (31) has a gap with the side wall of the receiving groove, the first protrusion is a zigzag structure, the zigzag structure has an inclined surface, and the crucible (30) is driven to move relative to the first protrusion along the inclined surface.

5. The electron beam evaporation coating device according to claim 2, characterized in that At least part of the first protrusion is driven to move towards or away from the second protrusion (32).

6. The electron beam evaporation coating device according to any one of claims 1 to 5, characterized in that The electron beam evaporation coating device further includes a driving assembly, the driving assembly includes a driving member (51) and a screw rod (52), and the driving member (51) is drivingly connected with the crucible (30) and / or the heat conduction structure (40) through the screw rod (52).

7. The electron beam evaporation coating device according to claim 6, characterized in that A through hole is formed in the side wall and / or the bottom wall of the receiving groove, and the screw rod (52) is drivingly connected with the crucible (30) and / or the heat conduction structure (40) through the through hole.

8. The electron beam evaporation coating device according to claim 3, characterized in that The electron beam evaporation coating device further includes a driving assembly, the driving assembly is drivingly connected with the bottom wall of the pot body (31).

9. The electron beam evaporation coating device according to claim 4, characterized in that The electron beam evaporation coating device further includes a driving assembly, the driving assembly is drivingly connected with the side wall of the pot body (31).

10. The electron beam evaporation coating device according to claim 6, characterized in that The electron beam evaporation coating device includes a controller (60), and the controller (60) is electrically connected with the driving assembly.

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