Heating protection kit applied to magnetron sputtering equipment
By optimizing the structure of the heating protection kit in the magnetron sputtering equipment, the contact area between the wafer and the deposition ring is reduced, thus solving the wafer sticking problem, improving the operating efficiency of the equipment, and reducing maintenance costs.
Patent Information
- Application Number
- CN202520226411.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-12
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-02-12
AI Technical Summary
In existing magnetron sputtering equipment, the strong adhesion between the wafer and the deposition ring makes it easy for wafers to stick together during the forming process, which affects the processing effect and increases the frequency of equipment maintenance and cleaning.
A heating protection kit is adopted, including a heater and a deposition ring. The deposition ring consists of a main ring body and a conical ring body. The upper surface of the conical ring body is narrower than the lower surface and gradually increases in width along the axis of the conical ring body to reduce the contact area between the wafer and the deposition ring. Combined with structures such as a ring support platform and a cover ring, the design of the protection kit is optimized.
It reduces the risk of wafer sticking during wafer handling, decreases the frequency of equipment maintenance and cleaning, improves equipment utilization, and reduces costs.
Smart Images
Figure CN223674727U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of thin film deposition, specifically relates to a heating protection kit applied to magnetron sputtering equipment. BACKGROUND
[0002] The thin film deposition equipment is a kind of device for depositing thin layer material on the surface of substrate, which is widely used in the fields of semiconductor, optics, energy, tool coating and the like.The magnetron sputtering equipment is a kind of equipment for depositing thin film on the surface of material by using magnetron sputtering technology, which belongs to one kind of thin film deposition equipment.
[0003] Generally, the deposition cavity of magnetron sputtering equipment is provided with a heating protection kit, and the heating protection kit comprises a heater and a protection kit, the protection kit comprises a deposition ring, a cover ring and the like various ring-shaped components, the heater is used for carrying and heating wafer, and the deposition ring and the cover ring and the like various ring-shaped components are used for shielding metal ions to protect the key parts in the deposition cavity and the heater from the impact of metal ions or weaken the impact of metal ions.At present, the common deposition ring is a ring-shaped component sleeved on the outer periphery of the heater, the shape of its cross section is rectangular, its upper surface is higher than the upper surface of the heater, and the lower surface of the wafer is tightly attached to the upper surface of the deposition ring.In this way, the deposition ring can protect the heater, but the contact area between the deposition ring and the wafer is relatively large, which leads to the strong adhesion between the film layer structure formed when the wafer is formed and the deposition ring, and further leads to the wafer sticking phenomenon during wafer handling, thereby affecting the forming processing of the wafer. SUMMARY
[0004] In order to solve the above problems existing in the prior art, the utility model provides a heating protection kit applied to magnetron sputtering equipment.The technical problems to be solved by the utility model are realized by the following technical schemes:
[0005] In one embodiment of the utility model, the outer periphery of the heater is sleeved with an annular support platform, the annular support platform is located on the lower side of the heater and connected with the heater, and the deposition ring is installed on the annular support platform.
[0006] In one embodiment of the utility model, the outer periphery of the heater is sleeved with an annular support platform, the annular support platform is located on the lower side of the heater and connected with the heater, and the deposition ring is installed on the annular support platform.
[0007] In one embodiment of the present application, the width of the main ring body is greater than the width of the annular support platform, and the main ring body protrudes from the annular support platform along its radial direction.
[0008] In one embodiment of the present application, two conical ring bodies are provided, and the two conical ring bodies are respectively arranged on the two radial sides of the main ring body.
[0009] In one embodiment of the present application, the two conical ring bodies are respectively a first conical ring body and a second conical ring body, the first conical ring body is arranged on the inner side of the main ring body, the second conical ring body is arranged on the outer side of the main ring body, the inner ring surface of the first conical ring body is coplanar with the inner ring surface of the main ring body, and the outer ring surface of the second conical ring body is coplanar with the outer ring surface of the main ring body.
[0010] In one embodiment of the present application, the diameter of the wafer is greater than the outer diameter of the first conical ring body and less than the inner diameter of the second conical ring body.
[0011] In one embodiment of the present application, the main ring body and the conical ring body are an integral structure.
[0012] In one embodiment of the present application, the inner ring surface of the main ring body is tightly attached to the outer peripheral surface of the heater, and the inner ring surface of the conical ring body on the inner side of the main ring body is tightly attached to the outer peripheral surface of the heater.
[0013] In one embodiment of the present application, the utility model further includes a cover ring, a fastening ring and a protection ring, the cover ring is located above the side of the wafer, the fastening ring and the protection ring are both installed on the cavity wall of the deposition cavity, and the two ends of the cover ring are respectively installed on the fastening ring and the protection ring.
[0014] In one embodiment of the present application, the width of the upper surface of the conical ring body is 1mm-1.5mm, the outer ring surface of the conical ring body is a conical surface, and the inclination angle of the conical surface is 50°-80°.
[0015] Compared with the prior art, the present application has the following advantages:
[0016] In the above scheme of the application, the heating protection kit comprises a heater and a deposition ring, the upper surface of the heater is used for carrying a wafer, and the deposition ring is sleeved on the outer periphery of the heater and detachably connected with the heater; the deposition ring comprises a main ring body and a tapered ring body, the main ring body and the tapered ring body are both sleeved on the outer periphery of the heater, the lower surface of the tapered ring body is connected with the main ring body, the upper surface of the tapered ring body protrudes from the upper surface of the heater, the width of the upper surface of the tapered ring body is smaller than the width of the lower surface of the tapered ring body, and the width of the tapered ring body gradually increases along a first direction, the first direction is from the upper end to the lower end of the tapered ring body and is parallel to the axis direction of the tapered ring body. By adopting this structure, the wafer can be in contact with the upper surface of the tapered ring body in the deposition ring during wafer forming. Compared with the existing deposition ring with a rectangular cross-sectional shape, the width of the upper surface of the tapered ring body in the deposition ring of the application is smaller than the width of the lower surface of the tapered ring body, so that the contact area between the wafer and the deposition ring can be reduced, thereby the adhesion effect between the film layer structure formed during wafer forming and the deposition ring can be weakened, and the wafer sticking risk during wafer carrying can be reduced.
[0017] The application will be further described in detail below with reference to the drawings and embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 is a schematic view of a heating protection kit and a wafer in an embodiment of the application Figure 1 ;
[0019] Figure 2 is a schematic view of a heater and a deposition ring in an embodiment of the application Figure 1 ;
[0020] Figure 3 is a schematic view of a heating protection kit and a wafer in an embodiment of the application Figure 2 ;
[0021] Figure 4 is a schematic view of a heater and a deposition ring in an embodiment of the application Figure 2 ;
[0022] Figure 5 is a schematic view of a heater, a deposition ring, a cover ring, a fastening ring and a protection ring in an embodiment of the application.
[0023] The drawings show that: 1-heater, 2-deposition ring, 21-main ring body, 22-tapered ring body, 3-wafer, 4-ring-shaped support platform, 5-cover ring, 6-fastening ring, 7-protection ring. DETAILED DESCRIPTION
[0024] The application will be further described in detail below with reference to the drawings and embodiments, but the embodiments of the application are not limited thereto.
[0025] Please refer to Figure 1 ,Figure 2 , Figure 3 , Figure 4 and Figure 5 This utility model provides a heating protection kit for use in magnetron sputtering equipment, which is installed in the deposition chamber of the magnetron sputtering equipment. It includes a heater 1 and a deposition ring 2. The upper surface of the heater 1 is used to support the wafer 3. The deposition ring 2 is sleeved on the outer periphery of the heater 1 and is detachably connected to the heater 1. The deposition ring 2 includes a main ring body 21 and a conical ring body 22. Both the main ring body 21 and the conical ring body 22 are sleeved on the outer periphery of the heater 1. The lower surface of the conical ring body 22 is connected to the main ring body 21. The upper surface of the conical ring body 22 protrudes from the upper surface of the heater 1. The width of the upper surface of the conical ring body 22 is smaller than the width of the lower surface of the conical ring body 22. The width of the conical ring body 22 gradually increases along a first direction, which is from the upper end to the lower end of the conical ring body 22 and is parallel to the axis of the conical ring body 22.
[0026] In some embodiments of this application, the magnetron sputtering apparatus includes a deposition chamber, a target, a magnetron control system, a gas control system, and a power supply system. The deposition chamber is a vacuum chamber used to provide a vacuum environment to reduce gas interference during wafer deposition. The target is the raw material for the coating material, such as metal or ceramic, and becomes the sputtering source when energized. The magnetron control system includes a permanent magnet or electromagnet mounted behind the target, used to generate a closed magnetic field to confine electron movement and improve ionization efficiency. The gas control system provides working gas and reactive gas to facilitate the sputtering formation of thin film structures. The power supply system provides power to ensure the magnetron sputtering apparatus operates normally.
[0027] In some embodiments of this application, the heater 1 is an integrated heating structure. The heater 1 includes a disk body, and a heating wire and a ventilation pipe are provided inside the disk body. The heating wire is used to heat the wafer, and the ventilation pipe is used to introduce an inert gas to optimize the reaction environment of the wafer 3, or to introduce a cooling gas to achieve rapid cooling of the wafer 3.
[0028] In some embodiments of this application, the deposition ring 2 and the heater 1 can be connected by fasteners such as screws.
[0029] In some embodiments of this application, the cross-sectional shape of the main ring 21 is rectangular, and the cross-sectional shape of the conical ring 22 is a right trapezoid.
[0030] In some embodiments of this application, the outer ring surface of the conical ring 22 is a conical surface.
[0031] In the above scheme of the present application, the heating protection kit comprises a heater 1 and a deposition ring 2, the upper surface of the heater 1 is used to carry a wafer 3, and the deposition ring 2 is sleeved on the outer periphery of the heater 1 and is detachably connected with the heater 1; the deposition ring 2 comprises a main ring body 21 and a tapered ring body 22, both the main ring body 21 and the tapered ring body 22 are sleeved on the outer periphery of the heater 1, the lower surface of the tapered ring body 22 is connected with the main ring body 21, the upper surface of the tapered ring body 22 protrudes from the upper surface of the heater 1, the width of the upper surface of the tapered ring body 22 is smaller than the width of the lower surface of the tapered ring body 22, and the width of the tapered ring body 22 gradually increases along a first direction, the first direction is from the upper end to the lower end of the tapered ring body 22 and is parallel to the axis direction of the tapered ring body 22. With this structure, the wafer 3 can be in contact with the upper surface of the tapered ring body 22 in the deposition ring 2 during forming, compared with the existing deposition ring 2 with a rectangular cross-sectional shape, the width of the upper surface of the tapered ring body 22 in the deposition ring 2 of the present application is smaller than the width of the lower surface thereof, so that the contact area between the wafer 3 and the deposition ring 2 can be reduced, thereby weakening the adhesion between the film structure formed during the forming of the wafer 3 and the deposition ring 2, and further reducing the risk of wafer sticking during wafer handling.
[0032] In addition, when the existing deposition ring 2 is used, in order to weaken the adhesion between the wafer 3 and the deposition ring 2, it is usually necessary to clean and maintain the deposited material accumulated near the wafer 3 and the deposition ring 2 multiple times, so that the maintenance and cleaning frequency of the heating protection kit in the deposition cavity is high, which affects the effective utilization rate of the magnetron sputtering equipment and increases the maintenance cost of the equipment. Since the adhesion between the wafer 3 and the deposition ring 2 can be weakened by using the above structure of the present application, the maintenance and cleaning frequency of the heating protection kit can be reduced, the maintenance cycle of the equipment can be improved, and the cost can be reduced. Specifically, the maintenance cycle can be improved from twice in the use cycle of one target to once in the use cycle of one target, the number of maintenance times of the deposition cavity is reduced, and the operation time is increased.
[0033] In some embodiments of the present application, as shown in Figures 1 to 4 the outer periphery of the heater 1 is sleeved with an annular support platform 4, the annular support platform 4 is located on the lower side of the heater 1 and is connected with the heater 1, and the deposition ring 2 is installed on the annular support platform 4. With this structure, the deposition ring 2 can be supported by the annular support platform 4, so that the stability of the installation of the deposition ring 2 can be improved.
[0034] In some embodiments of the present application, the annular support platform 4 and the heater 1 are in an integrated structure.
[0035] In some embodiments of the present application, a support column is further arranged below the heater 1.
[0036] In some embodiments of the present application, as shown in Figures 1 to 4As shown, the width of the main ring body 21 is greater than the width of the annular support platform 4, and the main ring body 21 is arranged to protrude radially beyond the annular support platform 4. With this structure, when the main ring body 21 is arranged to protrude radially beyond the annular support platform 4, the protruding portion can effectively shield the metal atoms and ions above the deposition cavity, preventing the metal atoms and ions from eroding the components and cavity walls below the deposition cavity, thereby improving the protection of the heating protection kit.
[0037] In an alternative example, as shown in Figure 1 and Figure 2 The conical ring body 22 is provided with a conical outer surface.
[0038] In some embodiments of the present application, as shown in Figure 3 and Figure 4 The conical ring body 22 is provided with two conical ring bodies 22, which are respectively arranged on the two radial sides of the main ring body 21, and the main ring body 21 and the two conical ring bodies 22 together form a trapezoidal groove. With this structure, the deposited film material can be stored in the trapezoidal groove, which can improve the cleaning cycle of the deposited material, reduce the cleaning cost, and improve the deposition efficiency.
[0039] In some embodiments of the present application, the two conical ring bodies 22 are respectively arranged on the inner side and the outer side of the main ring body 21, the outer surface of the conical ring body 22 arranged on the inner side of the main ring body 21 is a conical surface, and the inner surface of the conical ring body 22 arranged on the outer side of the main ring body 21 is a conical surface.
[0040] In some embodiments of the present application, the two conical ring bodies 22 are respectively a first conical ring body and a second conical ring body, the first conical ring body is arranged on the inner side of the main ring body 21, the second conical ring body is arranged on the outer side of the main ring body 21, the inner surface of the first conical ring body is coplanar with the inner surface of the main ring body 21, and the outer surface of the second conical ring body is coplanar with the outer surface of the main ring body 21. With this structure, the structure of the deposition ring 2 is simpler and easier to form.
[0041] In some embodiments of the present application, the diameter of the wafer 3 is greater than the outer diameter of the first conical ring body and less than the inner diameter of the second conical ring body. With this structure, the wafer 3 can be supported by the first conical ring body to ensure normal formation, and the second conical ring body can be shielded to prevent metal ions above the deposition cavity from eroding the components or cavity walls below the deposition cavity.
[0042] In some embodiments of the present application, the main ring body 21 and the conical ring body 22 are an integral structure. With this structure, the deposition ring 2 is more stable as a whole and is easier to process and form.
[0043] In some embodiments of the present application, the inner annular surface of the main ring body 21 is tightly attached to the outer peripheral surface of the heater 1, and the inner annular surface of the tapered ring body 22 located inside the main ring body 21 is tightly attached to the outer peripheral surface of the heater 1. With this structure, the gap between the deposition ring 2 and the heater 1 can be reduced, and the film layer material can be prevented from accumulating between the deposition ring 2 and the heater 1 to affect the heating performance of the heater 1.
[0044] In some embodiments of the present application, as shown in Figure 5 The cover ring 5 is located above the side of the wafer 3, the fastening ring 6 and the protection ring 7 are both installed on the cavity wall of the deposition cavity, and the two ends of the cover ring 5 are respectively installed on the fastening ring 6 and the protection ring 7. With this structure, the cover ring 5 can shield the components above the deposition cavity and the cavity wall from the impact of metal ions, and can also prevent the back of the wafer 3 from being plated. The cover ring 5 can be stably installed by being supported and fixed by the fastening ring 6 and the protection ring 7, and the metal ions can be further shielded, thereby reducing the erosion of the metal ions on the components and the cavity wall inside the deposition cavity.
[0045] In some embodiments of the present application, the width of the upper surface of the tapered ring body 22 is 1mm-1.5mm, the outer annular surface of the tapered ring body 22 is a tapered surface, and the inclination angle of the tapered surface is 50°-80°. With this structure, the size of the tapered ring body 22 is optimized to further weaken the adhesion between the tapered ring body 22 and the wafer 3.
[0046] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "circumferential", "axial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0047] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0048] In the utility model, unless another definite provision and limitation, the term "mount", "link", "connect", "fix" and so on term should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electric connection;Can be direct connection, also can indirectly connect through intermediate medium, can be two element inside's intercommunication or two element's mutual action relation. For ordinary skilled person in the art, can understand the specific meaning of above-mentioned term in the utility model according to specific circumstances.
[0049] The above is further detailed description of the utility model in combination with specific preferred embodiments, and the specific implementation of the utility model cannot be limited to these descriptions. For ordinary skilled person in the art to which the utility model belongs, without departing from the concept of the utility model, a number of simple deductions or substitutions can also be made, which should be considered as belonging to the protection scope of the utility model.
Claims
1. A heating protection kit for use in a magnetron sputtering apparatus for installation into a deposition chamber of a magnetron sputtering apparatus, characterized in that, The deposition ring is sleeved on the outer periphery of the heater and detachably connected with the heater. The deposition ring comprises a main ring body and a tapered ring body, both of which are sleeved on the outer periphery of the heater, the lower surface of the tapered ring body is connected with the main ring body, the upper surface of the tapered ring body protrudes from the upper surface of the heater, the width of the upper surface of the tapered ring body is smaller than the width of the lower surface of the tapered ring body, and the width of the tapered ring body gradually increases along a first direction, the first direction being from the upper end to the lower end of the tapered ring body and parallel to the axis direction of the tapered ring body.
2. The heating protection kit for a magnetron sputter device according to claim 1, characterized in that The outer periphery of the heater is sleeved with an annular support platform, which is located on the lower side of the heater and connected with the heater, and the deposition ring is installed on the annular support platform.
3. The heating protection kit for a magnetron sputter device according to claim 2, characterized in that The width of the main ring body is greater than the width of the annular support platform, and the main ring body protrudes from the annular support platform along the radial direction.
4. The heating protection kit for use in a magnetron sputter device according to claim 2, characterized in that The tapered ring body is provided with two, two tapered ring bodies are respectively arranged on the radial sides of the main ring body, and the main ring body and the two tapered ring bodies jointly form a trapezoidal groove.
5. The heating protection kit for a magnetron sputter device according to claim 4, characterized in that The two tapered ring bodies are respectively a first tapered ring body and a second tapered ring body, the first tapered ring body is arranged on the inner side of the main ring body, the second tapered ring body is arranged on the outer side of the main ring body, the inner ring surface of the first tapered ring body is coplanar with the inner ring surface of the main ring body, and the outer ring surface of the second tapered ring body is coplanar with the outer ring surface of the main ring body.
6. The heating protection kit for a magnetron sputter device according to claim 5, characterized in that The diameter of the wafer is greater than the outer diameter of the first tapered ring body and smaller than the inner diameter of the second tapered ring body.
7. The heating protection kit for a magnetron sputter device according to claim 1 or 4, characterized in that The main ring body and the tapered ring body are an integral structure.
8. The heating protection kit for a magnetron sputter device according to claim 7, characterized in that The inner ring surface of the main ring body is tightly attached to the outer peripheral surface of the heater, and the inner ring surface of the tapered ring body on the inner side of the main ring body is tightly attached to the outer peripheral surface of the heater.
9. The heating protection kit for use in a magnetron sputter device according to claim 1, characterized in that It also comprises a cover ring, a fastening ring and a protection ring, the cover ring is located above the side of the wafer, the fastening ring and the protection ring are both installed on the cavity wall of the deposition cavity, and the two ends of the cover ring are respectively installed on the fastening ring and the protection ring.
10. The heating protection kit for use in a magnetron sputter device according to claim 1, characterized in that The width of the upper surface of the tapered ring body is 1mm-1.5mm, the outer ring surface of the tapered ring body is a tapered surface, and the inclination angle of the tapered surface is 50°-80°.