Backlight module and display equipment

Abstract

The utility model relates to the technical field of backlight display, and provides a backlight module and display equipment. The light diffusion plate is parallel to the substrate; the light-emitting front surface of each light-emitting unit is obliquely arranged on the substrate, and light emitted from the light-emitting front surface is projected on the light diffusion plate; wherein the light-emitting units are arranged at intervals, and projections of light emitted by the light-emitting front faces of the adjacent light-emitting units on the light diffusion plate have overlapped parts. The light-emitting units are all obliquely arranged on the substrate, the light-emitting units emit light towards the oblique front, light spot compensation is carried out among the chips, light spots formed after oblique light emitting are larger, the number of used chips can be reduced, the manufacturing cost is saved, and the problem that in the prior art, in order to make the display device light and thin, under the condition that OD is certain, the light spots are not large is solved. And a predetermined display effect can be achieved only by arranging more chips, so that the cost of the display equipment is obviously increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of backlight display, more particularly, to a backlight module and a display device. BACKGROUND

[0002] In LED lighting or backlight display technology, optical distance (OD) refers to the distance between the diffusion plate and the light source (such as LED). This distance affects the uniformity of light mixing and the light output effect of the backlight. In the era of rapid development of display technology, display devices tend to be lighter and thinner, so OD is a key factor in the thickness of display devices. The shorter the OD, the thinner the display device.

[0003] In the current conventional technical solution, the chips of the backlight module emit light towards the front, and the light spot is enlarged through the diffusion layer to reduce the OD. However, the diffusion effect of light through the diffusion layer is limited. In the case of a certain OD, more chips need to be arranged to achieve the predetermined display effect, resulting in a significant increase in the cost of the display device. UTILITY MODEL CONTENT

[0004] The purpose of the present application is to provide a backlight module and a display device to solve the problem in the prior art that in order to make the display device lighter and thinner, more chips need to be arranged to achieve the predetermined display effect in the case of a certain OD, resulting in a significant increase in the cost of the display device.

[0005] Therefore, in a first aspect, the present application provides a backlight module, comprising: a substrate; a light diffusion plate arranged parallel to the substrate; a plurality of light emitting units, each light emitting unit having a light emitting front surface inclinedly arranged on the substrate, and the light emitted from the light emitting front surface being projected on the light diffusion plate; wherein the plurality of light emitting units are arranged at intervals, and the light emitted from the light emitting front surfaces of adjacent light emitting units has overlapping parts in the projection on the light diffusion plate.

[0006] The backlight module provided in the above-mentioned solution has a light emitting circuit arranged on the substrate, and the plurality of light emitting units are electrically connected to the light emitting circuit, and the plurality of light emitting units are driven to emit light by the light emitting circuit.

[0007] The backlight module provided in the above-mentioned solution has a light emitting unit comprising: an LED chip; and a lens layer covering around the LED chip.

[0008] The backlight module provided in the above-mentioned solution has a lens layer arranged without a gap with the LED chip.

[0009] The backlight module provided in the above-mentioned solution has a light emitting unit further comprising: a fluorescent layer covering the lens layer; a diffusion layer covering the fluorescent layer; and a reflective layer covering the diffusion layer.

[0010] The outer surface of the lens layer is a curved surface with an arc line.

[0011] The curved surface includes a first arc surface and a second arc surface, the first arc surface is connected with the second arc surface, and a concave valley structure is formed at the connection.

[0012] The curved surface further includes a first vertical surface and a second vertical surface, the first vertical surface is connected with the first arc surface, and the second vertical surface is connected with the second arc surface.

[0013] The light diffusion plate is in contact with the plurality of light emitting units.

[0014] In a second aspect, the application provides a display device including the backlight module.

[0015] The backlight module provided by the application has at least the following beneficial effects: in the present application, the plurality of light emitting units are inclinedly arranged on the substrate, the projection of the light emitted by the light emitting front surface of the adjacent light emitting units on the light diffusion plate has an overlapping part, that is, the chips of the backlight module emit light obliquely forward, the light spots between the plurality of chips are compensated, and the light spot formed after oblique light emission is larger under the same OD, thereby the number of chips used can be reduced, the manufacturing cost is saved, and the technical problem that in the prior art, in order to make the display device become light and thin, more chips need to be arranged under the condition of a certain OD to achieve a predetermined display effect, resulting in a significant increase in the cost of the display device is solved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0017] Fig. 1 The structure schematic diagram of the backlight module provided by an embodiment of the application is shown in the figure.

[0018] Fig. 2 The structure schematic diagram of the light emitting unit provided by an embodiment of the application is shown in the figure.

[0019] Fig. 3 The outer shape structure schematic diagram of the lens layer provided by an embodiment of the application is shown in the figure.

[0020] In the figure, each reference sign represents:

[0021] 1, substrate; 2, light diffusion plate; 3, light emitting unit; 31, light emitting front surface; 32, lens layer; 33, fluorescent layer; 34, diffusion layer; 35, reflective layer; 321, first vertical surface; 322, first arc surface; 323, concave valley structure; 324, second arc surface; 325, second vertical surface. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application and not to limit the present application.

[0023] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or position based on the orientation or position shown in the drawings, and are only for the convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0024] CSP (Chip Scale Package) technology is an advanced semiconductor packaging technology that allows the packaged chip size to approach or equal the size of the bare chip, greatly reducing the volume of the package. CSP technology exhibits its unique advantages in many aspects. The development of CSP technology is of great significance to the progress of the semiconductor packaging industry, as it not only enhances the performance of electronic products, but also provides the possibility of designing smaller and more efficient electronic systems.

[0025] LED display chips are increasingly using CSP packaging technology, which makes the size of the LED approach the size of the chip itself, helping to realize the miniaturization of LED products.

[0026] Optical distance (OD) refers to the distance between the diffusion plate and the light source (such as LED). This distance affects the uniformity of light mixing and the light output effect of the backlight. In the era of rapid development of display technology, display devices tend to be lighter and thinner, so OD is a key factor in the thickness of display devices. The shorter the OD, the thinner the display device.

[0027] In the prior art, the chips of the backlight module emit light towards the front, and the light spot is enlarged by the diffusion layer to reduce the OD. However, the diffusion effect of the light through the diffusion layer is limited, and in the case of a certain OD, more chips need to be arranged to achieve the predetermined display effect, resulting in a significant increase in the cost of the display device.

[0028] Therefore, the embodiment of the present application provides a backlight module, as shown in the drawings, the backlight module comprises a substrate 1, a light diffusion plate 2 arranged in parallel with the substrate 1, and a plurality of light emitting units 3, the light emitting front surface 31 of each light emitting unit 3 is arranged obliquely on the substrate 1, and the light emitted from the light emitting front surface 31 is projected on the light diffusion plate 2, wherein the plurality of light emitting units 3 are arranged at intervals, and the light emitted from the light emitting front surface 31 of the adjacent light emitting units 3 has overlapping parts in the projection on the light diffusion plate 2. Figs. 1-3

[0029] Specifically, in the embodiment, the backlight module mainly comprises a substrate 1, a light diffusion plate 2 arranged in parallel with the substrate 1, and a plurality of light emitting units 3. The plurality of light emitting units 3 are arranged at intervals, and the light emitting front surface 31 of each light emitting unit 3 is arranged obliquely on the substrate 1, and the light emitted from the light emitting front surface 31 of the light emitting unit 3 is projected on the light diffusion plate 2 to form a plurality of light spots, and the light emitted from the light emitting front surface 31 of the adjacent light emitting units 3 has overlapping parts in the projection on the light diffusion plate 2, that is, the light spots projected on the light diffusion plate 2 by the adjacent light emitting units 3 can compensate for each other. The display effect is improved.

[0030] Because the plurality of light emitting units 3 arranged obliquely have an included angle with the light diffusion plate 2, the light spot projected on the light diffusion plate 2 by the light emitting units 3 arranged obliquely is larger than the light spot projected on the light diffusion plate 2 by the light emitting units 3 parallel to the light diffusion plate 2, so the light spot area projected on the light diffusion plate 2 by the light emitting units 3 arranged obliquely is larger. For the same area of the light diffusion plate 2, fewer light emitting units 3 can meet the actual needs, thereby reducing the manufacturing cost.

[0031] Compared with the prior art, in the embodiment, the plurality of light emitting units 3 are arranged obliquely on the substrate 1, and the light emitted from the light emitting front surface 31 of the adjacent light emitting units 3 has overlapping parts in the projection on the light diffusion plate 2, that is, the chips of the backlight module emit light towards the oblique front, and the light spots between the plurality of chips are compensated, and in the case of the same OD, the light spot formed after the oblique emission is larger, thereby the number of chips used can be reduced, the manufacturing cost is saved, and the technical problem that in the prior art, in the case of a certain OD, more chips need to be arranged to achieve the predetermined display effect in order to make the display device become light and thin, resulting in a significant increase in the cost of the display device is solved.

[0032] ​In an embodiment, the substrate 1 is provided with a light emitting circuit, and the plurality of light emitting units 3 are electrically connected to the light emitting circuit, and the plurality of light emitting units 3 are driven to emit light by the light emitting circuit.

[0033] Specifically, in the embodiment, the substrate 1 is provided with a light emitting circuit, and the plurality of light emitting units 3 are arranged on the substrate 1 and electrically connected to the light emitting circuit; the light emitting units 3 can be soldered on the substrate 1 by flip-chip technology, and the light emitting front surface 31 of the light emitting unit 3 emits white light by driving of the light emitting circuit on the substrate 1.

[0034] In an embodiment, the light emitting unit 3 comprises: an LED chip; and a lens layer 32 covering the LED chip.

[0035] Specifically, in the embodiment, the lens layer 32 can cover the LED chip without gap, and the lens layer 32 can provide bottom support for the LED chip arranged obliquely, so that the connection between the LED chip and the substrate 1 is more stable. The lens layer 32 can diffuse and propagate the light emitted by the LED chip.

[0036] In an embodiment, the light emitting unit 3 further comprises: a fluorescent layer 33 covering the lens layer 32; a diffusion layer 34 covering the fluorescent layer 33; and an emission layer 35 covering the diffusion layer 34.

[0037] Specifically, in the embodiment, the light emitting unit 3 comprises the LED chip, the lens layer 32, the fluorescent layer 33, the diffusion layer 34 and the emission layer 35. The LED chip can be packaged with the lens layer 32 by CSP packaging technology. The shape of the lens layer 32 can be reasonably set according to the light diffusion effect. The lens layer 32 can cover the LED chip without gap.

[0038] The fluorescent layer 33 is arranged on the surface of the lens layer 32, and the fluorescent layer 33 can completely cover the lens layer 32. The diffusion layer 34 is arranged on the surface of the fluorescent layer 33, and the emission layer 35 is arranged on the surface of the diffusion layer 34.

[0039] Part of the light emitted from the front surface of the LED chip is refracted and sequentially transmitted through the lens layer 32, the fluorescent layer 33, the diffusion layer 34 and the emission layer 35 and emitted from the front surface of the LED chip; and the other part of the light is refracted back to the lens layer 32 by the fluorescent layer 33, the diffusion layer 34 and the emission layer 35 and directly emitted from the side surface of the LED chip. After multiple refraction and reflection, the light emitted by the LED chip is uniformly diffused outward.

[0040] In an embodiment, the outer surface of the lens layer 32 is a curved surface with an arc. The curved surface includes a first arc surface 322 and a second arc surface 324, the first arc surface 322 is connected with the second arc surface 324, and a concave valley structure 323 is formed at the connection. The curved surface also includes a first vertical surface 321 and a second vertical surface 325, the first vertical surface 321 is connected with the first arc surface 322, and the second vertical surface 325 is connected with the second arc surface 324.

[0041] Specifically, in the embodiment, the outer surface of the lens layer 32 includes the first arc surface 322 and the second arc surface 324, which can be integrally formed and have a circular arc shape. Thus, the first arc surface 322 and the second arc surface 324 are connected to form the concave valley structure 323, and the light emitting unit 3 is arranged inside the lens layer 32 and located at the middle position of the concave valley structure 323. The lens layer 32 forms two convex lens structures on both sides of the light emitting unit 3, so that the light beam angle of the light emitting unit 3 can be further opened by the first arc surface 322 and the second arc surface 324, and the backlight module has a larger light emitting angle.

[0042] In an embodiment, the light diffusion plate 2 is in contact with the plurality of light emitting units 3.

[0043] Specifically, in the embodiment, the light diffusion plate 2 can also be in contact with the plurality of light emitting units 3, that is, the light diffusion plate 2 is arranged on the plurality of light emitting units 3. In this case, the distance OD is the shortest, that is, the distance OD is equal to the thickness of the lens layer 32, the fluorescent layer 33, the diffusion layer 34, and the emission layer 35 encapsulated on the LED chip. This makes the display device more lightweight.

[0044] In addition, the application also provides a display device including the backlight module as described above.

[0045] Specifically, in the embodiment, the display device can include a housing and a backlight module fixedly arranged on the housing. The backlight module includes a substrate 1, a light diffusion plate 2, and a plurality of light emitting units 3. The light diffusion plate 2 is arranged parallel to the substrate 1. The light emitting front surface 31 of each light emitting unit 3 in the plurality of light emitting units 3 is arranged obliquely on the substrate 1, and the light emitted from the light emitting front surface 31 is projected on the light diffusion plate 2. The plurality of light emitting units 3 are arranged at intervals, and the light emitted from the light emitting front surface 31 of the adjacent light emitting units 3 has overlapping parts on the light diffusion plate 2.

[0046] The plurality of light emitting units 3 are arranged at intervals, and the light emitting front surface 31 of each light emitting unit 3 is arranged obliquely on the substrate 1. The light emitted from the light emitting front surface 31 of the light emitting unit 3 is projected on the light diffusion plate 2 to form a plurality of light spots. The light emitted from the light emitting front surface 31 of adjacent light emitting units 3 is projected on the light diffusion plate 2 to form light spots that overlap each other. That is, the light spots projected on the light diffusion plate 2 by adjacent light emitting units 3 can compensate for each other, thereby improving the display effect.

[0047] The plurality of light emitting units 3 arranged obliquely have an included angle with the light diffusion plate 2. The light spot projected on the light diffusion plate 2 by the light emitting unit 3 arranged obliquely is larger than the light spot projected on the light diffusion plate 2 by the light emitting unit 3 arranged parallel to the light diffusion plate 2. Therefore, the light spot projected on the light diffusion plate 2 by the light emitting unit 3 arranged obliquely has a larger area. For the same area of the light diffusion plate 2, fewer light emitting units 3 can be arranged to meet the actual needs, thereby reducing the manufacturing cost.

[0048] The light emitted from the light emitting front surface 31 of adjacent light emitting units 3 is projected on the light diffusion plate 2 to form light spots that overlap each other. That is, the chips of the backlight module emit light obliquely forward, and the light spots between the plurality of chips compensate for each other. In the case of the same OD, the light spot formed after oblique light emission is larger, thereby reducing the number of chips used and saving the manufacturing cost. In the prior art, in order to make the display device thin and light, more chips need to be arranged to achieve the predetermined display effect under the condition of a certain OD, which significantly increases the cost of the display device.

[0049] It can be understood that the substrate 1 is provided with a light emitting circuit, the plurality of light emitting units 3 are electrically connected to the light emitting circuit, and the plurality of light emitting units 3 are driven to emit light by the light emitting circuit. The light emitting unit 3 can be soldered on the substrate 1 by flip-chip technology. The light emitting front surface 31 of the light emitting unit 3 emits white light by the driving of the light emitting circuit on the substrate 1.

[0050] The light emitting unit 3 includes an LED chip, a lens layer 32, a fluorescent layer 33, a diffusion layer 34, and an emission layer 35. The LED chip can be packaged with the lens layer 32 by CSP packaging technology. The lens layer 32 covers the LED chip. The shape of the lens layer 32 can be reasonably set according to the light diffusion effect. The lens layer 32 can cover the LED chip without gaps. The lens layer 32 can provide bottom support for the obliquely arranged LED chip to make the connection between the LED chip and the substrate 1 more stable. The lens layer 32 can diffuse and propagate the light emitted by the LED chip. The fluorescent layer 33 covers the lens layer 32; the diffusion layer 34 covers the fluorescent layer 33; and the emission layer 35 covers the diffusion layer 34.

[0051] Part of the light emitted from the front of the LED chip passes through refraction, and then passes through the lens layer 32, the fluorescent layer 33, the diffusion layer 34 and the emission layer 35 from the front of the LED chip; and another part of the light is refracted back to the lens layer 32 by the fluorescent layer 33, the diffusion layer 34 and the emission layer 35, and directly emitted from the side of the LED chip. After multiple refraction and reflection, the light emitted by the LED chip is uniformly diffused outward.

[0052] The outer surface of the lens layer 32 is a curved surface with an arc line. The outer surface of the lens layer 32 includes a first arc surface 322 and a second arc surface 324, which can be integrally formed, and the surfaces of the two arc surfaces can be circularly arc-shaped. Therefore, the first arc surface 322 and the second arc surface 324 are connected to form a concave valley structure 323, and the light emitting unit 3 is arranged inside the lens layer 32 and located at the middle position of the concave valley structure 323. The lens layer 32 forms two convex lens structures on both sides of the light emitting unit 3, so that the beam angle of the light emitting unit 3 can be further opened by the first arc surface 322 and the second arc surface 324, so that the backlight module has a larger light emitting angle.

[0053] The light diffusion plate 2 can also be connected in contact with the plurality of light emitting units 3, that is, the light diffusion plate 2 is pressed on the plurality of light emitting units 3, at this time, the distance of OD is the shortest, that is, the distance of OD is equal to the thickness of the lens layer 32, the fluorescent layer 33, the diffusion layer 34 and the emission layer 35 encapsulated on the LED chip. So that the display device is more light and thin.

[0054] The display device provided in the embodiment is provided with a plurality of light emitting units 3 which are arranged on the substrate 1 in an inclined manner, and the light emitted from the light emitting front surface 31 of the adjacent light emitting unit 3 has an overlapping part on the light diffusion plate 2, that is, the chip of the backlight module emits light to the obliquely front direction, and the light spots between the plurality of chips are compensated, and under the same OD, the light spot formed after the oblique light emission is larger, thereby reducing the number of chips used and saving the manufacturing cost. The technical problem that in the prior art, in order to make the display device become light and thin, more chips need to be arranged under the condition of a certain OD to achieve the predetermined display effect, resulting in a significant increase in the cost of the display device is solved.

[0055] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A backlight module, characterized in that, The application relates to a backlight module. The backlight module comprises: a substrate; a light diffusion plate arranged in parallel with the substrate; a plurality of light-emitting units, each of which is arranged on the substrate with a light-emitting front surface inclined, and light emitted from the light-emitting front surface is projected on the light diffusion plate; 2. The backlight module of claim 1, wherein, wherein the plurality of light-emitting units are arranged at intervals, and the light emitted from the light-emitting front surfaces of adjacent light-emitting units has overlapping parts on the light diffusion plate.

3. The backlight module of claim 1, wherein, The substrate is provided with a light-emitting circuit, the plurality of light-emitting units are electrically connected with the light-emitting circuit, and the plurality of light-emitting units are driven to emit light by the light-emitting circuit. The light-emitting unit comprises: an LED chip; 4. The backlight module of claim 3, wherein, a lens layer covering the LED chip.

5. The backlight module of claim 3, wherein, The lens layer is arranged without a gap with the LED chip. The light-emitting unit further comprises: a fluorescent layer covering the lens layer; a diffusion layer covering the fluorescent layer; 6. The backlight module of any one of claims 3-5, wherein, a reflective layer covering the diffusion layer.

7. The backlight module of claim 6, wherein, An outer surface of the lens layer is a curved surface with an arc line.

8. The backlight module of claim 7, wherein, The curved surface comprises a first arc surface and a second arc surface, the first arc surface is connected with the second arc surface, and a concave valley structure is formed at the connection.

9. The backlight module of claim 1, wherein, The curved surface further comprises a first vertical surface and a second vertical surface, the first vertical surface is connected with the first arc surface, and the second vertical surface is connected with the second arc surface.

10. A display device, characterized by comprising: The light diffusion plate is in contact with the plurality of light-emitting units. The backlight module comprises any one of claims 1-9.

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