Data processing core board of microcontroller unit

Abstract

The utility model discloses a data processing core board of a microcontroller unit. The data processing core board comprises a microprocessor, a power switching circuit SMPS, a pseudo static random access memory PSRAM, a serial FLASH, a temperature sensor and an ST-LINK downloading and debugging interface which are all welded on a PCB. The data processing core board is high in integration level, low in cost and high in data sampling rate and processing speed, system complexity can be remarkably reduced, and the data processing core board is suitable for various data acquisition and processing scenes.

Description

TECHNICAL FIELD

[0001] The utility model relates to core board technical field, and more particularly, a kind of microcontroller unit's data processing core board. BACKGROUND

[0002] With the development of information technology, more and more measurement and control equipment rely on high-speed data processing capability's analog-digital conversion chip, microprocessor chip.Usually, the hardware circuit cost of meeting such demand is higher, and PCB area is large.The traditional microprocessor core board is more concerned with the design of digital circuit, and it is difficult to adapt to the needs of analog data acquisition and processing of analog-digital conversion type.

[0003] Therefore, it is urgent to develop a kind of high-performance, high-integration, low-cost data processing core board. SUMMARY

[0004] The utility model provides a kind of microcontroller unit's data processing core board to solve the problem that core board needs high-speed data acquisition and processing.

[0005] In order to solve the above problems, according to an aspect of the utility model, a kind of microcontroller unit's data processing core board is provided, the data processing core board includes: microprocessor, power conversion circuit SMPS, pseudo-static random access memory PSRAM, serial FLASH, temperature sensor, ST-LINK download and debugging interface welded on PCB board;Wherein, the power conversion circuit SMPS, pseudo-static random access memory PSRAM, serial FLASH and temperature sensor are connected with the microprocessor;

[0006] The power conversion circuit SMPS is used to provide power supply for the microprocessor;

[0007] The pseudo-static random access memory PSRAM is used to store the data exceeding the RAM capacity of the microprocessor;

[0008] The serial FLASH is used to store the program and non-volatile data exceeding the storage capacity of the microprocessor;

[0009] The temperature sensor is used to detect the ambient temperature of data processing core board;

[0010] The ST-LINK download and debugging interface is used to download program to microprocessor, and complete software debugging in combination with software.

[0011] Preferably, wherein two-way 16-bit differential ADC is integrated in the microprocessor, for high-speed data acquisition of 3.6M sampling rate.

[0012] Preferably, wherein the data processing core board further comprises:

[0013] An analog circuit edge interface connected to the microprocessor, the analog circuit edge interface is connected to two ADCs of the microprocessor through two-way ADC differential input leads, and the microprocessor is connected to the analog circuit edge interface through two-way DAC output leads.

[0014] Preferably, wherein the PCB board is 6 layers, the ADC differential input leads are located in the 4th layer of the PCB board, and equal-length wiring is adopted, the fourth layer is surrounded by the ground layer of the second layer, the power layer of the third layer and the ground layer of the fifth layer; at the analog circuit edge interface, the differential input access points of each group of ADCs are separated by analog ground access points.

[0015] Preferably, wherein the two-way DAC is connected to the in-phase input of two operational amplifiers in the microprocessor, and the two operational amplifiers are in voltage follower mode, so that the DAC output can provide a bias voltage that can be adjusted and set by software for other amplification circuits outside the data processing core board.

[0016] Preferably, wherein the analog circuit edge interface further comprises an analog power supply interface and a reference power supply interface, the analog power supply interface is connected to the microprocessor through an analog power supply lead, and the reference power supply interface is connected to the microprocessor through a reference power supply lead.

[0017] Preferably, wherein the data processing core board further comprises a digital circuit edge interface connected to the microprocessor;

[0018] Among them, the microprocessor leads out 3 groups of SPI to the digital circuit edge interface, 2 groups of SPI have a common CLK lead;

[0019] The digital circuit edge interface is provided with a CAN bus interface connected to the microprocessor through the CAN bus.

[0020] Preferably, wherein the temperature sensor is connected to the microprocessor through an I 2C bus.

[0021] Preferably, wherein the data processing core board further comprises a debugging element connected to the microprocessor, and the debugging element comprises a USART debugging interface.

[0022] Preferably, wherein the microprocessor is STM32H730I BK6Q.

[0023] The utility model provides a kind of data processing core board of microcontroller unit, the data processing core board includes: microprocessor, power conversion circuit SMPS, pseudo static random access memory PSRAM, serial FLASH, temperature sensor, ST-LINK download and debugging interface that are all welded on PCB board.The data processing core board of the utility model has high integration, low cost and higher data sampling rate and processing speed, can significantly reduce system complexity, applicable to a variety of data acquisition and processing scene. BRIEF DESCRIPTION OF DRAWINGS

[0024] The exemplary embodiments of the utility model can be more completely understood by referring to the following drawings:

[0025] Figure 1 It is structure diagram of data processing core board 100 of microcontroller unit according to the utility model embodiment;

[0026] Figure 2 It is circuit principle block diagram of data processing core board of microcontroller unit according to the utility model embodiment. DETAILED DESCRIPTION

[0027] Now refer to the drawings to introduce the exemplary embodiments of the utility model, however, the utility model can be implemented in many different forms, and it is not limited to the embodiments described here, and these embodiments are provided to thoroughly and completely disclose the utility model, and fully convey the scope of the utility model to the person skilled in the art. The terms in the exemplary embodiments shown in the drawings are not limited to the utility model. In the drawings, the same units / elements use the same reference numerals.

[0028] Unless otherwise specified, the terms used here (including scientific and technical terms) have the meaning commonly understood by the person skilled in the art. In addition, it can be understood that the terms defined in the commonly used dictionary should be understood as having a consistent meaning in the context of its related field, and should not be understood as idealized or overly formal meaning.

[0029] The utility model aims at providing a kind of high integration, low cost, function extension flexible special data acquisition and processing's data processing core board, this core board is realized based on STM32H730 IBK6Q, applicable to the application scene needing higher data sampling rate, high-speed data processing and high-precision signal processing, with the characteristics of fast processing speed, high integration, low cost.

[0030] Figure 1 It is structure diagram of data processing core board 100 of microcontroller unit according to the utility model embodiment. As Figure 1As shown, the data processing core board of the microcontroller unit provided by the utility model implementation mode, include: all welding on the microprocessor 101 of PCB board, power conversion circuit SMPS 102, pseudo static random access memory PSRAM 103, serial FLASH 104, temperature sensor 105, ST-LINK download and debugging interface 106, wherein, the power conversion circuit SMPS, pseudo static random access memory PSRAM, serial FLASH and temperature sensor are connected with the microprocessor.

[0031] Preferably, the power conversion circuit SMPS 102 is used to provide power for the microprocessor.

[0032] Preferably, the pseudo static random access memory PSRAM 103 is used to store data exceeding the RAM capacity of the microprocessor.

[0033] Preferably, the serial FLASH 104 is used to store programs and non-volatile data exceeding the storage capacity of the microprocessor.

[0034] Preferably, the temperature sensor 105 is used to detect the ambient temperature of the data processing core board.

[0035] Preferably, the ST-LINK download and debugging interface 106 is used to download programs to the microprocessor and complete software debugging in combination with software.

[0036] Preferably, two 16-bit differential ADCs are integrated in the microprocessor, which are used for high-speed data acquisition at a sampling rate of 3.6M.

[0037] Preferably, the data processing core board further comprises:

[0038] An analog circuit edge interface connected to the microprocessor, the analog circuit edge interface is connected to two ADCs of the microprocessor through two-way ADC differential input leads, and the microprocessor is connected to the analog circuit edge interface through two-way DAC output leads.

[0039] Preferably, the PCB board is 6 layers, the ADC differential input leads are located in the 4th layer of the PCB board, and equal-length wiring is adopted, the fourth layer is surrounded by the ground layer of the second layer, the power layer of the third layer and the ground layer of the fifth layer; at the analog circuit edge interface, the differential input access point of each group of ADCs is separated by an analog ground access point.

[0040] Preferably, the two-way DAC is connected to the in-phase input of two operational amplifiers in the microprocessor, and the two operational amplifiers are in voltage follower mode, so that the DAC output can provide a bias voltage that can be adjusted and set by software to the other amplification circuit outside the data processing core board.

[0041] Preferably, the analog circuit edge interface further comprises an analog power supply interface and a reference power supply interface, the analog power supply interface is connected to the microprocessor through an analog power supply lead, and the reference power supply interface is connected to the microprocessor through a reference power supply lead.

[0042] Preferably, the data processing core board further comprises a digital circuit edge interface connected to the microprocessor.

[0043] The microprocessor leads out three groups of SPI to the digital circuit edge interface, and two groups of SPI share a CLK lead.

[0044] The digital circuit edge interface is provided with a CAN bus interface connected to the microprocessor through the CAN bus.

[0045] Preferably, the temperature sensor is connected to the microprocessor through an I 2 C bus.

[0046] Preferably, the data processing core board further comprises a debugging element connected to the microprocessor, and the debugging element comprises a USART debugging interface.

[0047] Preferably, the microprocessor is STM32H730 I BK6Q.

[0048] In combination Figure 2 The utility model relates to microprocessor, pseudo static random access memory PSRAM, serial FLASH, temperature sensor, SMPS power conversion circuit, CAN bus, ST-LINK download and debugging interface, USART debugging interface, debugging element, fixing hole, 6 layer PCB of type STM32H730 I BK6Q.

[0049] The microcontroller is the core of data processing; the PSRAM is used for processing data exceeding the RAM capacity of the microprocessor itself; the FLASH is used for storing programs and non-volatile data exceeding the storage capacity of the microprocessor itself; the temperature sensor is used for detecting the ambient temperature of the core board; the SMPS power conversion circuit provides power supply for the core of the microprocessor; the CAN bus is used for realizing cooperative collection and processing of data by multiple core boards; the ST-LINK download and debugging interface is used for downloading programs to the MCU, and the debugging tool software is used for completing the debugging of the MCU application software; the debugging elements include the USART debugging interface, which can output the debugging results in cooperation with the debugging tool software; other debugging elements ensure that the core board becomes the minimum system of basic data collection and test functions; the edge interface is used for leading out or inputting the MCU and other functional modules on the core board, and can be used for connecting other functional circuit boards through pins or direct welding in actual applications; and the 6-layer PCB is used for welding and carrying the circuit elements of the core board, and provides lines for the connection of various elements.

[0050] In the utility model, the microcontroller unit model number is STM32H730 IBK6Q, the chip is the core of data processing, utilizes its hardware CORDIC function to promote data processing speed, and utilizes its FMAC to improve the precision and data processing speed of collected data.

[0051] In the utility model, the microprocessor of STM32H730 IBK6Q model number completes high speed analog-digital conversion through 2 16-bit ADCs in the chip, utilizes the CORDIC function integrated in the chip to promote data processing speed, utilizes FMAC to improve the precision and processing speed of collected data, is connected into differential input mode through the PCB, and is connected with other PCBs through the pin / stamp hole dual mode interface of the PCB edge.

[0052] The 1 12-bit ADC (analog-digital conversion unit) in the microprocessor is connected to the direct and fast pin of the microprocessor, is connected into differential input mode through the PCB, and is connected with other PCBs through the pin / stamp hole dual mode interface of the PCB edge.

[0053] The differential circuit of the ADC in the microprocessor and the PCB edge pin is arranged on the 4th layer of the 6-layer PCB, and the layer is surrounded by the 2nd layer ground layer, the 3rd layer power supply layer and the 5th layer ground layer.Equivalent length differential lines connect the input pin of the ADC (analog-digital conversion unit) in the chip and the data collection core board interface; the edge interface connected by each group of differential input lines is separated by analog ground lines to reduce the noise interference introduced by the differential input lines.In the 4th layer and other layers, the input differential signals of the ADC are surrounded by the shielding layer connected with the analog ground.

[0054] Combination Figure 2 As shown in the utility model, 3 groups of SPI are led out to the digital circuit edge interface by the microprocessor, 2 groups of SPI have shared CLK lead lines, and the high-speed and high-precision ADC of the SPI interface of the shared CLK clock line is facilitated.

[0055] In the utility model, the output of 2-way MCU on-chip DAC (digital analog conversion unit) is led out through the analog circuit interface. The output of the DAC is connected to the non-inverting input of two operational amplifiers in the MCU through software setting, and the two operations are set to voltage follower mode through software setting. The DAC output will provide 2-way other amplification circuit outside the core board with a software-adjustable and set bias voltage.

[0056] The analog circuit edge interface and the data circuit edge interface are located on different edges of the PCB board. The analog circuit edge interface includes 2 groups of differential input ADC interface, and 1-way differential input interface is connected with the 12-bit ADC in the microprocessor. The analog circuit edge interface also reserves an analog power supply interface and a high-precision reference power supply interface for on-chip ADC.

[0057] The digital circuit edge interface reserves a CAN bus interface to realize more-way data acquisition and data collaborative processing of multiple MCUs.

[0058] The analog circuit edge interface and the digital circuit edge interface are dual-mode of stamp hole and pin hole, can be welded with 1.27mm pin and other functional circuit, or directly welded with other circuit board through stamp hole. These edge interfaces are distributed on three edges of the core board, and the edge interface of one edge is specially provided for the external interface of the analog circuit.

[0059] In the utility model, the PSRAM is connected to the microprocessor through the Octo-SPI interface on the PCB to process data exceeding the RAM capacity of the microprocessor itself, and meet the demand of large data processing. Since the Octo-SPI interface is adopted, a larger capacity chip can be replaced in the production link without changing the PCB circuit, and the demand of more data processing is met.

[0060] In the utility model, the FLASH is connected to the microprocessor through the Dua l-Quard SPI and Octo-SPI hardware compatible interface on the PCB to store programs and non-volatile data exceeding the storage capacity of the microprocessor itself. Since the Dua l-Quard SPI and Octo-SPI hardware compatible interface are adopted, a larger capacity chip can be replaced in the production link without changing the PCB circuit, and the storage demand of more programs and non-volatile data is met.

[0061] In the utility model, temperature sensor is connected to microprocessor by the line on PCB with I 2C bus interface, is used to detect the environment temperature of core board, can better combine software to realize the temperature compensation of ADC data according to the core board environment temperature detected by temperature sensor and the MCU temperature of MCU piece temperature sensor, improves the precision of the data of collection.

[0062] In the utility model, SMPS power conversion circuit provides power supply for the core of microprocessor, can reduce the overall energy consumption and chip temperature of microprocessor.

[0063] In the utility model, debugging element includes USART debugging interface, can cooperate with debugging tool software and output debugging result, other debugging elements can guarantee that core board becomes the minimum system containing basic data acquisition test function, facilitates software debugging, can not have to weld these debugging elements in the production stage after debugging.

[0064] In the utility model, fixed hole is used for circuit board insertion, and core board and other circuit boards can be reliably fixed with stud, screw.

[0065] 6 layer PCB is used to weld and carry core board circuit element, provides line for the connection of each element, and its size is 35mm*28mm.

[0066] The core board of the utility model utilizes two-way 16-bit differential ADC integrated in STM32H730I BK6Q piece, can realize 3.6M sampling rate high-speed data acquisition, and the real-time performance and accuracy of data acquisition are improved significantly. Meanwhile, core board adopts SMPS power conversion circuit to further reduce the power consumption of MCU core, is suitable for long time continuous work.

[0067] The core board can utilize the hardware CORD I C function and FMAC function of MCU when software programming, speeds up signal processing speed, improves the precision of collected data, and improves the efficiency and real-time performance of signal processing. The design of core board also includes a PSRAM and double FLASH memory, and rich input / output interface, communication interface, debugging interface, to adapt to various data processing scenes.

[0068] Compared with prior art, the utility model has the following advantages:

[0069] The two 16-bit differential ADCs integrated in the MCU are used to realize the 3.6M sampling rate of the core board, improve the real-time performance and accuracy of data acquisition, have low power consumption, are suitable for long-time continuous work, have high integration, reduce external components and system complexity, are suitable for various data processing scenes, have high precision, provide higher signal resolution and measurement accuracy, and utilize the CORDIC function of the MCU to accelerate the signal processing speed of Fourier transform, wavelet transform and the like, and meet the high-speed data processing requirement.

[0070] The utility model has been described by referring to a small number of embodiments. However, it is well known to those skilled in the art that, as defined in the attached patent claims, other embodiments in addition to the above disclosure of the utility model fall within the scope of the utility model.

[0071] Generally, all terms used in the claims are interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise in the specification. All references to “a” or “an” or “the” [item] are to be construed as referring to one or more instances of the item, unless otherwise indicated by context. The steps of any method disclosed herein need not be performed in the exact order disclosed, unless explicitly stated.

[0072] In the description of the utility model, the terms “upper”, “lower”, “left”, “right”, “inner”, “outer” and the like indicate the direction or positional relationship terms based on the direction or positional relationship shown in the drawings, which are merely for the convenience of description, and do not indicate or imply that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0073] In the description of the utility model, unless otherwise explicitly specified and limited, the terms “mounting”, “connection” and “connection” should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium; can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0074] Finally, it should be noted that: the above examples are only used to illustrate the technical scheme of the utility model and not to limit it, although the utility model has been described in detail with reference to the above examples, those skilled in the art should understand that: the specific implementation of the utility model can still be modified or replaced, and any modification or equivalent replacement without departing from the spirit and scope of the utility model should be covered in the protection scope of the claims of the utility model.

Claims

1. A data processing core board of a microcontroller unit, characterized in that, The data processing core board comprises: a microprocessor, a power conversion circuit SMPS, a pseudo-static random access memory PSRAM, a serial FLASH, a temperature sensor and an ST-LINK download and debugging interface which are all welded on a PCB board; wherein the power conversion circuit SMPS, the pseudo-static random access memory PSRAM, the serial FLASH and the temperature sensor are all connected with the microprocessor; The power conversion circuit SMPS is used for providing power supply for the microprocessor. The pseudo-static random access memory PSRAM is used for storing data exceeding the RAM capacity of the microprocessor. The serial FLASH is used for storing programs and non-volatile data exceeding the storage capacity of the microprocessor. The temperature sensor is used for detecting the ambient temperature of the data processing core board. The ST-LINK download and debugging interface is used for downloading programs to the microprocessor and completing software debugging in combination with software.

2. The data processing core board according to claim 1, characterized in that, The microprocessor is internally integrated with two-way 16-bit differential ADCs, which are used for high-speed data acquisition at a sampling rate of 3.6M.

3. The data processing core board according to claim 2, characterized in that, The data processing core board further comprises: An analog circuit edge interface connected with the microprocessor, wherein the analog circuit edge interface is connected to two ADCs of the microprocessor through two-way ADC differential input leads, and the microprocessor is connected to the analog circuit edge interface through two-way DAC output leads.

4. The data processing core board according to claim 3, characterized in that, The PCB board is 6 layers, the ADC differential input leads are located on the fourth layer of the PCB board, and equal-length wiring is adopted, and the fourth layer is surrounded by the second layer of ground layer, the third layer of power supply layer and the fifth layer of ground layer; at the analog circuit edge interface, the differential input access points of each group of ADCs are separated by analog ground access points.

5. The data processing core board according to claim 3, characterized in that, Two-way DACs are connected with the non-inverting inputs of two operational amplifiers in the microprocessor, and the two operational amplifiers are in voltage follower mode, so that the DAC output can provide a bias voltage which can be adjusted and set by software for other amplification circuits outside the data processing core board.

6. The data processing core board according to claim 3, characterized in that The analog circuit edge interface further comprises: an analog power supply interface and a reference power supply interface, wherein the analog power supply interface is connected with the microprocessor through an analog power supply lead, and the reference power supply interface is connected with the microprocessor through a reference power supply lead.

7. The data processing core board of claim 1, wherein, The data processing core board further comprises: a digital circuit edge interface connected with the microprocessor; Among them, the microprocessor leads out three groups of SPI to the digital circuit edge interface, and two groups of SPI have a shared CLK lead; The digital circuit edge interface is provided with a CAN bus interface and is connected with the microprocessor through the CAN bus.

8. The data processing core board of claim 1, wherein, The temperature sensor is connected with the microprocessor through an I2C bus.

9. The data processing core board of claim 1, wherein, The data processing core board further comprises: a debugging element connected with the microprocessor, wherein the debugging element comprises: a USART debugging interface.

10. The data processing core board according to claim 1, characterized in that, The microprocessor is STM32H730IBK6Q.

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