Electronic device, circuit board and electronic equipment

Abstract

The embodiment of the utility model provides an electronic device, a circuit board and electronic equipment, and the electronic device comprises at least two element bodies and at least two groups of lead-out electrode assemblies. The element bodies are sequentially stacked in the height direction of the electronic device, and the element bodies are electrically connected with the export electrode assemblies in a one-to-one correspondence mode; the at least two element bodies comprise a first element body and a second element body, the first element body is a first capacitor or a first inductor, and the second element body is a second capacitor or a second inductor.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device design, and in particular to an electronic device, a circuit board and an electronic equipment. BACKGROUND

[0002] With the continuous progress of technology, consumers have higher and higher requirements for the compactness of electronic equipment. Reducing the size of the circuit board is a solution to improve the compactness of electronic equipment. The circuit board includes a substrate and various electronic devices. Among them, the electronic devices include inductors, capacitors and the like. Since each electronic device needs to occupy a corresponding arrangement area, it is difficult to further compress the size of the circuit board, thereby making it difficult to further improve the compactness of the electronic equipment. CONTENT OF THE UTILITY MODEL

[0003] The electronic device, the circuit board and the electronic equipment provided by the embodiments of the present application solve the problem of how to improve the compactness of the electronic device on the circuit board.

[0004] In order to solve the above technical problem, the present application is implemented as follows:

[0005] In a first aspect, the embodiments of the present application provide an electronic device.

[0006] The electronic device provided by the embodiments of the present application includes at least two element bodies and at least two groups of lead-out electrode assemblies; the element bodies are sequentially stacked along the height direction of the electronic device, and each element body is electrically connected to a group of lead-out electrode assemblies in one-to-one correspondence; the at least two element bodies include a first element body and a second element body, the first element body is a first capacitor or a first inductor, and the second element body is a second capacitor or a second inductor.

[0007] Optionally, the at least two groups of lead-out electrode assemblies include a first lead-out electrode assembly and a second lead-out electrode assembly, the first lead-out electrode assembly includes a first sub-lead-out electrode and a second sub-lead-out electrode, and the second lead-out electrode assembly includes a third sub-lead-out electrode and a fourth sub-lead-out electrode; the first element body is electrically connected to the first sub-lead-out electrode and the second sub-lead-out electrode, respectively, and the second element body is electrically connected to the third sub-lead-out electrode and the fourth sub-lead-out electrode, respectively.

[0008] Optionally, the first element body is located below the second element body along a height direction of the electronic device; the first element body comprises a plurality of first pieces stacked, each of the first pieces comprising a first insulating base and a first conductor layer, the first conductor layer being arranged on one side of the first insulating base along a thickness direction of the first insulating base; the first conductor layer comprises a first sub-conductor portion, a second sub-conductor portion and a third sub-conductor portion separated by insulation, the first sub-conductor portion being electrically connected to the first lead-out electrode assembly; a first side of the second sub-conductor portion is exposed to an outer surface of the first element body, a second side of the third sub-conductor portion is exposed to the outer surface of the first element body, the third sub-lead-out electrode is connected to the first side, and the fourth sub-lead-out electrode is connected to the second side.

[0009] Optionally, the first element body is a first capacitor, and each of the first sub-conductor portions is electrically connected to one of the first sub-lead-out electrode and the second sub-lead-out electrode in turn and alternately.

[0010] Optionally, the first element body is a first inductor, and each of the first sub-conductor portions is connected in series in turn and end to end to form a first spiral body, wherein the first insulating base between two adjacent first sub-conductor portions is embedded with a first electrical connector, and two ends of the first electrical connector are connected to the first sub-conductor portions adjacent thereto along a thickness direction of the first insulating base; one end of the first spiral body is connected to the first sub-lead-out electrode, and the other end of the first spiral body is electrically connected to the second sub-lead-out electrode.

[0011] Optionally, the second element body comprises a plurality of second pieces stacked, each of the second pieces comprising a second insulating base and a second conductor layer, the second conductor layer being arranged on one side of the second insulating base along a thickness direction of the second insulating base; the second conductor layer comprises a fourth sub-conductor portion, and the fourth sub-conductor portion is electrically connected to the second lead-out electrode assembly.

[0012] Optionally, the second element body is a second capacitor, and each of the fourth sub-conductor portions is electrically connected to one of the third sub-lead-out electrode and the fourth sub-lead-out electrode in turn and alternately.

[0013] Optionally, the second element body is a second inductor, and each of the fourth sub-conductor portions is connected in series in turn and end to end to form a second spiral body, wherein the second insulating base between two adjacent fourth sub-conductor portions is embedded with a second electrical connector, and two ends of the second electrical connector are connected to the fourth sub-conductor portions adjacent thereto along a thickness direction of the second insulating base; one end of the second spiral body is connected to the third sub-lead-out electrode, and the other end of the second spiral body is electrically connected to the fourth sub-lead-out electrode.

[0014] In a second aspect, an embodiment of the present application provides a circuit board.

[0015] The circuit board provided by the embodiment of the present application comprises a substrate and any one of the electronic devices provided by the embodiment of the present application, and the electronic device is fixed and electrically connected to the substrate.

[0016] In a third aspect, an embodiment of the present application provides an electronic device.

[0017] The electronic device provided by the embodiment of the present application comprises any one of the circuit boards provided by the embodiment of the present application.

[0018] The above at least one technical scheme adopted by the embodiment of the present application can achieve the following beneficial effects:

[0019] In the embodiment of the present application, the element bodies of the electronic device are sequentially stacked along the height direction of the electronic device, so that the element arrangement density of the electronic device along the height direction can be improved, the area of the arrangement region required for arranging each element can be reduced, and the compactness of the electronic device can be improved. Furthermore, the size of the circuit board can be compressed, and the compactness of the electronic device can be improved.

[0020] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following description and the attached drawings. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the embodiments or the related art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0022] Figure 1 A top view of the first electronic device provided by the embodiment of the present application is shown in FIG. 1;

[0023] Figure 2 A top view of the second electronic device provided by the embodiment of the present application is shown in FIG. 2; Figure 1 A cross-sectional view along A-A of the electronic device shown in FIG. 1 is shown in FIG. 3;

[0024] Figure 3 A top view of the second electronic device provided by the embodiment of the present application is shown in FIG. 2;

[0025] Figure 4 A cross-sectional view along B-B of the second electronic device provided by the embodiment of the present application is shown in FIG. 4;

[0026] Figure 5A second electronic device according to an embodiment of the present application, along a C-C cross section;

[0027] Figure 6 A first exploded view of a first piece of a first element body according to an embodiment of the present application;

[0028] Figure 7 A first view of a first piece according to an embodiment of the present application;

[0029] Figure 8 A second view of a first piece according to an embodiment of the present application;

[0030] Figure 9 A first view of a second piece according to an embodiment of the present application;

[0031] Figure 10 A second view of a second piece according to an embodiment of the present application;

[0032] Figure 11 A third electronic device according to an embodiment of the present application, along a C-C cross section;

[0033] Figure 12 A first view of a third piece according to an embodiment of the present application;

[0034] Figure 13 A first view of a fourth piece according to an embodiment of the present application;

[0035] Figure 14 A fourth electronic device according to an embodiment of the present application, along a B-B cross section;

[0036] Figure 15 A fourth electronic device according to an embodiment of the present application, along a C-C cross section;

[0037] Figure 16 A second exploded view of a first piece of a first element body according to an embodiment of the present application;

[0038] Figure 17 A first view of a first helix according to an embodiment of the present application;

[0039] Figure 18 A second exploded view of a second piece of a second element body according to an embodiment of the present application;

[0040] Figure 19 A second view of a second helix according to an embodiment of the present application;

[0041] Figure 20 A view of a circuit board according to an embodiment of the present application.

[0042] Reference Signs List:

[0043] 1 - circuit board

[0044] 10 - electronic device; 10a - element body; 10b - lead-out electrode assembly

[0045] 11 - first element body; 110 - first sheet body; 111 - first insulating base; 112 - first conductor layer; 1120 - first spiral body; 1121 - first sub-conductor portion; 1122 - second sub-conductor portion; 1123 - third sub-conductor portion; 1124 - first side of second sub-conductor portion; 1125 - second side of third sub-conductor portion; 113 - first electrical connecting member

[0046] 12 - second element body; 120 - second sheet body; 121 - second insulating base; 122 - second conductor layer; 1220 - second spiral body; 1221 - fourth sub-conductor portion; 123 - second electrical connecting member

[0047] 13 - first lead-out electrode assembly; 131 - first sub-lead-out electrode; 132 - second sub-lead-out electrode

[0048] 14 - second lead-out electrode assembly; 141 - third sub-lead-out electrode; 142 - fourth sub-lead-out electrode

[0049] 20 - substrate DETAILED DESCRIPTION

[0050] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described clearly and completely below with reference to the embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0051] In the description of the present application, it should be noted that unless explicitly defined and limited, the terms “mounting”, “connection” and “linking” should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0052] In addition, although the terms used in the present application are selected from the commonly used terms, some terms mentioned in the specification of the present application may be selected by the applicant according to his or her judgment, and the detailed meanings of which are described in the relevant part of the description herein.

[0053] Furthermore, the present application is to be interpreted by the meaning of each term used and not by the actual term used.

[0054] The technical solutions provided by the embodiments of the present application are described in detail below with reference to the drawings.

[0055] The embodiments of the present application provide an electronic device. Referring to Figures 1 to 19 The electronic device 10 provided by the embodiments of the present application includes at least two element bodies 10a and at least two groups of lead-out electrode assemblies 10b.

[0056] The element bodies 10a are sequentially stacked in the height direction of the electronic device 10. It should be noted that, taking the example that the bottom of the electronic device 10 is welded to the substrate of the circuit board, the direction parallel to the thickness direction of the substrate is the height direction of the electronic device 10.

[0057] In the embodiments of the present application, the element bodies 10a are electrically connected to the groups of lead-out electrode assemblies 10b one by one. For example, in the case that the element bodies 10a are all capacitors and the number of the element bodies 10a is 4, the electronic device 10 includes four stacked independent capacitors. For example, the circuit related to the camera module of the electronic device needs to be provided with two capacitors, which can be connected to the circuit related to the camera module through the two groups of lead-out electrode assemblies 10b, so that the two capacitors located below are connected to the circuit related to the camera module. The circuit related to the charging function of the electronic device needs to be provided with two capacitors, which can be connected to the circuit related to the charging function through the other two groups of lead-out electrode assemblies 10b, so that the two capacitors located above are connected to the circuit related to the charging function.

[0058] Further, in the embodiments of the present application, the at least two element bodies 10a include a first element body 11 and a second element body 12. The first element body 11 is a first capacitor or a first inductor, and the second element body 12 is a second capacitor or a second inductor.

[0059] For example, in the case that the electronic device 10 includes two element bodies 10a, the electronic device 10 can specifically include a first capacitor and a second capacitor. Alternatively, the electronic device 10 can specifically include a first capacitor and a second inductor. Alternatively, the electronic device 10 can specifically include a first inductor and a second capacitor. Alternatively, the electronic device 10 can specifically include a first inductor and a second inductor.

[0060] In other words, the electronic device 10 can be a combination of multiple capacitors, or the electronic device 10 can be a combination of multiple inductors, or the electronic device 10 can be a combination of capacitors and inductors.

[0061] In this way, in the embodiments of the present application, the element bodies 10a of the electronic device 10 are arranged in sequence along the height direction of the electronic device 10, so that the arrangement density of the elements along the height direction of the electronic device 10 can be improved, and the area of the arrangement region required for arranging the elements can be reduced, and the compactness of the electronic device can be improved. Furthermore, the size of the circuit board can be compressed, and the compactness of the electronic device can be improved.

[0062] To facilitate the understanding of the scheme provided by the embodiments of the present application by those skilled in the art, hereinafter, the specific structure of the electronic device 10 will be briefly described mainly by taking an example of the electronic device 10 including two element bodies 10a.

[0063] Reference Figures 3 to 5 In some embodiments, the at least two groups of lead-out electrode assemblies 10b include a first lead-out electrode assembly 13 and a second lead-out electrode assembly 14. The first lead-out electrode assembly 13 includes a first sub-lead-out electrode 131 and a second sub-lead-out electrode 132. The second lead-out electrode assembly 14 includes a third sub-lead-out electrode 141 and a fourth sub-lead-out electrode 142. The first element body 11 is electrically connected to the first sub-lead-out electrode 131 and the second sub-lead-out electrode 132, respectively, and the second element body 12 is electrically connected to the third sub-lead-out electrode 141 and the fourth sub-lead-out electrode 142, respectively.

[0064] For example, the first element body 11 is a first capacitor, which includes a first positive plate and a first negative plate. The first positive plate is electrically connected to the first sub-lead-out electrode 131, and the first negative plate is electrically connected to the second sub-lead-out electrode 132. Similarly, the second element body 12 is a second capacitor, which includes a second positive plate and a second negative plate. The second positive plate is electrically connected to the third sub-lead-out electrode 141, and the second negative plate is electrically connected to the fourth sub-lead-out electrode 142.

[0065] In addition, similarly, the first element body 11 can be a first inductor, and the second element body 12 can be a second inductor, which will not be listed one by one here.

[0066] Reference Figure 4 Or Figure 5 In some embodiments, along the height direction of the electronic device 10, the first element body 11 is located below the second element body 12. Referring to Figures 4 to 6 The first element body 11 includes a plurality of first sheet bodies 110 arranged in sequence. Each first sheet body 110 includes a first insulating base body 111 and a first conductor layer 112. The first conductor layer 112 is arranged on one side of the first insulating base body 111 along the thickness direction of the first insulating base body 111.

[0067] Reference Figures 11 to 13The first conductor layer 112 includes first, second, and third sub-conductor portions 1121, 1122, and 1123, which are insulated and separated. The first sub-conductor portion 1121 is electrically connected to the first lead-out electrode assembly 13. A first side 1124 of the second sub-conductor portion 1122 is exposed to an outer surface of the first element body 11, and a second side 1125 of the third sub-conductor portion 1123 is exposed to the outer surface of the first element body 11. The third lead-out electrode 141 is connected to the first side 1124, and the fourth lead-out electrode 142 is connected to the second side 1125.

[0068] In this way, the third lead-out electrode 141 can be prevented from falling off by connecting the third lead-out electrode 141 to the first side 1124 of the second sub-conductor portion 1122. The fourth lead-out electrode 142 can be prevented from falling off by connecting the fourth lead-out electrode 142 to the second side 1125 of the third sub-conductor portion 1123.

[0069] In some embodiments, the first element body 11 is a first capacitor. Referring to Figure 4 、 Figures 6 to 8 、 Figure 12 and Figure 13 , each first sub-conductor portion 1121 is electrically connected to one of the first and second lead-out electrodes 131 and 132 in turn and alternately.

[0070] It should be noted that, referring to Figures 6 to 8 、 Figure 12 and Figure 13 , in some embodiments, the first conductor layer 112 can include only one sub-conductor portion. In other words, the first conductor layer 112 can include only the first sub-conductor portion 1121, and not include the second and third sub-conductor portions 1122 and 1123. Since the first conductor layer 112 can include only one sub-conductor portion, the first conductor layer 112 can be considered as a one-piece structure.

[0071] In the case where the first conductor layer 112 is a one-piece structure, each one-piece first conductor layer 112 is electrically connected to one of the first and second lead-out electrodes 131 and 132 in turn and alternately. Referring to Figure 4 、 Figures 6 to 8 For example, the first conductor layer 112 located at the lowermost layer is electrically connected to the second lead-out electrode 132, the first conductor layer 112 located at the second lowermost layer is electrically connected to the first lead-out electrode 131, and the first conductor layer 112 located at the third lowermost layer is electrically connected to the second lead-out electrode 132, and so on, so that each one-piece first conductor layer 112 is electrically connected to one of the first and second lead-out electrodes 131 and 132 in turn and alternately.

[0072] Similarly, in the case where the first conductor layer 112 includes the first sub-conductor portion 1121, the second sub-conductor portion 1122, and the third sub-conductor portion 1123 which are insulated and separated, for example, the first sub-conductor portion 1121 located at the lowermost layer is electrically connected to the second sub-extraction electrode 132, the first sub-conductor portion 1121 located at the second lowermost layer is electrically connected to the first sub-extraction electrode 131, the first sub-conductor portion 1121 located at the third lowermost layer is electrically connected to the second sub-extraction electrode 132, and so on, so that each first sub-conductor portion 1121 is alternately electrically connected to one of the first sub-extraction electrode 131 and the second sub-extraction electrode 132 in turn.

[0073] In addition, the second sub-conductor portion 1122 and the third sub-conductor portion 1123 are provided on each layer of the first insulating base 111, so that Figure 12 For example, the first side 1124 of the second sub-conductor portion 1122 is flush with one edge of the first insulating base 111, so that the first side 1124 of the second sub-conductor portion 1122 is exposed on the outer surface of the first element body 11. The second side 1125 of the third sub-conductor portion 1123 is flush with the other edge of the first insulating base 111, so that the second side 1125 of the third sub-conductor portion 1123 is exposed on the outer surface of the first element body 11.

[0074] Further, the adhesion strength of the third sub-extraction electrode 141 can be improved by connecting the third sub-extraction electrode 141 to the first side 1124 of each second sub-conductor portion 1122, so as to prevent the third sub-extraction electrode 141 from falling off. The adhesion strength of the fourth sub-extraction electrode 142 can be improved by connecting the fourth sub-extraction electrode 142 to the second side 1125 of each third sub-conductor portion 1123, so as to prevent the fourth sub-extraction electrode 142 from falling off.

[0075] In some embodiments, the first element body 11 is a first inductor. Referring to Figure 14 , Figure 16 and Figure 17 , each first sub-conductor portion 1121 is sequentially connected in series to form a first spiral body 1120. The first insulating base 111 located between adjacent two first sub-conductor portions 1121 is embedded with a first electrical connector 113. Along the thickness direction of the first insulating base 111, the two ends of the first electrical connector 113 are respectively connected to the first sub-conductor portions 1121 adjacent thereto.

[0076] Further, one end of the first spiral body 1120 is connected with the first sub lead-out electrode 131, and the other end of the first spiral body 1120 is electrically connected with the second sub lead-out electrode 132. In this way, the first sub conductor portions 1121 located in the layers can be connected in series, so that the first sub conductor portions 1121 connected with each other form a spiral coil, and then the two ends of the spiral coil can be electrically connected with the first sub lead-out electrode 131 and the second sub lead-out electrode 132 respectively, so as to form an inductive element.

[0077] With reference to Figure 5 , Figure 9 and Figure 10 , in some embodiments, the second element body 12 includes a plurality of second sheet bodies 120 arranged in a stack. Each second sheet body 120 includes a second insulating base body 121 and a second conductor layer 122. The second conductor layer 122 is arranged on one side of the second insulating base body 121 along the thickness direction of the second insulating base body 121. The second conductor layer 122 includes a fourth sub conductor portion 1221, which is electrically connected with the second lead-out electrode assembly 14.

[0078] In the case where the second element body 12 is a second capacitor, with reference to Figure 11 , each fourth sub conductor portion 1221 is alternately electrically connected with one of the third sub lead-out electrode 141 and the fourth sub lead-out electrode 142. The way in which each fourth sub conductor portion 1221 is electrically connected with the electrode is similar to the way in which each first sub conductor portion 1121 is electrically connected with the electrode, and thus will not be described here.

[0079] In the case where the second element body 12 is a second inductor, with reference to Figure 15 , Figure 18 and Figure 19 , each fourth sub conductor portion 1221 is connected in series end to end to form a second spiral body 1220. The second insulating base body 121 between two adjacent fourth sub conductor portions 1221 is embedded with a second electrical connecting piece 123. Along the thickness direction of the second insulating base body 121, the two ends of the second electrical connecting piece 123 are respectively connected with the fourth sub conductor portions 1221 adjacent thereto.

[0080] Further, one end of the second spiral body 1220 is connected with the third sub lead-out electrode 141, and the other end of the second spiral body 1220 is electrically connected with the fourth sub lead-out electrode 142. The way in which each fourth sub conductor portion 1221 is connected in series and electrically connected with the electrode is similar to the way in which each first sub conductor portion 1121 is connected in series and electrically connected with the electrode, and thus will not be described here.

[0081] Exemplarily, the manufacturing process of the electronic device 10 can refer to the manufacturing process of a multilayer ceramic capacitor in the related art. For example, the first insulating substrate 111 can be a ceramic dielectric film, and the first conductor layer 112 can be printed on the ceramic dielectric film by a printing process. The second insulating substrate 121 can be a ceramic dielectric film, and the second conductor layer 122 can be printed on the ceramic dielectric film by a printing process. Then, the ceramic dielectric films printed with the conductor layers can be stacked according to requirements. Then, the stack is sintered. Further, a metal layer can be sealed outside the sintered body, wherein the metal layer outside respectively constitutes the first sub lead-out electrode 131, the second sub lead-out electrode 132, the third sub lead-out electrode 141 and the fourth sub lead-out electrode 142.

[0082] The embodiment of the present application provides a circuit board. Referring to Figure 20 The circuit board 1 provided by the embodiment of the present application comprises a substrate 20 and any one of the electronic devices 10 provided by the embodiment of the present application. The electronic device 10 is fixed and electrically connected to the substrate 20. For example, a plurality of pads are arranged on the substrate 20, and each lead-out electrode of the electronic device 10 is correspondingly welded to the pad.

[0083] The embodiment of the present application provides an electronic device, which comprises any one of the circuit boards 1 provided by the embodiment of the present application. Exemplarily, the electronic device can be a mobile phone, a tablet computer or a wearable device.

[0084] It should be noted that, in the present document, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or sequence between the entities or operations. Moreover, the terms "comprise", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or device.

[0085] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: At least two component bodies (10a) and at least two sets of lead-out electrode assemblies (10b); The component bodies (10a) are stacked sequentially along the height direction of the electronic device, and each component body (10a) is electrically connected to a set of the output electrode assemblies (10b) in a corresponding manner. The at least two component bodies (10a) include a first component body (11) and a second component body (12), wherein the first component body (11) is a first capacitor or a first inductor, and the second component body (12) is a second capacitor or a second inductor.

2. The electronic device according to claim 1, characterized in that, The at least two sets of outgoing electrode assemblies (10b) include a first outgoing electrode assembly (13) and a second outgoing electrode assembly (14). The first outgoing electrode assembly (13) includes a first sub-outgoing electrode (131) and a second sub-outgoing electrode (132). The second outgoing electrode assembly (14) includes a third sub-outgoing electrode (141) and a fourth sub-outgoing electrode (142). The first element body (11) is electrically connected to the first sub-outlet electrode (131) and the second sub-outlet electrode (132) respectively, and the second element body (12) is electrically connected to the third sub-outlet electrode (141) and the fourth sub-outlet electrode (142) respectively.

3. The electronic device according to claim 2, characterized in that, Along the height direction of the electronic device, the first component body (11) is located below the second component body (12); The first element body (11) includes a plurality of first sheets (110) stacked together. Each first sheet (110) includes a first insulating substrate (111) and a first conductor layer (112). The first conductor layer (112) is disposed on one side of the first insulating substrate (111) along the thickness direction of the first insulating substrate (111). The first conductor layer (112) includes an insulated first sub-conductor portion (1121), a second sub-conductor portion (1122), and a third sub-conductor portion (1123), the first sub-conductor portion (1121) being electrically connected to the first outgoing electrode assembly (13); The first side (1124) of the second sub-conductor portion (1122) is exposed on the outer surface of the first element body (11), the second side (1125) of the third sub-conductor portion (1123) is exposed on the outer surface of the first element body (11), the third sub-outlet electrode (141) is connected to the first side (1124), and the fourth sub-outlet electrode (142) is connected to the second side (1125).

4. The electronic device according to claim 3, characterized in that, The first element body (11) is a first capacitor, and each of the first sub-conductor portions (1121) is alternately electrically connected to one of the first sub-outgoing electrode (131) and the second sub-outgoing electrode (132).

5. The electronic device according to claim 3, characterized in that, The first element body (11) is a first inductor, and each of the first sub-conductor portions (1121) is connected in series to form a first spiral (1120). The first insulating substrate (111) located between two adjacent first sub-conductor portions (1121) is provided with a first electrical connector (113). Along the thickness direction of the first insulating substrate (111), the two ends of the first electrical connector (113) are respectively connected to the adjacent first sub-conductor portion (1121). One end of the first helical body (1120) is connected to the first sub-outlet electrode (131), and the other end of the first helical body (1120) is electrically connected to the second sub-outlet electrode (132).

6. The electronic device according to claim 3, characterized in that, The second component body (12) includes a plurality of stacked second sheets (120), each second sheet (120) including a second insulating substrate (121) and a second conductor layer (122), the second conductor layer (122) being disposed on one side of the second insulating substrate (121) along the thickness direction of the second insulating substrate (121); The second conductor layer (122) includes a fourth sub-conductor portion (1221) which is electrically connected to the second lead-out electrode assembly (14).

7. The electronic device according to claim 6, characterized in that, The second element body (12) is a second capacitor, and each of the fourth sub-conductor portions (1221) is alternately electrically connected to one of the third sub-outgoing electrode (141) and the fourth sub-outgoing electrode (142).

8. The electronic device according to claim 6, characterized in that, The second element body (12) is a second inductor, and each of the fourth sub-conductor portions (1221) is connected in series to form a second spiral (1220). The second insulating substrate (121) located between two adjacent fourth sub-conductor portions (1221) is provided with a second electrical connector (123). Along the thickness direction of the second insulating substrate (121), the two ends of the second electrical connector (123) are respectively connected to the adjacent fourth sub-conductor portion (1221). One end of the second helix (1220) is connected to the third sub-outlet electrode (141), and the other end of the second helix (1220) is electrically connected to the fourth sub-outlet electrode (142).

9. A circuit board, characterized in that, include: The substrate (20) and the electronic device according to any one of claims 1 to 8, wherein the electronic device is fixed and electrically connected to the substrate (20).

10. An electronic device, characterized in that, include: The circuit board according to claim 9.

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