Rotary sheet carrying mechanism of high-density integrated circuit lead frame

Abstract

The utility model relates to the technical field of lead frame conveying equipment, in particular to a rotary piece carrying mechanism of a high-density integrated circuit lead frame, which comprises a transferring module and two sets of piece taking and placing modules used for taking and placing the lead frame, the transferring module comprises a vertical frame, a rotating frame and a transferring driving piece, the rotating frame is rotatably arranged on the vertical frame, and the transferring driving piece is arranged on the rotating frame. A rotating shaft of the rotating stand is longitudinally arranged; the two sheet taking and placing modules are mounted on the rotating stand and are symmetrically arranged relative to a rotating shaft of the rotating stand; the transfer driving part is used for driving the rotating frame to rotate so as to drive the two sheet taking and placing modules to be switched between the two sheet taking and placing stations in a reciprocating manner; wherein one of the sheet taking and placing stations is provided with a sheet carrying table used for carrying the lead frame transferred by the sheet taking and placing module, and the sheet carrying table is provided with a sheet pushing assembly used for transversely pushing the lead frame. When the lead frame taking and placing device is used, one piece taking and placing module takes a lead frame, the other piece taking and placing module puts down the lead frame, one piece is taken and one piece is placed, and the working efficiency is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to lead frame conveying equipment technical field, concretely relates to high density integrated circuit lead frame's rotation formula moves piece mechanism. BACKGROUND

[0002] Lead frame as the important carrier in semiconductor integrated chip packaging technology, is the important bridge of connecting internal circuit and external lead, also is a kind of key structural member that the electrical connection of chip internal circuit lead-out end and external lead is realized with the aid of bonding material (gold wire, aluminum wire, copper wire), forms electrical circuit, it plays the bridge function of connection with external wire, and the lead frame is needed in the majority of semiconductor integrated block, is the important basic material in electronic information industry.

[0003] The lead frame needs to be fed and discharged in the electroplating process, and a kind of lead frame poking transfer device and method are disclosed in Chinese patent with patent No.CN201811397007.6, device and method are used to automatically move and poke lead frame for preheating, movement of the poking lever is controlled by the transmission module, the poking lever drives the poking claw to move and transfer the arranged lead frame from the feeding platform to the preheating table, so as to realize the poking movement and preheating treatment of lead frame.

[0004] For example, the previously developed feeding mechanism for lead frame transfer is disclosed in Chinese patent literature with publication No.CN219566761U, which relates to a grabbing type rotary feeding mechanism for integrated circuit lead frame, comprising a transfer module and a clamping mechanism, the transfer module comprises a reciprocating drive seat, and the bottom of the drive seat is provided with a rotatable rotary drive member;The clamping mechanism includes a pair of opposite and opposite moving clamping grippers, the clamping gripper includes a gripper drive plate arranged along the length direction of the gripper bottom plate, the gripper drive plate is provided with one or more longitudinally arranged gripper drive strips, and the gripper drive strip is provided with a clamping finger for lifting and supporting the bottom plate edge of the lead frame;The lead frame to be clamped can be attached to the bottom of the gripper bottom plate first, and can be matched with lead frames of different widths and sizes, improving the clamping stability, and being applicable to lead frames of various sizes;Then, the clamping mechanism can be rotated by 180° under the drive of the transfer module and the rotary drive member, and then can be horizontally transferred to one place for discharging or feeding.

[0005] The above prior art realizes feeding or discharging after the rotation of lead frame by 180° rotation of the clamping mechanism. However, the movement of the clamping mechanism is realized by reciprocating movement of the transfer module, after clamping a piece of lead frame, it is moved to the specified position, and then returns to continue taking material, so that the material transfer between the two positions needs to be completed by reciprocating movement of the transfer module once, and the efficiency needs to be improved. SUMMARY

[0006] The utility model provides a high-density integrated circuit lead frame's rotary type piece carrying mechanism in view of the above-mentioned technical problem of prior art.

[0007] To achieve the above object, the utility model provides the following technical scheme:

[0008] Provide high-density integrated circuit lead frame's rotary type piece carrying mechanism, including shift module group and two groups of pick and place piece module group for taking and placing lead frame, shift module group includes riser, swivel frame and shift drive part, swivel frame can rotately be installed in riser, and the rotation axis of swivel frame is longitudinally arranged, two groups of pick and place piece module group are installed in swivel frame, and two groups of pick and place piece module group are symmetrically arranged relative to the rotation axis of swivel frame, and shift drive part is used to drive swivel frame to rotate, to drive two groups of pick and place piece module group reciprocating switching in two pick and place workstations,

[0009] One of pick and place piece workstation is provided with the slide table for taking and placing piece module group to transfer the lead frame, and the slide table is provided with the piece pushing assembly for laterally pushing the lead frame.

[0010] As a further optional scheme, pick and place piece module group includes lifting seat, longitudinal shift drive part for installing in swivel frame and driving lifting seat to move up and down, clamping piece slide rail installed on lifting seat, two groups of clamping piece clamping arms slidingly installed on clamping piece slide rail, and clamping piece drive part for driving two groups of clamping piece clamping arms to approach / away.

[0011] As a further optional scheme, longitudinal shift drive part is electric cylinder fixed to swivel frame, and the telescopic rod thereof is connected with lifting seat, and lifting seat is fixed with lifting guide column, and swivel frame is provided with longitudinal linear bearing, and lifting guide column passes through longitudinal linear bearing.

[0012] As a further optional scheme, riser includes vertical frame body and horizontal frame body in inverted "N" shape, and the upper end of two vertical frame bodies is connected with the both ends of horizontal frame body, and two groups of pick and place piece module group are arranged below the both sides of horizontal frame body.

[0013] As a further optional scheme, piece pushing assembly includes piece pushing rod, piece pushing drive part for driving piece pushing rod to lift and laterally shift, and slide table is provided with piece pushing groove for piece pushing rod to pass through and laterally shift.

[0014] As a further optional scheme, piece pushing drive part includes piece pushing base and piece pushing longitudinal shift seat, piece pushing longitudinal shift seat is installed on piece pushing base, piece pushing base is provided with piece lifting cylinder for driving piece pushing longitudinal shift seat to move up and down, and piece pushing rod is installed on piece pushing longitudinal shift seat, and piece pushing drive part further includes piece power part for driving piece pushing base to laterally shift.

[0015] As a further optional scheme, piece pushing rod is arranged in two rows on the top of piece pushing longitudinal shift seat, and space is left between two rows of piece pushing rods for placing lead frame.

[0016] As a further optional solution, the wafer stage is provided with a receiving station, a transition station and a delivery station arranged in sequence, the receiving station is close to the transfer module to receive the lead frame from the pick-and-place module, two rows of pushers move the lead frame in the receiving station to the transition station, and simultaneously move the lead frame in the transition station to the delivery station.

[0017] As a further optional solution, the delivery station is provided with a supporting body, and the supporting body is a plurality of grids arranged at intervals.

[0018] As a further optional solution, the wafer stage is provided with two blocks of stop pieces for guiding and limiting the lead frame on both sides, and the distance between the two blocks of stop pieces is adjustable.

[0019] The beneficial effects of the present application are as follows:

[0020] The rotating wafer moving mechanism for high-density integrated circuit lead frames of the present application has the advantages that one group of pick-and-place modules picks up the lead frame, and the other group of pick-and-place modules puts down the lead frame, so that one pick-up operation is matched with one put-down operation, and the work efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The figure is a structural schematic view of the wafer moving mechanism in the embodiment.

[0022] Figure 2 The figure is an exploded view of the wafer moving mechanism in the embodiment.

[0023] Figure 3 The figure is a structural schematic view of the transfer module in the embodiment.

[0024] Figure 4 The figure is a structural schematic view of the pusher assembly in the embodiment.

[0025] Figure 5 The figure is a structural schematic view of the wafer stage in the embodiment.

[0026] Figure 6 The figure is an exploded view of the wafer stage in the embodiment.

[0027] REFERENCE SIGNS:

[0028] Transfer module 50, stand 501, vertical frame body 502, horizontal frame body 503, rotating frame 504, transfer driving member 505;

[0029] Pick-and-place module 51, lifting seat 511, longitudinal movement driving member 512, clamping piece sliding rail 513, clamping piece clamping arm 514, lifting guide column 515;

[0030] Wafer stage 52, wafer pushing groove 521, receiving station 522, transition station 523, delivery station 524, supporting body 525, stop piece 526;

[0031] Pusher assembly 53, pusher rod 531, pusher base 532, pusher longitudinal shift seat 533, pusher lifting cylinder 534, pusher power component 535. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0033] The film transfer mechanism in this embodiment, such as Figures 1 to 6 As shown, the system includes a transfer module 50 and two sets of pick-and-place modules 51 for picking up and placing lead frames. The transfer module 50 includes a stand 501, a rotating frame 504, and a transfer drive 505. The rotating frame 504 is rotatably mounted on the stand 501, and its rotation axis is longitudinally arranged. The two sets of pick-and-place modules 51 are mounted on the rotating frame 504 and are symmetrically arranged with respect to the rotation axis of the rotating frame 504. The transfer drive 505 (using a motor) drives the rotating frame 504 to rotate, thereby causing the two sets of pick-and-place modules 51 to reciprocate between two pick-and-place stations. In this example, the reciprocating position is 180° rotation. The support frame 501 includes a vertical frame 502 and a horizontal frame 503 in the shape of an inverted "U". The two ends of the horizontal frame 503 are connected to the upper ends of the two vertical frames 502. Two sets of pick-and-place modules 51 are arranged on both sides below the horizontal frame 503.

[0034] In this embodiment, the plate picking and placing module 51 includes a lifting seat 511, a longitudinal drive component 512 mounted on a rotating frame 504 for driving the lifting seat 511 to move up and down, a plate clamping slide rail 513 mounted on the lifting seat 511, two sets of plate clamping arms 514 slidably mounted on the plate clamping slide rail 513, and a plate clamping drive component (which may be a cylinder) for driving the two sets of plate clamping arms 514 to move closer to or further away from each other. The longitudinal drive component 512 is an electric cylinder fixed to the rotating frame 504, and its telescopic rod is connected to the lifting seat 511; the lifting seat 511 is fixed with a lifting guide column 515, and the rotating frame 504 is provided with a longitudinal linear bearing, through which the lifting guide column 515 passes.

[0035] One of the pick-and-place stations is provided with a wafer table 52 for receiving the lead frame transferred by the pick-and-place module 51, and the wafer table 52 is provided with a wafer pushing assembly 53 for laterally pushing the lead frame. The wafer pushing assembly 53 comprises a wafer pushing rod 531 and a wafer pushing drive for driving the wafer pushing rod 531 to lift and laterally move, and the wafer table 52 is provided with a wafer pushing groove 521 for the wafer pushing rod 531 to pass through and laterally move. The wafer pushing drive comprises a wafer pushing base 532 and a wafer pushing longitudinal moving seat 533, the wafer pushing longitudinal moving seat 533 is installed on the wafer pushing base 532, the wafer pushing base 532 is provided with a wafer pushing lifting cylinder 534 for driving the wafer pushing longitudinal moving seat 533 to move up and down, and the wafer pushing rod 531 is installed on the wafer pushing longitudinal moving seat 533; the wafer pushing drive further comprises a wafer pushing power element 535 for driving the wafer pushing base 532 to laterally move.

[0036] Specifically, the wafer pushing rod 531 is arranged in two rows on the top of the wafer pushing longitudinal moving seat 533, and spaces are left between the two rows of wafer pushing rods 531 for placing the lead frame. The wafer table 52 is provided with a wafer receiving station 522, a transition station 523 and a wafer output station 524 arranged in sequence, the wafer receiving station 522 is close to the transfer module 50 to receive the lead frame transferred by the pick-and-place module 51, and the two rows of wafer pushing rods 531 move the lead frame in the wafer receiving station 522 to the transition station 523, and move the lead frame in the transition station 523 to the wafer output station 524. That is, the two rows of wafer pushing rods 531 are inserted into the two sides of the lead frame in the wafer receiving station 522, one row of wafer pushing rods 531 pushes the lead frame in the wafer receiving station 522 to the transition station 523, and the other row of wafer pushing rods 531 pushes the lead frame in the transition station 523 to the wafer output station 524.

[0037] In the embodiment, the wafer output station 524 is provided with a wafer supporting body 525, and the wafer supporting body 525 is a plurality of grids arranged at intervals, so as to facilitate clamping and moving the lead frame.

[0038] In the embodiment, the wafer table 52 is provided with two blocking pieces 526 for guiding and limiting the two sides of the lead frame, and the distance between the two blocking pieces 526 is adjustable, so as to guide and limit lead frames of different specifications. Specifically, the blocking piece 526 is provided with a rod body, and the position of the blocking piece 526 is adjusted by tightening or loosening the rod body.

[0039] In the description of the present application, obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0040] Therefore, the above detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0041] In the description of the present application, it should be pointed out that the terms "middle", "upper", "lower", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product is used, and are merely for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are only used for differentiation in description and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present application, it should be pointed out that unless otherwise explicitly specified and limited, the terms "provided", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

Claims

1. A rotary sheet transfer mechanism for high density integrated circuit lead frames, characterized by: The transferring module comprises a vertical frame, a rotating frame and a transferring driving element, the rotating frame is rotatably installed on the vertical frame, and the rotating shaft of the rotating frame is arranged longitudinally; the two sets of pick-and-place sheet modules are installed on the rotating frame and are symmetrically arranged relative to the rotating shaft of the rotating frame; the transferring driving element is used to drive the rotating frame to rotate, so as to drive the two sets of pick-and-place sheet modules to reciprocally switch between two pick-and-place sheet stations. One of the pick-and-place sheet stations is provided with a carrier sheet table for receiving the lead frame transferred by the pick-and-place sheet module, and the carrier sheet table is provided with a sheet pushing assembly for laterally pushing the lead frame.

2. The rotating die bonder of claim 1 wherein: The pick-and-place sheet module comprises a lifting seat, a longitudinal moving driving element installed on the rotating frame for driving the lifting seat to move up and down, a clamping sheet sliding rail installed on the lifting seat, two sets of clamping sheet clamping arms slidingly installed on the clamping sheet sliding rail, and a clamping driving element for driving the two sets of clamping sheet clamping arms to move close to or away from each other.

3. The rotating die bonder of claim 2 wherein: the die bonder further comprises a plurality of die holders mounted on the rotatable die bonder plate; and the plurality of die holders are arranged in a circular pattern around the center of the rotatable die bonder plate. The longitudinal moving driving element is an electric cylinder fixed to the rotating frame, the telescopic rod of which is connected with the lifting seat; the lifting seat is fixed with a lifting guide column, and the rotating frame is provided with a longitudinally arranged linear bearing, and the lifting guide column passes through the longitudinally arranged linear bearing.

4. The rotating die bonder of claim 1 wherein: the die bonder further comprises a plurality of die holders; and the plurality of die holders are arranged in a circular pattern around the central axis. The vertical frame comprises an inverted "n" shaped vertical frame body and a horizontal frame body, the two ends of the horizontal frame body are connected with the upper end portions of the two vertical frame bodies, and the two sets of pick-and-place sheet modules are arranged below the two sides of the horizontal frame body.

5. The rotating die bonder of claim 1 wherein: the die bonder further comprises a plurality of die holders; and the plurality of die holders are arranged in a circular pattern around the central axis. The sheet pushing assembly comprises a sheet pushing rod and a sheet pushing driving element for driving the sheet pushing rod to move up and down and laterally, and the carrier sheet table is provided with a sheet pushing groove for the sheet pushing rod to pass through and laterally move.

6. The rotating die bonder of claim 5 wherein: the die bonder further comprises a plurality of die holders mounted on the rotatable die bonder plate; and the plurality of die holders are arranged in a circular pattern around the center of the rotatable die bonder plate. The sheet pushing driving element comprises a sheet pushing base and a sheet pushing longitudinal moving seat, the sheet pushing longitudinal moving seat is installed on the sheet pushing base, the sheet pushing base is provided with a sheet pushing lifting cylinder for driving the sheet pushing longitudinal moving seat to move up and down, and the sheet pushing rod is installed on the sheet pushing longitudinal moving seat; the sheet pushing driving element further comprises a sheet pushing power element for driving the sheet pushing base to laterally move.

7. The rotating die bonder of claim 6 wherein: the die bonder further comprises a plurality of die holders mounted on the rotatable carrier; and the plurality of die holders are arranged in a circular pattern around the rotatable carrier. The sheet pushing rod is arranged in two rows on the top of the sheet pushing longitudinal moving seat, and spaces are left between the two rows of sheet pushing rods for placing the lead frame.

8. The rotating die bonder of claim 7 wherein: the die bonder further comprises a plurality of die holders mounted on the rotatable carrier; and the plurality of die holders are arranged in a circular pattern around the rotatable carrier. The carrier sheet table is provided with a sheet receiving station, a transition station and a sheet discharging station arranged in sequence, the sheet receiving station is close to the transferring module to receive the lead frame transferred by the pick-and-place sheet module, and the two rows of sheet pushing rods move the lead frame in the sheet receiving station to the transition station and simultaneously move the lead frame in the transition station to the sheet discharging station.

9. The rotating die bonder of claim 8 wherein: the die bonder further comprises a plurality of die holders mounted on the rotatable carrier; and the plurality of die holders are arranged in a circular pattern around the rotatable carrier. The sheet discharging station is provided with a sheet supporting body, and the sheet supporting body is a plurality of spaced grid bars.

10. The rotating die bonder of claim 7 wherein: the die bonder further comprises a plurality of die holders; and the plurality of die holders are arranged in a circular pattern. The carrier sheet table is provided with two sheet blocking plates for guiding and limiting the lead frame on both sides, and the distance between the two sheet blocking plates is adjustably arranged.

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