Double-area suction ejector pin unit, ejector pin mechanism and die bonding equipment

Abstract

The utility model relates to the technical field of die bonding, and particularly discloses a double-area suction ejector pin unit, an ejector pin mechanism and die bonding equipment, and the ejector pin unit comprises an ejector pin inner cap, the top surface of which is provided with a pin passing hole and a plurality of ejector chip adsorption holes; the ejector pin outer sleeve is arranged outside the ejector pin inner cap in a sleeving manner, and the ejector pin outer sleeve is matched with the ejector pin inner cap to form an anti-shake adsorption cavity with an upward opening in a surrounding manner; and the ejector pin body is positioned in the ejector pin inner cap and extends upwards through the pin passing hole after being driven. The double-area suction ejector pin unit, the ejector pin mechanism and the die bonding equipment provided by the utility model can effectively solve the problems that when a die bonding swing arm of the existing die bonding equipment swings, a thin film shakes, a wafer on the thin film is not favorably positioned, and finally the die bonding is poor.

Description

TECHNICAL FIELD

[0001] The utility model relates to die bonding technical field especially relates to a double area divides ceiling needle unit, needle mechanism and die bonding equipment. BACKGROUND

[0002] The wafer is fixed on the film when the wafer is delivered, and the film is tensioned on the ring.

[0003] The die bonding equipment comprises a ring fixing mechanism for arranging the ring, a needle mechanism located below the ring and upwardly lifting the wafer to separate from the film, and a die bonding swing arm for moving the lifted wafer to the substrate.

[0004] The existing needle mechanism comprises:

[0005] A needle cap, the top of the needle cap is provided with a plurality of wafer adsorption holes;

[0006] A needle body, the needle body is located in the needle cap and is arranged in sliding mode up and down relative to the needle cap.

[0007] When the die bonding operation is performed, the steps are as follows:

[0008] ① The wafer adsorption hole downwardly adsorbs the film to avoid the film from moving upwardly along the needle in the subsequent wafer lifting process;

[0009] ② The needle body moves upwardly, pierces the adsorbed film, and lifts the wafer located directly above the needle body upwardly to separate from the film;

[0010] ③ The die bonding swing arm takes away the lifted wafer and moves the wafer to the substrate;

[0011] ④ After the needle body is retracted downwardly, the wafer adsorption hole breaks the vacuum to release the film, the ring fixing mechanism moves the ring, and the next wafer moves to the position directly above the needle body;

[0012] ⑤ The needle body lifts another wafer upwardly again, and simultaneously, the die bonding swing arm returns to the wafer taking position again to take away the lifted wafer after the die bonding operation is completed.

[0013] In the above process, the die bonding efficiency is very high, therefore, the die bonding swing arm almost continuously reciprocates, which is equivalent to continuously blowing the film, resulting in the up and down shaking of the film. The shaking of the film affects the visual positioning accuracy of the camera on the wafer, therefore, when the ring fixing mechanism moves the ring, the geometric center of the wafer cannot be exactly located in the position directly above the needle body. When the needle body lifts the wafer upwardly, the wafer cannot be directly lifted to the geometric center, and the wafer is easily lifted to be inclined. When the die bonding swing arm takes the wafer, the wafer is easily damaged, and finally, the die bonding is poor.

[0014] Therefore, it is necessary to improve the existing die bonding equipment to solve the problem that the die bonding swing arm swings and causes the film to shake, which is not conducive to positioning the wafer on the film, and ultimately leads to die bonding failure.

[0015] The above information disclosed in this BACKGROUND section is only included to enhance the understanding of the background of the present disclosure, and thus can include information that is not prior art to those of ordinary skill in the art. Utility model content

[0016] One purpose of the present utility model is to provide a double-zone separate suction pin unit, a pin mechanism and a die bonding equipment, which can effectively solve the problem that the die bonding swing arm of the existing die bonding equipment swings and causes the film to shake, which is not conducive to positioning the wafer on the film, and ultimately leads to die bonding failure.

[0017] To achieve the above purpose, on the one hand, the present utility model provides a double-zone separate suction pin unit, comprising:

[0018] A pin inner cap is provided with a pin hole and a plurality of wafer suction holes on the top surface;

[0019] A pin outer sleeve is sleeved on the outside of the pin inner cap and cooperates with the pin inner cap to form a jitter-proof suction cavity with an opening upward;

[0020] A pin body is located in the pin inner cap and extends upward through the pin hole after being driven.

[0021] Optionally, the upper end opening of the jitter-proof suction cavity is in a ring structure, and the pin hole and each wafer suction hole are located in the ring structure.

[0022] Optionally, further comprising:

[0023] A pin base is installed on the pin body to slide up and down on the pin base;

[0024] A barrel cap base is installed on the pin base, and both the pin outer sleeve and the pin inner cap are installed on the upper end of the barrel cap base, and the barrel cap base blocks the lower end opening of the jitter-proof suction cavity.

[0025] Optionally, the pin base and the pin body are both provided with a pin suction passage upper section that communicates to each wafer suction hole,

[0026] The outer side of the pin base is provided with a pin suction passage lower section that communicates to the pin suction passage upper section, and a wafer suction air pipe joint that communicates to the pin suction passage lower section.

[0027] Optionally, further comprising:

[0028] A needle reset spring is sleeved on the needle body and below the needle base, and is used to drive the needle body to slide downwards to be flush with or below the needle hole.

[0029] Optionally, the sidewall of the needle sleeve is connected with a vibration-proof adsorption air pipe joint communicated with the vibration-proof adsorption cavity.

[0030] In another aspect, the application provides a needle mechanism, which comprises any of the double-zone adsorption needle units and a vertical direct-drive mechanism for driving the needle body of the double-zone adsorption needle unit to extend upwards through the needle hole.

[0031] Optionally, the vertical direct-drive mechanism comprises a cam below the needle body and a rotary drive mechanism for driving the cam to rotate.

[0032] Optionally, the application further comprises:

[0033] A top crystal adsorption vacuum pump, whose suction port is communicated with each top crystal adsorption hole of the needle inner cap;

[0034] A vibration-proof adsorption vacuum pump, whose suction port is communicated with the vibration-proof adsorption cavity;

[0035] The suction force of the upper end opening of the vibration-proof adsorption cavity is less than the suction force of each top crystal adsorption hole.

[0036] In still another aspect, the application provides a die bonding apparatus, which comprises a die ring fixing mechanism for placing a die ring, any of the needle mechanisms below the die ring and driving a wafer upwards to be separated from a film, and a die bonding swing arm for moving the wafer to a substrate.

[0037] The application has the following advantages: the application provides a double-zone adsorption needle unit, a needle mechanism and a die bonding apparatus, and the die bonding process is as follows:

[0038] (1) The upper end opening of the vibration-proof adsorption cavity and the top crystal adsorption holes together suck the film downwards, avoiding the film from moving upwards with the needle in the subsequent top crystal process;

[0039] (2) The needle body moves upwards after being driven, pierces the adsorbed film, and then drives the wafer above the needle body upwards to be separated from the film;

[0040] (3) The die bonding swing arm takes away the wafer and moves it to the substrate;

[0041] (4) After the needle body is retracted downwards, the top crystal adsorption holes break the vacuum to release the film, but the vibration-proof adsorption cavity keeps the vacuum state to adsorb the film;

[0042] (5) The crystal ring fixing mechanism moves the crystal ring so that the next wafer is moved directly above the needle body;

[0043] (6) The needle body again lifts a wafer upward, and synchronously, the die bonding swing arm returns to the wafer taking position after the die bonding is completed, and the lifted wafer is taken away.

[0044] In the above process, when the crystal ring drives the film to move horizontally, the anti-shaking adsorption cavity continuously adsorbs the film, suppresses the up-and-down shaking of the film, reduces the difficulty of visual positioning of the camera on the wafer, and further improves the visual positioning accuracy, so that the geometric center of the wafer is moved horizontally to the top of the needle body by the crystal ring fixing mechanism. When the needle body is lifted upward to lift the wafer, it can be directly lifted to the geometric center of the wafer, and it is not easy to be lifted off-center, thereby avoiding damage to the wafer due to the inclination of the wafer when the die bonding swing arm takes the wafer, and finally reducing the die bonding defects.

[0045] Therefore, the double-zone suction needle unit provided by the utility model can effectively solve the problem that the existing die bonding equipment causes the film to shake when the die bonding swing arm swings, which is not conducive to positioning the wafer on the film, and ultimately leads to die bonding defects. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.

[0047] Figure 1 The structure schematic view of the die bonding equipment provided for the embodiment;

[0048] Figure 2 The structure schematic view of the needle mechanism provided for the embodiment;

[0049] Figure 3 The cross-sectional schematic view of the double-zone suction needle unit provided for the embodiment;

[0050] Figure 4 The cross-sectional schematic view of the needle mechanism provided for the embodiment.

[0051] In the drawings:

[0052] 1, crystal ring fixing mechanism;

[0053] 2, needle mechanism;

[0054] 201, double-area suction ceiling needle unit; 2011, inner cap of the needle; 2011a, needle passing hole; 2011b, adsorption hole of the top crystal; 2012, outer sleeve of the needle; 2012a, anti-shake adsorption cavity; 2012b, annular structure; 2013, needle body; 2014, needle base; 2014a, lower section of the needle adsorption channel; 2015, cap base; 2015a, upper section of the needle adsorption channel; 2016, needle reset spring; 2017, anti-shake adsorption air pipe joint; 2018, adsorption air pipe joint of the top crystal;

[0055] 202, vertical direct drive mechanism; 2021, cam; 2022, rotary drive mechanism;

[0056] 3, flip arm for die bonding. DETAILED DESCRIPTION

[0057] In the present application, the term "embodiment" means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The term "embodiment" appearing at various positions in the specification does not necessarily refer to the same embodiment, and does not particularly limit the independence or association between other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, each technical feature mentioned in each embodiment can be combined in any way to form a corresponding implementable technical solution.

[0058] Unless otherwise defined, the meanings of the technical terms used herein are the same as those commonly understood by those skilled in the art to which the present application belongs; the use of related terms herein is only for the purpose of describing specific embodiments, and is not intended to limit the present application.

[0059] In the description of the present application, the phrase "and / or" is a description of the logical relationship between the objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this paper generally represents that the associated objects before and after are a kind of "or" logical relationship.

[0060] In the present application, terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, primary or secondary or order relationship between the entities or operations.

[0061] In the absence of more restrictions, in the utility model, the "including", "containing", "having" or other similar expressions used in the sentence are intended to cover non-exclusive inclusion, and these expressions do not exclude the presence of other elements in the process, method or product including the elements described, so that the process, method or product including a series of elements can not only include those limited elements, but also include other elements not explicitly listed, or also include the elements inherent in such process, method or product.

[0062] As the same understanding in the "Guidelines for Examination", in the utility model, "greater than", "less than", "exceed" and other expressions are understood as not including the number; "above", "below", "within" and other expressions are understood as including the number. In addition, in the description of the embodiments of the utility model, the meaning of "multiple" is more than two (including two), and similar expressions related to "multiple" are also understood in this way, for example, "multiple groups", "multiple times" and the like, unless otherwise explicitly specified.

[0063] In the description of the embodiments of the utility model, the spatial-related expressions used, such as "center", "vertical", "horizontal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. The indicated orientation or position relationship is based on the orientation or position relationship shown in the specific embodiment or the drawing, and is only for the convenience of describing the specific embodiments of the utility model or for the reader to understand, and does not indicate or imply that the indicated device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, therefore it cannot be understood as a limitation on the embodiments of the utility model.

[0064] Unless otherwise explicitly specified or limited, in the description of the embodiments of the utility model, the terms "mounting", "connecting", "connecting", "fixing", "setting" and the like should be understood broadly. For example, the "connection" can be fixed connection, or detachable connection, or integrated setting; it can be mechanical connection, or electrical connection, or communication connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art to which the utility model belongs, the specific meaning of the above terms in the embodiments of the utility model can be understood according to the specific circumstances.

[0065] The embodiment provides a double-district suction plunger unit 201, a plunger mechanism 2 and a die bonding device, which are suitable for a wafer die bonding operation scene in semiconductor manufacturing and can effectively solve the problem that the die bonding swing arm 3 of the existing die bonding device swings and causes film shaking, which is not conducive to positioning of a wafer on the film and finally leads to die bonding failure.

[0066] Referring to Figure 1 In the embodiment, the die bonding device comprises a wafer ring fixing mechanism 1 for arranging a wafer ring, a plunger mechanism 2 located below the wafer ring and used for lifting a wafer upward to separate the wafer from a film, and a die bonding swing arm 3 used for moving the lifted wafer to a substrate.

[0067] Referring to Figure 2 The plunger mechanism 2 comprises a double-district suction plunger unit 201 used for adsorbing the film and a vertical direct drive mechanism 202 used for driving the double-district suction plunger unit 201 to lift the wafer on the film upward.

[0068] Referring to Figure 3 The double-district suction plunger unit 201 comprises a plunger inner cap 2011, a plunger outer sleeve 2012 and a plunger body 2013.

[0069] The top surface of the plunger inner cap 2011 is provided with a plunger hole 2011a and a plurality of wafer adsorption holes 2011b; the plunger outer sleeve 2012 is sleeved outside the plunger inner cap 2011 and cooperates with the plunger inner cap 2011 to form a jitter-proof adsorption cavity 2012a which is arranged in an upward opening mode; and the plunger body 2013 is located in the plunger inner cap 2011 and is driven by the vertical direct drive mechanism 202 to extend upward through the plunger hole 2011a so as to pierce the film and lift the corresponding wafer upward.

[0070] The double-district suction plunger unit 201 provided by the embodiment is used as follows when die bonding operation is needed:

[0071] (1) The upper end opening of the jitter-proof adsorption cavity 2012a and the wafer adsorption holes 2011b together adsorb the film downward, so as to avoid the film from moving upward with the plunger in the subsequent wafer lifting process;

[0072] (2) The plunger body 2013 is driven to move upward, pierces the adsorbed film and lifts the wafer located directly above the plunger body 2013 upward to separate the wafer from the film;

[0073] (3) The die bonding swing arm 3 takes away the lifted wafer and moves the wafer to the substrate;

[0074] (4) After the plunger body 2013 is retracted downward, the wafer adsorption holes 2011b break the vacuum to release the film, but the jitter-proof adsorption cavity 2012a keeps the vacuum suction state to adsorb the film;

[0075] (5) The crystal ring fixing mechanism 1 moves the crystal ring, so that the next wafer is moved to the top of the needle body 2013;

[0076] (6) The needle body 2013 again lifts up a wafer, and synchronously, the crystal fixing swing arm 3 returns to the wafer taking position again after the crystal fixing is completed, and the lifted wafer is taken away.

[0077] In the above process, when the crystal ring drives the film to move horizontally, the anti-shake adsorption cavity 2012a continuously adsorbs the film, inhibits the up-and-down shaking of the film, reduces the difficulty of visual positioning of the camera on the wafer, and further improves the visual positioning accuracy, so that the crystal ring fixing mechanism 1 moves the geometric center of the wafer horizontally to the top of the needle body 2013. When the needle body 2013 lifts up the wafer upward, it can directly lift up to the geometric center of the wafer, and it is not easy to be lifted off-center, thereby avoiding damage to the wafer due to the inclination of the wafer when the crystal fixing swing arm 3 takes the wafer, and finally reducing the crystal fixing defects.

[0078] Therefore, the double-zone separate suction needle unit 201 can effectively solve the problem that the existing crystal fixing device causes the film to shake when the crystal fixing swing arm 3 swings, which is not conducive to positioning the wafer on the film, and ultimately leads to crystal fixing defects.

[0079] In this embodiment, the upper end opening of the anti-shake adsorption cavity 2012a is in a ring structure 2012b, and the needle hole 2011a and each wafer adsorption hole 2011b are located in the ring structure 2012b. The upper end opening of the anti-shake adsorption cavity 2012a is designed as a ring structure 2012b that surrounds the needle hole 2011a and each wafer adsorption hole 2011b, which is conducive to enabling the anti-shake adsorption cavity 2012a to adsorb the film in a larger area under the limitation of the limited top surface area of the double-zone separate suction needle unit 201, and further improving the anti-shake effect.

[0080] Optionally, the double-zone separate suction needle unit 201 further comprises a needle base 2014, a cap base 2015, and a needle reset spring 2016.

[0081] The needle body 2013 is slidably installed on the needle base 2014; the cap base 2015 is installed on the needle base 2014, and the needle outer sleeve 2012 and the needle inner cap 2011 are both installed on the upper end of the cap base 2015, and the cap base 2015 blocks the lower end opening of the anti-shake adsorption cavity 2012a. The needle reset spring 2016 is sleeved on the needle body 2013 and located below the needle base 2014, and is used to drive the needle body 2013 to slide downward relative to the needle inner cap 2011 to be flush with or lower than the needle hole 2011a.

[0082] Optionally, the top pin base 2014 and the top pin body 2013 are both provided with a top pin suction passage upper section 2015a communicated to each top wafer suction hole 2011b, and the barrel cap base 2015 is provided with a top pin suction passage lower section 2014a communicated to the top pin suction passage upper section 2015a,

[0083] The outer side of the top pin base 2014 is provided with a top pin suction passage lower section 2014a communicated to the top pin suction passage upper section 2015a, and a top wafer suction air pipe joint 2018 communicated to the top pin suction passage lower section 2014a;

[0084] The side wall of the top pin outer sleeve 2012 is connected with a shakeproof suction air pipe joint 2017 communicated to the shakeproof suction cavity 2012a.

[0085] Further, the top pin mechanism 2 further comprises a top wafer suction vacuum pump and a shakeproof suction vacuum pump.

[0086] The suction port of the top wafer suction vacuum pump is communicated to each top wafer suction hole 2011b of the top pin inner cap 2011 through the top wafer suction air pipe joint 2018; and the suction port of the shakeproof suction vacuum pump is communicated to the shakeproof suction cavity 2012a through the shakeproof suction air pipe joint 2017.

[0087] In this embodiment, the suction force of the upper end opening of the shakeproof suction cavity 2012a is smaller than the suction force of each top wafer suction hole 2011b.

[0088] The main function of the top wafer suction hole 2011b is to fix the film, while ensuring that the film does not rise with the wafer when the wafer is lifted by the top pin. Therefore, the top wafer suction hole 2011b needs a strong suction force to firmly grasp the film.

[0089] The shakeproof suction cavity 2012a is mainly used for absorbing the film, but it needs to ensure that the film can be laterally moved while being absorbed, so as to laterally move the next wafer directly above the top pin body 2013. If the suction force of the shakeproof suction cavity 2012a is too large, the film may be pulled by the strong suction force of the shakeproof suction cavity 2012a during the lateral movement of the wafer ring driven by the wafer ring fixing mechanism 1, resulting in displacement or deflection of the wafer, so that the wafer cannot be accurately lifted, thereby affecting the quality of die bonding.

[0090] That is, the main function of the shakeproof suction cavity 2012a is to suppress the shaking of the film, rather than to fix the film. Therefore, it only needs sufficient suction force to stabilize the film, without excessive suction force. The appropriate suction force can balance various forces in the die bonding process, ensuring that the wafer can be smoothly lifted and moved.

[0091] Therefore, in order to avoid the top crystal adsorption hole 2011b from excessively pulling the film when the crystal ring is horizontally moved, the top crystal adsorption hole 2011b needs to be broken vacuum after the top pin body 2013 lifts the wafer, so that the top crystal adsorption hole 2011b releases the film.

[0092] Therefore, the suction force of the upper end opening of the anti-shaking adsorption cavity 2012a is smaller than the suction force of each top crystal adsorption hole 2011b, which can ensure the smooth progress of the die bonding process, improve the die bonding precision, and protect the film and the wafer from being damaged.

[0093] Referring to Figure 4 Optionally, the vertical direct drive mechanism 202 includes a cam 2021 located below the top pin body 2013, and a rotary drive mechanism 2022 for driving the cam 2021 to rotate. When the rotary drive mechanism 2022 drives the cam 2021 to rotate, if the outer convex part of the cam 2021 abuts against the top pin body 2013, the top pin body 2013 can be lifted upward to lift the wafer upward; if the constant diameter part of the cam 2021 abuts against the top pin body 2013, the top pin body 2013 can be driven by the top pin return spring 2016 to slide downward to be flush with or lower than the needle hole 2011a, so as to avoid scratching the film when the film is horizontally moved.

[0094] In summary, the die bonding equipment provided by the embodiment has the following advantages:

[0095] ① The die bonding precision is improved: through the design of the double-zone separate suction top pin unit 201, the shaking of the film during the die bonding process is effectively inhibited, the difficulty of visual positioning of the camera on the wafer is reduced, the visual positioning precision is improved, and thus the die bonding precision is improved.

[0096] ② The die bonding defects are reduced: the top pin body 2013 can directly reach the geometric center of the wafer, avoiding damage to the wafer due to top deviation and reducing the occurrence of die bonding defects.

[0097] ③ The film is prevented from being damaged: through reasonable distribution of suction force, the occurrence of damage to the film due to excessive suction force during the horizontal movement of the film is avoided.

[0098] ④ The anti-shaking adsorption area is increased: the upper end opening of the anti-shaking adsorption cavity 2012a is designed as a ring structure 2012b surrounding the needle hole 2011a and each top crystal adsorption hole 2011b, so that the anti-shaking adsorption cavity 2012a can adsorb the film in a larger area, further improving the anti-shaking effect.

[0099] It needs to be explained that the linear drive mechanism mentioned in the utility model can be a cylinder, a hydraulic cylinder, an electric cylinder or a motor screw linear module, and the rotating drive mechanism mentioned can be a brush motor, a brushless motor or a rotating cylinder. The utility model does not limit the specific structure form of the linear drive mechanism and the rotating drive mechanism.

[0100] Finally, it needs to be explained that although the above-mentioned embodiments have been described in the specification and drawings of the application, the patent protection scope of the application cannot be limited. Any equivalent structure or equivalent flow replacement or modification based on the essential concept of the application, the content recorded in the specification and drawings of the application, the technical solutions directly or indirectly implemented in other related technical fields, etc. are included in the patent protection scope of the application.

Claims

1. A dual zone split ceiling tile pin unit, comprising: It comprises: a needle inner cap (2011), the top surface of which is provided with a needle hole (2011a) and a plurality of top crystal adsorption holes (2011b); a needle outer sleeve (2012), which is sleeved outside the needle inner cap (2011) and cooperates with the needle inner cap (2011) to form an anti-shake adsorption cavity (2012a) with an opening facing upward; a needle body (2013), which is located in the needle inner cap (2011) and is driven to extend upward through the needle hole (2011a).

2. The dual zone split pick pin unit of claim 1, wherein, The upper end opening of the anti-shake adsorption cavity (2012a) is in a ring structure (2012b), and the needle hole (2011a) and each top crystal adsorption hole (2011b) are located in the ring structure (2012b).

3. The dual zone split pick pin unit of claim 1, wherein, It further comprises: a needle base (2014), in which the needle body (2013) is slidingly installed; a cap base (2015), which is installed on the needle base (2014), and the needle outer sleeve (2012) and the needle inner cap (2011) are both installed on the upper end of the cap base (2015), and the cap base (2015) blocks the lower end opening of the anti-shake adsorption cavity (2012a).

4. The dual zone split pick pin unit of claim 3, wherein, The needle base (2014) and the needle body (2013) are both provided with a needle adsorption passage upper section (2015a) which communicates with each top crystal adsorption hole (2011b), the outer side of the needle base (2014) is provided with a needle adsorption passage lower section (2014a) which communicates with the needle adsorption passage upper section (2015a), and a top crystal adsorption air pipe joint (2018) which communicates with the needle adsorption passage lower section (2014a).

5. The dual zone split pick pin unit of claim 3, wherein, It further comprises: a needle reset spring (2016), which is sleeved on the needle body (2013) and located below the needle base (2014), and is used to drive the needle body (2013) to slide downward relative to the needle inner cap (2011) to be flush with or lower than the needle hole (2011a).

6. The dual zone split pick pin unit of claim 1, wherein, The sidewall of the needle outer sleeve (2012) is connected with an anti-shake adsorption air pipe joint (2017) which communicates with the anti-shake adsorption cavity (2012a).

7. A needle mechanism, characterized by It comprises the double-zone separation adsorption needle unit (201) of any one of claims 1-6, and a vertical direct drive mechanism (202) which drives the needle body (2013) of the double-zone separation adsorption needle unit (201) to extend upward through the needle hole (2011a).

8. The needle mechanism of claim 7, wherein, The vertical direct drive mechanism (202) comprises a cam (2021) located below the needle body (2013), and a rotary drive mechanism (2022) which drives the cam (2021) to rotate.

9. The pim mechanism of claim 7, wherein, It further comprises: A top crystal adsorption vacuum pump, a suction port of the top crystal adsorption vacuum pump is communicated to each top crystal adsorption hole (2011b) of the top needle inner cap (2011); A jitter adsorption vacuum pump, a suction port of the jitter adsorption vacuum pump is communicated to the jitter adsorption cavity (2012a); Wherein, the suction force of the upper end opening of the jitter adsorption cavity (2012a) is less than the suction force of each top crystal adsorption hole (2011b).

10. A die bonding apparatus, characterized in that, A crystal ring fixing mechanism (1) for placing a crystal ring, a wafer is lifted up to separate from a film by a crystal ring fixing mechanism (1) under the crystal ring A top needle mechanism (2) as claimed in any one of claims 7-9, and a die bonding swing arm (3) for moving the lifted wafer to a substrate.

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