Radiator for TR chip in subsonic speed environment
By adding a heat dissipation skin and a liquid cooler to the heat sink of the TR chip, setting up flow channels and combining them with external environment heat exchange, the problem of poor heat dissipation performance of the TR chip over a long period of time was solved, achieving efficient and stable heat dissipation and simplified processing.
Patent Information
- Application Number
- CN202423198862.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-24
AI Technical Summary
In the existing technology, the heat dissipation performance of TR chips is poor when working for a long time. The aluminum plate reaches the same temperature as the chip in a short period of time, resulting in the loss of heat dissipation function.
A heat dissipation skin and a liquid cooler are added to the heat dissipation plate. The plate body flow channel and the skin flow channel are set up. Heat exchange is carried out through coolant and heat dissipation is combined with the external environment. The heat dissipation skin adopts a split structure with an independent flow channel design.
It achieves efficient heat dissipation for long-term operation of TR chips, and the independent flow channel design ensures the stability and reliability of the heat dissipation function, while reducing the difficulty of processing.
Smart Images
Figure CN223680110U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to chip heat dissipation technical field especially relates to a heat sink for TR chip in subsonic speed environment. BACKGROUND
[0002] TR chip, full name is transmit / receive chip, is the core component of phased array radar system, is responsible for signal transmission and reception, is the key element of realizing radar beam scanning, target detection, tracking and other functions.
[0003] In actual signal process, the power of TR chip is large, can produce a large amount of heat, and the TR chip needs to be cooled.
[0004] In prior art, for the heat dissipation of TR chip, the aluminum plate with high heat dissipation coefficient is directly contacted with TR chip to realize the heat dissipation of TR chip.
[0005] However, this heat dissipation mode is only suitable for short time heat dissipation (for example, 3-5min), if the working time of TR chip is long (more than 30min), the temperature of aluminum plate will be the same as that of TR chip in short time, resulting in the loss of heat dissipation function. INVENTION CONTENTS
[0006] In view of the above analysis, the utility model aims at providing a heat sink for TR chip in subsonic speed environment to solve the problem of poor heat dissipation performance of TR chip in prior art.
[0007] The utility model mainly aims at realizing the following technical schemes.
[0008] The utility model provides a heat sink for TR chip in subsonic speed environment, including heat dissipation board, heat dissipation skin and liquid cooling machine, TR chip is placed on heat dissipation board and directly contacted with heat dissipation board, heat dissipation board is placed on heat dissipation skin and directly contacted with heat dissipation skin, the plate body flow channel is set up in heat dissipation board, the skin flow channel is set up in heat dissipation skin, and the plate body flow channel, the skin flow channel and the liquid cooling machine are sequentially connected to constitute cooling liquid circulation loop.
[0009] Further, the heat dissipation skin includes the first skin and the second skin that are symmetrically arranged along the center line of the heat dissipation skin and detachably connected, and the cross-sectional shape of the first skin and the second skin is semicircular.
[0010] Further, the first skin flow channel is set up in the first skin, the first skin outer wall is provided with the first liquid inlet and the first liquid outlet communicated with the first skin flow channel, the first liquid inlet is connected with the liquid outlet of the liquid cooling machine, and the first liquid outlet is connected with the liquid inlet of the liquid cooling machine.
[0011] Further, the second skin is internally provided with a second skin flow channel, and the second skin outer wall is provided with a second liquid inlet and a second liquid outlet communicated with the second skin flow channel.
[0012] Further, the first skin flow channel and the second skin flow channel are independently arranged.
[0013] Further, the first skin and the second skin are detachably connected through a connecting flange.
[0014] Further, the heat dissipation skin comprises a skin inner layer and a skin outer layer sleeved on the outer wall of the skin inner layer, the inner wall of the skin outer layer is provided with a flow groove, and the skin inner layer covers the opening of the flow groove, and the flow groove and part of the skin inner layer form a skin flow channel.
[0015] Further, the heat dissipation plate is an aluminum heat dissipation plate, and the heat dissipation skin is an aluminum heat dissipation skin.
[0016] Further, the heat dissipation skin is in the shape of a circular truncated cone.
[0017] Further, the inclination angle of the side wall of the heat dissipation skin is 73-78°.
[0018] Compared with the prior art, the heat dissipation device for the TR chip in the subsonic speed environment has at least one of the following beneficial effects:
[0019] A) The heat dissipation device for the TR chip in the subsonic speed environment provided by the utility model increases the heat dissipation skin and the liquid cooling machine on the basis of the heat dissipation plate, opens a plate flow channel in the heat dissipation plate, opens a skin flow channel in the heat dissipation skin, and when the TR chip is in the process of transmitting and receiving signals, the liquid cooling machine is started, the cooling liquid is passed into the plate flow channel and the skin flow channel, the cooling liquid exchanges heat with the TR chip through the heat dissipation plate, the heat dissipation of the TR chip is realized, the heat dissipation of the TR chip is strengthened, and the heat dissipation performance of the TR chip during long-time work is effectively ensured.
[0020] B) The heat dissipation device for the TR chip in the subsonic speed environment provided by the utility model, since the TR chip is in the subsonic speed environment, the temperature of the external environment is less than that of the TR chip, and the heat of the TR chip can also exchange heat with the external environment through the heat dissipation plate and the heat dissipation skin, so that the TR chip is further cooled.
[0021] C) The heat dissipation device for the TR chip in the subsonic speed environment provided by the utility model, the first skin flow channel and the second skin flow channel in the first skin are independently arranged, so that on the one hand, when one of the skin flow channels is blocked, the other skin flow channel still has a heat dissipation function, the normal heat dissipation of the TR chip is ensured, and on the other hand, the first skin flow channel and the second skin flow channel are independently arranged, so that in the processing process, the problems of subsequent communication and alignment of the two skin flow channels do not need to be considered, and the processing difficulty can be greatly reduced.
[0022] The above technical solutions can be combined with each other to realize more preferred combination solutions. Other features and advantages of the present application will be described in the subsequent specification, and some advantages can be apparent from the specification or can be understood by implementing the present application. The purposes and other advantages of the present application can be realized and obtained through the contents specifically indicated in the specification, embodiments and drawings. BRIEF DESCRIPTION OF DRAWINGS
[0023] The drawings are only for the purpose of illustrating specific embodiments and are not considered as limiting the present application, and the same reference signs represent the same components throughout the drawings.
[0024] Fig. 1 A structural schematic view of the heat sink for the TR chip in a subsonic speed environment provided by the present application embodiment one is provided;
[0025] Fig. 2 An axial cross-section perspective view of the heat sink for the TR chip in a subsonic speed environment provided by the present application embodiment one is provided;
[0026] Fig. 3 A structural schematic view of the heat dissipation skin in the heat sink for the TR chip in a subsonic speed environment provided by the present application embodiment one is provided.
[0027] Reference signs:
[0028] 1-heat dissipation plate; 2-heat dissipation skin; 201-first skin; 202-second skin; 203-first liquid inlet; 204-first liquid outlet; 205-connection flange; 206-skin inner layer; 207-skin outer layer; 208-skin flow channel; 3-TR chip. DETAILED DESCRIPTION
[0029] The preferred embodiments of the present application will be specifically described below in combination with the drawings, wherein the drawings constitute a part of the present application and are used to explain the principles of the present application together with the embodiments of the present application, and are not used to limit the scope of the present application.
[0030] Embodiment one
[0031] The present embodiment provides a heat sink for a TR chip in a subsonic speed environment, referring to Figs. 1-2, including a heat dissipation plate 1 (for example, an aluminum heat dissipation plate), a heat dissipation skin 2 (for example, an aluminum heat dissipation skin), and a liquid cooling machine, the TR chip 3 is placed on the heat dissipation plate 1 and directly contacts the heat dissipation plate 1, the heat dissipation plate 1 is placed on the heat dissipation skin 2 and directly contacts the heat dissipation skin 2, the heat dissipation plate 1 is provided with a plate body flow channel, the heat dissipation skin 2 is provided with a skin flow channel 208, and the plate body flow channel, the skin flow channel 208 and the liquid cooling machine are sequentially connected to form a cooling liquid circulation loop.
[0032] Compared with the prior art, the heat dissipation device for the TR chip in the subsonic speed environment provided by the embodiment adds the heat dissipation skin 2 and the liquid cooling machine on the basis of the heat dissipation plate 1, the plate body flow channel is arranged in the heat dissipation plate 1, the skin flow channel 208 is arranged in the heat dissipation skin 2, when the TR chip 3 emits and receives signals, the working time of the TR chip 3 is 3-5 min, and the TR chip 3 can be conventionally cooled through the heat dissipation plate 1, when the working time of the TR chip 3 is more than 5 min, the liquid cooling machine is started, the cooling liquid is introduced into the plate body flow channel and the skin flow channel 208, the cooling liquid exchanges heat with the TR chip 3 through the heat dissipation plate 1, and the TR chip 3 is cooled, so that the TR chip 3 can be strengthened and cooled, and the heat dissipation performance of the TR chip 3 in a long time working state is effectively ensured.
[0033] In addition, since the TR chip 3 is in the subsonic speed environment, the temperature of the external environment is less than the temperature of the TR chip 3, and the heat of the TR chip 3 can also exchange heat with the external environment through the heat dissipation plate 1 and the heat dissipation skin 2, so that the TR chip 3 is further cooled.
[0034] In order to increase the heat dissipation area, the shape of the heat dissipation skin 2 is a circular truncated cone, and the inclination angle of the side wall of the heat dissipation skin 2 is 73-78°. The heat dissipation skin 2 with this shape can not only effectively cool the TR chip 3, but also stably support the heat dissipation plate 1 and the TR chip 3, and ensure the stability of the overall structure.
[0035] In order to facilitate the processing of the heat dissipation skin 2, the heat dissipation skin 2 is of a split structure, including a first skin 201 and a second skin 202 which are symmetrically arranged along the center line of the heat dissipation skin 2 and can be detachably connected, see Fig. 3 The cross-sectional shape of the first skin 201 and the second skin 202 is a half ring, thereby forming a circular ring-shaped heat dissipation skin 2.
[0036] The first skin 201 is provided with a first skin 201 flow channel, and the outer wall of the first skin 201 is provided with a first liquid inlet 203 and a first liquid outlet 204 which are in communication with the first skin 201 flow channel. The first liquid inlet 203 is connected with the liquid outlet of the liquid cooling machine, and the first liquid outlet 204 is connected with the liquid inlet of the liquid cooling machine.
[0037] The second skin 202 is provided with a second skin 202 flow channel, and the outer wall of the second skin 202 is provided with a second liquid inlet and a second liquid outlet which are communicated with the second skin 202 flow channel, the second liquid inlet is connected with the liquid outlet of the liquid cooling machine, and the second liquid outlet is connected with the liquid inlet of the liquid cooling machine.
[0038] That is, the first skin 201 flow channel and the second skin 202 flow channel are independently arranged, so that, on the one hand, when one of the skin flow channels 208 is blocked, the other skin flow channel 208 can still have a heat dissipation function, ensuring normal heat dissipation of the TR chip 3; on the other hand, the first skin 201 flow channel and the second skin 202 flow channel are independently arranged, and in the processing process, there is no need to consider the problems of communication and alignment of the two skin flow channels 208, which can greatly reduce the processing difficulty.
[0039] Exemplarily, the first skin 201 and the second skin 202 are detachably connected through the connecting flange 205.
[0040] In order to reduce the processing difficulty of the skin flow channel 208, the above-mentioned first skin 201 and the second skin 202 have basically the same structure, both of which include a skin inner layer 206 and a skin outer layer 207 which is sleeved on the outer wall of the skin inner layer 206, the inner wall of the skin outer layer 207 is provided with a zigzag or back-shaped flow groove, the skin inner layer 206 covers the opening of the flow groove, and the flow groove and part of the skin inner layer 206 constitute the skin flow channel 208.
[0041] Exemplarily, the cross-sectional shape of the skin flow channel 208 is triangular or rectangular.
[0042] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.
Claims
1. A heat spreader for a TR chip in a subsonic environment, characterized by, The TR chip is placed on and directly contacts with a heat dissipation plate, the heat dissipation plate is placed on and directly contacts with a heat dissipation skin, a plate body flow channel is formed in the heat dissipation plate, a skin flow channel is arranged in the heat dissipation skin, and the plate body flow channel, the skin flow channel and the liquid cooling machine are sequentially connected to form a cooling liquid circulation loop.
2. The heat spreader for a TR chip in a subsonic environment of claim 1, wherein, The heat dissipation skin comprises a first skin and a second skin which are symmetrically arranged along a center line of the heat dissipation skin and detachably connected.
3. The heat spreader for a TR chip in a subsonic environment of claim 2, wherein, An upper first skin flow channel is formed in the first skin, a first liquid inlet and a first liquid outlet which are in communication with the first skin flow channel are arranged on the outer wall of the first skin, the first liquid inlet is connected with the liquid outlet of the liquid cooling machine, and the first liquid outlet is connected with the liquid inlet of the liquid cooling machine.
4. The heat spreader for a TR chip in a subsonic environment of claim 3, wherein, An upper second skin flow channel is formed in the second skin, a second liquid inlet and a second liquid outlet which are in communication with the second skin flow channel are arranged on the outer wall of the second skin, the second liquid inlet is connected with the liquid outlet of the liquid cooling machine, and the second liquid outlet is connected with the liquid inlet of the liquid cooling machine.
5. The heat spreader for a TR chip in a subsonic environment of claim 4, wherein, The first skin flow channel and the second skin flow channel are independently arranged.
6. The heat spreader for a TR chip in subsonic environments of claim 2, wherein, The first skin and the second skin are detachably connected through a connecting flange.
7. The heat spreader for a TR chip in a subsonic environment of any of claims 1 to 6, wherein, The heat dissipation skin comprises a skin inner layer and a skin outer layer which is sleeved on the outer wall of the skin inner layer, a flow groove is formed in the inner wall of the skin outer layer, the skin inner layer covers the opening of the flow groove, and the flow groove and part of the skin inner layer form the skin flow channel.
8. The heat spreader for a TR chip in a subsonic environment of any of claims 1 to 6, wherein, The heat dissipation plate is an aluminum heat dissipation plate, and the heat dissipation skin is an aluminum heat dissipation skin.
9. The heat spreader for a TR chip in a subsonic environment of any of claims 1 to 6, wherein, The shape of the heat dissipation skin is a circular truncated cone.
10. The heat spreader for a TR chip in a subsonic environment of claim 9, wherein, The inclination angle of the side wall of the heat dissipation skin is 73-78°.