High-strength hanging bar structure for integrated circuit
By employing Y-shaped suspension ribs and reinforcing ribs in integrated circuits, the problem of insufficient strength of lead frame suspension ribs was solved, thereby improving the stability of the wafer stage and the heat dissipation effect of the chip.
Patent Information
- Application Number
- CN202423017390.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-09
AI Technical Summary
The existing lead frame suspension structure is not strong enough for high-power integrated circuits, which leads to deformation of the wafer stage and affects the heat dissipation of the chip.
The design adopts a Y-shaped suspension rod, with both ends of the suspension rod fixed to the lead wire frame and reinforcing ribs set inside the fork. The suspension rod is arranged in three sections from the outside to the inside, increasing the fixed connection points and buffering capacity.
This improves the stability of the lifting shank and the wafer stage, preventing deformation and ensuring effective heat dissipation for the chip.
Smart Images
Figure CN223680119U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor lead frame, specifically for a high strength muscle structure for integrated circuit. BACKGROUND
[0002] For DIP (dual in-line package) such integrated circuit with high power use requirement, in order to facilitate chip heat dissipation, its carrier wafer platform is exposed to the surface of the package, the muscle of such product connecting carrier wafer platform has very deep concave depth, if using the muscle structure design of existing lead frame, the carrier wafer platform may be deformed due to insufficient strength, cannot be completely exposed, as shown in Figs. Figure 1 and Figure 2 , thereby affecting the heat dissipation effect of the chip. SUMMARY
[0003] In order to solve the above technical problems, the utility model provides a high strength muscle for integrated circuit, which can effectively improve the strength of the product.
[0004] Its technical scheme is as follows: a high strength muscle structure for integrated circuit, which comprises a chip mounted on the front surface of a carrier wafer platform, and two sides of the carrier wafer platform are connected with a muscle, characterized in that the muscle is a Y-shaped muscle, the bifurcated ends of the Y-shaped muscle are connected with a lead frame, and a reinforcing rib is arranged in the bifurcation, and the other end of the Y-shaped muscle is connected with the side surface of the carrier wafer platform.
[0005] Further, the Y-shaped muscle is a three-section sinking structure from outside to inside, and the reinforcing rib comprises two horizontal sections arranged in the second layer of folding surface and the third layer of folding surface respectively.
[0006] After the utility model is adopted, the muscle design with Y-shaped bifurcation is adopted, the fixed connection points of the muscle and the lead frame are increased, and the reinforcing rib is increased at the bifurcation, so that the stability of the muscle is effectively improved; further, the multi-section structure of the sinking muscle can effectively improve the buffering of the muscle under stress, prevent the deformation of the carrier wafer platform connected at the bottom of the muscle, and further improve the stability. BRIEF DESCRIPTION OF DRAWINGS
[0007] Figure 1 for the carrier wafer platform back surface not completely exposed to the surface of the plastic package in the prior art Figure 1 ;
[0008] Figure 2 for the carrier wafer platform back surface not completely exposed to the surface of the plastic package in the prior art Figure 2 ;
[0009] Figure 3 for the structure of the utility model is a top view;
[0010] Figure 4 The structure front view of the utility model;
[0011] Figure 5 The utility model discloses a completely exposed on the surface of plastic package body back surface of the carrier platform schematic view. Specific implementation
[0012] See Figures 3 to 5 As shown in the figure, a high-strength hanging rib structure for integrated circuits includes a chip 6 mounted on the front face of a carrier platform 4, and the two sides of the carrier platform 4 are connected with hanging ribs. The hanging ribs are Y-shaped, the bifurcated ends of the Y-shaped hanging rib 1 are fixed with the lead frame and the bifurcated inner part is provided with a reinforcing rib 2, the other end of the Y-shaped hanging rib 1 is connected with the side face of the carrier platform 4, and the side face of the carrier platform 4 is provided with a connecting point.
[0013] The Y-shaped hanging rib 1 is a three-section folded surface structure arranged from outside to inside, the reinforcing rib 2 includes two horizontal sections arranged in the second layer of folded surface and the third layer of folded surface respectively, and the three-section distribution concave manner can effectively improve the buffering of the hanging rib after stress and prevent the carrier platform connected with the bottom of the hanging rib from deforming.
[0014] The bifurcated part of the hanging rib 1 is connected through the reinforcing rib 2 to improve the stability, one end of the hanging rib 1 is connected with the carrier platform 4, and the other end is fixed with the lead frame through the hanging rib connecting point 3, which will be cut off after plastic packaging, and the hanging rib 1 is separated from the lead frame. The chip 6 is mounted on the upper face of the front face of the carrier platform 4, and the back surface 5 of the carrier platform 4 will be exposed on the surface of the plastic package body 7 after plastic packaging, so that the chip 6 can dissipate heat outward through the back surface 5 of the carrier platform.
Claims
1. A high-strength suspension rib structure for integrated circuits, comprising a carrier table, a chip is mounted on the front surface of the carrier table, and suspension ribs are connected to both sides of the carrier table respectively, characterized in that, The hanging rib is a Y-shaped hanging rib, the bifurcated two ends of the Y-shaped hanging rib are fixed with the lead frame, and a reinforcing rib is arranged in the bifurcation, and the other end of the Y-shaped hanging rib is connected with the side of the slide table.
2. A high strength rib structure for an integrated circuit according to claim 1, wherein The Y-shaped hanging rib is a three-section folded surface structure arranged from outside to inside, and the reinforcing rib includes two horizontal sections arranged in the second layer of folded surfaces and the third layer of folded surfaces respectively.