Capacitor module structure and inverter

Abstract

The utility model discloses a capacitor module structure and an inverter, which comprise a box body, a frame plate is arranged in the box body, a plurality of monomer capacitors are arranged on the frame plate, a positive wiring board and a negative wiring board are arranged in the box body, and the positive wiring board and the negative wiring board are parallel to the frame plate. The frame plate, the positive electrode wiring board and the negative electrode wiring board are arranged at intervals in an insulating manner; two pins of the single capacitor penetrate through the frame plate and are respectively connected with the positive electrode wiring board and the negative electrode wiring board in a welding manner; and the positive terminal board and the negative terminal board are electrically connected to the power semiconductor assembly respectively. The capacitor box has the advantages that the structural design is reasonable, more capacitors can be arranged in the box body, and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to inverter technical field, especially a kind of capacitor module structure and inverter. BACKGROUND

[0002] Inverter is a kind of power electronic equipment, function is through high-frequency switching device and control circuit and is converted into high-frequency pulse signal by direct-current power supply, high-frequency pulse signal is converted into pure sine ac by output filter unit. Inverter is adjusted output waveform in frequency converter, provides suitable ac, to ensure that load equipment is normally operated under the voltage, frequency condition. Among them, the capacitor module in inverter is mainly used to stabilize DC bus voltage. Since the output voltage of power supply can fluctuate due to load change, these capacitors can smooth this fluctuation, maintain the stability of voltage, which is crucial for the normal operation of inverter, therefore, how to reasonably arrange more capacitors becomes a problem to be solved. SUMMARY

[0003] In view of the above technical problems of prior art, the technical problem to be solved by the utility model is: how to provide a capacitor module structure and inverter with reasonable structure design, which can arrange more capacitors in the box.

[0004] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0005] A kind of capacitor module structure, including box, the frame plate is arranged in the box, multiple single capacitors are arranged on the frame plate, the box has positive connection plate and negative connection plate, which are arranged in parallel with the frame plate, the frame plate, positive connection plate and negative connection plate are insulated from each other;Two pins of the single capacitor pass through the frame plate and are respectively connected to the positive connection plate and the negative connection plate by welding;The positive connection plate and the negative connection plate are connected to the power semiconductor assembly.

[0006] By arranging multiple single capacitors on the frame plate, and connecting the positive and negative poles of the single capacitors to the power semiconductor assembly through the positive and negative connection plates, the number of capacitors in the box can be increased, and the capacitance can be increased, so that it can be applied to high-power inverters.

[0007] Further, the frame plate has mounting holes arranged in both horizontal and vertical directions, and the single capacitors are installed one by one on the mounting holes.

[0008] Further, the power semiconductor assemblies are located on one side of the frame plate towards the middle of the box and are arranged side by side along the side; the positive terminal extendingly arranged on the positive terminal plate corresponds to the power semiconductor assembly; the negative terminal extendingly arranged on the negative terminal plate corresponds to the power semiconductor assembly; and the positive terminal and the negative terminal are connected with the corresponding power semiconductor assembly respectively.

[0009] In this way, the positive terminal and the negative terminal extendingly arranged on the positive terminal plate and the negative terminal plate are connected with the power semiconductor assembly, which can reduce the wiring difficulty and increase the reliability of the electrical connection, and is conducive to improving the service life.

[0010] Further, the single capacitors are arranged side by side in at least two rows in a direction away from the power semiconductor assembly, and the bus connection plates arranged in series are arranged between the adjacent two rows of single capacitors, and the bus connection plates are insulatively arranged on the side of the frame plate towards the positive terminal plate and the negative terminal plate.

[0011] In this way, a large-capacity capacitor can be formed by connecting small-capacity capacitors in series, which can improve the voltage bearing capacity of the capacitor and reduce the cost.

[0012] Further, the positive terminal plate and the negative terminal plate have the connection holes uniformly arranged along the edges on the side away from the power semiconductor assembly, and the positive terminal and the negative terminal of the single capacitor are respectively connected to the connection holes of the positive terminal plate and the negative terminal plate.

[0013] Further, the negative terminal plate is located between the positive terminal plate and the frame plate, and the distance from the connection hole of the negative terminal plate to the power semiconductor assembly is less than the distance from the connection hole of the positive terminal plate to the power semiconductor assembly.

[0014] Further, the positive terminal plate and the negative terminal plate have the connection holes uniformly arranged along the edges on the side away from the power semiconductor assembly, and the positive terminal and the negative terminal of the single capacitor are respectively connected to the connection holes of the positive terminal plate and the negative terminal plate.

[0015] Further, the box has a plurality of inductance coils arranged side by side on one side, and the positive terminal strip and the negative terminal strip pass through the inductance coils.

[0016] An inverter comprising the capacitor module structure as described above.

[0017] In summary, the utility model has the advantages of reasonable structure design and more capacitors arranged in the box. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a whole structure schematic view of the embodiment.

[0019] Figure 2 and Figure 3 for Figure 1 A schematic diagram of the internal structure.

[0020] Figure 4 This is a schematic diagram of the capacitor module structure.

[0021] Figure 5 for Figure 4 A schematic diagram of its decomposed structure. Detailed Implementation

[0022] The present invention will be further described in detail below with reference to the embodiments.

[0023] In practical implementation: such as Figures 1-5 As shown, an inverter includes a housing 1, inside which a frame plate 2 and a heat-conducting base plate 7 are disposed. A power semiconductor component 5 is mounted on the heat-conducting base plate 7. A plurality of individual capacitors 3 are arranged on the frame plate 2. The housing 1 has a positive terminal block 41 and a negative terminal block 42 arranged parallel to the frame plate 2. The frame plate 2, the positive terminal block 41, and the negative terminal block 42 are insulated from each other at intervals. The two pins of the individual capacitors 3 pass through the frame plate 2 and are respectively welded to the positive terminal block 41 and the negative terminal block 42. The positive terminal block 41 and the negative terminal block 42 are respectively connected to the power semiconductor component 5.

[0024] The power semiconductor components 5 are located on the side of the frame plate 2 facing the middle of the box, and multiple ones are arranged side by side along this side; positive terminals corresponding to the power semiconductor components 5 are extended on the positive terminal plate 41, and negative terminals corresponding to the power semiconductor components 5 are extended on the negative terminal plate 42, and the positive terminals and negative terminals are respectively connected to the corresponding power semiconductor components 5.

[0025] The frame plate 2 has mounting holes evenly distributed along the horizontal and vertical directions, and the individual capacitors 3 are mounted on the mounting holes one by one. Specifically, the individual capacitors 3 are arranged in two rows side by side along the direction away from the power semiconductor component 5, and a busbar connection plate 43 is connected in series between adjacent rows of individual capacitors 3. The busbar connection plate 43 is insulatedly disposed on the side of the frame plate 2 facing the positive terminal plate 41 and the negative terminal plate 42.

[0026] The positive electrode connecting plate 41 and the negative electrode connecting plate 42 are provided with connecting holes which are uniformly distributed along the edges, and the positive electrode and the negative electrode of the single capacitor 3 are respectively connected to the connecting holes of the positive electrode connecting plate 41 and the negative electrode connecting plate 42. In the embodiment, the negative electrode connecting plate 42 is located between the positive electrode connecting plate 41 and the frame plate 2, and the distance between the connecting holes of the negative electrode connecting plate 42 and the power semiconductor assembly 5 is smaller than the distance between the connecting holes of the positive electrode connecting plate 41 and the power semiconductor assembly 5.

[0027] The outer side of the positive electrode connecting plate 41 and the negative electrode connecting plate 42 is provided with a bent connecting part, and the positive electrode connecting strip and the negative electrode connecting strip are respectively connected to the two connecting parts. One side of the box 1 is provided with a plurality of inductance coils 6 which are arranged side by side, and the positive electrode connecting strip and the negative electrode connecting strip pass through the inductance coils 6.

[0028] With the above structure, a plurality of single capacitors can be arranged on the frame plate, a large-capacity capacitor is formed by connecting small-capacity capacitors in series, the voltage bearing capacity of the capacitor can be improved, and the cost can be reduced.

[0029] In addition, in the embodiment, the upper and lower sides of the box 1 are provided with ventilation openings, and a cooling fan is arranged on any ventilation opening. The back side of the heat-conducting bottom plate 7 is vertically provided with heat dissipation fins which are arranged at equal intervals, and a heat dissipation air duct is formed between adjacent two heat dissipation fins, and the through direction of the heat dissipation air duct is towards the ventilation opening. The frame plate 2 is connected to the heat-conducting bottom plate 7.

[0030] The above only describes the preferred embodiments of the present application, and the present application is not limited to the above. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A capacitive module structure, characterized by, The application relates to a capacitor module structure, which comprises a box (1), a frame plate (2) arranged in the box (1), a plurality of single capacitors (3) arranged on the frame plate (2), a positive electrode wiring plate (41) and a negative electrode wiring plate (42) arranged in parallel with the frame plate (2) in the box (1), and the frame plate (2), the positive electrode wiring plate (41) and the negative electrode wiring plate (42) are insulatedly arranged at intervals; two pins of the single capacitor (3) pass through the frame plate (2) and are welded to the positive electrode wiring plate (41) and the negative electrode wiring plate (42) respectively; the positive electrode wiring plate (41) and the negative electrode wiring plate (42) are electrically connected to a power semiconductor assembly (5).

2. The capacitive module structure of claim 1, wherein, The frame plate (2) is provided with mounting holes arranged in the transverse and longitudinal directions; the single capacitors (3) are correspondingly arranged on the mounting holes.

3. The capacitive module structure of claim 2, wherein, The power semiconductor assembly (5) is arranged on one side of the frame plate (2) towards the middle of the box and is arranged in parallel with a plurality of power semiconductor assemblies (5); the positive electrode wiring plate (41) is provided with positive electrode terminals corresponding to the power semiconductor assemblies (5) in extension; the negative electrode wiring plate (42) is provided with negative electrode terminals corresponding to the power semiconductor assemblies (5) in extension; the positive electrode terminals and the negative electrode terminals are connected to the corresponding power semiconductor assemblies (5) respectively.

4. The capacitive module structure of claim 3, wherein, The single capacitors (3) are arranged in at least two rows in parallel away from the power semiconductor assemblies (5); the single capacitors (3) in adjacent two rows are provided with bus connection plates (43) arranged in series; the bus connection plates (43) are insulatively arranged on one side of the frame plate (2) towards the positive electrode wiring plate (41) and the negative electrode wiring plate (42).

5. The capacitive module structure of claim 3, wherein, The positive electrode wiring plate (41) and the negative electrode wiring plate (42) are provided with connecting holes arranged in the edge on one side away from the power semiconductor assemblies (5); the positive electrodes and the negative electrodes of the single capacitors (3) are connected to the connecting holes of the positive electrode wiring plate (41) and the negative electrode wiring plate (42) respectively.

6. The capacitive module structure of claim 5, wherein, The negative electrode wiring plate (42) is arranged between the positive electrode wiring plate (41) and the frame plate (2); the distance from the connecting holes of the negative electrode wiring plate (42) to the power semiconductor assemblies (5) is smaller than the distance from the connecting holes of the positive electrode wiring plate (41) to the power semiconductor assemblies (5).

7. The capacitive module structure of claim 3, wherein, The positive electrode wiring plate (41) and the negative electrode wiring plate (42) are provided with wiring parts arranged in bending on one side away from the power semiconductor assemblies (5); the positive electrode wiring part and the negative electrode wiring part are connected to the positive electrode wiring strip and the negative electrode wiring strip respectively.

8. The capacitive module structure of claim 7, wherein, One side of the box (1) is provided with a plurality of inductance coils (6) arranged in parallel; the positive electrode wiring strip and the negative electrode wiring strip pass through the inductance coils (6).

9. An inverter, characterized by, The application further discloses a capacitor module structure as claimed in any one of claims 1-8.

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