Power supply backboard

Abstract

The utility model relates to a power supply backboard, which comprises a PCB (Printed Circuit Board), a first busbar, a second busbar, a third busbar, a fourth busbar, a fifth busbar and a sixth busbar, the PCB is provided with a first surface, a second surface, a first side and a second side, the first busbar is stacked on the first surface of the PCB; the second busbar and the third busbar are stacked on the first busbar side by side left and right to form a second layer of busbar; the fourth busbar and the fifth busbar are stacked on the second layer of busbar side by side in a left-right manner to form a third layer of busbar; and the sixth busbar is stacked on the second surface of the PCB. According to the power supply backboard, five busbars are stacked in three layers on a first surface of a PCB, a layer of busbar is arranged on a second surface of the PCB, and the six busbars respectively provide six connection nodes staggered from each other on the same side, so that the requirements of limited space multi-path input and output and thermal risk reduction can be met.

Description

TECHNICAL FIELD

[0001] The present application relates to the power distribution technical field, more particularly, to a power supply backboard. BACKGROUND

[0002] In the power supply system, in order to meet the requirements of customers, the power conversion frame backboard needs to have double busbar input, single busbar output, and the input and output need to be isolated. In the limited space of 1U (44.45mm), the multi-layer busbar connection is limited by height and depth, and the copper bar has the risk of exceeding the allowed safety temperature due to heat accumulation.

[0003] Therefore, it is necessary to have a backboard connection scheme that can meet the multi-channel input and output in limited space and reduce the heat risk. CONTENT OF THE INVENTION

[0004] The technical problem to be solved by the present application is to provide a power supply backboard that can meet the multi-channel input and output in limited space and reduce the heat risk, in view of the above-mentioned defects of the prior art.

[0005] The technical solution adopted by the present application to solve its technical problem is: a power supply backboard is provided, comprising a PCB board, a first busbar, a second busbar, a third busbar, a fourth busbar, a fifth busbar and a sixth busbar, wherein: the PCB board has a first surface and a second surface opposite to each other, and a first side and a second side opposite to each other; the first busbar is stacked on the first surface of the PCB board; the second busbar and the third busbar are stacked side by side on the first busbar, forming a second layer of busbars; the fourth busbar and the fifth busbar are stacked side by side on the second layer of busbars, forming a third layer of busbars; the sixth busbar is stacked on the second surface of the PCB board; the first busbar, the second busbar, the third busbar, the fourth busbar and the fifth busbar are respectively provided with a first connection node, a second connection node, a third connection node, a fourth connection node and a fifth connection node on the first side of the PCB board, and the sixth busbar is provided with a sixth connection node on the first side of the PCB board, and the first connection node, the second connection node, the third connection node, the fourth connection node, the fifth connection node and the sixth connection node are staggered with each other on the first side of the PCB board.

[0006] According to one embodiment of the power supply back plate described in the application, the first bus bar, the second bus bar, the third bus bar, the fourth bus bar and the fifth bus bar are respectively bent on the first side of the PCB board to form the first connection node, the second connection node, the third connection node, the fourth connection node and the fifth connection node from the first surface to the second surface of the PCB board, and the sixth bus bar is bent on the first side of the PCB board to form the sixth connection node from the second surface to the first surface of the PCB board.

[0007] According to one embodiment of the power supply back plate described in the application, the first bus bar, the second bus bar, the third bus bar, the fourth bus bar, the fifth bus bar and the sixth bus bar are respectively provided with soldering feet staggered with each other and soldered and fixed with the PCB board, and the first bus bar and the second layer bus bar and the second layer bus bar and the third layer bus bar are respectively isolated by an insulating pad and fixed together.

[0008] According to one embodiment of the power supply back plate described in the application, the fourth bus bar and the fifth bus bar in the third layer bus bar are respectively provided with a press-in stud extending from the first surface to the second surface of the PCB board, the second bus bar and the third bus bar of the second layer bus bar are correspondingly provided with a first mounting hole for the press-in stud, and the first bus bar is correspondingly provided with a second mounting hole for the press-in stud; the press-in stud between the third layer bus bar and the second layer bus bar is sleeved with a first insulating pad, the press-in stud between the second layer bus bar and the first bus bar is sleeved with a second insulating pad, and the end of the press-in stud is sleeved with a third insulating pad and a gasket and then locked by a nut to fix the first bus bar, the second layer bus bar and the third layer bus bar together.

[0009] According to one embodiment of the power supply back plate described in the application, the first insulating pad is provided with a first cylindrical section inserted into the first mounting hole, the second insulating pad is provided with a second cylindrical section inserted into the first mounting hole and embedded with the first cylindrical section, and the third insulating pad is provided with a third cylindrical section passing through the second mounting hole and embedded with the second insulating pad.

[0010] According to one embodiment of the power supply back plate described in the application, the sixth bus bar is provided with a plurality of avoidance holes corresponding to the soldering feet of the first bus bar, the second bus bar, the third bus bar, the fourth bus bar and the fifth bus bar.

[0011] According to one embodiment of the power supply backboard, the first bus bar, the second bus bar, the third bus bar, the fourth bus bar, the fifth bus bar and the sixth bus bar are respectively provided with at least one supporting leg near the first connecting node, the second connecting node, the third connecting node, the fourth connecting node, the fifth connecting node and the sixth connecting node.

[0012] According to one embodiment of the power supply backboard, the first bus bar, the second bus bar, the third bus bar, the fourth bus bar, the fifth bus bar and the sixth bus bar are respectively provided with at least one supporting leg near the first connecting node, the second connecting node, the third connecting node, the fourth connecting node, the fifth connecting node and the sixth connecting node.

[0013] According to one embodiment of the power supply backboard, four of the first connecting node, the second connecting node, the third connecting node, the fourth connecting node, the fifth connecting node and the sixth connecting node are used as two-way positive and negative input nodes, and two are used as one-way positive and negative output nodes.

[0014] According to one embodiment of the power supply backboard, the first connecting node and the sixth connecting node are used as the one-way positive and negative output nodes, the second connecting node and the fourth connecting node are used as one of the two-way positive and negative input nodes, and the third connecting node and the fifth connecting node are used as the other of the two-way positive and negative input nodes.

[0015] According to one embodiment of the power supply backboard, the first connecting node and the sixth connecting node are formed in the middle positions of the first bus bar and the sixth bus bar and are staggered left and right, the second connecting node and the third connecting node are formed in one end of the left and right ends of the second bus bar and the third bus bar, and the fourth connecting node and the fifth connecting node are formed in the other end of the left and right ends of the fourth bus bar and the fifth bus bar, so that the first connecting node, the second connecting node, the third connecting node, the fourth connecting node, the fifth connecting node and the sixth connecting node are staggered with each other on the first side of the PCB.

[0016] According to one embodiment of the power supply backboard, the edge of the second side of the PCB is provided with a plurality of input gold fingers, and the second surface of the PCB is further provided with a plurality of output connectors between the input gold fingers and the sixth bus bar, and the first bus bar, the second bus bar, the third bus bar, the fourth bus bar, the fifth bus bar and the sixth bus bar are respectively electrically connected to the input gold fingers and the output connectors through the PCB.

[0017] The power backboard of the present application has the following beneficial effects: the power backboard according to the embodiments of the present application has five busbars arranged in three layers on the first surface of the PCB, and one busbar arranged on the second surface of the PCB, and the six busbars provide six connection nodes staggered with each other on the same side of the PCB, so as to meet the requirement of providing multiple input and output in limited space, and meanwhile, the appropriate gap between the busbars helps air circulation, reduces the temperature of the busbars, and meets the requirement of thermal design. The three busbars on the first surface of the PCB according to the embodiments of the present application are isolated and fixed together by the insulating pad, and then welded on the PCB together, so as to have compact structure, high strength, meet the requirement of electrical safety, help heat dissipation of the busbars, have high positioning accuracy of the welding points of the busbars, and improve the manufacturability. BRIEF DESCRIPTION OF DRAWINGS

[0018] The present application will be further described below in combination with the drawings and embodiments, wherein:

[0019] Figure 1 is a schematic diagram of the overall structure of the power backboard according to an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of the overall structure of the power backboard according to another embodiment of the present application; Figure 1

[0021] Figure 3 is a schematic diagram of the exploded structure of the power backboard according to an embodiment of the present application; Figure 1

[0022] Figure 4 is a schematic diagram of the partial structure of the power backboard according to an embodiment of the present application; Figure 1

[0023] Figure 5 is an enlarged view of A in Figure 1

[0024] ​​​​Explanation of reference numerals: 100 - power backboard; 10 - PCB board; 111 - first surface; 112 - second surface; 121 - first side; 122 - second side; 13 - input gold fingers; 14 - output connector; 20 - first busbar; 21 - first soldering leg; 30 - second layer busbar; 31 - second busbar; 311 - second soldering leg; 312 - supporting leg; 32 - third busbar; 321 - third soldering leg; 40 - third layer busbar; 41 - fourth busbar; 411 - fourth soldering leg; 42 - fifth busbar; 421 - fifth soldering leg; 50 - sixth busbar; 51 - sixth soldering leg; 52 - clearance hole; 61 - first connecting node; 62 - second connecting node; 63 - third connecting node; 64 - fourth connecting node; 65 - fifth connecting node; 66 - sixth connecting node; 71 - first insulating pad; 711 - first cylindrical segment; 72 - second insulating pad; 721 - second cylindrical segment; 73 - third insulating pad; 731 - third cylindrical segment; 81 - press rivet; 82 - first mounting hole; 83 - second mounting hole; 84 - gasket; 85 - nut. DETAILED DESCRIPTION

[0025] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application. Moreover, the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0026] The present application proposes a power backboard arranged in a stack to meet the needs of multiple input and output in limited space and reduce the risk of heat. Figure 1 and Figure 2 respectively show the overall structure of the power backboard 100 from different angles according to an embodiment of the present application, Figure 3 show the exploded structure of the power backboard 100. Referring to Figures 1 to 3As shown, the power backplane 100 is mainly composed of a PCB board 10, a first busbar 20, a second busbar 31, a third busbar 32, a fourth busbar 41, a fifth busbar 42 and a sixth busbar 50. The PCB board 10 has a first surface 111 and a second surface 112 opposite to each other, and a first side 121 and a second side 122 opposite to each other. The first busbar 20 is stacked on the first surface 111 (i.e. the upper surface in the figure) of the PCB board 10 and is fixed to the PCB board 10 by two or more first soldering feet 21. The first busbar 20 is bent at the first side 121 of the PCB board 10 in a direction from the first surface 111 to the second surface 112 of the PCB board 10 (i.e. the downward direction in the figure) to form a first connecting node 61 at a left position in the middle of the first busbar 10. The second busbar 31 and the third busbar 32 are stacked on the first busbar 20 side by side and are fixed to the PCB board 10 by two or more second soldering feet 311 and third soldering feet 321 respectively, thereby forming a second layer of busbars 30 (see Fig. 2). Figure 4 The second busbar 31 and the third busbar 32 are both bent downward at the first side 121 of the PCB board 10 to form a second connecting node 62 and a third connecting node 63 respectively at right end positions of the second busbar 31 and the third busbar 32. The fourth busbar 41 and the fifth busbar 42 are stacked on the second busbar 31 and the third busbar 32 in the second layer of busbars 30 side by side respectively and are fixed to the PCB board 10 by two or more fourth soldering feet 411 and fifth soldering feet 421 respectively, thereby forming a third layer of busbars 40 (see Fig. 3). Figure 4 The fourth busbar 41 and the fifth busbar 42 are both bent downward at the first side 121 of the PCB board 10 to form a fourth connecting node 64 and a fifth connecting node 65 respectively at left end positions of the fourth busbar 41 and the fifth busbar 42. The sixth busbar 50 is stacked on the second surface 112 (i.e. the lower surface in the figure) of the PCB board 10 and is fixed to the PCB board 10 by two or more sixth soldering feet 51. The sixth busbar 50 is bent at the first side 121 of the PCB board 10 in a direction from the second surface 112 to the first surface 111 of the PCB board 10 (i.e. the upward direction in the figure) to form a sixth connecting node 66 at a right position in the middle of the sixth busbar 50.

[0027] Thus, a first bus 20, a second bus 31, a third bus 32, a fourth bus 41, and a fifth bus 42 are stacked in three layers on the first surface 111 of the PCB board 10, and a sixth bus 50 is stacked on the second surface 112 of the PCB board 10. The first soldering pins 21, 311, 321, 411, 421, and 51 of the first bus 20, the second bus 31, the third bus 32, the fourth bus 41, the fifth bus 42, and the sixth bus 50 are staggered and soldered to the PCB board 10, thereby forming a four-layer stacked bus structure. Six staggered connection nodes are provided on the same side (i.e., the first side 121) of the PCB board 10 to meet the requirements of multiple inputs and outputs. For example, four of the following nodes—first connection node 61, second connection node 62, third connection node 63, fourth connection node 64, fifth connection node 65, and sixth connection node 66—can be used as two positive and negative input nodes, and two can be used as one positive and negative output node. Specifically... Figures 1 to 3 In the illustrated embodiment, the first connection node 61 of the first bus 20 and the sixth connection node 66 of the sixth bus 50 serve as one positive and one negative output node, wherein the sixth connection node 66 serves as the positive output node and the first connection node 61 serves as the negative output node. The second connection node 62 of the second bus 31 and the fourth connection node 64 of the fourth bus 41 serve as one positive and one negative input node, wherein the second connection node 62 serves as the negative input node and the fourth connection node 64 serves as the positive input node. The third connection node 63 of the third bus 32 and the fifth connection node 62 of the fifth bus 42 serve as another positive and one negative input node, wherein the third connection node 63 serves as the negative input node and the fifth connection node 65 serves as the positive input node. These two positive and one negative input nodes and one positive and one negative output node are staggered on the first side 121 of the PCB board 10 for easy wiring by the user. See also Figures 1 to 3 As shown, the edge of the second side 122 of the PCB board 10 is provided with a plurality of input gold fingers 13, and the second surface 112 of the PCB board 10 is also provided with a plurality of output connectors 14 between the input gold fingers 13 and the sixth bus 50. The first bus 20, the second bus 31, the third bus 32, the fourth bus 41, the fifth bus 42 and the sixth bus 50 are electrically connected to the input gold fingers 13 and the output connectors 14 respectively through the circuit configuration in the PCB board 10.

[0028] In order to better meet the electrical safety requirements, the power backboard 100 according to the above-mentioned embodiments of the present application will also isolate and stack the first busbar 20 and the second layer busbar 30 and the second layer busbar 30 and the third layer busbar 40 together through the insulating pads, and then weld and fix them together on the PCB board 10. See Figure 3 As shown in Figure 4 As shown in the figure, the fourth busbar 41 and the fifth busbar 42 in the third layer busbar 40 are respectively provided with two or more downwardly extending press-in studs 81, and the second busbar 31 and the third busbar 32 of the second layer busbar 30 are correspondingly provided with first mounting holes 82 for the press-in studs 81 to pass through, and the first busbar 20 is correspondingly provided with second mounting holes 83 for the press-in studs 81 to pass through. When the first busbar 20, the second layer busbar 30 and the third layer busbar 40 are stacked, a first insulating pad 71 is sleeved on the press-in studs 81 between the third layer busbar 40 and the second layer busbar 30, a second insulating pad 72 is sleeved on the press-in studs 81 between the second layer busbar 30 and the first busbar 20, and after a third insulating pad 73 and a washer 84 are sleeved on the end of the press-in studs 81 passing through the second mounting hole 83 and then locked by a nut 85, the first busbar 20, the second busbar 31 and the third busbar 32 in the second layer busbar 30 and the fourth busbar 41 and the fifth busbar 42 in the third layer busbar 40 can be stacked and fixed together. Moreover, the first insulating pad 71 is provided with a first cylindrical section 711 inserted into the first mounting hole 82, the second insulating pad 72 is provided with a second cylindrical section 721 inserted into the first mounting hole 82 and sleeved on the first cylindrical section 711 of the first insulating pad 71 to form an embedded structure with the first cylindrical section 711, and the third insulating pad 73 is provided with a third cylindrical section 731 passing through the second mounting hole 83 and inserted into the second insulating pad 72 to form an embedded structure with the second insulating pad 72, so that the first busbar 20, the second busbar 31 and the third busbar 32 of the second layer busbar 30 and the fourth busbar 41 and the fifth busbar 42 of the third layer busbar 40 are completely isolated from each other, meeting the electrical safety requirements. Moreover, the first insulating pad 71 and the second insulating pad 72 maintain a suitable gap between the busbars, which helps the flow of air, reduces the temperature of the busbars, and meets the thermal design requirements. In addition, the first busbar 20, the second busbar 31, the third busbar 32, the fourth busbar 41 and the fifth busbar 42 are assembled together, which not only enhances the overall strength and ensures the safety gap, but also increases the positioning accuracy of the busbar welding points, facilitating the improvement of manufacturability.

[0029] Further referring to Figure 1 As shown in Figure 5As shown, taking the first connection node 61 as an example, the first busbar 20, the second busbar 31, the third busbar 32, the fourth busbar 41, the fifth busbar 42 and the sixth busbar 50 are respectively provided with support feet 312 close to the first connection node 61, the second connection node 62, the third connection node 63, the fourth connection node 64, the fifth connection node 65 and the sixth connection node 66 (for example, the left and right sides) for insertion with the PCB board 10 to strengthen the mechanical strength and facilitate the user to connect the wires.

[0030] Further referring to Figure 2 As shown, the first soldering feet 21 of the first busbar 20, the second soldering feet 311 of the second busbar 31, the third soldering feet 321 of the third busbar 32, the fourth soldering feet 411 of the fourth busbar 41 and the fifth soldering feet 421 of the fifth busbar 42 on the sixth busbar 50 corresponding to the first surface 111 of the PCB board 10 are further provided with a plurality of avoiding holes 52, and the distribution and shape of the plurality of avoiding holes 52 can be flexibly set according to the position and distribution of the soldering feet of each busbar to avoid the soldering points, thereby improving the manufacturability process.

[0031] The above only describes the preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power backplane (100) characterized by, The application relates to a PCB board (10), a first busbar (20), a second busbar (31), a third busbar (32), a fourth busbar (41), a fifth busbar (42) and a sixth busbar (50), wherein: The PCB board (10) has a first surface (111) and a second surface (112) opposite to each other, and a first side (121) and a second side (122) opposite to each other; The first busbar (20) is stacked on the first surface (111) of the PCB board (10); The second busbar (31) and the third busbar (32) are stacked on the first busbar (20) side by side, forming a second layer of busbars (30); The fourth busbar (41) and the fifth busbar (42) are stacked on the second layer of busbars (30) side by side, forming a third layer of busbars (40); The sixth busbar (50) is stacked on the second surface (112) of the PCB board (10); The first busbar (20), the second busbar (31), the third busbar (32), the fourth busbar (41) and the fifth busbar (42) are respectively provided with a first connecting node (61), a second connecting node (62), a third connecting node (63), a fourth connecting node (64) and a fifth connecting node (65) on the first side (121) of the PCB board (10), the sixth busbar (50) is provided with a sixth connecting node (66) on the first side (121) of the PCB board (10), and the first connecting node (61), the second connecting node (62), the third connecting node (63), the fourth connecting node (64), the fifth connecting node (65) and the sixth connecting node (66) are staggered on the first side (121) of the PCB board (10).

2. The power backplane (100) of claim 1, wherein, The first busbar (20), the second busbar (31), the third busbar (32), the fourth busbar (41) and the fifth busbar (42) are respectively folded on the first side (121) of the PCB board (10) in the direction from the first surface (111) to the second surface (112) of the PCB board (10) to form the first connecting node (61), the second connecting node (62), the third connecting node (63), the fourth connecting node (64) and the fifth connecting node (65), and the sixth busbar (50) is folded on the first side (121) of the PCB board (10) in the direction from the second surface (112) to the first surface (111) of the PCB board (10) to form the sixth connecting node (66).

3. The power backplane (100) of claim 1, wherein, The first busbar (20), the second busbar (31), the third busbar (32), the fourth busbar (41), the fifth busbar (42) and the sixth busbar (50) are respectively provided with soldering feet staggered with each other and soldered and fixed with the PCB board (10), and the first busbar (20) and the second layer of busbars (30), and the second layer of busbars (30) and the third layer of busbars (40) are respectively isolated by insulating pads and stacked and fixed together.

4. The power backplane (100) of claim 3, characterized in that The fourth bus bar (41) and the fifth bus bar (42) in the third layer bus bar (40) are respectively provided with a press-in stud (81) extending in the direction from the first surface (111) to the second surface (112) of the PCB (10), and the second bus bar (31) and the third bus bar (32) of the second layer bus bar (30) are correspondingly provided with a first mounting hole (82) for the press-in stud (81) to pass through, and the first bus bar (20) is correspondingly provided with a second mounting hole (83) for the press-in stud (81) to pass through; the press-in stud (81) between the third layer bus bar (40) and the second layer bus bar (30) is sleeved with a first insulating pad (71), the press-in stud (81) between the second layer bus bar (30) and the first bus bar (20) is sleeved with a second insulating pad (72), and the end of the press-in stud (81) is sleeved with a third insulating pad (73) and a washer (84) and then locked by a nut (85) to fix the first bus bar (20), the second layer bus bar (30) and the third layer bus bar (40) together.

5. The power backplane (100) of claim 4, characterized in that The first insulating pad (71) is provided with a first cylindrical section (711) inserted into the first mounting hole (82), the second insulating pad (72) is provided with a second cylindrical section (721) inserted into the first mounting hole (82) and embedded with the first cylindrical section (711), and the third insulating pad (73) is provided with a third cylindrical section (731) passing through the second mounting hole (83) and embedded with the second insulating pad (72).

6. The power backplane (100) of claim 1, wherein, The sixth bus bar (50) is provided with a plurality of avoidance holes (52) corresponding to the welding feet of the first bus bar (20), the second bus bar (31), the third bus bar (32), the fourth bus bar (41) and the fifth bus bar (42).

7. The power backplane (100) of claim 1, wherein, The first bus bar (20), the second bus bar (31), the third bus bar (32), the fourth bus bar (41), the fifth bus bar (42) and the sixth bus bar (50) are respectively provided with at least one supporting leg (312) inserted into the PCB (10) near the first connecting node (61), the second connecting node (62), the third connecting node (63), the fourth connecting node (64), the fifth connecting node (65) and the sixth connecting node.

8. The power backplane (100) of claim 7, characterized in that The first bus bar (20), the second bus bar (31), the third bus bar (32), the fourth bus bar (41), the fifth bus bar (42) and the sixth bus bar (50) are respectively provided with a supporting leg (312) on the left and right sides of the first connecting node (61), the second connecting node (62), the third connecting node (63), the fourth connecting node (64), the fifth connecting node (65) and the sixth connecting node, respectively.

9. The power backplane (100) of claim 1, wherein, Four of the first connecting node (61), the second connecting node (62), the third connecting node (63), the fourth connecting node (64), the fifth connecting node (65) and the sixth connecting node (66) are used as two-way positive and negative input nodes, and two are used as one-way positive and negative output nodes.

10. The power backplane (100) of claim 9, characterized in that The first connecting node (61) and the sixth connecting node (66) are used as the one-way positive and negative output nodes, the second connecting node (62) and the fourth connecting node (64) are used as one-way positive and negative input nodes of the two-way positive and negative input nodes, and the third connecting node (63) and the fifth connecting node (65) are used as the other one-way positive and negative input nodes of the two-way positive and negative input nodes.

11. The power backplane (100) of claim 10, wherein, The first connecting node (61) and the sixth connecting node (66) are formed at the middle positions of the first bus bar (20) and the sixth bus bar (50) and staggered left and right, the second connecting node (62) and the third connecting node (63) are formed at one end of the left and right ends of the second bus bar (31) and the third bus bar (32) respectively, and the fourth connecting node (64) and the fifth connecting node (65) are formed at the other end of the left and right ends of the fourth bus bar (41) and the fifth bus bar (42) respectively, so that the first connecting node (61), the second connecting node (62), the third connecting node (63), the fourth connecting node (64), the fifth connecting node (65) and the sixth connecting node (66) are staggered with each other on the first side (121) of the PCB board (10).

12. The power backplane (100) of claim 1, wherein, The edge of the second side (122) of the PCB board (10) is provided with a plurality of input gold fingers (13), and the second surface (112) of the PCB board (10) is further provided with a plurality of output connectors (14) between the input gold fingers (13) and the sixth bus bar (50), and the first bus bar (20), the second bus bar (31), the third bus bar (32), the fourth bus bar (41), the fifth bus bar (42) and the sixth bus bar (50) are respectively electrically connected with the input gold fingers (13) and the output connectors (14) through the PCB board (10).

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