Circuit board structure capable of being bent at one time

Abstract

The utility model provides a circuit board structure capable of being bent at one time, which comprises a bent circuit layer and a groove body, a prepreg layer is arranged between the bent circuit layer and the groove body, and a glue layer is arranged at the position, corresponding to the groove body, between the bent circuit layer and the prepreg layer; the adhesive layer is arranged at the position, corresponding to the groove body, of the bent circuit layer, the prepreg in the bent area is adhered and bound, the problems that the prepreg is torn and dropped in the bending process are solved, the phenomena that in the prior art, the bent prepreg layer is extruded or stretched, dropped and torn are generated, and the service life of the prepreg layer is prolonged. And the problems of board surface pollution or electronic module pollution during application are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of circuit board processing especially relates to a one-off bending circuit board structure. BACKGROUND

[0002] With the continuous development of intelligentization and digitization, electronic modules are continuously developing towards high density and miniaturization, and the circuit boards applied thereto are also developing towards refinement and multifunction.

[0003] The one-off bending circuit board is derived on the basis of rigid-flex circuit boards, and essentially is to "thin" part of the rigid circuit board to form a structure that can be bent once to meet some electronic modules that need to be assembled in a three-dimensional and flexible manner.

[0004] At present, the one-off bending circuit board is usually designed as a rigid circuit board, and after the rigid circuit board is manufactured, the local part is subjected to depth control milling and cutting for thinning processing to form a structure that can be bent locally.

[0005] According to the prior art, the thinned area that can be bent has a conductive copper layer and is covered by a semi-cured sheet layer and a solder mask layer, and when bent, the semi-cured sheet layer will be extruded or stretched, causing problems such as dropping of slag and tearing, resulting in contamination of the board surface or electronic modules.

[0006] In view of the above problems, a new one-off bending circuit board structure is proposed. CONTENT OF THE UTILITY MODEL

[0007] The utility model aims at solving the problem of dropping of slag and tearing of the semi-cured sheet layer when the one-off bending circuit board is bent, causing contamination of the board surface or electronic modules, and provides a one-off bending circuit board structure, which comprises a bending circuit layer and a groove body, a semi-cured sheet layer is arranged between the bending circuit layer and the groove body, and a glue layer is arranged between the bending circuit layer and the semi-cured sheet layer at a position corresponding to the groove body.

[0008] Further, the glue layer is larger than the bottom surface of the groove body on one side.

[0009] Further, the material of the glue layer is acrylic acid or epoxy resin.

[0010] Further, an auxiliary copper layer is arranged between the groove body and the glue layer.

[0011] Further, the auxiliary copper layer is larger than the bottom surface of the groove body on one side.

[0012] Further, the thickness of the auxiliary copper layer is 10 microns to 25 microns.

[0013] Further, the surface of the auxiliary copper layer is provided with a gold layer or an antioxidant layer.

[0014] Further, the glue layer is larger than the auxiliary copper layer on one side.

[0015] Further, the circuit board structure comprises a circuit layer, and the circuit layer is larger than the groove on one side corresponding to a windowed area of the groove.

[0016] The disposable bent circuit board structure provided by the utility model sets a glue layer at the position of the bent circuit layer corresponding to the groove, which forms adhesion and restraint on the prepreg in the bending area, avoids the problem of prepreg tearing and dropping slag during bending, solves the problem of the prepreg layer being squeezed or stretched after bending in the prior art, and the phenomenon of dropping slag and tearing, which causes pollution of the board surface or electronic module during application, further, the auxiliary copper layer is set, which can effectively cover the prepreg at the groove position, further prevent the prepreg from dropping slag and other problems, and can provide stronger support force and stability for the bending area after bending. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the structures shown in the drawings without creative labor for those skilled in the art.

[0018] Figure 1 It is a cross-sectional view of the disposable bent circuit board structure of the utility model;

[0019] Figure 2 It is a cross-sectional view of the circuit board stack structure of the utility model.

[0020] Explanation of reference numerals:

[0021]

[0022] The realization, functional characteristics and advantages of the utility model will be further described with reference to the drawings combined with the embodiments. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below combined with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only some embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] It should be noted that if the embodiment of the utility model has directionality indication (such as up, down, left, right, front, back), the directionality indication is only used to explain the relative position relationship, movement condition and the like between components in a certain specific posture, if the specific posture changes, the directionality indication also changes accordingly.

[0025] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings.

[0026] Please refer to Figure 1 , Figure 1 It is the cross section schematic view of the disposable bent circuit board structure of the utility model; Figure 2 It is the cross section schematic view of the circuit board stack structure of the utility model.

[0027] The disposable bent circuit board structure 10 of the utility model, including bending circuit layer 100 and groove body 200, bending circuit layer 100 and groove body 200 between the setting of semi-cured sheet layer 300, bending circuit layer 100 and semi-cured sheet layer 300 between the position corresponding to groove body 200 setting glue layer 400;Specifically, take semi-cured sheet layer 300, and make glue layer 400 at the position corresponding to groove body 200, then with the core plate and bending circuit layer 100 made with circuit layer 700 in turn alignment, stack, press and milling, form disposable bent circuit board structure 10.

[0028] In the embodiment, groove body 200 forms bending area 500 in the longitudinal area of circuit board structure 10, and glue layer 400 is arranged below semi-cured sheet layer 300 in bending area 500, so that semi-cured sheet layer 300 is adhered and bound, avoiding the problem of tearing and slagging of semi-cured sheet layer 300 during bending, and having the effect of prolonging the service life of the circuit board.

[0029] In the embodiment, the single side of glue layer 400 is larger than the bottom surface of groove body 200, so that glue layer 400 forms a structure of "extending into" the circuit board body, and the edge position of glue layer 100 exceeds bending area 500, which has the effect of avoiding the edge of glue layer 400 from being raised from the edge of groove body 200 during bending, and also has the effect of reducing the height difference of the stack structure at the edge position of the groove.

[0030] It is worth noting that the material of glue layer 400 is acrylic or epoxy resin, and the material of semi-cured sheet layer 300 is mainly epoxy resin in general, so that the two have similar material properties, and therefore, during processing and pressing, semi-cured sheet layer 300 and glue layer 400 can be better combined, and also have better bonding effect with bending circuit layer 100.

[0031] It is worth mentioning that the auxiliary copper layer 600 is arranged between the groove body 200 and the adhesive layer 400. The manufacturing method of the auxiliary copper layer 600 is to take a single-sided copper-clad plate and pass through a circuit pattern to form the auxiliary copper layer 600. At this time, the insulating medium layer of the single-sided copper-clad plate is the prepreg layer 300. The auxiliary copper layer 600 covers the prepreg layer 300, which can prevent the prepreg layer 300 from tearing and falling off during bending. Further, the auxiliary copper layer 600 is equivalent to adding a core layer to the bending area 500, which can provide certain support to the bending area 500, thereby increasing the bending force and the stability after one-time bending.

[0032] It is worth mentioning that the auxiliary copper layer 600 is larger than the bottom surface of the groove body on one side, forming a structure in which the auxiliary copper layer “extends into” the circuit board, so that the auxiliary copper layer 600 and the board body of the circuit board are tightly combined to prevent the edges of the auxiliary copper layer 600 from tearing and warping during bending.

[0033] In particular, the thickness of the auxiliary copper layer 600 is designed to be thin, between 10 microns and 25 microns. This design ensures that the auxiliary copper layer 600 can protect the prepreg layer 300 from tearing while also providing good flexibility to prevent the circuit board from being difficult to bend or having poor bending stability due to the addition of the auxiliary copper layer 600.

[0034] It is worth mentioning that the adhesive layer 400 is larger than the auxiliary copper layer 600 on one side, forming an effect in which the adhesive layer 400 “encloses” the auxiliary copper layer 600 during folding. During the folding process, the edges of the parts of the adhesive layer 400 and the auxiliary copper layer 600 that extend into the circuit board body form a stepped gap, which improves the stability of the one-time bent circuit board structure 10.

[0035] In particular, the surface of the auxiliary copper layer 600 is provided with a gold layer or an anti-oxidation layer. That is, a thin gold layer is deposited on the surface of the circuit board through a gold plating process, which provides excellent electrical conductivity and corrosion resistance to the circuit board, thereby improving the reliability of the one-time bent circuit board structure 10. Alternatively, an OSP processing technology forms an anti-oxidation layer, which is light and thin and can effectively protect the metal on the surface of the circuit board from oxidation and corrosion, thereby improving the stability of the one-time bent circuit board structure 10.

[0036] In this embodiment, the one-time bent circuit board structure 10 includes a circuit layer 700. The circuit layer 700 is larger than the groove body 200 on one side corresponding to the windowed area of the groove body 200, so that the edges of the groove body 200 are copper-free. On the one hand, this can make the depth control milling cutting process simpler. On the other hand, when the depth control milling cutting adopts a loop current feedback depth control method, other circuit layers may affect the loop current. The design of the copper-free edges of the groove body avoids the problem of “signal fraud” interference caused by other copper layers to the current loop.

[0037] In particular, the auxiliary copper layer 600 and the circuit layer 700 in the laminated structure 20 are located on the first side of the single-sided copper-clad plate, and then the laminated plate is milled to a depth of the auxiliary copper layer from the surface of the first side of the laminated plate to form the one-time bending circuit board structure 10 by forming the solder resist layer 800.

[0038] It is worth noting that the solder resist layer 800 is made of flexible solder resist ink, which has good insulation performance on the one hand, can effectively isolate the circuit from the outside world, prevent short circuit and circuit damage, and play a protective role for the circuit; on the other hand, the flexible solder resist ink has flexibility, and the bending of the one-time bending circuit board structure 10 in the application process will not be affected.

[0039] The above is only the preferred embodiment of the present application, and does not limit the patent range of the present application. Any equivalent structural transformation or direct / indirect application in other related technical fields within the scope of the present application is included in the patent protection range of the present application.

Claims

1. A circuit board structure that can be bent in one go, characterized in that, The structure comprises a bending circuit layer and a groove, and a prepreg layer is arranged between the bending circuit layer and the groove.

2. A one-time-bend flexible circuit board structure as defined in claim 1, wherein, The glue layer is larger than the bottom surface of the groove on one side.

3. A one-time folded circuit board structure as claimed in claim 1 or 2, characterized in that The glue layer is made of acrylic acid or epoxy resin.

4. A one-time folded circuit board structure as claimed in claim 1 or 2, characterized in that An auxiliary copper layer is arranged between the groove and the glue layer.

5. A one-time-bend flexible circuit board structure as defined in claim 4, wherein, The auxiliary copper layer is larger than the bottom surface of the groove on one side.

6. A one-time-bend flexible circuit board structure as defined in Claim 4, wherein, The thickness of the auxiliary copper layer is 10-25 microns.

7. A one-time-bend flexible circuit board structure as defined in claim 4, wherein, The surface of the auxiliary copper layer is provided with a gold layer or an anti-oxidation layer.

8. A one-time-bend flexible circuit board structure as defined in Claim 4, wherein, The glue layer is larger than the auxiliary copper layer on one side.

9. The one-time-bend flexible circuit structure of claim 1, wherein, The circuit board structure comprises a circuit layer, and the circuit layer is larger than the groove on one side corresponding to the windowed area of the groove.

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