Heat conduction type polyimide flexible copper-clad plate

Abstract

The utility model relates to the technical field of copper-clad plates, and discloses a heat conduction type polyimide flexible copper-clad plate which comprises a base layer, an adhesion layer is arranged on the outer surface of the base layer, an insulating layer is arranged at the other end, away from the base layer, of the adhesion layer, and a heat conduction medium layer is arranged at the other end, away from the adhesion layer, of the insulating layer. A copper foil layer is arranged at the other end, away from the insulating layer, of the heat-conducting medium layer. According to the heat-conducting polyimide flexible copper-clad plate, due to the special structural design in the heat-conducting medium layer, the combination of high-heat-conductivity materials selected by the carbon-based material layer and the matching of aluminum oxide or zinc oxide and carbon fibers or carbon nanotubes, the conduction efficiency of heat in the copper-clad plate is effectively improved; the matching of the limiting groove and the limiting frame ensures the uniform distribution of the carbon-based material layer, avoids the local thermal resistance difference caused by the non-uniform distribution of the heat conduction material, enables the heat to be quickly and uniformly transmitted out from a heat source, and guarantees the operation of an electronic component in a normal working temperature range.

Description

TECHNICAL FIELD

[0001] The utility model relates to copper -clad plate technical field, concretely is a kind of heat-conducting type polyimide flexible copper -clad plate. BACKGROUND

[0002] Copper-clad laminate is a kind of plate-shaped material, simply referred to as copper-clad plate, which is made by impregnating electronic glass fiber cloth or other reinforcing materials with resin and covering one or both sides with copper foil and then hot pressing. Various printed circuit boards with different forms and functions are made by selectively processing, etching, drilling and copper plating on copper-clad plates to produce different printed circuits. Printed circuit boards mainly serve as interconnection, insulation and support, and have a great impact on signal transmission speed, energy loss and characteristic impedance in circuits.

[0003] Chinese utility model patent publication number CN 216659170 U discloses a heat dissipation type double-sided flexible cover. The structure is simple and reasonable, and the two circular baffle pieces on both sides can store a large amount of flexible double-sided copper plate through the central rotating shaft and can be quickly taken out through the bearing. However, the carbon-based material layer is not evenly distributed, which leads to local thermal resistance differences due to uneven distribution of heat-conducting materials, making it difficult to quickly and evenly transfer heat from the heat source. In addition, when subjected to external force, local deformation and cracking occur due to uneven single-sided stress, affecting normal use. SUMMARY

[0004] The utility model solves the problem of uneven distribution of carbon-based material layer in existing technology, which leads to local thermal resistance differences due to uneven distribution of heat-conducting materials, making it difficult to quickly and evenly transfer heat from the heat source. In addition, when subjected to external force, local deformation and cracking occur due to uneven single-sided stress, affecting normal use.

[0005] The utility model adopts the technical scheme of a heat-conducting type polyimide flexible copper-clad plate, which includes a base layer. An adhesive layer is provided on the outer surface of the base layer. An insulating layer is provided on the other end of the adhesive layer away from the base layer. A heat-conducting medium layer is provided on the other end of the insulating layer away from the adhesive layer. A copper foil layer is provided on the other end of the heat-conducting medium layer away from the insulating layer.

[0006] Preferably, the heat-conducting medium layer includes an oxide layer, and a limiting frame is fixedly installed on the outer surface of the oxide layer. A carbon-based material layer is provided on the outer surface of the oxide layer. Limiting grooves are opened on the outer surface of the carbon-based material layer, and the carbon-based material layer is adapted to the oxide layer through the limiting grooves.

[0007] By the technical scheme, the adaptive design of the limiting groove and the oxide layer can accurately position the carbon-based material layer, so that the distribution of the carbon-based material layer in the heat-conducting medium layer is more uniform and stable, and displacement and agglomeration of the carbon-based material layer in the subsequent use process are avoided, thereby ensuring the consistency and stability of the overall heat-conducting performance of the heat-conducting medium layer, facilitating uniform heat conduction in the copper-clad plate, and the limiting frame plays a role in further fixing and restraining the carbon-based material layer, enhancing the integrity of the heat-conducting medium layer structure, preventing the carbon-based material layer from being separated due to external force or long-term use, improving the durability of the heat-conducting medium layer, prolonging the service life of the copper-clad plate, and ensuring that the copper-clad plate stably plays a heat-conducting function for a long time.

[0008] Preferably, the carbon-based material layer is one of aluminum oxide or zinc oxide materials, and the carbon-based material layer is one of carbon fiber or carbon nanotube materials.

[0009] By the technical scheme, aluminum oxide and zinc oxide are both materials with good heat-conducting performance and high chemical stability, and as optional components of the carbon-based material layer, can effectively improve the heat-conducting capacity of the heat-conducting medium layer, meet the heat dissipation demand of electronic equipment, ensure that electronic components operate within a normal operating temperature range, and improve the reliability and performance stability of the equipment. Carbon fiber and carbon nanotube have excellent thermal conductivity and good mechanical properties, and they can enhance heat conduction while maintaining or improving the flexibility of the copper-clad plate to some extent, so that the copper-clad plate can still adapt to bending and other actual use scenarios on the basis of having good heat-conducting performance, and will not be damaged due to frequent bending, thereby widening the application range of the copper-clad plate.

[0010] Preferably, the insulating layer is an epoxy resin insulating layer, and the insulating layer is located between the copper foil layer and the adhesive layer.

[0011] By the technical scheme, epoxy resin has good insulating performance, chemical stability, and good adhesion to other materials, and as an insulating layer can effectively insulate the electrical conduction between the copper foil layer and other layers, prevent electrical faults such as short circuits in electronic equipment, ensure the safe operation of the equipment, and improve the reliability of the copper-clad plate in the electrical aspect.

[0012] Preferably, the adhesive layer, the insulating layer, the heat-conducting medium layer, and the copper foil layer are provided in two, and the two adhesive layers, the two insulating layers, the two heat-conducting medium layers, and the two copper foil layers are located at the upper and lower ends of the center line of the base layer.

[0013] Through the technical scheme, the copper-clad plate is more balanced in mechanical properties, and when subjected to external force, each layer at the upper and lower ends can bear force in coordination, thereby reducing local deformation, cracking and other problems caused by uneven force on a single side, improving the mechanical strength and overall stability of the copper-clad plate, prolonging the service life, and better adapting to complex use environments and assembly requirements, which helps to ensure the uniformity of electric field distribution, avoids electric field distortion caused by single-sided structural differences, and further improves the electrical performance reliability of the copper-clad plate, and ensures the stability and accuracy of signal transmission in electronic equipment.

[0014] Preferably, the adhesion layer, the insulation layer, the heat-conducting medium layer and the copper foil layer are hot-pressed and bonded, and the adhesion layer, the insulation layer, the heat-conducting medium layer and the copper foil layer are integrated.

[0015] Through the technical scheme, the hot-pressing and bonding process can realize close combination between the layers, eliminate the interlayer gaps and micro cracks, improve the overall density of the copper-clad plate, not only enhance the connection strength between the layers, avoid delamination during use, but also help heat to be more smoothly conducted between the layers, improve the overall effect of the heat-conducting performance, and ensure that heat can be efficiently transferred from the heat source to the external environment.

[0016] Preferably, the adhesion layer is made of epoxy resin material, and the adhesion layer has a thickness of 5-10 μm.

[0017] Through the technical scheme, the epoxy resin is used as the material of the adhesion layer, which can effectively bond the adjacent base layer, insulation layer and other layers together due to its good adhesion, and ensure the stability of the overall structure of the copper-clad plate. Meanwhile, the chemical stability of the epoxy resin also helps the copper-clad plate to maintain stable performance under different environmental conditions, and is not prone to delamination.

[0018] Compared with the prior art, the heat-conducting polyimide flexible copper-clad plate has the following beneficial effects:

[0019] 1. The heat-conducting polyimide flexible copper-clad plate, the special structure design in the heat-conducting medium layer and the combination of the high-heat-conducting material selected for the carbon-based material layer, the combination of aluminum oxide or zinc oxide and carbon fibers or carbon nanotubes, effectively improve the heat conduction efficiency in the copper-clad plate, the cooperation of the limiting groove and the limiting frame ensures the uniform distribution of the carbon-based material layer, avoids local thermal resistance differences caused by uneven distribution of heat-conducting materials, enables heat to be quickly and uniformly transferred from the heat source, ensures the operation of electronic components within the normal working temperature range, and improves the reliability and performance stability of electronic equipment.

[0020] 2、The heat-conducting type polyimide flexible copper-clad plate, the carbon fiber or carbon nanotube material in the carbon-based material layer not only helps heat conduction, but also maintains or improves the flexibility of the copper-clad plate to a certain extent, meanwhile, the integrated structure formed by the heat pressing of the layers and the design of the symmetric distribution of the layers on the upper and lower ends of the center line of the base layer make the copper-clad plate more balanced in mechanical properties, and when subjected to external force, the layers on the upper and lower ends can bear force cooperatively, reducing local deformation, cracking and other problems caused by uneven force on a single side.

[0021] 3、The heat-conducting type polyimide flexible copper-clad plate, the heat pressing process makes the layers tightly combined, eliminates the interlayer gap and micro gap, improves the overall density, enhances the connection strength between the layers, avoids the delamination phenomenon in the use or processing process, effectively isolates the electrical conduction path between the copper foil layer and other layers, and prevents the occurrence of electrical faults such as short circuit. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The utility model discloses a three-dimensional structure schematic diagram Figure 1 ;

[0023] Figure 2 The utility model discloses a three-dimensional structure schematic diagram Figure 2 ;

[0024] Figure 3 The utility model discloses a split structure schematic diagram Figure 1 ;

[0025] Figure 4 The utility model discloses a split structure schematic diagram Figure 2 ;

[0026] Figure 5 It is the split structure schematic diagram of the heat-conducting medium layer of the utility model.

[0027] Wherein: 1, base layer;2, adhesion layer;3, insulating layer;4, heat-conducting medium layer;401, oxide layer;402, limiting frame;403, carbon-based material layer;404, limiting groove;5, copper foil layer. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0029] Embodiment one: as Figures 1-5The utility model provides a kind of heat-conducting type polyimide flexible copper-clad plate, including base layer 1, base layer 1 outer surface is provided with adhesion layer 2, adhesion layer 2 is provided with insulating layer 3 away from another end of base layer 1, insulating layer 3 is provided with heat-conducting medium layer 4 away from another end of adhesion layer 2, heat-conducting medium layer 4 is provided with copper foil layer 5 away from another end of insulating layer 3.

[0030] Specific, heat-conducting medium layer 4 includes oxide layer 401, oxide layer 401 outer surface is fixedly installed with limiting frame 402, oxide layer 401 outer surface is provided with carbon-based material layer 403, carbon-based material layer 403 outer surface is provided with limiting slot 404, carbon-based material layer 403 is adapted with oxide layer 401 by limiting slot 404, the advantage is, the adaptation design of limiting slot 404 and oxide layer 401 can accurately position carbon-based material layer 403, make its distribution in heat-conducting medium layer 4 more uniform, stable, avoid carbon-based material in subsequent use process to shift, agglomerate etc.

[0031] Specific, carbon-based material layer 403 is one of alumina or zinc oxide material, carbon-based material layer 403 is one of carbon fiber or carbon nanotube material, the advantage is, alumina and zinc oxide are both materials with good heat-conducting performance and high chemical stability, as optional component of carbon-based material layer 403, can effectively improve the heat-conducting capacity of heat-conducting medium layer 4, meet the heat dissipation demand of electronic equipment, guarantee electronic component to operate in normal operating temperature range, improve the reliability and performance stability of equipment, carbon fiber and carbon nanotube have excellent thermal conductivity and good mechanical properties, they can enhance heat conduction while maintaining or improving the flexibility of copper-clad plate to some extent, so that copper-clad plate can still adapt to bending and other actual use scenarios on the basis of good heat-conducting performance, without being damaged due to frequent bending, widen the application range of copper-clad plate.

[0032] Specific, insulating layer 3 is epoxy resin insulating layer, insulating layer 3 is between copper foil layer 5 and adhesion layer 2, the advantage is, epoxy resin has good insulating property, chemical stability and good adhesion with other materials, as insulating layer 3 can effectively insulate electrical conduction between copper foil layer 5 and other layers, prevent short circuit and other electrical faults in electronic equipment, guarantee the safe operation of equipment, improve the reliability of copper-clad plate in electrical aspect.

[0033] Embodiment two: asFigures 2-5 As an improvement to the previous embodiment.

[0034] Specifically, the adhesion layer 2, the insulation layer 3, the heat-conducting medium layer 4 and the copper foil layer 5 are provided with two same ones, and the two adhesion layers 2, the two insulation layers 3, the two heat-conducting medium layers 4 and the two copper foil layers 5 are located at the upper and lower ends of the center line of the base layer 1. The advantage is that the copper-clad plate is more balanced in mechanical properties, and when subjected to external force, the layers at the upper and lower ends can cooperate to bear the force, reducing local deformation, cracking and other problems caused by uneven force on one side, improving the mechanical strength and overall stability of the copper-clad plate, prolonging its service life, and better adapting to complex use environment and assembly requirements, which helps to ensure the uniformity of electric field distribution, avoid electric field distortion caused by unilateral structural differences, and further improve the electrical performance reliability of the copper-clad plate, ensuring the stability and accuracy of signal transmission in electronic equipment.

[0035] Specifically, the adhesion layer 2, the insulation layer 3, the heat-conducting medium layer 4 and the copper foil layer 5 are hot-pressed and bonded, and the adhesion layer 2, the insulation layer 3, the heat-conducting medium layer 4 and the copper foil layer 5 are of an integrated structure. The advantage is that the hot-pressing and bonding process can achieve close combination between the layers, eliminating the interlayer gaps and small gaps, improving the overall density of the copper-clad plate, not only enhancing the connection strength between the layers and avoiding delamination during use, but also helping heat to be more smoothly conducted between the layers, improving the overall effect of the heat-conducting performance and ensuring efficient heat transfer from the heat source to the external environment.

[0036] Specifically, the adhesion layer 2 is made of epoxy resin material, and the thickness of the adhesion layer 2 is 5-10 μm. The advantage is that the epoxy resin as the material of the adhesion layer 2 can effectively bond the adjacent base layer 1, insulation layer 3 and other layers firmly together due to its good adhesion, ensuring the stability of the overall structure of the copper-clad plate. At the same time, its own chemical stability also helps the copper-clad plate to maintain stable performance under different environmental conditions and is not prone to problems such as delamination.

[0037] Working principle: in use, the base layer 1 is connected with the insulating layer 3, the heat conducting medium layer 4 and the copper foil layer 5 through the adhesive layer 2 at the upper and lower ends respectively, the adhesive layer 2 adopts epoxy resin material, the thickness is 5-10 μm, it is connected with each layer closely through the heat pressing process and forms an integrated structure, in the heat pressing process, the epoxy resin makes each layer material mutually fusion and bond firmly under the action of high temperature and pressure, the insulating layer 3 is epoxy resin insulating layer, is located between the copper foil layer 5 and the adhesive layer 2, mainly plays the role of insulating electrical conduction, prevents short circuit and other electrical faults, the heat conducting medium layer 4 is composed of oxide layer 401 and carbon-based material layer 403, the limiting frame 402 on the outer surface of oxide layer 401 and the limiting groove 404 on the outer surface of carbon-based material layer 403 cooperate with each other, make carbon-based material layer 403 evenly and stably distribute on oxide layer 401, carbon-based material layer 403 can select alumina or zinc oxide combined with carbon fiber or carbon nanotube material, through optimizing combination, the heat conducting performance is promoted and the flexibility is maintained, when there is heat generation, heat is conducted from the copper foil layer 5 to the heat conducting medium layer 4, due to the synergistic effect of carbon-based material layer 403 and oxide layer 401, heat can be quickly and evenly dispersed and conducted, then passes through the insulating layer 3, the adhesive layer 2, and finally dissipates to the surrounding environment by the base layer 1.

[0038] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A heat-conductive polyimide flexible copper-clad plate comprising a base layer (1), characterized in that: The outer surface of the base layer (1) is provided with a adhesion layer (2), the other end of the adhesion layer (2) away from the base layer (1) is provided with an insulating layer (3), the other end of the insulating layer (3) away from the adhesion layer (2) is provided with a thermal conductive medium layer (4), the other end of the thermal conductive medium layer (4) away from the insulating layer (3) is provided with a copper foil layer (5).

2. The heat-conductive polyimide flexible copper-clad plate according to claim 1, characterized in that: The thermal conductive medium layer (4) comprises an oxide layer (401), the outer surface of the oxide layer (401) is fixedly installed with a limiting box (402), the outer surface of the oxide layer (401) is provided with a carbon-based material layer (403), the outer surface of the carbon-based material layer (403) is provided with a limiting groove (404), and the carbon-based material layer (403) is matched with the oxide layer (401) through the limiting groove (404). 3.The heat-conductive polyimide flexible copper clad plate according to claim 2, characterized in that: The carbon-based material layer (403) is one of aluminum oxide or zinc oxide material, and the carbon-based material layer (403) is one of carbon fiber or carbon nanotube material.

4. The heat-conductive polyimide flexible copper-clad plate according to claim 1, characterized in that: The insulating layer (3) is an epoxy insulating layer, and the insulating layer (3) is located between the copper foil layer (5) and the adhesion layer (2).

5. The heat-conductive polyimide flexible copper-clad plate according to claim 1, characterized in that: The adhesion layer (2), the insulating layer (3), the thermal conductive medium layer (4) and the copper foil layer (5) are provided with the same two, and the two adhesion layers (2), the insulating layers (3), the thermal conductive medium layers (4) and the copper foil layers (5) are located at the upper and lower ends of the center line of the base layer (1).

6. The heat-conductive polyimide flexible copper-clad plate according to claim 1, characterized in that: The adhesion layer (2), the insulating layer (3), the thermal conductive medium layer (4) and the copper foil layer (5) are hot-pressed and bonded, and the adhesion layer (2), the insulating layer (3), the thermal conductive medium layer (4) and the copper foil layer (5) are integrated.

7. The heat-conducting polyimide flexible copper-clad plate of claim 1, wherein: The adhesion layer (2) is made of epoxy resin material, and the thickness of the adhesion layer (2) is 5-10 μm.

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