Special-shaped welding strip
By designing a transition section structure between the irregularly shaped and flat sections of the irregularly shaped solder ribbon, the problems of shading and breakage of the solar cells by the irregularly shaped solder ribbon were solved, achieving higher light utilization and improved aesthetics of the solder ribbon.
Patent Information
- Application Number
- CN202423210159.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-06
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing irregularly shaped welding strips, under the same conductivity conditions, significantly obstruct the solar cells, affecting power generation performance, and the connection between the irregularly shaped section and the flat section is prone to causing the solar cells to break.
Design an irregularly shaped solder strip, comprising an irregularly shaped segment, a first transition segment, a flat segment, and a second transition segment connected in sequence. The cross-section of the irregularly shaped segment is a combination of triangles and rectangles. By using rounded corners and the design of the transition segments, shading and stress concentration are reduced, light utilization is improved, and breakage is avoided.
It improves light utilization, reduces shading of solar cells, enhances the aesthetics of the solder ribbon, and prevents solar cells from breaking during the lamination process.
Smart Images
Figure CN223681435U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to solar cell manufacturing technical field, in particular to a special-shaped solder strip. BACKGROUND
[0002] After solar cell piece is made, need to weld together mutually multiple cell piece and form a cell string. Generally speaking, utilize solder strip and weld mutually multiple cell piece. In order to guarantee the performance of cell piece, generally adopt special-shaped solder strip and weld. The existing special-shaped solder strip has greater shielding under the condition of same conductive capacity, influences cell piece power generation performance. In addition, the connecting place of some special-shaped solder strips has no transition section, and the special-shaped section is easy to cause cell piece fragmentation in lamination if being at the edge of cell piece. SUMMARY
[0003] One object of the first aspect of the utility model is to provide a special-shaped solder strip, solve the problem of greater shielding of the special-shaped solder strip in prior art, which is not conducive to power generation performance.
[0004] In particular, the utility model provides a special-shaped solder strip, including multiple solder strip units connected in sequence, each solder strip unit includes special-shaped section, first transition section, flat section and second transition section connected in sequence, wherein the cross section of the special-shaped section is the shape of the superposition of the triangle on top and the rectangle below, and the cross section of the flat section is a rectangle.
[0005] Optionally, the special-shaped section includes an internal copper core and an external plating layer, the internal copper core includes a triangular part on top and a rectangular part below, and the angle of the top angle of the triangular part is less than 90 degrees.
[0006] Optionally, the top angle of the triangular part is a circular arc, and the radian of the circular arc is π / 36~5π / 9.
[0007] Optionally, the two side faces of the triangular part are planes, the external plating layer includes a first plating layer, and the first plating layer is arranged outside the two side faces of the triangular part, and the reflectivity of the first plating layer is 70-100%.
[0008] Optionally, the material of the first plating layer is selected from one or more of aluminum, aluminum alloy, silver, silver alloy, tin and lead.
[0009] Optionally, the thickness of the first plating layer is 1-6 microns.
[0010] Optionally, the two side faces of the triangular part of the internal copper core are formed into concave surfaces inwardly, the external plating layer includes a second plating layer, the second plating layer is arranged outside the concave surfaces, and the material of the second plating layer is tin or tin alloy.
[0011] Optionally, the second plating layer has a thickness of 8-15 μm.
[0012] Optionally, the rectangular shape and size of the irregular section are the same as the shape and size of the cross section of the flat section, and the bottom and side of the rectangular of the irregular section and the cross section of the flat section are rounded.
[0013] Optionally, the height of the first and second transition sections gradually decreases from the irregular section to the flat section.
[0014] Optionally, the cross section of the first and second transition sections is an isosceles trapezoid above and a rectangle below. The cross section of the irregular section of the present application is the superposition of a triangle and a rectangle, which can increase the light utilization rate when the light irradiates the triangle area and is reflected to the solar cell by the triangle. In addition, the cross section of the irregular solder strip of the present application is a rectangle below, which can share part of the copper required for conduction, reduce the shielding of the cell sheet, and improve the light utilization rate.
[0015] The rounding of the bottom and side of the rectangular of the irregular section and the cross section of the flat section can avoid injury during operation. In addition, the appearance of the rounded corner is more beautiful than that of the right angle.
[0016] The use of the circular arc of the top angle of the triangular part of the internal copper core in the irregular section can avoid the appearance of the sharp part of the outer layer, avoid stress concentration of the sharp part, prevent damage of the outer layer and the plating layer, and protect the solder strip and the operator.
[0017] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0018] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, which are exemplary and non-limiting. The same reference numerals in the drawings indicate the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:
[0019] Figure 1 is a partial front view of the irregular solder strip according to one specific embodiment of the present application;
[0020] Figure 2 is a partial schematic perspective view of the irregular solder strip according to one specific embodiment of the present application;
[0021] Figure 3 is a schematic view of the cross section of the irregular section according to one specific embodiment of the present application;
[0022] Figure 4 is a cross-sectional schematic view of a special-shaped section according to another specific embodiment of the present application;
[0023] Figure 5 is a cross-sectional schematic view of a first transition section or a second transition section according to one specific embodiment of the present application;
[0024] Figure 6 is a cross-sectional schematic view of a first transition section or a second transition section according to one specific embodiment of the present application.
[0025] BRIEF DESCRIPTION OF DRAWINGS
[0026] Special-shaped solder strip - 100; Special-shaped section - 110; Triangle - 111; Rectangle - 112; Inner copper core - 113; First plating layer - 114; Triangle part - 115; Rectangle part - 116; Top corner - 117; Second plating layer - 118; First transition section - 120; Flat section - 130; Second transition section - 140. DETAILED DESCRIPTION
[0027] In the description of the present embodiment, it should be understood that the terms "length", "width", "height", "upper", "lower", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0028] As one specific embodiment of the present application, as shown in Figure 1 and Figure 2 , the present embodiment provides a special-shaped solder strip 100. The special-shaped solder strip 100 can include a plurality of solder strip units connected in sequence, each solder strip unit can include a special-shaped section 110, a first transition section 120, a flat section 130 and a second transition section 140 connected in sequence; wherein the cross section of the special-shaped section 110 is the shape of the superposition of the triangle 111 above and the rectangle 112 below, and the cross section of the flat section 130 is a rectangle.
[0029] Specifically, the cross section of the special-shaped section 110 of the present embodiment is the superposition of the triangle 111 and the rectangle 112, which can further increase the light utilization rate when the light is reflected to the solar cell by the triangle 111 area. In addition, the cross section of the special-shaped solder strip 100 of the present embodiment is a rectangle below, which can share part of the copper required for conduction, reduce the shielding of the battery piece, and improve the light utilization rate.
[0030] As a specific embodiment of the utility model, the shape and size of the rectangle 112 of the special-shaped section 110 are the same as the shape and size of the cross section of the flat section 130.
[0031] Specifically, the shape and size of the rectangle 112 of the special-shaped section 110 in the embodiment are the same as the shape and size of the cross section of the flat section 130, so only the triangle 111 gradually disappears in the process of gradually transitioning from the special-shaped section 110 to the flat section 130 in the transition process of the transition section. The rounded corners between the bottom and the side of the rectangle of the cross section of the flat section 130 can avoid cutting in the operation process. In addition, the rounded corners are more beautiful in appearance than the right angles.
[0032] Specifically, the height of the first transition section 120 and the second transition section 140 of the embodiment gradually decreases from the special-shaped section 110 to the flat section 130. By providing the transition section, the height difference between the special-shaped section 110 and the flat section 130 can be reduced, and the broken pieces in the lamination process can be reduced.
[0033] As a specific embodiment of the utility model, as shown in Figure 3 and Figure 4 The special-shaped section 110 of the embodiment can include an internal copper core 113 and an external plating layer.
[0034] Specifically, the internal copper core 113 of the special-shaped section 110 includes an upper triangular part 115 and a lower rectangular part 116, and the angle of the top corner 117 of the triangular part 115 is less than 90°. For example, the angle of the top corner 117 of the triangular part 115 in the embodiment can be 90°, 60°, 45°, 30°, etc. Preferably, the angle of the top corner 117 of the triangular part 115 in the embodiment is 60°.
[0035] As a specific embodiment of the utility model, the top corner 117 of the triangular part 115 in the embodiment is a circular arc, and the radian of the circular arc is π / 36-5π / 9. For example, the radian of the circular arc of the top corner in the embodiment is π / 36, π5 / 36, 5π / 9, etc.
[0036] Specifically, the top corner 117 of the triangular part 115 of the internal copper core 113 in the special-shaped section 110 of the embodiment uses a circular arc, which can avoid the appearance of a sharp part of the outer layer, avoid stress concentration of the sharp part, prevent damage of the outer layer and the plating layer, and protect the solder strip and the operator.
[0037] As a specific embodiment of the utility model, as shown in Figure 3As shown, the two sides of the triangular part 115 of the internal copper core 113 of the embodiment are flat. At this time, the external plating layer can be a first plating layer 114, which is arranged outside the two side surfaces of the triangular part 115, and the reflectivity of the first plating layer 114 is 70-100%. For example, the reflectivity of the first plating layer 114 can be 70%, 80%, 90% or 100%. Specifically, the reflectivity of the first plating layer 114 can be selected according to actual needs. By arranging the first plating layer 114 with such high reflectivity on the two side surfaces of the triangular part 115, the utilization rate of light can be improved without affecting the shape of the profiled solder strip, thereby bringing gain to the power of the assembly.
[0038] Specifically, the material of the first plating layer 114 of the embodiment can be selected from one or more of aluminum, aluminum alloy, silver, silver alloy, tin, and lead. These materials have high reflectivity, which can improve the utilization rate of light and bring gain to the power of the final device.
[0039] Specifically, the first plating layer 114 of the embodiment can be obtained by electroplating.
[0040] Specifically, the thickness of the first plating layer 114 can be 1-6 μm, for example, 1 μm, 3 μm, 5 μm or 6 μm. Specifically, the thickness of the first plating layer 114 can be designed according to actual conditions.
[0041] As a specific embodiment of the utility model, as shown in Figure 4 As shown, the two sides of the triangular part 115 of the internal copper core 113 of the embodiment are inwardly recessed to form concave surfaces. The external plating layer of the embodiment can include a second plating layer 118, which can fill the recessed part to make the outer surface flat, and the shape of the profiled solder strip 100 after overall plating is also more in line with the shape of the internal copper core 113, which is also conducive to distinguishing the front and back of the profiled solder strip 100.
[0042] Specifically, the material of the second plating layer 118 can be tin or tin alloy, which can also be obtained by electroplating. In addition, the thickness of the second plating layer 118 can be 8 μm-15 μm, for example, the thickness of the second plating layer 118 can be 8 μm, 10 μm, 12 μm or 15 μm. Specifically, the thickness of the second plating layer 118 can be designed according to actual conditions. Specifically, the cross section of the first transition section 120 and the second transition section 140 is an isosceles trapezoid located above and a rectangle located below.
[0043] When the two sides of the triangular part 115 are flat structures, the two sides of the internal copper core of the isosceles trapezoid are also flat structures (as shown in Figure 5 When the two sides of the triangular part 115 are inwardly recessed concave surfaces, the two sides of the internal copper core of the isosceles trapezoid are also inwardly recessed concave surfaces (as shown in Figure 6
[0044] Specifically, since the first transition section 120 and the second transition section 140 of the present embodiment are both transition sections from the profiled section 110 to the flat section 130, the side edges thereof are similar to the side edges of the profiled section, thereby ensuring the surface flatness after external plating.
[0045] At this point, those skilled in the art should recognize that, although the present application has been fully illustrated and described herein with reference to a number of exemplary embodiments, many other variations or modifications can be directly determined or deduced from the disclosure of the present application in accordance with the principles of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all such other variations or modifications.
Claims
1. A profiled solder strip, characterized in that, The solder strip comprises a plurality of sequentially connected solder strip units, each of which comprises a profiled section, a first transition section, a flat section and a second transition section sequentially connected; wherein the profiled section has a triangular shape on top and a rectangular shape on the bottom, and the flat section has a rectangular shape.
2. The profiled solder strip according to claim 1, wherein, the profiled section comprises an inner copper core and an outer plating layer; the inner copper core comprises a triangular part on top and a rectangular part on the bottom.
3. The profiled solder strip according to claim 2, wherein, the triangular part has a rounded top corner, and the rounded corner has an arc of π / 36~5π / 9.
4. The profiled solder strip according to claim 2 or 3, wherein, the two side faces of the triangular part are flat, the outer plating layer comprises a first plating layer, and the first plating layer is arranged outside the two side faces of the triangular part; the reflectivity of the first plating layer is 70~100%.
5. The profiled solder strip according to claim 4, wherein, the material of the first plating layer is selected from one of aluminum, aluminum alloy, silver, silver alloy, tin and lead.
6. The profiled solder strip according to claim 4, wherein, the thickness of the first plating layer is 1~6μm.
7. The profiled solder strip according to claim 2 or 3, wherein, the two side faces of the triangular part of the inner copper core are inwardly formed as concave surfaces; the outer plating layer comprises a second plating layer, the second plating layer is arranged outside the concave surfaces, and the material of the second plating layer is tin or tin alloy.
8. The profiled solder strip according to claim 7, wherein, the thickness of the second plating layer is 8μm~15μm.
9. The profiled solder strip according to claim 1, wherein, the shape and size of the rectangular shape of the profiled section are the same as the shape and size of the cross section of the flat section, and the bottom and the side edges of the rectangular shape of the profiled section and the cross section of the flat section are rounded.
10. The profiled solder strip according to claim 1, wherein, the height of the first transition section and the second transition section gradually decreases from the profiled section to the flat section.
11. The profiled solder strip according to claim 1, wherein, the cross section of the first transition section and the second transition section is an isosceles trapezoid on top and a rectangle on the bottom.