LED lamp bead structure beneficial to glue dispensing

By introducing a beveled side plate into the LED bead structure to form an adhesive groove, the problems of inaccurate dispensing and air bubbles are solved, improving the accuracy and stability of dispensing, and making it suitable for various chip types.

CN223681440UActive Publication Date: 2025-12-16ZHEJIANG INTELED OPTOELECTRONICS TECH
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Patent Information

Application Number
CN202423195705.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2025-12-16
Estimated Expiration
2034-12-24

AI Technical Summary

Technical Problem

Existing LED bead structures are prone to misalignment and glue overflow during dispensing, resulting in inconsistent glue surfaces, bottom air bubbles, and a high risk of needle clogging.

Method used

Two sloping side plates are introduced into the LED structure to form glue grooves. The sloping surfaces guide the flow of glue, increase the opening area, and improve the dispensing effect.

Benefits of technology

It improves dispensing accuracy, reduces glue overflow and bottom air bubbles, enhances the process window, and is suitable for different types of chip structures.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an LED lamp bead structure favorable for dispensing, which relates to the technical field of LED lamp beads, and comprises a bottom plate and a side plate, the side plate is arranged on the bottom plate in a surrounding manner, a lamp bead chip is arranged on the bottom plate, the lamp bead chip is arranged at the central position of the bottom plate, one side, facing the lamp bead chip, of the side plate is provided with two inclined surfaces, and the inclined surfaces are arranged on the bottom plate. A first inclined plane is arranged on the lower side of the side plate, a second inclined plane is arranged on the upper side of the side plate, on the basis that the strength of the side wall is not greatly changed, the opening area is increased, the process window is improved, the point deviation problem can be solved, glue flows downwards along the side wall, and the bottom bubble phenomenon can be improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to LED lamp pearl technical field, specifically related to a LED lamp pearl structure of benefiting from the point of glue. BACKGROUND

[0002] With the LED display screen point interval smaller and smaller, LED lamp pearl also does more and more small. For the lamp pearl needing to point the glue, the difficulty of the point of glue also increases linearly.

[0003] The existing LED lamp pearl structure opening is small, and the required point of glue precision is very high, often there is a little deviation, and the glue spills.

[0004] The shortcomings of the existing lamp pearl structure:

[0005] 1: point deviation, glue overflow, resulting in uneven glue surface, and poor consistency of glue surface.

[0006] 2: Because of the chip and the wire at the bottom, the bottom bubble often appears during the point of glue.

[0007] 3: Because the opening is small, only a small diameter point of glue needle can be selected, and the needle is too small to risk plugging the hole. INVENTION CONTENTS

[0008] The utility model relates to a LED lamp pearl structure of benefiting from the point of glue, solve the existing lamp pearl point of glue and easily point the glue not in place, and the point of glue effect is poor, and the problem that easily blocks the glue.

[0009] TECHNICAL SCHEME

[0010] To solve the above problems, the technical scheme provided by the utility model is:

[0011] A LED lamp pearl structure of benefiting from the point of glue, including bottom plate and side plate, the side plate is arranged around the bottom plate, the bottom plate is provided with lamp pearl chip, the lamp pearl chip is arranged at the center position of the bottom plate, the side plate is provided with two inclined surfaces towards the lamp pearl chip, the first inclined surface is arranged at the lower side of the side plate, and the second inclined surface is arranged at the upper side of the side plate.

[0012] Further, the outer side of the side plate is aligned with the side of the bottom plate.

[0013] Further, when the bottom plate is a square, the side plate is vertically connected by four identical side plates, and the four side plates are arranged along the square line of the bottom plate surface.

[0014] Further, when the bottom plate is a circle, the side plate is a ring structure arranged on the bottom plate, and the side plate is a whole ring structure.

[0015] Further, the first inclined surface on one side of the side plate forms an angle R1 with the first inclined surface on the side plate on the other side, and the angle R1 ranges from 0 to 55 degrees.

[0016] Further, the second inclined surface on one side of the side plate forms an angle R2 with the second inclined surface on the side plate on the other side, and the angle R2 ranges from 150 to 180 degrees.

[0017] Further, the height of the first inclined surface from the bottom plate surface is H1, the height of the second inclined surface on the first inclined surface is H2, and the relationship between H1 and H2 is that H2 is between 0.5 times H1 and 1 times H1.

[0018] Further, the width of the side plate is C1, and the side plate is further provided with a flat thickness C2, and the relationship between C1 and C2 is that C2 is between 0.2 times C1 and 0.5 times C1.

[0019] Further, the lamp bead chip is provided with a wire connected to the bottom plate.

[0020] Beneficial effects

[0021] The technical scheme provided by the utility model has the beneficial effects compared with the prior art:

[0022] The technical scheme provided by the utility model adds an inclined opening to the original opening, thereby greatly increasing the area of the cup opening and significantly increasing the dispensing process window.

[0023] 1. On the basis of little change in the side wall strength, the opening area is increased, the process window is improved, and the point deviation problem can be improved.

[0024] 2. The glue flows along the side wall, and the bottom bubble phenomenon can be improved.

[0025] 3. It is suitable for various dispensing lamp beads, and the bottom can be a wire bonding chip or a flip chip.

[0026] 4. It is particularly suitable for dispensing lamp beads for GOB products. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a schematic diagram of the lamp bead structure of the prior art;

[0028] Figure 2 It is a structural schematic diagram of the embodiment 1 of the utility model. DETAILED DESCRIPTION

[0029] In order to make the technical scheme of the utility model more clear, the utility model will be further described in detail below in combination with the drawings and specific embodiments.

[0030] Embodiment 1

[0031] In combination with the drawings Figure 2 A LED lamp bead structure beneficial to glue dispensing, the glue dispensing structure is composed of a bottom plate 10 and a side plate 11, a lamp bead chip 12 is installed on the bottom plate 10, the side plate 11 is arranged around the bottom plate 10, the lamp bead chip 12 is installed at the geometric center of the bottom plate 10, the side plate 11 on the bottom plate 10 is arranged around the lamp bead chip 12, and the outer side of the side plate 11 is aligned with the side of the bottom plate 10.

[0032] The bottom plate 10 is a square structure or a circular structure, and the side plate 11 is arranged around the upper surface of the bottom plate 10 and changes in shape in correspondence with the shape of the bottom plate 10.

[0033] When the bottom plate 10 is square, the side plate 11 is formed by vertically connecting four identical side plates end to end, and the four side plates 11 are arranged along the square lines on the surface of the bottom plate 10, and the outer side of the side plate 11 is aligned with the square lines of the bottom plate 10 at this time.

[0034] When the bottom plate 10 is circular, the side plate 11 is arranged in a ring shape on the bottom plate 10 in a ring structure, the side plate 11 as a whole is a ring structure, and the outer side of the side plate 11 is aligned with the circular lines of the bottom plate 10 at this time.

[0035] The side plate 11 is arranged around the lamp bead chip 12 on the bottom plate, thereby forming a glue groove 13 capable of accommodating glue, and the lamp bead chip 12 is arranged at the center position of the glue groove.

[0036] The side of the side plate 11 facing the lamp bead chip 12 is composed of two inclined surfaces with different angles, and the two inclined surfaces on the side of the side plate 11 facing the lamp bead chip 12 are used when dispensing glue. The glue slides down through the inclined surfaces on the side plate 11, thereby being filled into the glue groove 13 formed by the side plate 11. By filling the glue into the glue groove 13, the lamp bead chip 12 located in the glue groove 13 and fixed on the bottom plate 10 is fixed by the glue, and the lamp bead chip 12 is protected.

[0037] The two inclined surfaces of the side plate 11 are respectively a first inclined surface located on the lower side of the side plate 11 and a second inclined surface connected to the first inclined surface on the upper side of the side plate 11, and the first inclined surface further extends in the direction of the lamp bead chip 12 relative to the second inclined surface.

[0038] An angle R1 is formed between the first inclined surface on one side plate 11 and the first inclined surface on the symmetrically opposite side plate 11, and the value of the angle R1 ranges from 0 to 55 degrees. When the angle R1 is 0 degrees, the first inclined surfaces on both sides are parallel.

[0039] The second slope on one side plate 11 forms an angle R2 with the second slope on the symmetric side plate 11 on the other side, and the angle R2 ranges from 150 to 180 degrees, and when the angle R2 is 180 degrees, it means that the second slopes on both sides are on the same plane.

[0040] The height of the first slope from the surface of the bottom plate 10 is H1, and the height of the second slope on the first slope is H2, and the relationship between H1 and H2 is that H2 is between 0.5 times H1 and 1 times H1, and the first slope is used for dispensing glue, and the glue needle will dispense glue to the side of the first slope close to the second slope, which is used for temporarily placing glue, and the second slope is used to assist the glue to slide along the slope of the second slope, which is used to assist the glue to fill the glue groove 13.

[0041] The width of the side plate 11 is C1, and in addition to the width formed by the first slope and the second slope, there is a flat thickness C2 with a flat surface, and the relationship between C1 and C2 is that C2 is between 0.2 times C1 and 0.5 times C1.

[0042] A round corner is provided between the first slope and the second slope to facilitate the flow of glue.

[0043] The lamp bead chip 12 and the bottom plate 10 can be integrally formed by injection molding, or the lamp bead chip 12 can be fixed on the bottom plate 10 by drilling holes in the bottom plate 10.

[0044] The lamp bead chip 12 is provided with a wire connected to the bottom plate 10, so as to facilitate power supply and control of the lamp bead chip 12, and to realize the lighting and turning off of the lamp bead as a whole.

[0045] In use, only the dispensing pillow needs to be moved to the second slope on the side plate 11 on either side, and the pillow is correspondingly arranged at the position close to the first slope on the second slope, and after dispensing glue, the glue first flows on the second slope, and since the inclination angle of the second slope is smaller than that of the first slope, the glue on the second slope flows slowly on the second slope, and when the glue reaches the first slope, the glue flows faster, and the glue flows along the first slope to the glue groove 13, at this time the glue can cover the lamp bead chip 12, and since the glue gradually transitions from one side of the glue groove 13 to the other side of the glue groove 13 along the second slope on one side, the glue flows down along the side wall, which can improve the bottom bubble phenomenon, increase the opening area on the basis of little change in the strength of the side wall, improve the process window, and improve the point deviation problem.

[0046] It is suitable for various dispensing lamp beads, and the bottom can be a wire bonding chip or a flip chip. It is particularly suitable for dispensing lamp beads for GOB products.

[0047] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several deformations and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. An LED lamp bead structure facilitating dispensing, characterized in that, The application relates to a lamp bead structure, which comprises a bottom plate and side plates, the side plates are arranged around the bottom plate, lamp bead chips are arranged on the bottom plate, the lamp bead chips are arranged at the center position of the bottom plate, two inclined surfaces are arranged on the side of the side plates which is close to the lamp bead chips, a first inclined surface is arranged on the lower side of the side plates, and a second inclined surface is arranged on the upper side of the side plates.

2. The LED lamp bead structure for facilitating dispensing according to claim 1, wherein, The outer side of the side plate is aligned with the side edge of the bottom plate.

3. The LED lamp bead structure for facilitating dispensing according to claim 2, wherein, When the bottom plate is square, the side plates are connected vertically in a head-to-tail mode and are composed of four same side plates, and the four side plates are arranged along the square edge line of the bottom plate surface.

4. The LED lamp bead structure for facilitating dispensing according to claim 2, wherein, When the bottom plate is circular, the side plates are arranged in a ring structure on the bottom plate, and the whole side plates are a ring structure.

5. The LED lamp bead structure for facilitating dispensing according to claim 1, wherein, The first inclined surface on one side plate and the first inclined surface on the symmetric side plate form an angle R1, and the value range of the angle R1 is 0-55 degrees.

6. The LED lamp bead structure for facilitating dispensing according to claim 1, wherein, The second inclined surface on one side plate and the second inclined surface on the symmetric side plate form an angle R2, and the value range of the angle R2 is 150-180 degrees.

7. The LED lamp bead structure for facilitating dispensing according to claim 1, wherein, The height of the first inclined surface from the bottom plate surface is H1, the height of the second inclined surface on the first inclined surface is H2, and the relationship between H1 and H2 is that H2 is between 0.5 times H1 and 1 times H1.

8. The LED lamp bead structure for facilitating dispensing according to claim 1, wherein, The width of the side plate is C1, and the side plate is further provided with a flat thickness C2, and the relationship between C1 and C2 is that C2 is between 0.2 times C1 and 0.5 times C1.

9. The LED lamp bead structure for facilitating dispensing according to claim 1, wherein, The lamp bead chips are provided with wires connected to the bottom plate.