Light emitting diode with relatively high light output rate

Abstract

The utility model discloses a light emitting diode with higher light output rate, which relates to the technical field of light emitting diodes and comprises a light emitting diode body, a base and a transparent cover, the bottom of the light emitting diode body is movably mounted on the top of the base, and the transparent cover is movably mounted on the top of the base. The bottom of the light-emitting diode body is fixedly connected with a connection heat conduction assembly. According to the utility model, heat conduction and heat dissipation are stably carried out on the light-emitting diode body by arranging the connection heat conduction assembly in cooperation with the rapid heat dissipation assembly, and the problems that although the light output rate of an existing light-emitting diode is high, the light-emitting diode generates heat in actual use, the heat accumulates in a chip, the temperature of the chip is increased, and the service life of the chip is prolonged are solved. The internal quantum efficiency can be reduced by more than 5% when the temperature is increased by 10 DEG C, which means that the number of generated photons is reduced, the light output rate is reduced, and the light emitting efficiency of the light emitting diode is reduced, and the effects of heat conduction and heat dissipation are achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a light emitting diode technical field, specifically to a light emitting diode with higher light output rate. BACKGROUND

[0002] The light emitting diode is a kind of semiconductor electronic component that can convert electric energy into light energy, and its core part is the PN junction composed of P-type semiconductor and N-type semiconductor.

[0003] When the forward voltage is applied to the two ends of the light emitting diode, electrons will diffuse from the N-type semiconductor region to the P-type semiconductor region, and near the PN junction, electrons and holes recombine, according to the principle of semiconductor physics, this recombination process will release energy, and in some semiconductor materials, these energies are emitted in the form of photons, thereby generating light, this process is called electroluminescence.

[0004] For example, the light emitting diode with current expansion disclosed in CN222106754U mainly uniformly emits light and has higher light emitting efficiency by reasonably arranging the structure and distribution position of N primary electrode and P primary electrode. The N primary electrode is composed of a first main electrode and a first branch electrode, the first main electrode extends along the first side edge of the epitaxial sheet, one end of the first branch electrode is connected with the first main electrode, and the other end extends towards the second side edge of the epitaxial sheet, thereby increasing the area of the N primary electrode distributed on the epitaxial sheet. The P primary electrode is composed of a second main electrode and a second branch electrode, the second main electrode extends along the first side edge of the epitaxial sheet, one end of the second branch electrode is connected with the second main electrode, and the other end extends towards the first side edge of the epitaxial sheet, thereby increasing the area of the P primary electrode distributed on the epitaxial sheet. The structure of the N primary electrode and the P primary electrode increases the area of the N primary electrode and the P primary electrode distributed on the epitaxial sheet, so that the current can be fully expanded on the epitaxial sheet.

[0005] Based on the search of the patent number, combined with the deficiencies in the prior art, it is found that:

[0006] Although the existing light emitting diode has high light output rate, but in actual use, the light emitting diode will generate heat when in use, the heat will accumulate in the chip, causing the temperature of the chip to rise, and for every ten degrees Celsius, the internal quantum efficiency will decrease by more than five percent, which means that the number of generated photons decreases, the light output rate decreases, and the light emitting efficiency of the light emitting diode is reduced. UTILITY MODEL CONTENTS

[0007] In order to solve the problems in the background art, the utility model discloses a light output rate higher's light emitting diode has the advantage of heat conduction and heat dissipation, solve the existing light emitting diode although light output rate is higher, but in actual use, light emitting diode will produce heat when using, and the heat will accumulate in the chip, cause the chip temperature to rise, and the internal quantum efficiency will reduce more than 5% when temperature rises 10 degrees Celsius, which means that the number of photons produced decreases, and the light output rate decreases, which reduces the light emitting efficiency of the light emitting diode.

[0008] In order to achieve the above object, the utility model provides the following technical scheme: a light output rate higher's light emitting diode, including light emitting diode body, base and transparent cover, the bottom of light emitting diode body and the top of base swing installation, the top of base swing installation transparent cover, the bottom of light emitting diode body is connected with connecting heat conduction component, and the bottom of light emitting diode body is provided with quick heat dissipation component.

[0009] As the utility model prefers, the connecting heat conduction component includes copper plate, the bottom of copper plate is fixedly connected with one-way heat conduction rod, and the bottom of one-way heat conduction rod is fixedly connected with graphene plate.

[0010] As the utility model prefers, the quick heat dissipation component includes fin, the top of fin is fixedly connected with the bottom of graphene plate, the bottom of fin is fixedly connected with heat dissipation fin, the surface of heat dissipation fin is provided with contact groove, a plurality of contact grooves are equidistantly arranged.

[0011] As the utility model prefers, the inside of heat dissipation fin is fixedly connected with temperature sensor, and one side of heat dissipation fin is provided with sprayer.

[0012] As the utility model prefers, the temperature sensor is electrically connected with controller through wire, the controller is installed at the bottom of base, the controller is electrically connected with temperature sensor and sprayer through wire, the top of sprayer is fixedly connected with connecting rod, and the top of connecting rod is fixedly connected with the bottom of base.

[0013] As the utility model prefers, the bottom of fin is provided with connecting groove, and the inside of connecting groove is fixedly connected with graphene block.

[0014] As the utility model prefers, the top of sprayer is fixedly connected with heat dissipation fan, and the heat dissipation fan is electrically connected with controller through wire.

[0015] As the utility model prefers, the bottom of one-way heat conduction rod is provided with mounting groove, the inside of mounting groove is fixedly connected with graphene rod, and the bottom of graphene rod is fixedly connected with the top of fin.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] 1、 The utility model discloses a set up the connecting heat conduction component cooperation quick radiating component stable heat conduction radiating to the light emitting diode body, solved the current light emitting diode although the light output rate is higher, but in actual use, light emitting diode will produce heat when using, and the heat will accumulate in the chip, and the chip temperature rises, and the internal quantum efficiency will reduce more than 5% when every ten degrees Celsius, which means that the number of photons produced decreases, and the light output rate decreases, which reduces the light emitting efficiency of the light emitting diode.

[0018] 2、 The utility model discloses a set up the connecting heat conduction component, and the copper plate can absorb the heat generated at the bottom of the light emitting diode body in use and transfer the absorbed heat to the top of the one-way heat conduction rod, which can heat the heat one-way in use, avoid the influence of external heat on the normal use of the light emitting diode body, and can also quickly lead out the heat generated by the light emitting diode body, and the graphene plate can quickly radiate and conduct heat when transferring heat from the one-way heat conduction rod.

[0019] 3、 The utility model discloses a set up quick radiating component, and the heat sink can radiate the heat transferred by the graphene plate in use, which enhances the heat dissipation efficiency of the graphene plate in use, and the heat dissipation fin can quickly radiate the bottom of the heat sink in use, which enhances the heat dissipation stability in use, and the contact groove can enhance the contact area between the heat dissipation fin and the air, thereby improving the heat dissipation effect in use. DETAILED DESCRIPTION

[0020] Figure 1 It is a three-dimensional structure schematic diagram of the utility model;

[0021] Figure 2 It is a three-dimensional split structure schematic diagram of the utility model;

[0022] Figure 3 It is a three-dimensional split structure schematic diagram of the utility model; Figure 2 It is an enlarged structure schematic diagram of A in the utility model.

[0023] In the drawing: 1, light emitting diode body; 2, base; 3, transparent cover; 4, connecting heat conduction component; 41, copper plate; 42, one-way heat conduction rod; 43, graphene plate; 5, quick radiating component; 51, heat sink; 52, heat dissipation fin; 53, contact groove; 6, temperature sensor; 7, sprayer; 8, controller; 9, connecting rod; 10, connecting groove; 11, graphene block; 12, heat dissipation fan; 13, mounting groove; 14, graphene rod. DETAILED DESCRIPTION

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] like Figures 1 to 3 As shown, the present invention provides a light-emitting diode with a high light output rate, including a light-emitting diode body 1, a base 2 and a transparent cover 3. The bottom of the light-emitting diode body 1 is movably installed with the top of the base 2, the transparent cover 3 is movably installed with the top of the base 2, a heat-conducting component 4 is fixedly connected to the bottom of the light-emitting diode body 1, and a fast heat dissipation component 5 is provided at the bottom of the light-emitting diode body 1.

[0026] refer to Figure 2 The heat-conducting component 4 includes a copper plate 41, a one-way heat-conducting rod 42 fixedly connected to the bottom of the copper plate 41, and a graphene plate 43 fixedly connected to the bottom of the one-way heat-conducting rod 42.

[0027] As a technical optimization of this utility model, by setting the connecting heat conduction component 4, the copper plate 41 can absorb the heat generated at the bottom of the light-emitting diode body 1 during use and transfer the absorbed heat to the top of the one-way heat conduction rod 42. The one-way heat conduction rod 42 can conduct heat in one direction during use, avoiding external heat from affecting the normal use of the light-emitting diode body 1, and can also quickly dissipate the heat generated by the light-emitting diode body 1. The graphene plate 43 can quickly dissipate and conduct heat on the heat transferred by the one-way heat conduction rod 42 during use.

[0028] refer to Figure 3 The rapid heat dissipation component 5 includes a heat sink 51. The top of the heat sink 51 is fixedly connected to the bottom of the graphene plate 43. A heat dissipation fin 52 is fixedly connected to the bottom of the heat sink 51. A contact groove 53 is provided on the surface of the heat dissipation fin 52. Several contact grooves 53 are provided, and the several contact grooves 53 are arranged at equal distances.

[0029] As a technical optimization of this utility model, by setting up a fast heat dissipation component 5, the heat sink 51 can dissipate the heat transferred by the graphene plate 43 during use, thereby enhancing the heat dissipation efficiency of the graphene plate 43 during use. At the same time, the heat dissipation fins 52 can quickly dissipate heat from the bottom of the heat sink 51 during use, thereby enhancing the heat dissipation stability during use. The contact groove 53 can increase the contact area between the heat dissipation fins 52 and the air, thereby improving the heat dissipation effect during use.

[0030] refer to Figure 3The inside of the heat dissipation fin 52 is fixedly connected with a temperature sensor 6, and one side of the heat dissipation fin 52 is provided with a sprayer 7.

[0031] As a technical optimization scheme of the utility model, the temperature sensor 6 can detect the temperature in the heat dissipation fin 52 in use, and when the temperature sensor 6 detects that the temperature of the heat dissipation fin 52 is too high, a signal can be sent to the controller 8, the controller 8 is started after receiving and processing the signal, and the sprayer 7 is started, so that the heat dissipation fin 52 can be sprayed with coolant, a large amount of heat can be taken away by vaporization of the coolant, the heat dissipation fin 52 can be quickly cooled, and the situation that the light emitting diode body 1 is damaged due to overheating is avoided.

[0032] Reference Figure 2 The temperature sensor 6 is electrically connected with a controller 8 through wires, the controller 8 is installed at the bottom of the base 2, the controller 8 is electrically connected with the temperature sensor 6 and the sprayer 7 through wires, the top of the sprayer 7 is fixedly connected with a connecting rod 9, and the top of the connecting rod 9 is fixedly connected with the bottom of the base 2.

[0033] As a technical optimization scheme of the utility model, the controller 8 can control the temperature sensor 6 and the sprayer 7 in use, the use convenience in use is enhanced, and the connecting rod 9 can conveniently install and fix the sprayer 7 in use.

[0034] Reference Figure 3 The bottom of the heat dissipation fin 52 is provided with a connecting groove 10, and the inside of the connecting groove 10 is fixedly connected with a graphene block 11.

[0035] As a technical optimization scheme of the utility model, the connecting groove 10 can conveniently install and fix the graphene block 11 in use, and the graphene block 11 can quickly conduct heat on the graphene plate 43 to the heat dissipation fin 52 in use, so that the heat dissipation effect of the heat dissipation fin 52 in use is enhanced.

[0036] Reference Figure 3 The top of the sprayer 7 is fixedly connected with a heat dissipation fan 12, and the heat dissipation fan 12 is electrically connected with the controller 8 through wires.

[0037] As a technical optimization scheme of the utility model, the heat dissipation fan 12 can be started by the controller 8 in use, and the heat dissipation fan 12 can dissipate heat for the heat dissipation fin 52 after being started, so that the heat dissipation efficiency of the heat dissipation fin 52 in use is improved.

[0038] Reference Figure 2The bottom of the one-way heat conduction rod 42 is provided with a mounting groove 13, and the inside of the mounting groove 13 is fixedly connected with a graphene rod 14, and the bottom of the graphene rod 14 is fixedly connected with the top of the heat dissipation fin 51.

[0039] As a technical optimization scheme of the utility model, through setting mounting groove 13 and graphene rod 14, mounting groove 13 can conveniently install and fix graphene rod 14 in use, graphene rod 14 can improve the heat conduction efficiency of one-way heat conduction rod 42 in use, so that heat is quickly conducted to graphene plate 43, and meanwhile, heat returning to copper plate 41 can be avoided, so that the normal use of light emitting diode body 1 is affected.

[0040] The working principle and use process of the utility model are as follows: copper plate 41 can absorb the heat generated at the bottom of light emitting diode body 1 and transfer the absorbed heat to the top of one-way heat conduction rod 42 in use, one-way heat conduction rod 42 can conduct heat in one direction in use, so that the normal use of light emitting diode body 1 is not affected by external heat, and the heat generated by light emitting diode body 1 can be quickly conducted out, graphene plate 43 can quickly dissipate and conduct the heat transferred by one-way heat conduction rod 42 in use, heat dissipation fin 51 can dissipate the heat transferred by graphene plate 43 in use, thereby enhancing the heat dissipation efficiency of graphene plate 43 in use, and meanwhile, heat dissipation fin 51 can quickly dissipate the heat at the bottom of heat dissipation fin 51 in use, thereby enhancing the heat dissipation stability in use, and contact groove 53 can enhance the contact area between heat dissipation fin 52 and air, thereby enhancing the heat dissipation effect in use, effectively avoiding the temperature rise of light emitting diode body 1 and affecting the light output rate, achieving the effect of heat conduction and dissipation, and enhancing the stability of high light emitting efficiency of the light emitting diode.

[0041] In summary: the light emitting diode with high light output rate is provided with connecting heat conduction assembly 4 and stable quick heat dissipation assembly 5 to conduct and dissipate heat for light emitting diode body 1, thereby solving the problem that although the existing light emitting diode has high light output rate, heat is generated during use, the heat accumulates in the chip, the temperature of the chip rises, the internal quantum efficiency decreases by more than 5% for every ten degrees Celsius, which means that the number of generated photons decreases and the light output rate decreases, and the light emitting efficiency of the light emitting diode is reduced.

[0042] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A light emitting diode with high light output, comprising a light emitting diode body (1), a base (2) and a transparent cover (3), characterized in that: The bottom of the light emitting diode body (1) is movably mounted on the top of the base (2), the transparent cover (3) is movably mounted on the top of the base (2), the bottom of the light emitting diode body (1) is fixedly connected with a connecting heat conducting assembly (4), and the bottom of the light emitting diode body (1) is provided with a rapid heat dissipation assembly (5).

2. The light-emitting diode with high light output rate according to claim 1, characterized in that: The connecting heat conducting assembly (4) comprises a copper plate (41), and the bottom of the copper plate (41) is fixedly connected with a one-way heat conducting rod (42), and the bottom of the one-way heat conducting rod (42) is fixedly connected with a graphene plate (43).

3. A light-emitting diode with high light output rate according to claim 2, characterized in that: The rapid heat dissipation assembly (5) comprises a heat dissipation fin (51), the top of the heat dissipation fin (51) is fixedly connected with the bottom of the graphene plate (43), the bottom of the heat dissipation fin (51) is fixedly connected with a heat dissipation fin (52), the surface of the heat dissipation fin (52) is provided with a contact groove (53), the contact groove (53) is provided with a plurality of contact grooves (53), and the plurality of contact grooves (53) are equidistantly arranged.

4. A light-emitting diode with high light output rate according to claim 3, characterized in that: The inside of the heat dissipation fin (52) is fixedly connected with a temperature sensor (6), and one side of the heat dissipation fin (52) is provided with a sprayer (7).

5. A light-emitting diode with high light output rate according to claim 4, characterized in that: The temperature sensor (6) is electrically connected with a controller (8) through wires, the controller (8) is mounted on the bottom of the base (2), the controller (8) is electrically connected with the temperature sensor (6) and the sprayer (7) through wires, the top of the sprayer (7) is fixedly connected with a connecting rod (9), and the top of the connecting rod (9) is fixedly connected with the bottom of the base (2).

6. A light-emitting diode with high light output rate according to claim 3, characterized in that: The bottom of the heat dissipation fin (51) is provided with a connecting groove (10), and the inside of the connecting groove (10) is fixedly connected with a graphene block (11).

7. A light-emitting diode with high light output rate according to claim 5, characterized in that: The top of the sprayer (7) is fixedly connected with a heat dissipation fan (12), and the heat dissipation fan (12) is electrically connected with the controller (8) through wires.

8. A light-emitting diode with high light output rate according to claim 3, characterized in that: The bottom of the one-way heat conducting rod (42) is provided with a mounting groove (13), the inside of the mounting groove (13) is fixedly connected with a graphene rod (14), and the bottom of the graphene rod (14) is fixedly connected with the top of the heat dissipation fin (51).

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