Defective crystal grain removing equipment

Abstract

The utility model relates to a bad crystal grain removing device comprising a bearing platform and a crystal grain removing mechanism, the bearing platform is used for placing a wafer, the bearing platform is arranged in a first direction of the crystal grain removing mechanism, and the crystal grain removing mechanism comprises a base, a first adhesive tape rotating wheel assembly, a second adhesive tape rotating wheel assembly and an ejector pin assembly. The first adhesive tape rotating wheel assembly and the second adhesive tape rotating wheel assembly are arranged on the base in a spaced and rotatable mode in the second direction, the ejector pin assembly is movably arranged on the base and located between the first adhesive tape rotating wheel assembly and the second adhesive tape rotating wheel assembly, and the ejector pin assembly can move in the first direction to be close to the bearing platform; the first adhesive tape rotating wheel assembly and the second adhesive tape rotating wheel assembly are used for conveying an adhesive tape, the ejector pin assembly moves in the first direction to press the adhesive tape to a wafer located on the bearing platform, and the first direction is perpendicular to the second direction. The utility model provides bad crystal grain removing equipment which can automatically remove bad crystal grains according to a detection result of a previous process and can improve the removing yield.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of grain rejection, especially to a defective grain rejection equipment. BACKGROUND

[0002] After the chip is tested or appearance inspected, there will be some defective grains, and the defective grains need to be rejected before delivery. At present, most chip factories mainly use manual rejection of appearance defective products, and lack effective methods for appearance good but test unqualified products. Manual rejection requires employees to operate under a microscope, and after observing the appearance defective product, the grain is sucked away by a vacuum suction pen. Therefore, a large number of skilled operators are needed, and the proficiency of the operators is also a test, and long-time operation under the microscope is also a damage to the vision of the operators. The related equipment for rejecting defective grains in the prior art needs multiple rejection processes, and the production efficiency is low and the cost is high. Therefore, a defective grain rejection equipment is needed, which can automatically reject defective grains according to the detection results of the previous process, can reject multiple defective grains, combines multiple rejection processes, improves production efficiency, and reduces production cost. SUMMARY

[0003] Therefore, it is necessary to provide a defective grain rejection equipment, which can automatically reject defective grains according to the detection results of the previous process, has high automation degree, can effectively improve the rejection yield, and solves the limitation of manual rejection of appearance defective products.

[0004] The present application provides a defective grain rejection equipment, which comprises a bearing platform and a grain rejection mechanism. The bearing platform is used for placing a wafer, and the bearing platform is arranged in a first direction of the grain rejection mechanism. The grain rejection mechanism comprises a base, a first adhesive tape roller assembly, a second adhesive tape roller assembly, and a thimble assembly. The first adhesive tape roller assembly and the second adhesive tape roller assembly are arranged on the base in a second direction and can rotate. The thimble assembly is movably arranged on the base between the first adhesive tape roller assembly and the second adhesive tape roller assembly, and can move along the first direction to approach the bearing platform. The first adhesive tape roller assembly and the second adhesive tape roller assembly are used for conveying adhesive tape, and the thimble assembly moves along the first direction to press the adhesive tape onto the wafer on the bearing platform. The first direction is perpendicular to the second direction.

[0005] In the bad grain removing device provided in the application, the ejector assembly is movably arranged on the base, the ejector assembly is located between the first adhesive tape rotating wheel assembly and the second adhesive tape rotating wheel assembly, when removing the bad grain, the grain removing mechanism is lowered to a certain height, the bad grain moves to the lower part of the ejector assembly, the ejector assembly is lowered to eject the adhesive tape, the adhesive tape is adhered to the surface of the bad grain under the action of the first adhesive tape rotating wheel assembly and the second adhesive tape rotating wheel assembly and is kept for a period of time, so as to ensure that the adhesive tape is completely adhered to the bad grain, then the ejector assembly is raised, the adhesive tape retracts after losing the ejecting force and peels off the bad grain, and the removing process of the bad grain is completed. The above process can automatically remove the bad grain according to the detection result of the previous process, without manual manual removal, the degree of automation is high, the yield can be effectively improved, and the limitation of manual removal of appearance defects is solved.

[0006] In one embodiment, the ejector assembly comprises a driving member and an ejector pin, the driving member is connected between the base and the ejector pin, the driving member can drive the ejector pin to move along the first direction to move from the stop position to the bearing platform, the grain removing mechanism further comprises a limiting assembly, the limiting assembly is fixed on the base and located between the stop position and the bearing platform, the position of the limiting assembly is spaced apart from the stop position in the first direction, and the limiting assembly is used for abutting against the adhesive tape transversely arranged between the first adhesive tape rotating wheel assembly and the second adhesive tape rotating wheel assembly.

[0007] In one embodiment, the limiting assembly comprises a first stop block and a second stop block which are spaced apart along the second direction and fixed on the base, the first stop block and the second stop block are used for abutting against the adhesive tape transversely arranged between the first adhesive tape rotating wheel assembly and the second adhesive tape rotating wheel assembly, and the ejector pin can move along the first direction to pass between the first stop block and the second stop block.

[0008] In one embodiment, the first adhesive tape rotating wheel assembly comprises a discharging rotating shaft and a discharging motor, the discharging motor is connected between the discharging rotating shaft and the base, and the discharging motor is used for driving the discharging rotating shaft to rotate; the second adhesive tape rotating wheel assembly comprises a collecting rotating shaft and a collecting motor, the collecting motor is connected between the collecting rotating shaft and the base, and the collecting motor is used for driving the collecting rotating shaft to rotate, the discharging rotating shaft and the collecting rotating shaft are spaced apart along the second direction.

[0009] In one embodiment, the first adhesive tape rotating wheel assembly further comprises a discharging guide wheel, the discharging guide wheel is rotationally connected to the base and is closer to the bearing platform than the discharging rotating shaft;

[0010] The second adhesive tape rotating assembly further comprises a material receiving guide wheel, which is rotatably connected to the base and is closer to the supporting platform than the material receiving rotating shaft;

[0011] The material feeding guide wheel and the material receiving guide wheel are arranged in the second direction, the distance between the material feeding guide wheel and the material receiving guide wheel is smaller than the distance between the material feeding rotating shaft and the material receiving rotating shaft, and the ejector pin assembly is movable in the first direction to pass between the material feeding guide wheel and the material receiving guide wheel.

[0012] In one embodiment, the base is provided, the supporting platform is arranged on the base, the wafer rejecting mechanism comprises a vertical driving member, the vertical driving member is connected to the base and the base, and the vertical driving member is used to drive the base to move towards or away from the supporting platform in the first direction.

[0013] In one embodiment, the translation device is arranged between the base and the supporting platform, and the translation device is used to drive the supporting platform to move in a plane perpendicular to the first direction.

[0014] In one embodiment, the translation device comprises an X-axis driving assembly and a Y-axis driving assembly, the X-axis driving assembly is arranged on the Y-axis driving assembly, the Y-axis driving assembly is arranged on the base, the supporting platform is arranged on the X-axis driving assembly, the X-axis, the Y-axis and the first direction are perpendicular to each other, and the Y-axis is parallel to the second direction.

[0015] In one embodiment, the rotation device is connected between the translation device and the supporting platform, and the rotation device is used to drive the supporting platform to rotate in a plane perpendicular to the first direction.

[0016] In one embodiment, the base is provided, the supporting platform and the wafer rejecting mechanism are arranged on the base;

[0017] The defective wafer rejecting device further comprises an observation device, a scanning device and a movement switching assembly, the movement switching assembly is arranged on the base and above the supporting platform, the observation device comprises an observation camera and an observation lifting assembly, the observation camera is arranged on the observation lifting assembly, and the observation lifting assembly is arranged on the movement switching assembly; the scanning device comprises a scanning camera and a scanning lifting assembly, the scanning camera is arranged on the scanning lifting assembly, and the scanning lifting assembly is arranged on the movement switching assembly, and the movement switching assembly is used to drive the observation camera and the scanning camera to move to selectively be above the supporting platform. BRIEF DESCRIPTION OF DRAWINGS

[0018] The utility model makes further explanation in combination with the drawings and examples, in which,

[0019] Fig. 1 The structure schematic diagram of the bad grain removing equipment is provided for an embodiment of the application.

[0020] Fig. 2 The structure schematic diagram of the bad grain removing equipment is provided for an embodiment of the application.

[0021] Fig. The bad grain removing equipment 10, adhesive tape 100, bearing platform 20, grain removing mechanism 30, pedestal 31, first adhesive tape rotating wheel assembly 32, discharging rotating shaft 321, discharging motor 322, discharging guide wheel 323, second adhesive tape rotating wheel assembly 33, collecting rotating shaft 331, collecting motor 332, collecting guide wheel 333, thimble assembly 34, thimble 341, limiting assembly 35, first stopper 351, second stopper 352, vertical driving part 36, base 40, translation device 50, X-axis driving assembly 51, Y-axis driving assembly 52, rotating device 60, observation device 70, observation camera 71, observation lifting assembly 72, scanning device 80, scanning camera 81, scanning lifting assembly 82, movement switching assembly 90, first direction P1, second direction P2 DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purpose, features and advantages of the utility model more apparent, obvious and easy to understand, the specific implementation of the utility model is described in detail below in combination with the drawings. In the following description, a lot of specific details are set forth in order to give a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0023] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0024] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and should not be construed as indicating or implying relative importance or an indicated number of technical features. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0025] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] After the chip is tested or appearance inspected, some defective dies will be generated, and the defective dies need to be removed before delivery. At present, most chip factories mainly use manual removal of appearance defective dies, and lack effective methods for appearance good but test unqualified dies. Manual removal requires employees to operate under a microscope, and after observing the appearance defective dies, the dies are sucked away by a vacuum suction pen. Therefore, a large number of skilled operators are needed, and the proficiency of the operators is also a test, and long time operation under the microscope is also a harm to the eyesight of the operators. The existing defective die removal related equipment needs multiple removal processes, and the production efficiency is low and the cost is high. Therefore, a defective die removal equipment is needed, which can automatically remove defective dies according to the detection results of the previous process, can remove various defective dies, combines multiple removal processes, improves the production efficiency, and reduces the production cost.

[0027] Reference Figs. 1-2To solve the above problems, the embodiment of the present application provides a defective die removing device 10, which comprises a bearing platform 20 and a die removing mechanism 30. The bearing platform 20 is used for placing a wafer, and is arranged on a first direction P1 of the die removing mechanism 30. The die removing mechanism 30 comprises a base 31, a first adhesive tape rotating wheel assembly 32, a second adhesive tape rotating wheel assembly 33 and a ejector pin assembly 34. The first adhesive tape rotating wheel assembly 32 and the second adhesive tape rotating wheel assembly 33 are arranged on the base 31 along a second direction P2 and can rotate. The ejector pin assembly 34 is movably arranged on the base 31 and located between the first adhesive tape rotating wheel assembly 32 and the second adhesive tape rotating wheel assembly 33. The ejector pin assembly 34 can move along the first direction P1 to approach the bearing platform 20. The first adhesive tape rotating wheel assembly 32 and the second adhesive tape rotating wheel assembly 33 are used for conveying an adhesive tape 100. The ejector pin assembly 34 moves along the first direction P1 to press the adhesive tape 100 to the wafer on the bearing platform 20. The first direction P1 is perpendicular to the second direction P2.

[0028] Referring to Figs. 1-2In the defective die removing device 10, the carrying platform 20 is used to place a wafer, which is a silicon wafer used to make a silicon semiconductor circuit. The carrying platform 20 is disposed on the first direction P1 of the die removing mechanism 30, the die removing mechanism 30 can be raised or lowered relative to the carrying platform 20, and the die removing mechanism 30 can remove the defective wafer on the carrying platform 20. The die removing mechanism 30 includes a base 31, a first adhesive tape roller assembly 32, a second adhesive tape roller assembly 33, and a needle assembly 34. The first adhesive tape roller assembly 32 and the second adhesive tape roller assembly 33 are spaced apart along the second direction P2. The first adhesive tape roller assembly 32 is rotatably disposed on the base 31, and the second adhesive tape roller assembly 33 is rotatably disposed on the base 31. The first adhesive tape roller assembly 32 and the second adhesive tape roller assembly 33 are used to convey an adhesive tape 100, and the adhesive tape 100 is used to adhere the defective wafer. The adhesive tape 100 can be a high-adhesion adhesive tape to improve the effect of adhering the defective wafer. The needle assembly 34 is movably disposed on the base 31, and the needle assembly 34 is located between the first adhesive tape roller assembly 32 and the second adhesive tape roller assembly 33. The needle assembly 34 can move along the first direction P1 to press the adhesive tape 100 conveyed by the first adhesive tape roller assembly 32 and the second adhesive tape roller assembly 33 onto the wafer on the carrying platform 20. Specifically, the needle assembly 34 includes a driving member and a needle 341. The driving member is connected between the base 31 and the needle 341, and the driving member can drive the needle 341 to move along the first direction P1 from a stop position to the carrying platform 20. When the needle 341 is in the stop position, the adhesive tape 100 is not adhered to the wafer. When the needle 341 moves to the carrying platform 20, the adhesive tape 100 adheres to the wafer. In some embodiments, the die removing mechanism 30 further includes a limiting assembly 35. The limiting assembly 35 can resist the adhesive tape 100 that spans between the first adhesive tape roller assembly 32 and the second adhesive tape roller assembly 33, so that the adhesive tape 100 is in a relatively tight state when adhering the wafer. Specifically, the limiting assembly 35 is fixed to the base 31, and the limiting assembly 35 is located between the stop position and the carrying platform 20. The position of the limiting assembly 35 is spaced apart from the stop position along the first direction P1.

[0029] Referring to Figs. 1-2In some embodiments, the grain rejection mechanism 30 includes a vertical drive 36 capable of driving the ejector pin assembly 34 to move along the first direction P1 towards or away from the carrier platform 20. Specifically, the vertical drive 36 drives the grain rejection mechanism 30 to descend to a certain height along the first direction P1, the defective grain coordinate moves under the ejector pin 341, the ejector pin 341 descends, in turn, ejects the adhesive tape 100, further, allows the adhesive tape 100 to be bonded to the surface of the defective grain and remains for a period of time, ensuring that the adhesive tape 100 is completely bonded to the defective grain. Then, the vertical drive 36 drives the ejector pin 341 to rise, the adhesive tape 100 retracts after losing the ejecting force and peels off the defective grain, the feeding motor 322 and the receiving motor 332 rotate at the same time, moving the new adhesive tape 100 under the ejector pin 341, the defective grain is taken away at the same time and wound into the adhesive tape 100 receiving ring. In turn, the action is repeated to remove the position of all defective grains on the carrier platform 20.

[0030] Referring to Figs. 1-2 In some embodiments, the limiting assembly 35 includes a first stop block 351 and a second stop block 352, the first stop block 351 and the second stop block 352 are spaced apart along the second direction P2, the first stop block 351 and the second stop block 352 are fixed on the base 31, the first stop block 351 and the second stop block 352 can resist the adhesive tape 100 across the first adhesive tape roller assembly 32 and the second adhesive tape roller assembly 33, the ejector pin 341 can move along the first direction P1 to pass between the first stop block 351 and the second stop block 352, when the ejector pin 341 passes between the first stop block 351 and the second stop block 352 and resists the adhesive tape 100 across the first adhesive tape roller assembly 32 and the second adhesive tape roller assembly 33, the adhesive tape 100 is in a relatively tight state, and the adhesive tape 100 can adhere to the wafer on the carrier platform 20. In some embodiments, the first adhesive tape roller assembly 32 includes a feeding shaft 321 and a feeding motor 322, the feeding motor 322 is used to provide driving force for the feeding shaft 321 to rotate, the feeding motor 322 is connected between the feeding shaft 321 and the base 31. In some embodiments, the receiving motor 332 is used to provide driving force for the receiving shaft 331 to rotate, the receiving motor 332 is connected between the receiving shaft 331 and the base 31, the feeding shaft 321 and the receiving shaft 331 are spaced apart along the second direction P2 to ensure that the feeding shaft 321 and the receiving shaft 331 do not interfere with each other when conveying the adhesive tape 100, so as to ensure the normal operation of the grain rejection mechanism 30.

[0031] Referring to Figs. 1-2In some embodiments, the first adhesive tape rotating wheel assembly 32 further comprises a feeding guide wheel 323, which has a guiding effect on the adhesive tape 100, and can avoid the position deviation or knotting of the adhesive tape 100 during the conveying process. The feeding guide wheel 323 is rotationally connected to the base 31 and is closer to the bearing platform 20 than the feeding rotating shaft 321, i.e., when the adhesive tape 100 is fed, it passes through the feeding rotating shaft 321, the feeding guide wheel 323 and the limiting assembly 35 in sequence. The feeding guide wheel 323 can ensure that the position of the adhesive tape 100 in the stroke between the feeding rotating shaft 321 and the stop position is in a stable state and will not deviate or fold. In some embodiments, the second adhesive tape rotating wheel assembly 33 further comprises a collecting guide wheel 333, which has a guiding effect on the adhesive tape 100, and can avoid the position deviation or knotting of the adhesive tape 100 during the conveying process. The collecting guide wheel 333 is rotationally connected to the base 31 and is closer to the bearing platform 20 than the collecting rotating shaft 331, i.e., when the adhesive tape 100 is collected, it passes through the limiting assembly 35, the collecting guide wheel 333 and the collecting rotating shaft 331 in sequence. The collecting guide wheel 333 can ensure that the position of the adhesive tape 100 in the stroke between the collecting rotating shaft 331 and the stop position is in a stable state and will not deviate or fold. In some embodiments, the feeding guide wheel 323 and the collecting guide wheel 333 are arranged at intervals along the second direction P2, so that the feeding guide wheel 323 and the collecting guide wheel 333 do not affect each other. The distance between the feeding guide wheel 323 and the collecting guide wheel 333 is less than the distance between the feeding rotating shaft 321 and the collecting rotating shaft 331. The needle assembly 34 can move along the first direction P1 to pass between the feeding guide wheel 323 and the collecting guide wheel 333. During the entire process, the adhesive tape 100 passes through the feeding rotating shaft 321, the feeding guide wheel 323, the limiting assembly 35, the collecting guide wheel 333 and the collecting rotating shaft 331 in sequence.

[0032] Referring to Figs. 1-2In some embodiments, the defective die removing device 10 comprises a base 40, the carrying platform 20 is arranged on the base 40, the vertical driving member 36 is connected to the base 31 and the base 40, and the vertical driving member 36 is used to drive the base 31 to move close to or away from the carrying platform 20, so as to drive the ejector pin assembly 34 to move close to or away from the carrying platform 20. In some embodiments, the carrying platform 20 and the die removing mechanism 30 are arranged on the base 40, and the base 40 can be directly placed on a workbench or a desktop to support the defective die removing device 10 to be operated in a stable operation environment. In some embodiments, the defective die removing device 10 comprises a translation device 50, the translation device 50 is capable of driving the carrying platform 20 to move in a plane perpendicular to the first direction P1, so as to move the carrying platform 20 to a designated position, and the translation device 50 is arranged between the base 40 and the carrying platform 20. Specifically, the translation device 50 comprises an X-axis driving assembly 51 and a Y-axis driving assembly 52, the translation device 50 is capable of moving the carrying platform 20 in the X-axis direction and the Y-axis direction, the X-axis driving assembly 51 is arranged on the Y-axis driving assembly 52, the Y-axis driving assembly 52 is arranged on the base 40, and the carrying platform 20 is arranged on the X-axis driving assembly 51. In some embodiments, the X-axis is perpendicular to the first direction P1, the Y-axis is perpendicular to the first direction P1, and the X-axis is perpendicular to the Y-axis, and the Y-axis is parallel to the second direction P2.

[0033] Referring to Figs. 1-2 In some embodiments, the defective die removing device 10 comprises a rotation device 60, the rotation device 60 is connected between the translation device 50 and the carrying platform 20, and the rotation device 60 is capable of driving the carrying platform 20 to rotate in a plane perpendicular to the first direction P1, so as to adjust the position of the carrying platform 20. The defective die removing device 10 further comprises an observation device 70, a scanning device 80, and a moving switching assembly 90, the observation device 70 and the scanning device 80 are used to scan the chip, the moving switching assembly 90 is arranged on the base 40 and above the carrying platform 20, and the moving switching assembly 90 is capable of driving the observation camera 71 and the scanning camera 81 to move, so as to selectively be above the carrying platform 20 according to the requirement. The observation device 70 comprises the observation camera 71 and an observation lifting assembly 72, the observation camera 71 is arranged on the observation lifting assembly 72, the observation lifting assembly 72 is arranged on the moving switching assembly 90, and the observation camera 71 is capable of feeding back the fact picture of the removed die on a display, so as to facilitate the operator to adjust the position of the die and the ejector pin 341. The scanning device 80 comprises the scanning camera 81 and a scanning lifting assembly 82, the scanning camera 81 is arranged on the scanning lifting assembly 82, the scanning lifting assembly 82 is arranged on the moving switching assembly 90, and the scanning camera 81 is used to scan the wafer on the carrying platform 20, process the coordinate data after the scanning is completed, and compare with the previous process to determine the coordinate position of the defective die.

[0034] Referring to Figs. 1-2In the bad die reject device 10, the observation device 70 and the scanning device 80 are used to scan the chip, to merge the pre-process data, to locate the bad chip position, and to confirm the rejection result. The observation camera 71 feeds back the fact picture of the rejected die on the display, which is convenient for the operator to adjust the position of the die and the pin 341. The first adhesive tape rotating wheel assembly 32 and the second adhesive tape rotating wheel assembly 33 in the die reject mechanism 30 are used to release and collect the adhesive tape 100, the release guide wheel 323 and the collection guide wheel 333 are used to guide the adhesive tape 100 and to stabilize the direction of the adhesive tape 100, which ensures that the position of the adhesive tape is stable and will not deviate or fold. When using the bad die reject device 10, the first step is to place the chip on the bearing platform 20 through the chip placing mechanism or manually; the second step is to move the bearing platform 20 to the position of the scanning camera 81, the scanning camera 81 starts to scan and locate, and the rotating device 60 is used to adjust the chip to ensure that the XY direction of the chip is consistent with the translation device 50, further, the coordinate data is processed after the scanning is completed and compared with the pre-process to determine the coordinate position of the bad die. The third step is to reject the bad die for the first time. The die reject mechanism 30 is lowered to a certain height along the first direction P1, the coordinate of the bad die is moved to the position below the pin 341. The vertical driving part 36 drives the pin 341 to descend, the pin 341 pushes out the adhesive tape 100, the adhesive tape 100 is adhered to the surface of the bad die and remains for a period of time, which ensures that the adhesive tape 100 is completely adhered to the bad die, further, the vertical driving part 36 drives the pin 341 to ascend, the adhesive tape 100 retracts after losing the pushing force and peels off the bad die from the blue film, which completes the rejection of the bad die from the blue film. The pin 341 is rotated to a certain height to ensure that the pin 341 is separated from the adhesive tape 100, the release motor 332 and the feeding motor 322 are rotated at the same time to move the new adhesive tape 100 below the pin 341, the bad die is taken away at the same time and wound into the collection ring of the adhesive tape 100. This action is repeated to reject all the positions of the bad die on the blue film. The fourth step is to check the bad die and to reject it for the second time. After the first rejection, the scanning camera 81 scans all the positions of the bad die rejected for the first time to confirm whether the bad die is rejected. If the rejection is not completed, the device will automatically capture the position of a single die and adjust the rejection point to perform the second rejection on the position not completed. The fifth step is to confirm the second rejection and to perform the manual mode rejection. If there are still un-rejected dies after the second rejection, the device will enter the manual mode and the alarm light will flash. In the manual mode, the operator uses the observation camera 71 to automatically capture the position of the die and repeatedly rejects until all the bad dies are rejected.After the rejection is completed, the camera scans to confirm that the rejection is completed, and then the entire operation process of the defective wafer rejection device 10 is realized. Compared with the prior art of manually rejecting defective wafers, the defective wafer rejection device 10 provided by the present application has high automation, avoids damage to the surrounding dies in the manual rejection process, can automatically reject defective dies according to the detection results of the previous process, can effectively improve the rejection yield, and solves the limitation of manual rejection of only appearance defects.

[0035] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered as the scope of the present application.

[0036] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that, for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A bad die rejection apparatus, characterized by, The device includes a bearing platform for placing a wafer, and a wafer removing mechanism, the bearing platform is arranged in a first direction of the wafer removing mechanism, the wafer removing mechanism includes a base, a first adhesive tape roller assembly, a second adhesive tape roller assembly and a needle assembly, the first adhesive tape roller assembly and the second adhesive tape roller assembly are arranged on the base and spaced apart in a second direction, the needle assembly is movably arranged on the base and between the first adhesive tape roller assembly and the second adhesive tape roller assembly, the needle assembly can move in the first direction to approach the bearing platform, the first adhesive tape roller assembly and the second adhesive tape roller assembly are used to convey adhesive tape, the needle assembly moves in the first direction to press the adhesive tape on the wafer on the bearing platform, and the first direction is perpendicular to the second direction.

2. The defective-die removal apparatus according to claim 1, wherein The needle assembly includes a driving member and a needle, the driving member is connected between the base and the needle, the driving member can drive the needle to move in the first direction from a stop position to the bearing platform, the wafer removing mechanism further includes a limiting assembly, the limiting assembly is fixed on the base and between the stop position and the bearing platform, the position of the limiting assembly is spaced apart from the stop position in the first direction, and the limiting assembly is used to abut against the adhesive tape across the first adhesive tape roller assembly and the second adhesive tape roller assembly.

3. The bad die elimination apparatus according to claim 2, wherein The limiting assembly includes a first stop block and a second stop block spaced apart in the second direction and fixed on the base, the first stop block and the second stop block are used to abut against the adhesive tape across the first adhesive tape roller assembly and the second adhesive tape roller assembly, and the needle can move in the first direction to pass between the first stop block and the second stop block.

4. The bad die elimination apparatus according to claim 1, wherein The first adhesive tape roller assembly includes a feeding shaft and a feeding motor, the feeding motor is connected between the feeding shaft and the base, and the feeding motor is used to drive the feeding shaft to rotate, the second adhesive tape roller assembly includes a collecting shaft and a collecting motor, the collecting motor is connected between the collecting shaft and the base, and the collecting motor is used to drive the collecting shaft to rotate, and the feeding shaft and the collecting shaft are spaced apart in the second direction.

5. The bad die elimination apparatus according to claim 4, wherein The first adhesive tape roller assembly further includes a feeding guide wheel, the feeding guide wheel is rotationally connected to the base and closer to the bearing platform than the feeding shaft; The second adhesive tape roller assembly further includes a collecting guide wheel, the collecting guide wheel is rotationally connected to the base and closer to the bearing platform than the collecting shaft; The feeding guide wheel and the collecting guide wheel are spaced apart in the second direction, the distance between the feeding guide wheel and the collecting guide wheel is less than the distance between the feeding shaft and the collecting shaft, and the needle assembly can move in the first direction to pass between the feeding guide wheel and the collecting guide wheel.

6. The bad die elimination apparatus according to claim 1, wherein The wafer removing mechanism includes a vertical driving member connected to the base and the bottom, and the vertical driving member is used to drive the base to move close to or away from the carrying platform along the first direction.

7. The bad die elimination apparatus according to claim 6, wherein The translation device is arranged between the bottom and the carrying platform, and is used to drive the carrying platform to move in a plane perpendicular to the first direction.

8. The bad die elimination apparatus according to claim 7, wherein The translation device includes an X-axis driving assembly and a Y-axis driving assembly, the X-axis driving assembly is arranged on the Y-axis driving assembly, the Y-axis driving assembly is arranged on the bottom, and the carrying platform is arranged on the X-axis driving assembly.

9. The bad die elimination apparatus according to claim 7, wherein The rotation device is connected between the translation device and the carrying platform, and is used to drive the carrying platform to rotate in a plane perpendicular to the first direction.

10. The bad die elimination apparatus according to claim 1, wherein The bottom, the carrying platform and the wafer removing mechanism are arranged on the bottom. The bad wafer removing device further includes an observation device, a scanning device and a moving switching assembly, the moving switching assembly is arranged on the bottom and above the carrying platform, the observation device includes an observation camera and an observation lifting assembly, the observation camera is arranged on the observation lifting assembly, and the observation lifting assembly is arranged on the moving switching assembly; the scanning device includes a scanning camera and a scanning lifting assembly, the scanning camera is arranged on the scanning lifting assembly, and the scanning lifting assembly is arranged on the moving switching assembly, and the moving switching assembly is used to drive the observation camera and the scanning camera to move to selectively be above the carrying platform.

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