Semiconductor monocrystalline silicon grinding center

By designing a semiconductor single-crystal silicon grinding machining center that automatically controls the flow and spraying of coolant, the problems of manually adjusting the amount of polishing slurry sprayed and using additional water pumps have been solved, achieving efficient and automated management of coolant.

CN223685020UActive Publication Date: 2025-12-19KUNSHAN RIRIXIAN PRECISE MASCH CO LTD
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Patent Information

Application Number
CN202422779239.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-14
Publication Date
2025-12-19
Estimated Expiration
2034-11-14

AI Technical Summary

Technical Problem

Existing technology requires manual adjustment of the polishing liquid spray volume and an additional water pump for power, making it inconvenient to use.

Method used

A semiconductor single-crystal silicon grinding machining center was designed, which adopts an eccentrically set pump water tank and rotary vane pump structure, combined with valve assembly to realize automatic control and spraying of coolant. The automatic flow regulation and spraying of coolant is realized by the rotation of the grinding head.

Benefits of technology

It achieves automatic flow control and spraying of coolant, reduces coolant waste, improves cooling effect, simplifies operation process, and avoids the use of additional water pumps.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor monocrystalline silicon grinding center, which relates to the technical field of monocrystalline silicon processing equipment and comprises a cabinet, a cabinet door is hinged to one side of the cabinet, a transverse driving part is fixedly mounted at the top of the cabinet, a vertical arm is slidably mounted on the transverse driving part, and a vertical driving part is fixedly mounted on the vertical arm. A cross arm is slidably mounted on one side of the vertical driving part, and a first motor is fixedly mounted on one side of the cross arm. Compared with the prior art, through the eccentrically-arranged water pumping bin, a pump body is formed among the annular mounting base, the valve plate and the water pumping bin, the spraying amount of cooling liquid does not need to be manually adjusted, a water pump does not need to be additionally arranged, and use is more convenient; the feeding amount is associated with the opening degree of the valve body, the flow of the cooling liquid is automatically controlled, meanwhile, the problem that the cooling liquid is sprayed out before grinding is conducted can be avoided, and waste of the cooling liquid is reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to single crystal silicon processing equipment technical field especially relates to a kind of semiconductor single crystal silicon grinding machining center. BACKGROUND

[0002] Single crystal silicon is a kind of highly pure silicon material, mainly used in semiconductor and solar cell and other fields. Compared with polycrystalline silicon, the crystal structure of single crystal silicon is continuous single crystal, which makes it show higher efficiency and performance in electronic and photoelectric applications, and single crystal silicon needs to be ground and polished during processing.

[0003] The Chinese patent with publication number CN216967321U discloses a processing equipment for single crystal silicon surface grinding, which includes a processing rack, a workboard, a grinding fixing cover and a spraying cooling unit. The workboard is horizontally fixed in the processing rack. This technology realizes the circular motion of the universal spray head by manually holding the protruding block around the sliding groove in the slide plate to spray the polishing liquid. However, this technology needs manual adjustment of the spraying amount of the polishing liquid and an additional water pump to provide power for the spraying of the polishing liquid, which is inconvenient to use. UTILITY MODEL CONTENT

[0004] The utility model aims to provide a kind of semiconductor single crystal silicon grinding machining center to solve the problem of the prior art that needs manual adjustment of the spraying amount of the polishing liquid and an additional water pump to provide power for the spraying of the polishing liquid, which is inconvenient to use.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of semiconductor single crystal silicon grinding machining center, comprising: cabinet, the side of the cabinet is hingedly installed with cabinet door, the top of the cabinet is fixedly installed with horizontal drive, the vertical arm is slidably installed on the horizontal drive, the vertical arm is fixedly installed with vertical drive, the side of the vertical drive is slidably installed with horizontal arm, the side of the horizontal arm is fixedly installed with first motor;

[0006] Lower grinding assembly, which is fixedly installed on the top of the cabinet, is used for fixing single crystal silicon wafer, and is used for recycling cooling liquid.

[0007] Upper grinding assembly, which is fixedly installed on the bottom of the first motor, is drivingly connected with the first motor, is used for grinding and processing single crystal silicon wafer, and is used for spraying cooling liquid.

[0008] Circulation assembly, which is fixedly installed in the interior of the cabinet, is used for recycling and reusing cooling liquid.

[0009] A valve assembly is fixedly installed on one side wall of the vertical arm, and is used to control the flow of the cooling liquid.

[0010] Preferably, the lower grinding assembly comprises a grinding groove fixedly arranged at the top of the cabinet, the bottom of the grinding groove is fixedly installed with a second motor, the output end of the second motor is fixedly installed with a fixed disc, and the top of the grinding groove is fixedly arranged with a water baffle ring in a ring shape.

[0011] Preferably, the upper grinding assembly comprises a fixed cover fixedly installed at the fixed end of the first motor, the bottom of the fixed cover is rotatably installed with a grinding head, the inside of the grinding head is arranged with a relieved counterbore matched with the fixed cover, the bottom of the relieved counterbore is eccentrically arranged with a water pump chamber, the bottom of the water pump chamber is arranged with a plurality of water outlets, the inside of the water outlet is fixedly arranged with a small one-way valve, the center of the grinding head is fixedly connected with the output end of the first motor, the bottom of the grinding head is fixedly installed with a grinding disc, the grinding disc is arranged with a through hole matched with the water outlet, the top of the fixed cover is fixedly installed with a water injection cover, and the inside of the water injection cover is hollow and the top is arranged with a connector.

[0012] Preferably, the top of the fixed cover is arranged with a plurality of water injection openings, the bottom of the fixed cover is fixedly arranged with a ring-shaped mounting seat, the ring-shaped mounting seat is arranged with a plurality of grooves in an array, the inside of the groove is slidably installed with a valve piece, and the spring is fixedly arranged between the valve piece and the ring-shaped mounting seat.

[0013] Preferably, the water outlets are arranged in a ring shape on the bottom surface of the water pump chamber, and the water injection openings are located on one side of the central axis of the grinding head.

[0014] Preferably, the circulating assembly comprises a support fixedly installed on one side of the inside of the cabinet, the top of the support is fixedly installed with a water tank, the top of the water tank is communicated with the bottom of the grinding groove through a pipeline, the top of the cabinet is fixedly installed with a hose, the bottom of one side of the water tank is communicated with the hose through a pipeline, and the other end of the hose is communicated with the top of the water injection cover.

[0015] Preferably, the valve assembly comprises a valve body fixedly installed on one side wall of the vertical arm, the hose is sleevedly installed at both ends of the valve body, a rotating seat is fixedly installed on one side wall of the vertical arm, a gear is rotatably installed on one side of the rotating seat, a worm is rotatably installed on the other side of the rotating seat, the gear and the worm are fixedly connected through a rotating shaft, a worm wheel is fixedly installed at the switch of the valve body, the worm wheel is engaged with the worm, a trigger lever is fixedly installed on one side of the horizontal arm, a section of rack is arranged on the upper part of the trigger lever, and the trigger lever is matched with the gear.

[0016] The utility model discloses a technical effect and advantage:

[0017] 1, the utility model discloses a reasonable structure, through eccentric setting's pump water storehouse, make annular mounting seat, valve piece and pump water storehouse between formed pump body, and the faster grinding head rotates, the faster spraying speed, the cooling effect is better, compared with prior art, need not manual adjustment to the spraying amount of coolant, since the jet of coolant is located the bottom of abrasive disc, has cooled while grinding, and the cooling effect is better, and since the upper grinding assembly is formed the rotary vane pump structure, need not extra install water pump, and use more conveniently,

[0018] 2, in the utility model, the trigger rod on the cross arm is set to control the switch of valve body, only when the cross arm drops to certain working height, the trigger rod will drive gear to rotate, control valve body and open, along with the continuous feeding of cross arm, the valve body opens bigger and bigger, through the linkage with cross arm, the feeding amount is associated with the opening degree of valve body, thereby control the flow of coolant, compared with prior art, not only realizes the automatic control of the flow of coolant, can avoid the problem that the coolant is sprayed when not grinding, reduces the waste of coolant, and is more energy saving and environmental protection. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the front perspective structure schematic diagram of the utility model;

[0020] Figure 2 It is the inside perspective structure schematic diagram of the utility model;

[0021] Figure 3 It is the explosion schematic diagram of the upper grinding assembly of the utility model;

[0022] Figure 4 It is the utility model Figure 1 It is the enlarged view of A in the utility model;

[0023] Figure 5 It is the enlarged view of B in the utility model; Figure 1

[0024] Figure 6 It is the fixed cover perspective structure schematic diagram of the utility model;

[0025] Figure 7 It is the pump water storehouse perspective structure schematic diagram of the utility model;

[0026] Figure 8 It is the water injection cover perspective structure schematic diagram of the utility model;

[0027] Figure 9 It is the abrasive disc perspective structure schematic diagram of the utility model.

[0028] ​In the figure: 1, cabinet; 2, cabinet door; 3, horizontal drive; 4, vertical arm; 5, vertical drive; 6, horizontal arm; 7, first motor; 8, grinding groove; 9, second motor; 10, water retaining ring; 11, fixed disc; 12, support; 13, water tank; 14, hose; 15, valve body; 16, rotating seat; 17, trigger lever; 18, gear; 19, worm; 20, worm wheel; 21, fixed cover; 22, grinding head; 23, grinding disc; 24, water injection cover; 25, annular mounting seat; 26, valve piece; 27, water injection port; 28, let-out counterbore; 29, water pumping chamber; 30, water outlet. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0030] For example, Figures 1 to 9The illustrated semiconductor single crystal silicon grinding center includes: a cabinet 1, a cabinet door 2 is hingedly installed on one side of the cabinet 1, a transverse driving member 3 is fixedly installed on the top of the cabinet 1, a vertical arm 4 is slidingly installed on the transverse driving member 3, a vertical driving member 5 is fixedly installed on the vertical arm 4, the transverse driving member 3 and the vertical driving member 5 are prior art, a horizontal arm 6 is slidingly installed on one side of the vertical driving member 5, and a first motor 7 is fixedly installed on one side of the horizontal arm 6; a lower grinding assembly is fixedly installed on the top of the cabinet 1, the lower grinding assembly is used for fixing a single crystal silicon wafer, and the lower grinding assembly is used for recycling a cooling liquid; an upper grinding assembly is fixedly installed on the bottom of the first motor 7, the upper grinding assembly is drivingly connected with the first motor 7, the upper grinding assembly is used for grinding the single crystal silicon wafer, and the upper grinding assembly is used for spraying the cooling liquid; a circulation assembly is fixedly installed in the cabinet 1, the circulation assembly is used for recycling the cooling liquid; a valve assembly is fixedly installed on a side wall of the vertical arm 4, and the valve assembly is used for controlling the flow of the cooling liquid; in use, the single crystal silicon wafer is fixed on the lower grinding assembly, the first motor 7 is controlled to descend by the transverse driving member 3 and the vertical driving member 5, after descending to a certain height, the valve assembly is triggered to open, the valve assembly can control the flow following the descending height, after the first motor 7 is started, the upper grinding assembly grinds the single crystal silicon wafer, at the same time, a pump body is formed in the upper grinding assembly to pump out the cooling liquid in the circulation assembly, the faster the grinding speed of the upper grinding assembly is, the faster the spraying speed of the cooling liquid is, at the same time, the greater the downward feeding depth is, the greater the opening of the valve assembly is driven, and the greater the flow of the cooling liquid is, so that the automatic control of the flow of the cooling liquid is realized, the cooling effect during grinding is ensured, at the same time, the upper grinding assembly is provided, so that the upper grinding assembly plays a role of a water pump during grinding, and provides power for the spraying of the cooling liquid, compared with the prior art, not only the spraying amount of the polishing liquid needs not to be adjusted manually, but also an additional water pump is not needed to provide power for the spraying of the polishing liquid, and the use is more convenient.

[0031] As Figure 1 , Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8 And Figure 9As shown, the upper grinding assembly includes a fixed cover 21 fixedly installed at the fixed end of the first motor 7, the top of the fixed cover 21 is provided with a plurality of water injection ports 27, the bottom of the fixed cover 21 is fixedly provided with an annular mounting seat 25, the annular mounting seat 25 is annular and arrayed with a plurality of sink grooves, the valve plate 26 is slidingly installed inside the sink groove, the spring is fixedly arranged between the valve plate 26 and the annular mounting seat 25, the grinding head 22 is rotatably installed at the bottom of the fixed cover 21, the inside of the grinding head 22 is provided with a clearance counterbore 28 matched with the fixed cover 21, the bottom of the clearance counterbore 28 is eccentrically provided with a pump water chamber 29, the bottom of the pump water chamber 29 is provided with a plurality of water outlets 30, the inside of the water outlet 30 is fixedly provided with a small one-way valve, the center of the grinding head 22 is fixedly connected with the output end of the first motor 7, the grinding disc 23 is fixedly installed at the bottom of the grinding head 22, the grinding disc 23 is provided with a through hole matched with the water outlet 30, the water outlet 30 is annularly and arrayed on the bottom surface of the pump water chamber 29, the water injection port 27 is located on one side of the central axis of the grinding head 22, the water injection cover 24 is fixedly installed at the top of the fixed cover 21, the inside of the water injection cover 24 is hollow and the top is provided with a connector; when the first motor 7 rotates, the grinding head 22 is driven to rotate, the pump water chamber 29 eccentrically arranged inside the grinding head 22 also rotates and extrudes the valve plate 26 slidingly installed on the annular mounting seat 25, so that the space between the annular mounting seat 25, the valve plate 26 and the pump water chamber 29 changes from small to large and then from large to small, the dividing line of the change is the central axis of the grinding head 22, when the space between the annular mounting seat 25, the valve plate 26 and the pump water chamber 29 changes from small to large, since the one-way valve is arranged at the water outlet 30, at this time the pressure cannot be balanced through the water outlet 30, only negative pressure can be generated at the water injection port 27 to suck the cooling liquid, when the space between the annular mounting seat 25, the valve plate 26 and the pump water chamber 29 changes from large to small, positive pressure is generated at the water outlet 30 to spray the cooling liquid, and the speed of the suction and the spraying is related to the rotating speed of the grinding head 22, the faster the grinding head 22 rotates, the faster the spraying speed is, and the better the cooling effect is, compared with the prior art, it is not necessary to manually adjust the spraying amount of the cooling liquid, since the spraying port of the cooling liquid is located at the bottom of the grinding disc 23, the cooling is carried out at the same time of the grinding, the cooling effect is better, and since the upper grinding assembly forms a rotary vane pump structure, it is not necessary to additionally install a water pump, and the use is more convenient.

[0032] As Figure 1 and Figure 4As shown, the valve assembly includes a valve body 15 fixedly mounted on a side wall of the vertical arm 4, the hose 14 is sleeved and mounted on both ends of the valve body 15, a rotating seat 16 is fixedly mounted on a side wall of the vertical arm 4, a gear 18 is rotatably mounted on one side of the rotating seat 16, a worm 19 is rotatably mounted on the other side of the rotating seat 16, the gear 18 and the worm 19 are fixedly and connectingly arranged through a rotating shaft, a worm wheel 20 is fixedly mounted at the switch of the valve body 15, the worm wheel 20 is meshingly arranged with the worm 19, a trigger lever 17 is fixedly mounted on one side of the horizontal arm 6, the trigger lever 17 is provided with a section of rack at the upper portion, and the trigger lever 17 is matchingly arranged with the gear 18; the trigger lever 17 arranged on the horizontal arm 6 is used to control the switch of the valve body 15, only when the horizontal arm 6 is lowered to a certain working height, the trigger lever 17 drives the gear 18 to rotate, and drives the worm 19 to drive the worm wheel 20 to rotate, thereby controlling the valve body 15 to open, with the continuous feeding of the horizontal arm 6, the opening of the valve body 15 is larger and larger, since in the grinding process, the larger the feeding amount, the more serious the heat, through the linkage with the horizontal arm 6, the feeding amount is associated with the opening degree of the valve body 15, thereby controlling the flow of the cooling liquid, compared with the prior art, not only the flow of the cooling liquid is automatically controlled, but also the problem that the cooling liquid is sprayed when grinding is not performed is avoided, the waste of the cooling liquid is reduced, and it is more energy-saving and environment-friendly.

[0033] As shown in Figure 1 , Figure 2 , the lower grinding assembly includes a grinding groove 8 fixedly arranged at the top of the cabinet 1, a second motor 9 fixedly mounted at the bottom of the grinding groove 8, a fixed disc 11 fixedly mounted at the output end of the second motor 9, and a water blocking ring 10 fixedly arranged at the top of the grinding groove 8, the water blocking ring 10 is annular; the water blocking ring 10 arranged can reduce the waste caused by the splashing of the cooling liquid, facilitate the recycling of the cooling liquid, and be more energy-saving and environment-friendly.

[0034] As shown in Figure 1 , Figure 2 and Figure 4 , the circulating assembly includes a support 12 fixedly mounted on one side inside the cabinet 1, a water tank 13 fixedly mounted at the top of the support 12, the top of the water tank 13 is communicatively arranged with the bottom of the grinding groove 8 through a pipeline, a hose 14 fixedly mounted at the top of the cabinet 1, the bottom of one side of the water tank 13 is communicatively arranged with the hose 14 through a pipeline, and the other end of the hose 14 is communicatively arranged with the top of a water injection cover 24; the cooling liquid collected by the lower grinding assembly flows into the inside of the water tank 13 through the pipeline, under the suction of the upper grinding assembly, enters the water injection cover 24 through the hose 14, and is sprayed onto the single crystal silicon wafer being ground through the grinding head 22, facilitating the recycling of the cooling liquid, and being more energy-saving and environment-friendly.

[0035] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, the made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A center for grinding a semiconductor single crystal silicon, characterized by comprising: Include: Cabinet (1), one side of the cabinet (1) is hinged to the door (2), the top of the cabinet (1) is fixedly installed with a horizontal drive (3), the vertical drive (5) is fixedly installed on the vertical arm (4) of the horizontal drive (3), the horizontal arm (6) is slidably installed on one side of the vertical drive (5), the first motor (7) is fixedly installed on one side of the horizontal arm (6); The lower grinding assembly is fixedly installed on the top of the cabinet (1), and the lower grinding assembly is used for fixing the single crystal silicon wafer. The lower grinding assembly is used for recycling the cooling liquid. The upper grinding assembly is fixedly installed at the bottom of the first motor (7), and the upper grinding assembly is drivingly connected with the first motor (7). The upper grinding assembly is used for grinding the single crystal silicon wafer, and the upper grinding assembly is used for throwing the cooling liquid. The circulation assembly is fixedly installed in the cabinet (1), and the circulation assembly is used for recycling the cooling liquid. The valve assembly is fixedly installed on one side wall of the vertical arm (4), and the valve assembly is used for controlling the flow of the cooling liquid.

2. A semiconductor single crystal silicon grinding center according to claim 1, wherein The lower grinding assembly includes a grinding groove (8) fixedly installed on the top of the cabinet (1), a second motor (9) fixedly installed at the bottom of the grinding groove (8), a fixed disc (11) fixedly installed at the output end of the second motor (9), a water retaining ring (10) fixedly installed at the top of the grinding groove (8), and the water retaining ring (10) is annular. The upper grinding assembly includes a fixed cover (21) fixedly installed on the fixed end of the first motor (7), a grinding head (22) rotatably installed at the bottom of the fixed cover (21), a clearance counterbore (28) arranged in the grinding head (22), the clearance counterbore (28) matched with the fixed cover (21), a pump water warehouse (29) eccentrically arranged at the bottom of the clearance counterbore (28), a plurality of water outlets (30) arranged at the bottom of the pump water warehouse (29), a small one-way valve fixedly arranged in the water outlet (30), the center of the grinding head (22) fixedly connected with the output end of the first motor (7), a grinding disc (23) fixedly installed at the bottom of the grinding head (22), a through hole arranged on the grinding disc (23) matched with the water outlet (30), a water injection cover (24) fixedly installed at the top of the fixed cover (21), and the water injection cover (24) is hollow and provided with a connector at the top.

3. A semiconductor single crystal silicon grinding center according to claim 2, wherein A plurality of water injection openings (27) are arranged at the top of the fixed cover (21), an annular mounting seat (25) is fixedly arranged at the bottom of the fixed cover (21), the annular mounting seat (25) is annular and arrayed with a plurality of grooves, a valve plate (26) is slidably installed in the groove, and a spring is fixedly arranged between the valve plate (26) and the annular mounting seat (25).

4. A semiconductor single crystal silicon grinding center according to claim 3, wherein The water outlets (30) are annularly arranged on the bottom surface of the pump water warehouse (29), and the water injection openings (27) are located on one side of the central axis of the grinding head (22).

5. A semiconductor single crystal silicon grinding center according to claim 2, wherein The circulating assembly comprises a support (12) fixedly installed on one side of the inside of the cabinet (1), a water tank (13) fixedly installed on the top of the support (12), the top of the water tank (13) is communicated with the bottom of the grinding groove (8) through a pipeline, a hose (14) fixedly installed on the top of the cabinet (1), the bottom of one side of the water tank (13) is communicated with the hose (14) through a pipeline, and the other end of the hose (14) is communicated with the top of the water injection cover (24).

6. A semiconductor single crystal silicon grinding center according to claim 5, wherein The valve assembly comprises a valve body (15) fixedly installed on one side wall of the vertical arm (4), the hose (14) is sleeved and installed on both ends of the valve body (15), a rotating seat (16) fixedly installed on one side wall of the vertical arm (4), a gear (18) rotatably installed on one side of the rotating seat (16), a worm (19) rotatably installed on the other side of the rotating seat (16), the gear (18) and the worm (19) are fixedly connected through a rotating shaft, a worm wheel (20) fixedly installed on the switch of the valve body (15), the worm wheel (20) is meshed with the worm (19), one side of the horizontal arm (6) is fixedly installed with a trigger rod (17), the trigger rod (17) is provided with a rack on the upper portion, and the trigger rod (17) is matched with the gear (18).

Citation Information

Patent Citations

  • Processing equipment for grinding surface of monocrystalline silicon

    CN216967321U