Solar cell electroplating device

Abstract

The utility model provides a solar cell electroplating device, which relates to the technical field of solar cells and comprises a first anode, a second anode, a first cathode roller and a second cathode roller. The first anode and the second anode are located on the upper side face and the lower side face of a to-be-plated workpiece correspondingly and are each of an arc-shaped structure, and the protruding faces of the first anode and the second anode face the to-be-plated workpiece. The first cathode roller and the second cathode roller are located on the upper side face and the lower side face of a to-be-plated workpiece correspondingly and abut against the to-be-plated workpiece, and the first cathode roller and the second cathode roller are both configured to be capable of rotating along the axes of the first cathode roller and the second cathode roller so as to convey the to-be-plated workpiece to the position between the first anode and the second anode. The technical problem of uneven thickness of the edge and the middle area of the silicon substrate of the solar cell caused by power line aggregation at the two ends of the anode plate in the prior art is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar cell technical field especially is related to a solar cell electroplating device. BACKGROUND

[0002] Solar energy is a kind of clean green renewable energy, under the background of traditional chemical energy such as coal, oil, natural gas increasingly exhausted, environmental pollution more and more intense, solar power is more and more received by people's attention.The traditional preparation crystalline silicon solar cell metal electrode method is screen printing silver paste plus high temperature sintering, this method exists and consumes large amount of conductive silver paste, and the surface metallization cost of solar cell is high.In recent years, using electroplating method to produce the metal electrode of solar cell becomes a kind of method being popularized, electroplating generally is with copper ion-containing electroplating solution completely replaces silver paste, thereby reduces the production cost of crystalline silicon solar cell.

[0003] At present, for double-sided electroplating solar cell, adopt traditional rectangular flat plate anode, there will be current density high area and current density low area on the surface of silicon substrate, current density high area will get thicker electroplating coating, and the coating thickness in current density low area will be thin or completely without coating, thereby leading to the poor uniformity of electroplating solar cell coating. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of solar cell electroplating device to alleviate the technical problems of uneven thickness of solar cell silicon substrate edge and middle area caused by anode plate two ends power line aggregation in prior art.

[0005] The solar cell electroplating device provided by the utility model comprises: first anode, second anode, first cathode roller and second cathode roller;

[0006] The first anode and the second anode are located on the upper and lower two sides of the workpiece to be plated respectively, the first anode and the second anode are both arranged as arc-shaped structure, and the convex surfaces of the first anode and the second anode both face the workpiece to be plated;

[0007] The first cathode roller and the second cathode roller are located on the upper and lower two sides of the workpiece to be plated respectively, and both abut against the workpiece to be plated, and the first cathode roller and the second cathode roller are both configured to rotate along their own axes to convey the workpiece to be plated between the first anode and the second anode.

[0008] Further, the solar cell electroplating device further comprises first power supply and second power supply;

[0009] The positive electrode of the first power supply is connected with the first anode, and the negative electrode of the first power supply is connected with the first cathode roller;

[0010] The second anode is connected to the positive pole of the second power supply, and the second cathode roller is connected to the negative pole of the second power supply.

[0011] Further, the first anode and the second anode are symmetrically distributed on the upper and lower sides of the workpiece to be plated, respectively.

[0012] Further, the first cathode roller and the second cathode roller are distributed on the upper and lower sides of the workpiece to be plated, respectively.

[0013] Further, the solar cell electroplating device further comprises a first water chasing roller and a second water chasing roller;

[0014] The first water chasing roller is arranged below the workpiece to be plated and abuts against the workpiece to be plated, and is symmetrically arranged with the first cathode roller;

[0015] The second water chasing roller is arranged above the workpiece to be plated and abuts against the workpiece to be plated, and is symmetrically arranged with the second cathode roller.

[0016] Further, the solar cell electroplating device further comprises an electroplating tank;

[0017] The electroplating tank is provided with an electroplating solution, and the first anode and the second anode are arranged in the electroplating tank and immersed in the electroplating solution;

[0018] The electroplating tank is provided with a liquid inlet for introducing the electroplating solution;

[0019] The side wall of the electroplating tank is provided with an overflow port for flowing out the electroplating solution.

[0020] Further, the solar cell electroplating device further comprises a third water chasing roller and a fourth water chasing roller;

[0021] The third water chasing roller and the fourth water chasing roller are arranged on the side of the electroplating tank, and the third water chasing roller and the fourth water chasing roller are arranged on the upper and lower sides of the workpiece to be plated, respectively.

[0022] Further, the solar cell electroplating device further comprises a liquid storage tank;

[0023] The liquid storage tank is used for storing the electroplating solution, and the liquid storage tank is in communication with the liquid inlet of the electroplating tank, and the electroplating solution in the liquid storage tank can enter the electroplating tank.

[0024] Further, the workpiece to be plated comprises at least one of TOPCon, HJT, IBC solar cell silicon substrate;

[0025] The material of the first cathode roller and the second cathode roller comprises at least one of stainless steel, copper, steel, copper alloy and aluminum alloy.

[0026] The material of the first anode and the second anode is a bidirectional metal composite material coated with a titanium coating outside the metal copper, and the thickness of the titanium coating is 1.0-1.5mm.

[0027] Further, the distance between the tangent plane of the convex surface of the first anode and the end surface of the first anode is 5-20mm;

[0028] The distance between the tangent plane of the convex surface of the second anode and the end surface of the second anode is 5-20mm.

[0029] The solar cell electroplating device provided by the utility model adopts the first cathode roller and the second cathode roller to convey the workpiece to be plated to the position between the first anode and the second anode, and the structure of the first anode and the second anode is an arc structure, the distance between the arc-shaped two ends of the anode and the edge of the workpiece to be plated is far, the power line distribution is less, the plating layer thickness of the edge of the workpiece to be plated is also reduced, the plating layer thickness of the middle region of the workpiece to be plated is basically kept consistent, the thickness distribution of the same surface of the workpiece to be plated is more uniform, and the photoelectric conversion efficiency of the solar cell is improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the drawings needed in the specific embodiments or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating labor.

[0031] Figure 1 The overall structure schematic diagram of the solar cell electroplating device provided by the utility model embodiment is shown in the figure.

[0032] Figure 2 The structure schematic diagram of the first anode and the second anode provided by the utility model embodiment is shown in the figure.

[0033] Figure: 10-first anode;20-second anode;30-first cathode roller;40-second cathode roller;50-first water roller;60-second water roller;70-third water roller;80-fourth water roller;90-electroplating tank;91-liquid inlet;92-overflow;100-liquid storage tank;200-workpiece to be plated. SPECIFIC EMBODIMENTS

[0034] The technical solutions of the present application will be described clearly and completely in connection with the drawings. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0035] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0036] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] The specific embodiments of the present application will be described in detail below in connection with the drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present application, and are not used to limit the present application.

[0038] As shown in Figure 1 and Figure 2 The present embodiment provides a solar cell electroplating device, which comprises: a first anode 10, a second anode 20, a first cathode roller 30 and a second cathode roller 40; the first anode 10 and the second anode 20 are respectively located on the upper and lower two side surfaces of the workpiece to be plated 200, the first anode 10 and the second anode 20 are both provided as arc-shaped structures, and the convex surfaces of the first anode 10 and the second anode 20 both face the workpiece to be plated 200; the first cathode roller 30 and the second cathode roller 40 are respectively located on the upper and lower two side surfaces of the workpiece to be plated 200, and both abut against the workpiece to be plated 200, and the first cathode roller 30 and the second cathode roller 40 are both configured to be able to rotate along their own axes to convey the workpiece to be plated 200 between the first anode 10 and the second anode 20.

[0039] The solar cell electroplating device provided by the embodiment is a horizontal double-sided electroplating device, which adopts a first cathode roller 30 and a second cathode roller 40 to convey a workpiece 200 to be plated to a position between a first anode 10 and a second anode 20, and the first anode 10 and the second anode 20 are both in an arc-shaped structure. The distance between the arc-shaped ends of the anode and the edges of the workpiece 200 to be plated is far, the power line distribution is less, the plating layer thickness of the edges of the workpiece 200 to be plated is reduced, and the plating layer thickness of the middle region of the workpiece 200 to be plated is basically kept consistent, so that the thickness distribution of the same surface of the workpiece 200 to be plated is more uniform, which is beneficial to improve the photoelectric conversion efficiency of the solar cell.

[0040] In an optional embodiment, the workpiece 200 to be plated is one or several of a TOPCon, a HJT, and an IBC solar cell silicon substrate.

[0041] Regarding the shape and structure of the first anode 10 and the second anode 20, in detail:

[0042] The first anode 10 is located above the horizontally placed workpiece 200 to be plated, and the second anode 20 is located below the workpiece 200 to be plated. Preferably, the first anode 10 and the second anode 20 are symmetrically distributed on the upper and lower sides of the workpiece 200 to be plated. The first anode 10 and the second anode 20 in the embodiment are both special-shaped anodes, which are both arc-shaped plate structures. As shown in FIG. 1, the first anode 10 is a kind of arc-shaped anode with a middle low and two sides high, and the two sides are symmetrically concave arc surfaces. The second anode 20 is a kind of arc-shaped anode with a middle high and two sides low, and the two sides are symmetrically convex arc surfaces. Figure 2

[0043] In an optional embodiment, the distance between the tangent plane of the convex surface of the first anode 10 and the end surface of the first anode 10 is 5-20 mm, that is, the height difference between the middle part and the two sides of the first anode 10 is 5-20 mm.

[0044] In an optional embodiment, the distance between the tangent plane of the convex surface of the second anode 20 and the end surface of the second anode 20 is 5-20 mm, that is, the height difference between the middle part and the two sides of the second anode 20 is 5-20 mm.

[0045] In an optional embodiment, the convex surfaces of the first anode 10 and the second anode 20 both have a spacing with the workpiece 200 to be plated, and the spacing is preferably 2-10 mm.

[0046] In an optional embodiment, the materials of the first anode 10 and the second anode 20 are both bidirectional metal composites coated with a certain thickness of titanium coating outside the metal copper.

[0047] In an optional embodiment, the thickness of the titanium coating is 1.0-1.5 mm. ​

[0048] Regarding the shape and structure of the first cathode roller 30 and the second cathode roller 40, in detail:

[0049] The first cathode roller 30 is located above the workpiece 200 to be plated and is in abutment with the workpiece 200 to be plated, and the second cathode roller 40 is located below the workpiece 200 to be plated and is in abutment with the workpiece 200 to be plated. Preferably, the first cathode roller 30 and the second cathode roller 40 are respectively distributed on the upper and lower sides of the workpiece 200 to be plated.

[0050] In an optional embodiment, the material of the first cathode roller 30 is one or more of stainless steel, copper, steel, copper alloy, and aluminum alloy.

[0051] In an optional embodiment, the material of the second cathode roller 40 is one or more of stainless steel, copper, steel, copper alloy, and aluminum alloy.

[0052] In an optional embodiment, the present embodiment further comprises a first water-removing roller 50 and a second water-removing roller 60; the first water-removing roller 50 is arranged below the workpiece 200 to be plated and is in abutment with the workpiece 200 to be plated, and is symmetrically arranged with the first cathode roller 30; the second water-removing roller 60 is arranged above the workpiece 200 to be plated and is in abutment with the workpiece 200 to be plated, and is symmetrically arranged with the second cathode roller 40.

[0053] Specifically, the first water-removing roller 50 and the second water-removing roller 60 are both sponge water-removing rollers, the first cathode roller 30 and the second cathode roller 40 are distributed in a staggered manner, the first cathode roller 30 is provided with a first sponge water-removing roller below, and the second cathode roller 40 is provided with a second sponge water-removing roller above, so as to prevent the cathode rollers from being distributed on the upper and lower sides at the same time and the workpiece to be plated from being broken when passing through.

[0054] In an optional embodiment, the present embodiment further comprises an electroplating tank 90; the electroplating tank 90 is provided with an electroplating solution, and the first anode 10 and the second anode 20 are both arranged in the electroplating tank 90 and are immersed in the electroplating solution; the electroplating tank 90 is provided with a liquid inlet 91 for introducing the electroplating solution, and the side wall of the electroplating tank 90 is provided with an overflow port 92 for flowing out the electroplating solution.

[0055] Specifically, the electroplating device provided by the present embodiment can be provided with a plurality of electroplating tanks 90, the bottom of the electroplating tank 90 is provided with a liquid inlet 91, the left and right inner walls are provided with two overflow ports 92, the inside of the electroplating tank 90 is provided with the first anode 10 and the second anode 20 arranged in a symmetrical manner, the first cathode roller 30 and the second cathode roller 40 are located outside the electroplating tank 90, the electroplating solution enters the electroplating tank 90 from the liquid inlet 91, the electroplating solution needs to immerse the first anode 10, and the electroplating solution can flow out from the overflow port 92, thereby realizing the circulation of the electroplating solution in the electroplating tank 90.

[0056] In some preferred embodiments, the electroplating solution is one of a copper sulfate system electroplating solution, a copper pyrophosphate system electroplating solution, a stannous sulfate system electroplating solution, and a stannic methanesulfonate system electroplating solution.

[0057] In optional embodiments, the present embodiment further comprises a third water-removing roller 70 and a fourth water-removing roller 80; the third water-removing roller 70 and the fourth water-removing roller 80 are both arranged on the side of the electroplating tank 90, and the third water-removing roller 70 and the fourth water-removing roller 80 are arranged on the upper and lower sides of the workpiece 200 to be plated, respectively.

[0058] Specifically, the third water-removing roller 70 and the fourth water-removing roller 80 are both sponge water-removing rollers, as shown in the figure, the electroplating tank 90 is provided with two sponge water-removing rollers on the left and right sides, and the first cathode roller 30 and the second cathode roller 40 are both arranged on the side of the sponge water-removing roller away from the electroplating tank 90. Since the first cathode roller 30 and the second cathode roller 40 both need to be kept dry, the arrangement of the sponge water-removing roller not only helps to transport the workpiece 200 to be plated, but also prevents the cathode roller from being wetted by the overflowed electroplating solution, thereby preventing short circuit. Figure 1

[0059] In optional embodiments, the present embodiment further comprises a first power supply and a second power supply; the first anode 10 is connected to the positive pole of the first power supply, and the first cathode roller 30 is connected to the negative pole of the first power supply; the second anode 20 is connected to the positive pole of the second power supply, and the second cathode roller 40 is connected to the negative pole of the second power supply.

[0060] Specifically, the first power supply is a rectifier, and the first cathode roller 30 and the first anode 10 located above the workpiece 200 to be plated share one rectifier; the second power supply is a rectifier, and the second cathode roller 40 and the second anode 20 located below the workpiece 200 to be plated share one rectifier, which solves the problem of uneven thickness distribution on the upper and lower surfaces caused by the uneven current density distribution on the upper and lower surfaces in the current method of connecting the anode located above the silicon substrate and the anode located below the silicon substrate to one cathode roller and connecting the cathode roller to one rectifier.

[0061] In the present embodiment, the first anode 10, the first cathode roller 30, and the upper surface of the silicon substrate of the solar cell form one working circuit by being connected to one rectifier, and the second anode 20, the second cathode roller 40, and the lower surface of the silicon substrate form another working circuit by being connected to another rectifier, so that the working current can be set separately during electroplating, and the thickness of the plating layer on the upper and lower surfaces is more uniform.

[0062] In optional embodiments, the present embodiment further comprises a liquid storage tank 100; the liquid storage tank 100 is used for storing the electroplating solution, and the liquid storage tank 100 is in communication with the liquid inlet 91 of the electroplating tank 90, so that the electroplating solution in the liquid storage tank 100 can enter the electroplating tank 90.​

[0063] Specifically, the electroplating tank 90 is in communication with the liquid storage tank 100, the electroplating liquid in the liquid storage tank 100 enters the electroplating tank 90 through a pump and immerses the first anode 10 and the second anode 20, and the electroplating liquid can flow out of the overflow port 92 of the electroplating tank 90 and return to the liquid storage tank 100.

[0064] In some preferred embodiments, the workpiece 200 to be plated is conveyed into the electroplating tank 90 by the first cathode roller 30, the second cathode roller 40 and the plurality of sponge water-removing rollers, and is immersed in the electroplating liquid, and the workpiece 200 to be plated can pass through one overflow port 92 of the electroplating tank 90 to enter the electroplating tank 90 and pass through another overflow port 92 of the electroplating tank 90 to exit the electroplating tank 90, and it should be noted that the workpiece 200 to be plated cannot be in contact with the wall of the overflow port 92.

[0065] In addition, in the present embodiment, the first cathode roller 30, the second cathode roller 40, the first water-removing roller 50, the second water-removing roller 60, the third water-removing roller 70 and the fourth water-removing roller 80 can rotate along their respective axes to achieve the effect of conveying the workpiece 200 to be plated, and each of the first cathode roller 30, the second cathode roller 40, the first water-removing roller 50, the second water-removing roller 60, the third water-removing roller 70 and the fourth water-removing roller 80 has a rotating shaft connected thereto, and the rotating shaft in the present embodiment can achieve the function of driving the roller to rotate, and thus the structure and working principle of the rotating shaft are not described in detail.

[0066] After electroplating is performed by using the electroplating device provided in the present embodiment, the height of the fine grid lines on two surfaces can be measured by using a 3D microscope according to the nine-square grid method, the uniformity of the height of the same surface and the front and back surfaces can be compared, and IV testing can be performed to test the electrical performance of the double-sided plated solar cell at a temperature of 25℃ and an AM of 1.5G, and the test results show that, compared with the electroplating device using a conventional rectangular flat plate anode, the thickness distribution of the same surface obtained by using the electroplating device provided in the present embodiment is more uniform, and the photoelectric conversion efficiency of the solar cell is higher, and compared with the current electroplating mode in which the upper anode and the lower anode share one cathode roller connected to one rectifier for conduction, the electroplating device provided in the present embodiment connects the anode above the silicon substrate and the cathode roller to one rectifier and connects the anode below the silicon substrate and the cathode roller to another rectifier, and the working current can be set individually during electroplating, so that the thickness of the plating layers on the upper and lower surfaces is more uniform.

[0067] Finally, it should be noted that: the above embodiments are used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A solar cell electroplating apparatus, characterized in that, The utility model relates to a kind of electroplating device, including: First anode (10), second anode (20), first cathode roller (30) and second cathode roller (40); The first anode (10) and the second anode (20) are located at the upper and lower two sides of the workpiece to be plated (200) respectively, the first anode (10) and the second anode (20) are arranged as arc structure, and the convex surface of the first anode (10) and the second anode (20) is all towards the workpiece to be plated (200); The first cathode roller (30) and the second cathode roller (40) are located at the upper and lower two sides of the workpiece to be plated (200) respectively, and are all in contact with the workpiece to be plated (200), and the first cathode roller (30) and the second cathode roller (40) are all configured to be able to rotate along the axis itself, to convey the workpiece to be plated (200) to the first anode (10) and the second anode (20) between.

2. The solar cell electroplating apparatus of claim 1, wherein, Also including first power supply and second power supply; The first anode (10) is connected with the positive pole of the first power supply, and the first cathode roller (30) is connected with the negative pole of the first power supply; The second anode (20) is connected with the positive pole of the second power supply, and the second cathode roller (40) is connected with the negative pole of the second power supply.

3. The solar cell electroplating apparatus of claim 1, wherein, The first anode (10) and the second anode (20) are symmetrically distributed on the upper and lower two sides of the workpiece to be plated (200) respectively.

4. The solar cell electroplating apparatus of claim 1, wherein, The first cathode roller (30) and the second cathode roller (40) are distributed in the upper and lower two sides of the workpiece to be plated (200) respectively.

5. The solar cell electroplating apparatus of claim 4, wherein, Also including first water-removing roller (50) and second water-removing roller (60); The first water-removing roller (50) is arranged below the workpiece to be plated (200), and is in contact with the workpiece to be plated (200), and is symmetrically arranged with the first cathode roller (30); The second water-removing roller (60) is arranged above the workpiece to be plated (200), and is in contact with the workpiece to be plated (200), and is symmetrically arranged with the second cathode roller (40).

6. The solar cell electroplating apparatus of claim 1, wherein, Also including electroplating tank (90); The electroplating tank (90) is provided with electroplating solution, and the first anode (10) and the second anode (20) are arranged in the electroplating tank (90) and are immersed in the electroplating solution; The electroplating tank (90) is provided with liquid inlet (91) for passing in electroplating solution; The side wall of the electroplating tank (90) is provided with overflow port (92) for flowing out electroplating solution.

7. The solar cell electroplating apparatus of claim 6, wherein, Also including third water-removing roller (70) and fourth water-removing roller (80); The third water-removing roller (70) and the fourth water-removing roller (80) are arranged on the side of the electroplating tank (90), and the third water-removing roller (70) and the fourth water-removing roller (80) are arranged on the upper and lower two sides of the workpiece to be plated (200) respectively.

8. The solar cell electroplating apparatus of claim 6, wherein, Also including liquid storage tank (100); The liquid storage tank (100) is used for storing electroplating solution, the liquid storage tank (100) is communicated with the liquid inlet (91) of the electroplating tank (90), and the electroplating solution in the liquid storage tank (100) can enter the electroplating tank (90).

9. The solar cell electroplating apparatus of claim 1, wherein, The workpiece (200) to be plated comprises at least one of a TOPCon, a HJT, and an IBC solar cell silicon substrate; The material of the first cathode roller (30) and the second cathode roller (40) comprises at least one of stainless steel, copper, steel, copper alloy, and aluminum alloy; The material of the first anode (10) and the second anode (20) is a bidirectional metal composite material coated with a titanium coating outside the metal copper, and the thickness of the titanium coating is 1.0-1.5 mm.

10. The solar cell electroplating apparatus of claim 1, wherein, The distance between the tangent plane of the convex surface of the first anode (10) and the end surface of the first anode (10) is 5-20 mm; The distance between the tangent plane of the convex surface of the second anode (20) and the end surface of the second anode (20) is 5-20 mm.

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