Power semiconductor module test fixture
By designing a probe support mechanism and topology-compatible pin receiving holes suitable for power semiconductor module test fixtures, the problems of inaccurate pin contact and damage were solved, improving test accuracy and efficiency, and enabling universal testing of various modules.
Patent Information
- Application Number
- CN202423237477.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Existing power module test fixtures cannot ensure precise contact between the pins and the test components, which can easily lead to pin damage. They are also incompatible with testing modules with different topologies, resulting in inaccurate test results and low efficiency.
A power semiconductor module test fixture was designed, comprising a base, a functional board, and electrical connection components. It employs a probe support mechanism and a module mounting bracket to ensure precise pin alignment and utilizes pin-receiving holes compatible with various topologies to make the same fixture suitable for multiple modules.
It achieves precise pin contact, improves the accuracy and efficiency of test results, avoids pin damage, simplifies the testing process, and is applicable to modules with various topologies without the need to change fixtures.
Smart Images
Figure CN223692414U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, especially relates to a power semiconductor module test fixture. BACKGROUND
[0002] In the rapid development of power electronics technology, the performance and reliability of power modules as the core components of energy conversion and control are directly related to the stable operation of the entire power electronic system. Power modules are usually integrated by multiple power semiconductor devices (such as IGBT, MOSFET, etc.), and high-frequency, high-voltage and large-current output capabilities are achieved through advanced packaging technology. However, with the continuous expansion of application fields, the performance requirements of power modules are increasingly improved, which promotes the in-depth research and development of their testing technology.
[0003] In the production and use of power modules, the testing link plays a crucial role. On the one hand, strict testing can ensure that power modules meet the established performance indicators before leaving the factory, including electrical parameters such as current, voltage, power, efficiency, and various requirements such as thermal performance and mechanical performance. On the other hand, regular testing and maintenance of power modules in use are important means to ensure their long-term stable operation and extend their service life.
[0004] The existing test fixture tool cannot guarantee the matching precision of the PIN pin and the corresponding test cloth component. Therefore, the power semiconductor module is usually placed upside down with the pin end facing up, and the PIN pin is inserted into the corresponding pin adapter hole through the relative movement of the fixture. However, this design still has the following problems: 1. The contact between the pin and the corresponding test component during testing is not accurate enough; 2. The PIN pin is easily damaged during testing.
[0005] Therefore, a power semiconductor module test fixture is needed that can ensure accurate contact between the pin and the corresponding test component during testing, improve the accuracy of test results and test efficiency. UTILITY MODEL CONTENTS
[0006] The utility model provides a kind of power semiconductor module test fixture, can ensure accurate contact between the pin and the corresponding test component during testing, improve the accuracy of test results and test efficiency.
[0007] To solve the above technical problems, the present application provides the following technical solutions:
[0008] A power semiconductor module test fixture includes a base, a function board, and an electrical connection assembly.
[0009] The functional board is provided with first pin accommodating holes which are not less than the number of pins of the power module to be measured, and the positions of some or all of the first pin accommodating holes are distributed in the same way as the distribution of the pins of the power module to be measured.
[0010] The top of the base is further provided with second pin accommodating holes corresponding to the first pin accommodating holes.
[0011] The electrical connection assembly is used to connect the pins of the power module to be measured inserted into the second pin accommodating holes from the first pin accommodating holes.
[0012] Further, the electrical connection assembly comprises a test probe, a probe supporting mechanism and a plug-in board.
[0013] The probe supporting mechanism comprises a screw cylinder, a ring table, a collet and an elastic member.
[0014] The screw cylinder is threadedly connected with the lower end of the second pin accommodating hole, and the screw cylinder is sleeved with the test probe.
[0015] The ring table is located in the second pin accommodating hole and abuts against the screw cylinder, and the collet is provided with at least two and fixed at the end away from the screw cylinder of the ring table; the outer edge of the ring table protrudes the collet.
[0016] All the outer surfaces of the collets are conical surfaces, which gradually increase in diameter from the side close to the PIN pin to the side close to the test probe.
[0017] The corresponding position of the collet in the second pin accommodating hole is formed with an annular boss abutting against the outer surface of the collet, one end of the elastic member abuts against the annular boss, and the other end of the elastic member abuts against the ring table and is used to drive the ring table to adhere to the screw cylinder.
[0018] The plug-in board is fixed on the base, and a plurality of ports are formed on the plug-in board, and the test probe is electrically connected with the ports through wires.
[0019] Further, the functional board is provided with a first accommodating groove for placing the power module to be measured, and the first pin accommodating holes are formed in the first accommodating groove.
[0020] Further, the first accommodating groove comprises a punching area in the middle and a contact area on the front and back sides; the first pin accommodating holes are located in the punching area, and the contact area is attached with a silica gel pad.
[0021] Further, the functional board is provided with first screw holes at four vertices, and the top of the base is provided with second screw holes corresponding to the positions of the first screw holes of the functional board.
[0022] Further, the bottom of the base is fixed with four ground foot bolts with adjustable height.
[0023] Further, it further comprises a module fixing frame, and the module fixing frame comprises a rack body and a fixing mechanism.
[0024] The rack body is fixed on the base, and the fixing mechanism is fixed on the rack body, and the fixing mechanism is used for applying pressure to the top of the measured power module, so that the measured power module is fixed in the first accommodating groove.
[0025] In the scheme, if the PIN pin of the measured power module is bent, it can also be righted by the probe supporting mechanism, ensuring accurate contact between the PIN pin and the test probe, solving the problem that the PIN pin is easily damaged when the measured power module is placed vertically, without the need to invert the measured power module, while improving the accuracy of test results. The scheme also sets various topological structure compatible pin accommodating holes on the functional board, realizes universal testing of the same type of power module with multiple topological structures, does not need to replace the test fixture, can simplify the testing process, and improves the testing efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0026] Figure 1 It is a front view of a power semiconductor module test fixture embodiment;
[0027] Figure 2 It is a top view of the functional board in a power semiconductor module test fixture embodiment;
[0028] Figure 3 It is a top view of the base top in a power semiconductor module test fixture embodiment;
[0029] Figure 4 It is a longitudinal section view of the probe supporting mechanism in a power semiconductor module test fixture embodiment;
[0030] Figure 5 It is a top view of the cylinder clamp and ring table in a power semiconductor module test fixture embodiment;
[0031] Figure 6 It is a schematic view of the plugboard in a power semiconductor module test fixture embodiment;
[0032] Figure 7 It is a side view of the push-pull type quick clamp in a power semiconductor module test fixture embodiment. DETAILED DESCRIPTION
[0033] The following will be further described in detail through specific embodiments:
[0034] The marks in the drawings of the specification include: base 1, functional board 2, module fixing frame 3, first pin accommodating hole 4, punching area 5, contact area 6, first screw hole 7, second pin accommodating hole 8, second screw hole 9, anchor bolt 10, test probe 11, screw cylinder 12, cylinder clamp 13, elastic member 14, fixing mechanism 15, plugboard 16, port 17, ring table 18, first hole 19, second hole 20, third hole 21.
[0035] Example
[0036] like Figure 1 As shown, a power semiconductor module test fixture of this embodiment includes a base 1, a function board 2, a module fixing frame 3, and electrical connection components.
[0037] like Figure 2 As shown, the function board 2 has a first receiving slot for placing the power module under test. The bottom of the first receiving slot has first pin receiving holes 4, which are not less than the number of pins of the power module under test. The positional distribution of some or all of the first pin receiving holes 4 is the same as the pin distribution of the power module under test's topology. The bottom of the first receiving slot can have a large number of first pin receiving holes 4 to accommodate different power module pins. For example, the function board 2 can have one or more types of topology-compatible first pin receiving holes 4, and different power module pins can share a portion of the first pin receiving holes 4.
[0038] In this embodiment, the first receiving groove includes a perforated area 5 in the middle and contact areas 6 on the front and rear sides.
[0039] The first pin receiving hole 4 is located in the perforated area 5. A silicone pad is attached to the contact area 6 to protect the housing of the power module under test from damage while ensuring good thermal conductivity.
[0040] The function board 2 has first screw holes 7 at its four vertices for fixing the function board 2 to the base 1.
[0041] In this embodiment, the base 1 is made of high-strength aluminum alloy, which has good mechanical stability and heat dissipation performance. Figure 3 As shown, the top of the base 1 has a second screw hole 9 corresponding to the position of the first screw hole 7 on the function plate 2;
[0042] The top of the base 1 also has a second pin receiving hole 8 that corresponds one-to-one with the first pin receiving hole 4. The diameters of the first pin receiving hole 4 and the second pin receiving hole 8 are larger than the diameter of the pin.
[0043] The bottom of the base 1 is fixed with four height-adjustable anchor bolts 10 to adjust the level of the fixture on different test platforms, and the level error is controlled within ±0.05°.
[0044] The electrical connection assembly includes a test probe 11, a probe support mechanism, and a plug plate 16; the test probe 11 and the probe support mechanism are disposed at least in a portion of the second pin receiving hole 8.
[0045] like Figure 4 As shown, the probe support mechanism includes a screw cylinder 12, a ring platform 18, a collet 13, and an elastic element 14;
[0046] The screw cylinder 12 is externally threaded and is screwed to the lower end of the second pin accommodating hole 8; the screw cylinder 12 is sleeved on the test probe 11;
[0047] The ring table 18 is located in the second pin accommodating hole 8 and is abuttingly fitted to the screw cylinder 12; the collet 13 is provided with at least two and is fixed to the side of the ring table 18 away from the screw cylinder 12; the outer edge of the ring table 18 protrudes the collet 13. As shown in the embodiment, there are four ring tables 18, four collets 13 and four elastic members 14. Figure 5
[0048] The outer surface of all the collets 13 combined is a conical surface; the conical surface gradually increases in diameter from the side close to the needle pin to the side close to the test probe 11.
[0049] The second pin accommodating hole 8 is formed with an annular boss abutting the outer surface of the collet 13 at the corresponding position of the collet 13; one end of the elastic member 14 is in abutment with the annular boss, and the other end of the elastic member 14 is in abutment with the ring table 18 and is used to drive the ring table 18 to adhere to the screw cylinder 12.
[0050] In the embodiment, the lower end of the second pin accommodating hole 8 comprises a first hole 19 and a second hole 20 and a third hole 21 connected in sequence from outside to inside; the diameter of the second hole 20 is smaller than the diameter of the first hole 19 and the second hole 20; in the embodiment, the first hole 19 and the third hole 21 are circular holes, and the second hole 20 is a funnel-shaped hole, i.e. a funnel-shaped structure, which gradually reduces in diameter in the direction away from the first hole 19. The first hole 19 is internally threaded; the elastic member 14 is located between the outer surface of the collet 13 and the inner wall of the first hole 19 (i.e. the annular boss), is arranged in the axial direction of the first hole 19, one end is in contact with the top of the first hole 19, and the other end is in contact with the outer edge of the ring table 18. In the embodiment, the elastic member 14 is a spring.
[0051] As shown in the figure, the plugboard 16 is fixed to the side of the base 1, and a plurality of ports 17 are formed on the plugboard 16; the test probe 11 is electrically connected to the ports 17 through wires. Figure 6
[0052] The module fixing frame 3 comprises a rack body and a fixing mechanism 15;
[0053] The rack body is fixed to the base 1 by bolts, and the fixing mechanism 15 is fixed to the rack body by bolts; the fixing mechanism 15 is used to apply pressure to the top of the power module being tested, so that the power module being tested is fixed in the first accommodating groove.
[0054] The fixing mechanism 15, for example, adopts an electric telescopic rod, and a pressing plate is fixedly installed at the lower end of the telescopic rod. The telescopic length of the telescopic rod is adjusted by electricity, so that the pressing plate is in contact with the top of the power module to be measured. For another example, the fixing mechanism 15 adopts an existing push-pull type quick clamp, and a pressing plate is fixedly installed at the lower end of the push-pull type quick clamp. The pressing plate is lowered by a manual mode, and is in contact with the top of the power module to be measured. As shown in the figure, in the embodiment, the push-pull type quick clamp is adopted. A soft silica gel pad or a rubber pad is pasted on the lower surface of the pressing plate, so as to protect the surface of the power module to be measured and increase the friction. The pressing plate also plays a role of heat conduction.
[0055] In use, the foot bolt 10 is adjusted, so that the base 1 is kept horizontal.
[0056] The functional plate 2 is placed at the corresponding position of the base 1, and is aligned with the first pin accommodating hole 4 and the second pin accommodating hole 8. The first screw hole 7 and the second screw hole 9 are connected by a bolt, and are fixed.
[0057] The power semiconductor module to be measured is placed in the first accommodating groove of the functional plate 2, and the pin pin of the power semiconductor module to be measured is inserted into the corresponding first pin accommodating hole 4.
[0058] The test probe 11 is inserted into the second pin accommodating hole 8 from bottom to top. The test probes 11 of the same polarity are connected together by a wire in the base 1, and are connected to the corresponding gate, source, drain or gate, collector, emitter port 17 of the plug-in board 16. The port 17 of the plug-in board 16 is connected to the corresponding multi-way sorting test circuit board.
[0059] The top of the power module to be measured is pressed by the fixing mechanism 15, so that the power module to be measured is fixed in the first accommodating groove.
[0060] The pin pin extends from the first pin accommodating hole 4 into the second pin accommodating hole 8, and then enters the annular space formed by the collet 13 combination. The screw cylinder 12 is rotated, and is moved inward along the axial direction of the first hole 19 by the cooperation of the screw cylinder 12 and the first hole 19. The ring table 18 and the collet 13 are moved to the pin pin direction. During the movement, the tapered surface of the collet 13 is limited by the second hole 20 and the third hole 21, and is folded inward along the radial direction. The pin pin which may be bent can be centered and aligned with the test probe 11, so as to be in good contact with the test probe 11 below.
[0061] Finally, formal testing is performed.
[0062] After the testing is completed, the screw cylinder 12 is moved outward along the axial direction of the first hole 19. The elastic member 14 in the compressed state applies an outward force to the ring table 18, and drives the ring table 18 to reset the collet 13.
[0063] Next time, when testing other types of power modules, according to the corresponding topology, the position of the test probe 11 is changed and inserted into the corresponding second pin accommodating hole 8. The test signal is controlled by the multi-way sorting test circuit board to test.
[0064] In this scheme, if the pin of the power module under test is bent when inserted into the second pin accommodating hole 8, the probe supporting mechanism can support it to be centered, ensuring that the pin is in precise contact with the test probe 11, solving the problem that the pin is easily damaged when the power module under test is placed vertically. The power module under test does not need to be inverted, and the accuracy of the test results can be improved.
[0065] This scheme also sets a variety of topologically compatible pin accommodating holes on the functional board 2, and changes the polarity of the connecting probe wire to the corresponding topology, realizing the universal testing of the same type of power module with multiple topologies, without the need to replace the test fixture, which can simplify the testing process and improve the testing efficiency.
[0066] The above is only an embodiment of the present application, and the present application is not limited to this embodiment. The common knowledge of the specific structure and characteristics in the scheme is not described in detail, and the ordinary skilled person in the art knows all the ordinary technical knowledge in the technical field of the present application before the filing date or the priority date. The ordinary skilled person in the art can know all the prior art in this field and has the ability to apply conventional experimental means before this date. The ordinary skilled person in the art can improve and implement this scheme based on their own ability under the guidance of this application. Some typical known structures or known methods should not be an obstacle to the implementation of this application by the ordinary skilled person in the art. It should be noted that for those skilled in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application. These will not affect the effect and practicality of the present application. The protection scope of this application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.
Claims
1. A power semiconductor module test fixture, characterized by, The base, the function board, and the electrical connection assembly are included. The function board is provided with first pin accommodating holes which are not less than the number of pins of the power module to be measured. The base is further provided with second pin accommodating holes corresponding to the first pin accommodating holes. The electrical connection assembly is used to connect the pins of the power module to be measured inserted into the second pin accommodating holes from the first pin accommodating holes.
2. The power semiconductor module test fixture of claim 1, wherein: The electrical connection assembly includes test probes, probe supporting mechanisms, and a plug-in board. The probe supporting mechanism includes a screw cylinder, a ring table, a collet, and an elastic member. The screw cylinder is threadedly connected with the lower end of the second pin accommodating hole and is sleeved with the test probe. The ring table is located in the second pin accommodating hole and is abutted with the screw cylinder, and the collet is provided with at least two and is fixed at the end of the ring table away from the screw cylinder. The outer surface of all the collets is a tapered surface, which gradually increases in diameter from the side close to the PIN pin to the side close to the test probe. The corresponding position of the collet in the second pin accommodating hole is formed with an annular boss abutting the outer surface of the collet, one end of the elastic member is abutted with the annular boss, and the other end of the elastic member is abutted with the ring table and is used to drive the ring table to adhere to the screw cylinder. The plug-in board is fixed on the base, and a plurality of ports are formed on the plug-in board, and the test probes are electrically connected with the ports through wires.
3. The power semiconductor module test fixture of claim 1, wherein: The function board is provided with a first accommodating groove for placing the power module to be measured, and the first pin accommodating holes are formed in the first accommodating groove.
4. The power semiconductor module test fixture of claim 3, wherein: The first accommodating groove includes a punching area in the middle and contact areas on the front and back sides, the first pin accommodating holes are located in the punching area, and the contact areas are attached with silica gel pads.
5. The power semiconductor module test fixture of claim 1, wherein: First screw holes are formed at the four vertices of the function board, and second screw holes corresponding to the positions of the first screw holes of the function board are formed on the top of the base.
6. The power semiconductor module test fixture of claim 1, wherein: Four height-adjustable foundation bolts are fixed on the bottom of the base.
7. The power semiconductor module test fixture of claim 1, wherein: A module fixing frame is further included, which includes a rack body and a fixing mechanism. The rack body is fixed on the base, the fixing mechanism is fixed on the rack body, and the fixing mechanism is used to apply pressure to the top of the power module to be measured so as to fix the power module to be measured in the first accommodating groove.