Testing device

Abstract

The utility model relates to a testing device. The testing device comprises a testing platform, a probe station, an image sensor, a first supporting mechanism, a controller, a processing chip and a measuring instrument, the probe station is located on the testing platform, the probe station bears a device to be tested, the first supporting mechanism is located on the testing platform, and the image sensor is located on the first supporting mechanism. The controller controls the image sensor to shoot the to-be-tested device to obtain a first device image, the first device image comprises device identification information, the processing chip processes the first device image to determine whether the to-be-tested device is reversed or not, and when the to-be-tested device is reversed, the first device image is mirrored to obtain a first device image; and the controller is used for obtaining a second device image, processing the second device image to obtain device identification information, and controlling the measuring instrument to test the to-be-tested device based on the device identification information. According to the invention, the to-be-tested device with inversion can be identified, test errors are avoided, and the test efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit chip testing, in particular to a testing device. BACKGROUND

[0002] In the related art, with the continuous progress of integrated circuit technology, people have manufactured integrated circuits with quite complex circuit structures, high integration and different functions. These high-integration and multi-functional integrated blocks are connected to external circuits through a limited number of pins, which brings many difficulties to determine the quality of the integrated circuits. The integrated circuit manufacturing process requires increasingly higher requirements. Integrated circuit testing is an important link in the integrated circuit industry chain. The ultimate purpose of testing is to verify whether the logic design, circuit design, layout design and process design meet the predetermined requirements, so as to ensure the product quality and reliability of the IC (Integrated Circuit), which is one of the key links to ensure the performance and quality of integrated circuits. Moreover, since the manufacturing cycle of integrated circuits is long and the cost is high, it is particularly important to improve the manufacturing efficiency and quality of the manufacturing process.

[0003] In the manufacturing process of semiconductor products, hundreds of process steps are required. Wafer acceptance test (WAT) plays an important role in chip quality detection. Wafer acceptance test includes various test items and is an indispensable step in chip manufacturing. It is an important means of verifying design, monitoring production, ensuring quality, analyzing failure and guiding application.

[0004] For the final WAT test of the image sensor, the device on the BSI wafer encountered is the reversed and mirrored (the unreversed device and the reversed device are mirror images of each other), which makes it difficult for the tester and the equipment to identify the accurate position of the device under test, resulting in test failure and damage to other process area functions on the wafer due to mis-needle sticking. Moreover, after testing the device under test placed in the forward direction, editing the test software and then testing the reversed device under test, the test efficiency is low. Practical new type content

[0005] The present application aims to provide a testing device that can identify the reversed device under test and successfully complete the test of the device under test, thereby avoiding test failure and improving test efficiency.

[0006] According to a first aspect of an embodiment of the present application, a testing device is provided, comprising a test platform, a probe station, an image sensor, a first supporting mechanism, a controller, a processing chip and a measuring instrument.

[0007] The probe station is located on the test platform, and the probe station comprises a test chuck used for carrying and fixing a device to be tested; the first supporting mechanism is located on the test platform, and the image sensor is located on the first supporting mechanism and movably connected with the first supporting mechanism;

[0008] The controller is electrically connected with the image sensor, and the controller is used for controlling the image sensor to take a first device image of the device to be tested; the first device image comprises device identification information.

[0009] The processing chip is electrically connected with the image sensor, and the processing chip is used for processing the first device image to determine whether the device to be tested has inversion, when the device to be tested has inversion, performing mirror image processing on the first device image to obtain a second device image, and processing the second device image to obtain the device identification information.

[0010] The controller is electrically connected with the processing chip and the measuring instrument, and the controller is further used for controlling the measuring instrument to test the device to be tested based on the device identification information.

[0011] In an embodiment, the test device further comprises a mirror and a second supporting mechanism.

[0012] The second supporting mechanism is located on the test platform, and the first supporting mechanism and the second supporting mechanism are located on two sides of the probe station and oppositely arranged.

[0013] The mirror is located on the second supporting mechanism, and the mirror is arranged to face the test chuck and is used for imaging the device to be tested to obtain a mirror image.

[0014] The controller is further used for controlling the image sensor to take a mirror surface of the mirror to obtain the mirror image of the device to be tested.

[0015] The processing chip is used for comparing the second device image with the mirror image to determine whether the second device image is the same as the mirror image, and when the second device image is the same as the mirror image, processing the second device image to obtain the device identification information.

[0016] In an embodiment, the height of the image sensor from the test platform is the same as the height of the mirror from the test platform, and the mirror surface of the mirror is obliquely arranged.

[0017] In an embodiment, the angle between the mirror surface of the mirror and the surface of the test platform facing the mirror is 45 degrees, and the surface is a plane.

[0018] In an embodiment, the testing device further comprises a rotating mechanism, the image sensor is connected with the first supporting mechanism through the rotating mechanism, the rotating mechanism is used to rotate the image sensor to realize photographing the device under test to obtain a first device image and photographing a mirror surface of the mirror to obtain a mirror image of the device under test.

[0019] In an embodiment, the first supporting mechanism is a first supporting column, the first supporting column is perpendicular to the testing platform and faces the surface of the mirror.

[0020] The rotating mechanism comprises a first rotating element and a second rotating element, the first rotating element is located on the first supporting column and can rotate around the first supporting column.

[0021] The second rotating element is located on the first rotating element, the image sensor is located on the second rotating element, and the second rotating element is used to rotate the image sensor up and down around a horizontal axis.

[0022] In an embodiment, the measuring instrument is located above the probe station, and the image sensor and the mirror are located between the probe station and the measuring instrument.

[0023] In an embodiment, the probe station further comprises a base, the base is located on the testing platform, and the testing chuck is located on the base.

[0024] The base is provided with a moving mechanism, a stabilizing mechanism and a blowing mechanism, the moving mechanism is used to drive the probe station to move on the testing platform, the stabilizing mechanism is used to stabilize the testing chuck, and the blowing mechanism is used to blow away dust to avoid contaminating the device under test and the probe station.

[0025] In an embodiment, the measuring instrument comprises a head structure, a supporting plate, a first integrated circuit board, a first connecting piece, a second integrated circuit board and a probe, the first integrated circuit board is located on the head structure, the first connecting piece is used to connect the first integrated circuit board and the second integrated circuit board, the second integrated circuit board is electrically connected with the probe, and the probe is used to electrically contact with the device under test to enable the first integrated circuit board to electrically measure the device under test.

[0026] The supporting plate is provided with a clamping groove, and the second integrated circuit board is located in the clamping groove.

[0027] In an embodiment, the testing device further comprises a measuring unit and a second connector, the measuring unit is electrically connected with the measuring instrument through the second connector, and the second connector is also used for supporting the measuring instrument.

[0028] The measuring unit is used for receiving a test parameter, and controlling the measuring instrument to perform an electrical measurement on the device under test based on the test parameter and reading a measurement result of the measuring instrument.

[0029] Compared with the prior art, the application has the beneficial effects that: since the testing device comprises a testing platform, a probe station, an image sensor, a first supporting mechanism, a controller, a processing chip and a measuring instrument, the probe station is located on the testing platform, the probe station comprises a test chuck, the test chuck is used for carrying and fixing the device under test, the first supporting mechanism is located on the testing platform, the image sensor is located on the first supporting mechanism and is movably connected with the first supporting mechanism, the controller is electrically connected with the image sensor, the controller is used for controlling the image sensor to capture a first device image of the device under test, the first device image comprises device identification information, the processing chip is electrically connected with the image sensor, the processing chip is used for processing the first device image to determine whether the device under test has a reverse, when the device under test has a reverse, the first device image is mirror-processed to obtain a second device image, and the second device image is processed to obtain the device identification information, the controller is electrically connected with the processing chip and the measuring instrument, and the controller is also used for controlling the measuring instrument to test the device under test based on the device identification information. In this way, the technical scheme of the application can identify the device under test having a reverse in the process of testing the device under test, and successfully complete the testing of the device under test, so that testing errors can be avoided and the testing efficiency can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a structural schematic diagram of a testing device according to an exemplary embodiment.

[0031] Figure 2 is a structural schematic diagram of another testing device according to an exemplary embodiment.

[0032] Figure 3 is a flowchart of a testing device according to another exemplary embodiment. DETAILED DESCRIPTION

[0033] Unless otherwise defined, technical and scientific terms used in this specification and claims shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. In the description of the application following paragraphs, specific embodiments of the application are described in connection with the drawings. It will be apparent to those skilled in the art that modifications and substitutions can be made to the specific embodiments without departing from the spirit and scope of the application. Accordingly, it is intended that all such modifications and substitutions be included within the scope of the application.

[0034] In the related art, as the application field of integrated circuits expands, a large number of integrated circuits are used in various complete machine systems, and the integrated circuits are often used as key devices in the system. The quality and performance of the integrated circuits directly affect the stability and reliability of the system. The purpose of testing is to judge the tested chip. The efficiency of testing is very important. The purpose of testing is to detect whether the wafer product meets the process specification requirements by testing the WAT parameter electrical properties of the specific test structure on the wafer product. In addition to judging whether the tested device is qualified, the testing can also provide useful information about the manufacturing process, thereby helping to improve the yield, providing information about the weak links of the design scheme, helping to monitor the design problems, and being responsible for the quality of the design. The circuit or system is described in the form of data structure and program in the computer, and the model of the circuit or system is verified by the form of data stream of input signal.

[0035] A CMOS image sensor (CIS) is a device that converts an optical image into an electronic signal, usually consisting of an array of photosensitive cells, row drivers, column drivers, timing control logic, an AD converter, a data bus output interface, a control interface, and so on, and these parts are integrated on the same silicon wafer. The BSI CMOS (Back-illuminated CMOS) technology is used to build pixels, and light does not need to pass through the metal interconnection layer. However, this still brings some limitations to the light path, fortunately, many knowledge and technological progress that promote the continuous improvement of FSI technology can be directly applied to BSI CMOS technology, thereby laying a solid foundation for improving the performance of BSI CMOS. The first step of the technology is to converge the incident light into the optical region of the photodiode, and the optical requirements are the same as the FSI CMOS technology, but now the position of the microlens is closer to the photodiode, and a thicker microlens material layer needs to be deposited to obtain a shorter focal length. Unlike the natural aperture created by the interconnection layer in the FSI CMOS (Front-illuminated CMOS) technology, BSI needs to minimize crosstalk, so it is necessary to increase an aperture by depositing a metal grid on the photodiode. Since the BSI CMOS wafer is flipped, the incident light will first enter the silicon body material near the photodiode. At this time, due to the diffusion to the adjacent pixels or the diffusion and re-convergence at the back interface, the light will form crosstalk and cause loss. Blue light is particularly prone to this phenomenon, resulting in a decrease in blue QE (Quantum Efficiency) and an increase in crosstalk. Fortunately, by using advanced backside processing and a deeper photodiode to capture blue light, these problems can be solved. Another major advantage of BSI image sensors over traditional FSI image sensors is that the pixel has a lower light stack height. It should be noted that this advantage is not obvious compared to the FSI architecture with a light pipe, because for the latter, the effective light stack height is also reduced because the light is concentrated at the top of the interconnection stack and is limited and guided to the photodetector surface by the light pipe. The main advantage of the BSI image sensor is that it can separate the electrical components from the light, allowing the light path to be optimized independently, and vice versa. Moreover, this does not require creating an aperture in the metal layer or the light pipe, thereby eliminating the loss mechanism of incident light. The final result is that the BSI image sensor can achieve higher QE.

[0036] To solve the above technical problems, the application provides a test device, which can identify the presence of a reversed device under test during the testing of the device under test, and successfully complete the testing of the device under test, thereby avoiding testing errors and improving testing efficiency.

[0037] One embodiment of this application provides a testing apparatus. This testing apparatus can be used to test back-illuminated image sensors. Figure 1 As shown, the testing device includes: a testing platform 11, a probe station 12, an image sensor 13, a first support mechanism 14, a controller (not shown), a processing chip (not shown), a measuring instrument 15, a rotating mechanism 16, a measuring unit 17, and a second connector 18.

[0038] like Figure 1 As shown, the probe station 12 is located on the test platform 11, and the probe station 12 includes a base 121 and a test chuck 122. The base 121 is located on the test platform 11, and the test chuck 122 is located on the base 121. The shape of the test chuck 122 matches the shape of the device under test.

[0039] like Figure 2 As shown, in one embodiment, the device under test is circular, and the test chuck 122 may be circular. In another embodiment, the test chuck 122 may be rectangular.

[0040] In this embodiment, the base 121 is equipped with a moving mechanism, a stabilizing mechanism, and an air-blowing mechanism. The moving mechanism drives the probe station 12 to move on the test platform 11 to the location of the device under test (DUT) or to a designated location. The stabilizing mechanism stabilizes the test chuck 122 to ensure smooth testing. The stabilizing mechanism may have shock-absorbing capabilities. The air-blowing mechanism blows away dust to prevent contamination of the DUT and the probe station 12. The air-blowing mechanism can provide clean, dry air (CDA) to remove dust. The test chuck 122 carries and secures the DUT. The test chuck 122 may be a vacuum chuck, but is not limited to this.

[0041] like Figure 1 As shown, the first support mechanism 14 is located on the test platform 11, and the rotation mechanism 16 is located on top of the first support mechanism 14. The image sensor 13 is movably connected to the first support mechanism 14 through the rotation mechanism 16, which is used to drive the image sensor 13 to rotate. That is, the image sensor 13 is located on top of the first support mechanism 14 and can rotate to ensure that the device under test is within the field of view of the image sensor 13, thereby enabling the image of the device under test to be captured.

[0042] like Figure 1As shown, the first support mechanism 14 is a first support column, which is perpendicular to the surface of the test platform 11 facing the image sensor 13. The rotating mechanism 16 includes a first rotating element 161 and a second rotating element 162. The first rotating element 161 is located on the first support column and can rotate around the first support column to drive the image sensor 13 to rotate around the first support column. The second rotating element 162 is located on the first rotating element 161, and the image sensor 13 is located on the second rotating element 162. The second rotating element 162 is used to drive the image sensor 13 to rotate up and down around a horizontal axis to realize the pitching of the image sensor 13.

[0043] In the embodiment, the controller is electrically connected with the image sensor 13. The controller is used to control the image sensor 13 to take a first device image of the device under test. The first device image includes device identification information. The device identification information can be the name of the device under test, which can include numbers and letters, but is not limited thereto.

[0044] In one embodiment, the device identification information can be the pin or other identification information of the device under test. The other identification information can be, for example, a symbol or mark on the device under test for identifying the position.

[0045] In the embodiment, the processing chip is electrically connected with the image sensor 13, and the processing chip is used to process the first device image to determine whether the device under test has inversion. When the device under test has inversion, the processing chip performs mirror processing on the first device image to obtain a second device image, and processes the second device image to obtain the device identification information.

[0046] In the embodiment, the controller is electrically connected with the processing chip and the measuring instrument 15. When the processing chip obtains the device identification information, the controller is used to determine a corresponding target test program based on the device identification information and the correspondence between the device identification and the test program, and control the measuring instrument 15 to test the device under test based on the target test program.

[0047] In one embodiment, the controller can control the height of the probe and the clarity of the image of the device under test taken by the image sensor 13 to more clearly identify the device under test, which can achieve a 100% success rate in one test in the test, reduce production costs, and improve the efficiency of simultaneous testing of multiple devices under test and multiple device identification information.

[0048] As shown in FIG. 1, Figure 1 As shown, the measuring instrument 15 is located above the probe table 12, and the image sensor 13 is located between the probe table 12 and the measuring instrument 15.

[0049] As shown in FIG. 1, Figure 1As shown, the measuring instrument 15 comprises a head structure 151, a first integrated circuit board (not shown), a first connecting member 152, a second integrated circuit board (not shown), a probe 153 and a support plate 154. The support plate 154 is provided with a clamping groove (not shown).

[0050] The first integrated circuit board is located on the head structure 151, the first connecting member 152 is used to connect the first integrated circuit board and the second integrated circuit board, the second integrated circuit board is electrically connected with the probe 153, and the probe 153 is used to make electrical contact with the device to be measured so that the first integrated circuit board performs electrical measurement on the device to be measured. The first integrated circuit board is used to measure electrical parameters such as resistance, voltage, current, capacitance and inductance of the device to be measured. The second integrated circuit board can be a conversion board used to connect the probe 153 and the first integrated circuit board. The second integrated circuit board is located in the clamping groove on the support plate 154. The support plate 154 is used to support the second integrated circuit board and the probe 153.

[0051] As shown in Figure 1 The measuring unit 17 is electrically connected with the measuring instrument 15 through the second connecting member 18, and the second connecting member 18 is also used to support the measuring instrument 15. The measuring unit 17 is used to receive test parameters, control the measuring instrument 15 to perform electrical measurement on the device to be measured based on the test parameters, and read the measurement results of the measuring instrument 15. The test parameters may, for example, be voltage values, but are not limited thereto.

[0052] In one embodiment, the measuring unit 17 can further comprise a display module used to display the measurement results.

[0053] In one embodiment, the measuring unit 17 can be a measuring cabinet, but is not limited thereto. The measuring instrument 15 can be movably connected with the measuring unit 17 through the second connecting member 18, so that the measuring instrument 15 can rotate around the measuring unit 17 in the vertical direction to lift or lower the measuring instrument 15.

[0054] In one embodiment, the controller and the processing chip can be two independent devices. In another embodiment, the controller and the processing chip can be integrated in one chip or one device.

[0055] In the embodiment, when the device to be tested (for example, a BSI image sensor) is reversed, the device identification information can also be identified, and the corresponding target test program is determined based on the device identification information, so that the measuring instrument 15 is controlled to test the device to be tested based on the target test program, without the need to edit the test program after the testing of the normally placed device to be tested (for example, an FSI image sensor) is completed, so as to test the reversed device to be tested, simplify the test process, improve the test efficiency, and avoid the test personnel and the equipment from failing to identify the accurate position of the device to be tested, so as to cause test failure, damage to other process area functions on the device to be tested by the needle, improve the test accuracy, and successfully complete the test of the device to be tested.

[0056] The technical scheme provided in the embodiment of the application can improve the device identification information reading and identification reverse function when a BSI image sensor is mirrored and reversed, not on one test chip or not on one scrab line and needs to be tested at the same time, a main pin is connected to an SMU (source measurement unit), and the device identification information reading and identification reverse function is improved. The extreme event is correctly interpreted, the test data is stable and accurate, and the test efficiency is high.

[0057] According to the conventional method, the device identification information of the BSI image sensor is tested. The first pad is on the rightmost side, the wafer needs to be reversed to test the first pad, the test conditions need to be changed according to different pin connections, and the connection of which pad needs to be checked to test the electrical property of the BSI image sensor.

[0058] According to the technical scheme provided in the embodiment of the application, when the device to be tested (for example, a BSI image sensor) is reversed, the direction of the wafer can be kept unchanged, the connection of the test pin is changed, and the device to be tested can be accurately tested without the need to identify the device identification information again, so that the test efficiency is high.

[0059] The technical scheme provided in the embodiment of the application can obviously improve the problem of low test efficiency caused by the unclear English and numerical combination of the teskey (device name) due to the reverse teskey, obviously improve the correct electrical property characteristics under the condition that the test information does not change, can avoid long-time checking of data and corresponding test of each teskey, save time, and improve the test efficiency.

[0060] According to the technical scheme provided in the embodiment of the application, when it is confirmed that the device to be tested is reversed, the teskey of the device to be tested on the right side is difficult to identify, and only the reversed pin needs to be directly tested to the correct test point, so that the test is accurately and efficiently completed.

[0061] Another embodiment of the application provides a test device. Please refer to Figure 3The test device, based on the above embodiment, can further include a mirror 21 and a second support mechanism 22.

[0062] As shown in the figure, the second support mechanism 22 is located on the test platform 11, the first support mechanism 14 and the second support mechanism 22 are located on both sides of the probe table 12, and are oppositely arranged. Figure 3

[0063] The mirror 21 is located on the second support mechanism 22 and between the probe table 12 and the measuring instrument 15. The mirror 21 is arranged to face the test chuck 122, and is used for imaging the device under test to obtain a mirror image of the device under test.

[0064] In this embodiment, when the device under test is reversed, the controller is further configured to control the image sensor 13 to capture the mirror surface of the mirror 21 to obtain the mirror image of the device under test. Then, the processing chip is configured to compare the second device image with the mirror image to determine whether the second device image is the same as the mirror image, and when the second device image is the same as the mirror image, the second device image is processed to obtain the device identification information.

[0065] When the device under test is reversed, the mirror image of the device under test is positive. Comparing the second device image with the mirror image can determine whether the second device image obtained by mirroring the first device image is correct. When the second device image is the same as the mirror image, it means that the second device image is correct, and the device under test in the second device image is positive. In this way, it can be ensured that the subsequent test process is correct, and the success rate of the test can be improved.

[0066] In this embodiment, the height of the image sensor 13 from the test platform 11 is the same as the height of the mirror 21 from the test platform 11, and the mirror surface of the mirror 21 can be obliquely arranged. In this way, the image sensor 13 can capture the mirror surface of the mirror 21 to obtain the mirror image of the device under test.

[0067] In one embodiment, the angle between the mirror surface of the mirror 21 and the surface of the test platform 11 facing the mirror 21 is 45 degrees, but is not limited thereto. The surface of the test platform 11 facing the mirror 21 is a plane. The angle between the mirror surface of the mirror 21 and the surface of the test platform 11 facing the mirror 21 can also be other angles, such as 30° or 60°, etc.

[0068] The technical scheme provided by the embodiments of the present application can find the device under test according to the test requirement, and can identify more than 1000 BSI image sensors with reverse, and the time used is 10 minutes. Compared with the 10 hours of test time in the related art, the test efficiency is greatly improved.

[0069] ​The technical scheme provided by the embodiments of the present application can identify the names and pads of the to-be-tested devices with inversion, and perform secondary confirmation on the to-be-tested devices with inversion, and can measure more than 1000 to-be-tested devices.

[0070] In the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance. The term "a plurality of" refers to two or more, unless otherwise explicitly limited.

[0071] The above description of the embodiments is to facilitate the understanding and application of the present application by those of ordinary skill in the art. Those skilled in the art can easily make various modifications to these embodiments, and apply the general principles described herein to other embodiments without having to exert creative labor. Therefore, the present application is not limited to the embodiments herein, and the improvements and modifications made by those skilled in the art without departing from the scope and spirit of the present application are within the scope of the present application.

Claims

1. A test device, characterized in that, The application relates to a test platform, a probe station, an image sensor, a first supporting mechanism, a controller, a processing chip and a measuring instrument. The probe station is located on the test platform and comprises a test chuck used for carrying and fixing a device to be tested; the first supporting mechanism is located on the test platform, and the image sensor is located on the first supporting mechanism and movably connected with the first supporting mechanism. The controller is electrically connected with the image sensor; the controller is used for controlling the image sensor to take a first device image of the device to be tested; the first device image comprises device identification information. The processing chip is electrically connected with the image sensor; the processing chip is used for processing the first device image to determine whether the device to be tested has inversion; when the device to be tested has inversion, the first device image is processed by mirror image processing to obtain a second device image, and the second device image is processed to obtain the device identification information. The controller is electrically connected with the processing chip and the measuring instrument; the controller is further used for controlling the measuring instrument to test the device to be tested based on the device identification information. The application further relates to a mirror and a second supporting mechanism.

2. The test device of claim 1, wherein, The second supporting mechanism is located on the test platform; the first supporting mechanism and the second supporting mechanism are located on two sides of the probe station and oppositely arranged. The mirror is located on the second supporting mechanism; the mirror faces the test chuck and is used for imaging the device to be tested to obtain a mirror image. The controller is further used for controlling the image sensor to take a mirror surface of the mirror to obtain the mirror image of the device to be tested. The processing chip is used for comparing the second device image with the mirror image to determine whether the second device image is the same as the mirror image; when the second device image is the same as the mirror image, the second device image is processed to obtain the device identification information. The height of the image sensor from the test platform is the same as the height of the mirror from the test platform; the mirror surface of the mirror is obliquely arranged. The angle between the mirror surface of the mirror and the surface of the test platform facing the mirror is 45 degrees; the surface is a plane.

3. The test device of claim 2, wherein, A rotating mechanism is further provided; the image sensor is connected with the first supporting mechanism through the rotating mechanism; the rotating mechanism is used for rotating the image sensor to realize taking the first device image of the device to be tested and taking the mirror surface of the mirror to obtain the mirror image of the device to be tested.

4. The test device of claim 3, wherein, The first supporting mechanism is a first supporting column; the first supporting column is perpendicular to the surface of the test platform facing the mirror.

5. The test device of claim 2, wherein, The rotating mechanism comprises a first rotating element and a second rotating element; the first rotating element is located on the first supporting column and can rotate around the first supporting column.

6. The test device of claim 5, wherein, ​ ​ The second rotating element is located on the first rotating element, and the image sensor is located on the second rotating element, and the second rotating element is used to drive the image sensor to rotate up and down around a horizontal axis.

7. The test device of claim 2, wherein, The measuring instrument is located above the probe station, and the image sensor and the mirror are located between the probe station and the measuring instrument.

8. The test device of claim 1, wherein, The probe station further comprises a base, which is located on the test platform, and the test chuck is located on the base. The base is provided with a moving mechanism, a stabilizing mechanism and a blowing mechanism, the moving mechanism is used to drive the probe station to move on the test platform, the stabilizing mechanism is used to stabilize the test chuck, and the blowing mechanism is used to blow away dust to avoid contaminating the device to be tested and the probe station.

9. The test device of claim 1, wherein, The measuring instrument comprises a head structure, a support plate, a first integrated circuit board, a first connecting piece, a second integrated circuit board and a probe, the first integrated circuit board is located on the head structure, the first connecting piece is used to connect the first integrated circuit board and the second integrated circuit board, the second integrated circuit board is electrically connected with the probe, and the probe is used to electrically contact with the device to be tested to enable the first integrated circuit board to electrically measure the device to be tested. The support plate is provided with a clamping groove, and the second integrated circuit board is located in the clamping groove.

10. The test device of claim 9, wherein, Further comprising a measuring unit and a second connecting piece, the measuring unit is electrically connected with the measuring instrument through the second connecting piece, and the second connecting piece is also used to support the measuring instrument. The measuring unit is used to receive test parameters, control the measuring instrument to electrically measure the device to be tested based on the test parameters, and read the measurement results of the measuring instrument.

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