Computing power device and electronic system

Abstract

The utility model provides computing power equipment and an electronic system, the computing power equipment can comprise a shell, a plurality of computing power devices, a target structure and a first interface structure, and the plurality of computing power devices are arranged in the shell; the target structure is arranged in the shell and can accelerate gas flow in the shell; the first interface structure at least comprises a first interface and a second interface, the first interface is exposed from the outer surface of the shell to be electrically connected with a power supply, and the first interface is electrically connected with the plurality of computing power devices; and the second interface is exposed from the outer surface of the shell so as to be in signal connection with electronic equipment, and the second interface is in signal connection with the plurality of computing power devices.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular to a computing power device and an electronic system. BACKGROUND

[0002] With the development of artificial intelligence (AI), more hardware products (such as notebook computers, all-in-one computers, desktop computers, and other electronic devices) are applied to AI technology.

[0003] In the related art, the application of AI technology requires sufficient computing power support, and existing hardware products cannot meet this demand. UTILITY MODEL CONTENT

[0004] The present disclosure provides a computing power device and an electronic system, and the technical solutions are as follows:

[0005] In a first aspect, the present disclosure provides a computing power device, which can include: a housing, a plurality of computing power units, a target structure, and a first interface structure, the plurality of computing power units being arranged in the housing; the target structure is arranged in the housing and can accelerate the flow of gas in the housing; the first interface structure includes at least a first interface and a second interface, the first interface is exposed from the outer surface of the housing for electrical connection with a power supply, and the first interface is electrically connected with the plurality of computing power units; the second interface is exposed from the outer surface of the housing for signal connection with an electronic device, and the second interface is signal connected with the plurality of computing power units.

[0006] In some embodiments, the plurality of computing power units includes: a first computing power unit and at least one second computing power unit, the first computing power unit is electrically connected with the first interface and signal connected with the second interface; the at least one second computing power unit is electrically connected with the first interface and signal connected with the first computing power unit.

[0007] In some embodiments, the computing power of the first computing power unit is greater than or equal to the computing power of the second computing power unit.

[0008] In some embodiments, the computing power device can further include: a first memory and a second memory, the first memory is arranged in the housing and signal connected with the first computing power unit; the second memory is arranged in the housing and signal connected with the second computing power unit.

[0009] In some embodiments, the computing power device can further include a carrier having a first surface and a second surface opposite to each other; the first surface is provided with the first computing power unit and the first memory; the second surface is provided with the second computing power unit and the second memory, the second computing power unit is positionally corresponding to the first computing power unit, and the number of the second memory is less than the number of the first memory.

[0010] In some embodiments, the target structure includes a moving part and a wind blocking part; the moving part is arranged on the first surface side of the carrier, electrically connected with the first interface, and movable to generate air flow; the wind blocking part is arranged adjacent to the edge of the first surface and surrounds the moving part, the first computing power unit and the first memory.

[0011] In some embodiments, the first surface is provided with a plurality of first plug-in parts; the moving part is provided with a plurality of second plug-in parts, so that the moving part can be plugged with the first plug-in parts of the first region of the first surface, and can be unplugged from the first region and plugged with the first plug-in parts of the second region of the first surface.

[0012] In some embodiments, the computing power device can further include an adapter structure and a second interface structure; the adapter structure is signal-connected with the first computing power unit and the second computing power unit respectively; the second interface structure is signal-connected with the adapter structure and is provided with at least one connection interface, which is exposed or not exposed from the outer surface of the shell, and is used to connect a functional device, which includes at least one of the following: a storage device, a wireless communication device.

[0013] In some embodiments, the first interface structure further includes a network interface exposed from the outer surface of the shell for connection with a network device.

[0014] In a second aspect, the disclosure also provides an electronic system, which can include an electronic device and a computing power device; the electronic device is provided with a signal interface; the computing power device can include a shell, a plurality of computing power units, a target structure and a first interface structure; the plurality of computing power units are arranged in the shell; the target structure is arranged in the shell and can accelerate the air flow in the shell; the first interface structure includes at least a first interface and a second interface; the first interface is exposed from the outer surface of the shell for electrical connection with a power supply, and the first interface is electrically connected with the plurality of computing power units; the second interface is exposed from the outer surface of the shell for signal connection with the signal interface of the electronic device, and the second interface is signal-connected with the plurality of computing power units.

[0015] The above description is only a summary of the technical solutions of the present disclosure. In order to more clearly understand the technical means of the present disclosure and can be implemented in accordance with the content of the description, the following will be described in detail in the preferred embodiments of the present disclosure and with the help of the accompanying drawings as follows. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0017] Figure 1 The structural schematic diagram of the computing power equipment provided by an embodiment of the present disclosure is shown in the figure.

[0018] Figure 2 The partial structural schematic diagram of the computing power equipment provided by an embodiment of the present disclosure is shown in the figure. Figure 1

[0019] Figure 3 The partial structural schematic diagram of the computing power equipment provided by an embodiment of the present disclosure is shown in the figure. Figure 2

[0020] Figure 4 The partial structural schematic diagram of the computing power equipment provided by another embodiment of the present disclosure is shown in the figure.

[0021] Figure 5 The structural schematic diagram of the computing power equipment provided by still another embodiment of the present disclosure is shown in the figure.

[0022] Explanation of reference signs:

[0023] 10, computing power equipment; 11, shell; 111, opening; 112, foot pad; 113, first outer surface; 114, second outer surface; 12, computing power device; 121, first computing power device; 122, second computing power device; 13, target structure; 131, movable part; 132, wind shield; 14, first interface structure; 141, first interface; 142, second interface; 143, network interface; 15, first memory; 16, carrier; 161, first surface; 1611, first plug-in part; 17, switching structure; 18, second interface structure; 19, storage equipment; 191, M.2 plug-in interface; 20, wireless communication equipment. DETAILED DESCRIPTION

[0024] ​​The embodiments of the present disclosure will be described in further detail below with reference to the drawings and examples. The following detailed description of the examples and the accompanying drawings are provided for the purpose of illustrating the principles of the present disclosure, and are not intended to limit the scope of the present disclosure, which can be embodied in a variety of different forms, not limited to the specific examples disclosed herein, but include all technical solutions falling within the scope of the claims.

[0025] The present disclosure provides these examples in order to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these examples should be interpreted as merely exemplary, and not as a limitation.

[0026] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] In addition, "first", "second", and similar words used in the present disclosure do not indicate any order, number, or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0028] It should also be noted that, in the description of the present disclosure, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be interpreted broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between a first device and a second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.

[0029] All terms used in the present disclosure have the same meaning as understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or overly formalized sense, unless specifically defined herein.

[0030] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered part of the specification where appropriate.

[0031] With the development of artificial intelligence (AI), more hardware products (such as notebook computers, all-in-one machines, desktop computers, and other electronic devices) are applied to AI technology.

[0032] In the related art, the application of AI technology requires sufficient computing power support, and existing hardware products cannot meet this demand.

[0033] If the hardware product is connected to a cloud large model (Application Programming Interface, API) application, it can achieve sufficient computing power support, but uploading to the cloud may have the risk of personal privacy leakage; if a hardware product with sufficient computing power support is purchased, the cost is too high. In view of the above technical problems, the present disclosure provides a computing power device 10 which can be connected to a hardware product signal to meet the computing power demand of the hardware product; compared with the setting of uploading to the cloud, it can avoid privacy leakage; compared with the setting of purchasing a hardware product, it can reduce the cost.

[0034] First aspect

[0035] Referring to Figures 1 to 5 As shown, the computing power device 10 can include a housing 11, a plurality of computing power units 12, a target structure 13, and a first interface structure 14. The plurality of computing power units 12 are arranged in the housing 11, the target structure 13 is arranged in the housing 11 and can accelerate the flow of gas in the housing 11; the first interface structure 14 at least includes a first interface 141 and a second interface 142, the first interface 141 is exposed from the outer surface of the housing 11 for electrical connection with a power supply, and the first interface 141 is electrically connected with the plurality of computing power units 12; the second interface 142 is exposed from the outer surface of the housing 11 for signal connection with an electronic device, and the second interface 142 is signal connected with the plurality of computing power units 12.

[0036] The shell 11 can be provided with an opening 111, which can be a weight-reducing hole to reduce the weight of the shell 11; the opening 111 can also be a heat dissipation hole to reduce the temperature inside the shell 11; the bottom of the shell 11 can be provided with a plurality of foot pads 112 of materials such as elastic materials and rigid materials as shown in Figure 1 to provide a heat dissipation space between the shell 11 and the load-bearing surface such as a table top, and the opening 111 can be provided on the bottom surface of the shell 11 to accelerate heat dissipation. The shell 11 can be a regular cuboid, a square, a disc, etc., or an irregular shape, such as: Figure 1 a cuboid as shown in the shell 11, but the first outer surface 113 is outwardly convex to increase the contact area of the shell 11 with air, thereby improving the heat dissipation capacity of the shell 11; for example: Figure 5 a cuboid as shown in the shell 11, but the second outer surface 114 is wavy, and the part between the adjacent two wave patterns is concave inwardly to the shell 11, so as to increase the contact area of the shell 11 with air, thereby improving the heat dissipation capacity of the shell 11.

[0037] The computing power device 12 is arranged in the shell 11 to protect the computing power device 12 by the shell 11. The number of computing power devices 12 is multiple, and the parameters of any two computing power devices 12 can be the same or different, which can include but not limited to: the length dimension of the computing power device 12, the width dimension of the computing power device 12, the height dimension of the computing power device 12, and the computing power size of the computing power device 12.

[0038] The target structure 13 is arranged in the shell 11 to protect the target structure 13 by the shell 11. The target structure 13 can accelerate the flow of gas in the shell 11 to accelerate the heat dissipation of the shell 11. The target structure 13 can be a passive air flow, such as: the target structure 13 is a flow guide channel in communication with the opening 111 provided on the shell 11, so that the air flow outside the shell 11 can flow into the shell 11 through the opening 111 and the flow guide channel, thereby accelerating the flow of gas in the shell 11; the target structure 13 can also be an active air flow, such as: the target structure 13 is a movable member 131 such as a rotating fan blade or a vibrating spring, so as to generate air flow during the movement of the movable member 131, thereby accelerating the flow of gas in the shell 11.

[0039] A first interface structure 14 is used to at least realize the power-on of the computing power device 10 and the input and output of signals. The first interface 141 is exposed from the outer surface of the shell 11 to be connected with the power supply, and the part corresponding to the first interface 141 in the shell 11 is electrically connected with the plurality of computing power units 12. In this way, the power supply can supply power to the computing power units 12 through the first interface 141 to realize the work of the computing power units 12. Of course, in the case of the target structure 13 actively providing gas flow, the part corresponding to the first interface 141 in the shell 11 can also be electrically connected with the target structure 13 to provide power support for the movement of the target structure 13. The second interface 142 is exposed from the outer surface of the shell 11 to be conveniently connected with the electronic device (i.e. hardware product, which can be a mobile phone, a tablet computer, a notebook computer, an all-in-one machine, a desktop computer, etc.) through a connection line or other connection structure to realize the signal connection between the electronic device and the computing power device 10, and then realize the data transmission of the electronic device to the computing power device 10 for computing processing, and the result of the computing processing can be sent to the electronic device, thereby meeting the computing power demand of the hardware product. The number of the first interface 141 and / or the second interface 142 can be multiple to be used as backup in the case of failure, maintenance, etc.

[0040] In an example, referring to Figures 1 to 4 As shown, the computing power device 10 can include a shell 11, two computing power units 12, a target structure 13, and a first interface structure 14. The two computing power units 12 are arranged in the shell 11, the target structure 13 is arranged in the shell 11 and can accelerate the gas flow in the shell 11, and the first interface structure 14 at least includes a first interface 141 and a second interface 142. The first interface 141 is exposed from the outer surface of the shell 11 to be electrically connected with the power supply, and the first interface 141 is electrically connected with the two computing power units 12 and the target structure 13. The second interface 142 is exposed from the outer surface of the shell 11 to be signal-connected with the electronic device, and the second interface 142 is signal-connected with the plurality of computing power units 12.

[0041] A method for using the computing power device 10 includes:

[0042] S101: connecting the first interface 141 with the power supply to supply power to the computing power device 10;

[0043] S102: connecting the second interface 142 with the electronic device to realize the mutual transmission of data between the computing power device 10 and the electronic device;

[0044] S103: operating on the electronic device to send the data to be processed and the processing method to the computing power device 10, and at least one of the two computing power units 12 of the computing power device 10 processes the data according to the processing method and sends the processed result to the electronic device.

[0045] Another method for using the computing power device 10 includes:

[0046] S101: Connect the first interface 141 to the power supply to supply power to the computing device 10;

[0047] S102: Connect the second interface 142 to the electronic device to realize the mutual transmission of data between the computing device 10 and the electronic device;

[0048] S103: By operating on the electronic device, the data to be processed is sent to the computing device 10. The computing device 10 obtains the processing method (such as model structure) with the support of the network (such as network interface 143 and wireless communication device 20 below), and processes the data according to the processing method through at least one of the two computing devices 12, and then sends the processed result to the electronic device.

[0049] In this embodiment, the computing device 10 may include a housing 11, multiple computing units 12, a target structure 13, and a first interface structure 14. The multiple computing units 12 and the target structure 13 are disposed within the housing 11 for protection. The first interface 141 of the first interface structure 14 is disposed on the housing 11 to connect to a power source, thereby providing power to the electrical components on the computing device 10, including the multiple computing units 12. The second interface 142 of the first interface structure 14 can connect the computing device 10 and electronic devices to enable data transmission between them. Thus, when the first interface 141 supplies power to the computing device 10, data on the electronic device is transmitted to the computing device 10 through the second interface 142 for processing and can be returned to the electronic device after processing, thereby meeting the computing power requirements of hardware products in AI scenarios or other scenarios. At the same time, the multiple computing units 12 can provide more computing power support, further meeting the large computing power requirements of hardware products in AI scenarios or other scenarios. In addition, the target structure 13 can accelerate the gas flow inside the housing 11 to cool the inside of the housing 11, thereby ensuring that the computing device 10 can still be maintained within a safe temperature range when a large amount of computing is performed and a large amount of heat is generated.

[0050] In some embodiments, see Figure 3 and Figure 4 As shown, the plurality of computing units 12 may include: a first computing unit 121 and at least one second computing unit 122. The first computing unit 121 is electrically connected to the first interface 141 and signal-connected to the second interface 142; at least one second computing unit 122 is electrically connected to the first interface 141 and signal-connected to the first computing unit 121.

[0051] That is, after the second interface 142 transmits the data of the electronic device to the computing power device 10, the first computing power device 121 can perform the calculation processing, and if the first computing power device 121 cannot fully meet the computing power requirement, the part that cannot be completed can be sent to the second computing power device 122 for calculation processing by the second computing power device 122. The result processed by the second computing power device 122 can be sent to the first computing power device 121, and the first computing power device 121 can integrate or not integrate the results processed by itself and the second computing power device 122, and finally send to the electronic device through the second interface 142.

[0052] In this embodiment, the plurality of computing power devices 12 of the computing power device 10 can include the first computing power device 121 and at least one second computing power device 122, and the first computing power device 121 connects the second interface 142 and the second computing power device 122. In this way, the first computing power device 121 not only can perform calculation processing, but also can serve as a transmission structure, thereby reducing the setting of the transmission structure.

[0053] In other embodiments, the second interface 142 can also be signal connected with the plurality of computing power devices 12 respectively, that is, the plurality of computing power devices 12 can be arranged in parallel. In this way, the first interface 141 can send the same data to different computing power devices 12 for synchronous processing, and discard the processing results of the plurality of computing power devices 12 that are different from other processing results, so as to reduce the probability that the inaccurate results are caused by the failure of part of the computing power devices 12. The second interface 142 can also send different data to different computing power devices 12 for synchronous processing, so as to improve the processing efficiency of the computing power device 10.

[0054] In some embodiments, the computing power of the first computing power device 121 is greater than or equal to the computing power of the second computing power device 122.

[0055] In the case that the computing power of the first computing power device 121 is greater than the computing power of the second computing power device 122, the first computing power device 121 can provide sufficient computing power support, so as to reduce the work of the second computing power device 122. In this way, the time waste caused by the transmission of data from the first computing power device 121 to the second computing power device 122 can be relatively reduced, thereby improving the processing efficiency of the computing power device 10 and prolonging the service life of the second computing power device 122.

[0056] In the case that the computing power of the first computing power device 121 is equal to the computing power of the second computing power device 122, the first computing power device 121 and the second computing power device 122 can be manufactured by the same manufacturing device, so as to reduce the manufacturing cost of the computing power device 10.

[0057] In some embodiments, referring to Figure 3As shown, the computing power device 10 can further include a first memory 15 and a second memory, the first memory 15 is disposed in the shell 11 and is signal connected with the first computing power unit 121, and the second memory is disposed in the shell 11 and is signal connected with the second computing power unit 122.

[0058] The first memory 15 is disposed in the shell 11, so that the first memory 15 can be protected by the shell 11. The first memory 15 is signal connected with the first computing power unit 121, so that the first computing power unit 121 can call the information (such as calculation formula, calculation model, basic data, etc.) stored in the first memory 15 in the process of calculation, can temporarily store the data generated in the process in the first memory 15, can store the data after the current processing in the first memory 15 for record or next time calling, and can temporarily store the result of the calculation and processing of the second computing power unit 122 in the first memory 15.

[0059] The second memory is disposed in the shell 11, so that the second memory can be protected by the shell 11. The second memory is signal connected with the second computing power unit 122, so that the second computing power unit 122 can call the information stored in the second memory in the process of calculation, can temporarily store the data generated in the process in the second memory, and can store the data after the current processing in the second memory for record or next time calling.

[0060] In some embodiments, referring to Figure 3 As shown, the computing power device 10 can further include a carrier 16 having a first surface 161 and a second surface (not shown in the figure) opposite to each other, the first surface 161 is provided with the first computing power unit 121 and the first memory 15, and the second surface is provided with the second computing power unit 122 and the second memory, the second computing power unit 122 corresponds to the first computing power unit 121 in position, and the number of the second memory is less than the number of the first memory 15.

[0061] The carrier 16 can be, for example Figure 3The first surface 161 and the second surface are two surfaces of the carrier 16 which are opposite to each other, the first arithmetic unit 121 and the first memory 15 are arranged on the first surface 161, and the second arithmetic unit 122 and the second memory are arranged on the second surface. In this way, the heat generated during the calculation of the first arithmetic unit 121 and the heat generated during the calculation of the second arithmetic unit 122 are respectively located on the two sides of the carrier 16, so as to reduce the probability of failure of the arithmetic device 10 caused by the heat concentrated on one side of the carrier 16. In addition, the first arithmetic unit 121 and the first memory 15 are arranged on the first surface 161 of the carrier 16, and the second arithmetic unit 122 and the second memory are arranged on the second surface of the carrier 16. In this way, the problem of large size of the arithmetic device 10 caused by the fact that the first arithmetic unit 121, the first memory 15, the second arithmetic unit 122 and the second memory are concentratedly arranged on one side can be solved.

[0062] The carrier 16 can be a substrate with a circuit arrangement. In this way, the first arithmetic unit 121 and the second arithmetic unit 122 can be connected through the circuit on the carrier 16 itself, and when the second arithmetic unit 122 corresponds to the position of the first arithmetic unit 121, the first arithmetic unit 121 and the second arithmetic unit 122 can be connected through the circuit on the carrier 16 between them, so as to realize the shortest distance connection. Alternatively, the carrier 16 itself can not have a circuit arrangement, and a via hole can be formed on the carrier 16. The via hole is located between the first arithmetic unit 121 and the second arithmetic unit 122. In this way, a connecting line or the like structure connecting the first arithmetic unit 121 and the second arithmetic unit 122 can be arranged in the via hole, so as to realize the signal connection of the first arithmetic unit 121 and the second arithmetic unit 122. At the same time, when the second arithmetic unit 122 corresponds to the position of the first arithmetic unit 121, the connecting line or the like structure uses less material, so as to reduce the manufacturing cost of the arithmetic device 10. In addition, when the carrier 16 is a substrate with a circuit arrangement, the circuit of the carrier 16 itself can be connected with the first interface 141 and the second interface 142. The first surface 161 can be provided with a PCI e 8 lane specification slot connected with the circuit of the carrier 16 itself to be able to plug the first arithmetic unit 121. The second surface can be provided with a PCI e 8 lane specification slot connected with the circuit of the carrier 16 itself to be able to plug the second arithmetic unit 122.

[0063] The arithmetic power of the first arithmetic unit 121 is greater than that of the second arithmetic unit 122, so that the first arithmetic unit 121 needs a large amount of basic data and a large amount of temporary storage data generated during processing. Therefore, the number of the first memory 15 connected with the first arithmetic unit 121 is greater than that of the second memory connected with the second arithmetic unit 122, so as to respectively meet the storage requirements of the first arithmetic unit 121 and the second arithmetic unit 122, and to reduce the waste of the storage capacity of the second memory.

[0064] In some embodiments, the first computing unit 121 can be further provided with a heat-conducting structure such as heat-conducting silicone grease on the surface of the carrier 16 facing away from the first surface 161, so as to facilitate the rapid transfer of heat on the first computing unit 121 to the heat-conducting structure for dissipation, so as to ensure the normal operation of the first computing unit 121; of course, different forms of aluminum extrusions can be further provided on the first computing unit 121 and / or the heat-conducting structure, which can form heat dissipation channels to rapidly dissipate the heat around the first computing unit 121 through the heat dissipation channels to the opening 111 on the shell 11, thereby improving the heat dissipation capacity on the first surface 161 side. The second computing unit 122 can refer to the setting of the first computing unit 121 to set the corresponding heat-conducting structure and aluminum extrusion, thereby improving the heat dissipation capacity on the second surface side.

[0065] In some embodiments, referring to Figure 2 As shown, the target structure 13 can include a movable piece 131 and a wind-blocking piece 132; the movable piece 131 is provided on the first surface 161 side of the carrier 16 and is electrically connected to the first interface 141 and can be moved to generate airflow; the wind-blocking piece 132 is provided adjacent to the edge of the first surface 161 and surrounds the movable piece 131, the first computing unit 121 and the first memory 15.

[0066] The movable piece 131 is provided on the first surface 161 side of the carrier 16 to at least provide airflow to the first computing unit 121 and the first memory 15, thereby reducing the temperature of the first computing unit 121 and the first memory 15 and ensuring the normal operation of the first computing unit 121 and the first memory 15. The movable piece 131 is electrically connected to the first interface 141 to be movable and generate airflow under the condition of being powered on; the movement of the movable piece 131 can be the rotation of a fan blade, the vibration of a spring piece or other structure. The wind-blocking piece 132 can be on the edge of the first surface 161 or approach the edge of the first surface 161 but not reach the edge; the wind-blocking piece 132 can surround the movable piece 131, the first computing unit 121 and the first memory 15, so as to deliver more airflow generated by the movable piece 131 to the first computing unit 121 and the first memory 15, thereby further reducing the temperature of the first computing unit 121 and the first memory 15 and ensuring the normal operation of the first computing unit 121 and the first memory 15.

[0067] The usage probability and calculation processing amount of the second computing device 122 on the second surface side of the carrier 16 are less than or equal to the usage probability and calculation processing amount of the first computing device 121 on the first surface 161 side of the carrier 16, so that the heat on the second surface side of the carrier 16 is less than or equal to the heat on the first surface 161 side of the carrier 16. Based on this, the second surface side of the carrier 16 can not be provided with corresponding movable pieces 131 and wind-blocking pieces 132, so as to reduce the manufacturing cost of the computing power equipment 10, or the second surface side of the carrier 16 can be provided with corresponding movable pieces 131 and wind-blocking pieces 132, so as to cool the second computing device 122 and the second memory, thereby prolonging the service life of the second computing device 122 and the second memory.

[0068] In some embodiments, referring to Figure 2 As shown, the first surface 161 can be provided with a plurality of first plug-in parts 1611; the movable piece 131 can be provided with a plurality of second plug-in parts (not shown in the figure) so that the movable piece 131 can be plugged with the first plug-in parts 1611 of the first region of the first surface 161 and can be unplugged from the first region and plugged with the first plug-in parts 1611 of the second region of the first surface 161. The first region and the second region are two different regions of the first surface 161.

[0069] It can also be said that among the first plug-in parts 1611 and the second plug-in parts, one can be a plug-in column and the other can be a plug-in slot, and since the number of plug-in columns and plug-in slots is multiple, the plug-in region can be changed to change the position of the movable piece 131 relative to the first surface 161, thereby cooling different positions of the first surface 161. For example: the first surface 161 is also provided with other electronic devices that generate heat during work, so that the position of the movable piece 131 can be changed to mainly cool the first computing device 121 and the electronic devices; for another example: after the computing power equipment 10 is used for a period of time, it is found that the heat at another position of the first surface 161 is relatively concentrated, and then the movable piece 131 can be adjusted to the position where the heat is relatively concentrated, so as to improve the cooling effect of the computing power equipment 10. It can be understood that the change of the position of the movable piece 131 can occur in the wind-blocking piece 132, or can break through the wind-blocking piece 132, and when breaking through the wind-blocking piece 132, the position of the wind-blocking piece 132 can be adjusted adaptively, and the wind-blocking piece 132 can also be provided with a third plug-in part capable of plugging the first plug-in part 1611, so as to conveniently adjust the position of the movable piece 131.

[0070] In an example, referring to Figure 2 and Figure 3As shown, the first surface 161 is provided with a plurality of rows and columns of regularly arranged first plug-in parts 1611, the first plug-in part 1611 is a plug-in column, and the movable part 131 is provided with a plurality of second plug-in parts which are plug-in slots; part of the second plug-in parts of the movable part 131 are plugged with part of the first plug-in parts 1611, and are opposite to the position of the first computing device 121, so as to at least cool the first computing device 121 and the environment around the first computing device 121, and meanwhile, the first plug-in parts 1611 which are not plugged can abut against the inner surface of the shell 11 to support the shell 11, and at the same time, the heat in the shell 11 can be guided to the outside of the shell 11 through the first plug-in parts 1611 to further reduce the temperature in the shell 11.

[0071] In some embodiments, referring to Figure 3 and Figure 4 As shown, the computing power device 10 can further include a switching structure 17 and a second interface structure 18, the switching structure 17 is signal-connected with the first computing device 121 and the second computing device 122 respectively; the second interface structure 18 is signal-connected with the switching structure 17 and is provided with at least one connection interface, the connection interface is exposed or not exposed from the outer surface of the shell 11, and the connection interface is used to connect a functional device, the functional device including at least one of the following: a storage device 19, a wireless communication device 20.

[0072] The switching structure 17 is signal-connected with the first computing device 121 and the second computing device 122 respectively, so as to convert and apply the signals of the first computing device 121 and the second computing device 122 to the signals of the second interface structure 18, and meanwhile, the connection interface of the second interface structure 18 can connect the storage device 19, the wireless communication device 20, etc., in the case of connecting the storage device 19, the data of the first computing device 121 and the second computing device 122 can be stored in the storage device 19, and the contents stored in the storage device 19 can also be retrieved; in the case of connecting the wireless communication device 20, the wireless communication device 20 can provide network support for the plurality of computing devices 12.

[0073] In the case that the connection interface is exposed from the outer surface of the shell 11, the functional device can be located outside the computing power device 10; in the case that the connection interface is not exposed from the outer surface of the shell 11, the connection interface can be located inside the shell 11 and connect the functional device inside the shell 11, for example, referring to Figure 3 As shown, the connection interface is an M.2 plug-in interface 191 and is arranged inside the shell 11, so as to plug the storage device 19 on the M.2 plug-in interface 191 and locate the storage device 19 inside the shell 11, thereby facilitating synchronous carrying of the storage device 19.

[0074] In some embodiments, referring to Figures 1 to 4As shown, the first interface structure 14 can further include a network interface 143 exposed from the outer surface of the shell 11 for connecting with a network device (such as a network cable). In this way, the network interface 143 can provide network support for the computing power device 10.

[0075] The second aspect

[0076] The present disclosure also provides an electronic system, which can include an electronic device and the computing power device 10. The electronic device has a signal interface. The computing power device 10 includes a shell 11, a plurality of computing power units 12, a target structure 13, and a first interface structure 14. The plurality of computing power units 12 are arranged in the shell 11. The target structure 13 is arranged in the shell 11 and can accelerate the flow of gas in the shell 11. The first interface structure 14 at least includes a first interface 141 and a second interface 142. The first interface 141 is exposed from the outer surface of the shell 11 for electrical connection with a power supply, and the first interface 141 is electrically connected with the plurality of computing power units 12. The second interface 142 is exposed from the outer surface of the shell 11 for signal connection with the signal interface of the electronic device, and the second interface 142 is signal connected with the plurality of computing power units 12.

[0077] The electronic device can be a mobile phone, a tablet computer, a notebook computer, an all-in-one computer, etc. The second interface 142 of the computing power device 10 is signal connected with the signal interface of the electronic device, so that the data of the electronic device can be transmitted to the computing power device 10 through the signal interface and the second interface 142 for computing processing, and the result is returned to the electronic device, so that the computing power support of the electronic device can be met.

[0078] It should be noted that the computing power device in the electronic system provided by the present disclosure is similar to the description of the computing power device embodiments described above, and has similar beneficial effects as the computing power device embodiments described above. For technical details not disclosed in the electronic system embodiments of the present disclosure, please refer to the description of the computing power device embodiments in the present disclosure for understanding, which will not be described here.

[0079] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0080] Although some specific embodiments of the present disclosure have been described in detail by way of examples, one skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present disclosure. One skilled in the art should understand that the above embodiments can be modified or equivalent replacements can be made to some technical features without departing from the scope and spirit of the present disclosure. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict.

Claims

1. A computing power device, characterized in that, The application comprises: a shell; a plurality of computing units arranged in the shell; a target structure arranged in the shell and capable of accelerating the flow of gas in the shell; a first interface structure comprising at least a first interface exposed from the outer surface of the shell for electrical connection with a power supply and electrically connected with the plurality of computing units, and a second interface exposed from the outer surface of the shell for signal connection with an electronic device and signal connected with the plurality of computing units.

2. The computing device according to claim 1, wherein the plurality of computing units comprise: a first computing unit electrically connected with the first interface and signal connected with the second interface; at least one second computing unit electrically connected with the first interface and signal connected with the first computing unit.

3. The computing device according to claim 2, wherein the computing power of the first computing unit is greater than or equal to the computing power of the second computing unit. Further comprising:

4. The computing power device of claim 3, wherein, a first memory arranged in the shell and signal connected with the first computing unit; a second memory arranged in the shell and signal connected with the second computing unit. Further comprising:

5. The computing power device of claim 4, wherein, a carrier having a first surface and a second surface opposite to each other; the first surface is provided with the first computing unit and the first memory; the second surface is provided with the second computing unit and the second memory, the second computing unit is positionally corresponding to the first computing unit, and the number of the second memory is less than the number of the first memory.

6. The computing device according to claim 5, wherein the target structure comprises a movable member and a wind-blocking member; the movable member is arranged on the first surface side of the carrier, electrically connected with the first interface, and capable of moving to generate air flow; the wind-blocking member is arranged adjacent to the edge of the first surface and surrounds the movable member, the first computing unit and the first memory.

7. The computing device according to claim 6, wherein the first surface is provided with a plurality of first plug-in parts; the movable member is provided with a plurality of second plug-in parts, so that the movable member can be plugged into the first plug-in parts of the first area of the first surface, and can be unplugged from the first area and plugged into the first plug-in parts of the second area of the first surface. Further comprising:

8. The computing power device according to any one of claims 2 to 7, wherein, an adapter structure signal connected with the first computing unit and the second computing unit respectively; a second interface structure signal connected with the adapter structure and provided with at least one connection interface exposed or not exposed from the outer surface of the shell, the connection interface being used for connecting a functional device, the functional device comprising at least one of the following: a storage device, a wireless communication device.

9. The computing device according to claim 1, wherein the first interface structure further comprises a network interface exposed from the outer surface of the shell for connection with a network device. The application comprises:

10. An electronic system, characterized by an electronic device having a signal interface; a computing device comprising: a shell; a plurality of computing units arranged in the shell; ​ A target structure is arranged in the shell and is capable of accelerating the gas flow in the shell. The first interface structure comprises at least a first interface and a second interface. The first interface is exposed from the outer surface of the shell for electrical connection with a power supply, and the first interface is electrically connected with the plurality of computing units. The second interface is exposed from the outer surface of the shell for signal connection with a signal interface of the electronic device, and the second interface is signal connected with the plurality of computing units.

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