Information integration memory

Abstract

The utility model discloses an information integrated memory, which belongs to the technical field of electronic components and comprises an integrated memory outer shell and pins positioned on two sides of the integrated memory outer shell, L-shaped sliding grooves are arranged on two sides of the integrated memory outer shell along the length direction, and L-shaped sliding plates are arranged in the L-shaped sliding grooves in a sliding manner. The L-shaped sliding grooves are formed in the two sides, close to the pins, of the outer shell of the integrated memory, the L-shaped sliding plates are arranged in the L-shaped sliding grooves in a sliding mode, and the side check blocks and the check strips are arranged at the positions, corresponding to the pins, of the L-shaped sliding plates respectively, so that the pins can be protected in the transportation process, the pins are prevented from being bent, and the service life of the integrated memory is prolonged. In addition, in the welding process, the barrier strip can be controlled to move to the position between the two sets of pins, the barrier effect is achieved in the welding process, electrical connection between soldering tin liquid at the positions of the adjacent pins is effectively avoided, and stable transmission of signals is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to an integrated memory, in particular to an information integrated memory belongs to electronic component technical field. BACKGROUND

[0002] The prior art such as the utility model with the application number 202222149779.6 discloses an integrated memory, in order to solve the problem that pin is welded to the circuit board, cannot be pasted on the circuit board, causes the false welding, and the heat dissipation effect of integrated memory electronic component is poor, shortens the service life of component, the through hole is set up on the pin, the solder paste is melted into liquid under high-temperature heating, the capillary phenomenon principle is utilized, the solder paste is climbed up through the through hole, the area of the solder paste of the pin is increased, thereby the welding effect is strengthened, false welding is avoided, the heat dissipation assembly is driven on by the input power supply of the memory body, the heat dissipation assembly plays a heat dissipation role to the memory body, effectively prolongs the service life of the memory body, the utility model effectively strengthens the welding effect, simultaneously has the heat dissipation function, effectively prolongs the service life of device.

[0003] Similar to the above application, there are still some deficiencies:

[0004] During the transportation of the integrated memory, the pins are lack of protection, which can easily cause damage to the pins, affect the welding use, and during the welding process of the integrated memory, due to the lack of blocking between the two pins, too much soldering tin between the adjacent pins can be caused by carelessness during welding, which can cause electrical connection between the adjacent pins, which can damage the original normal signal transmission path of the pin and cause various faults.

[0005] Therefore, an information integrated memory is designed to optimize the above problems. UTILITY MODEL CONTENTS

[0006] The main purpose of the utility model is to provide an information integrated memory to solve the problems in the background art.

[0007] The purpose of the utility model can be achieved by adopting the following technical solutions:

[0008] An information integrated memory, comprising an integrated memory shell and pins located on both sides of the integrated memory shell, L-shaped sliding grooves are formed on both sides of the integrated memory shell along the length direction, L-shaped sliding plates are slidably arranged in the L-shaped sliding grooves, the L-shaped sliding plates can slide in the L-shaped sliding grooves along the length direction and the up-down direction, side blocks are uniformly installed on one end of the L-shaped sliding plates outside the L-shaped sliding grooves, the side blocks are attached to the outer side of the pins, and the other end of the side blocks away from the L-shaped sliding plates is fixed with a blocking bar attached to the bottom of the pin.

[0009] Preferably, the thickness of the L-shaped sliding plate bottom is less than half of the thickness of the L-shaped sliding groove bottom, the distance between the L-shaped sliding plate bottom and the L-shaped sliding groove inner bottom is greater than the thickness of the pin, and the vertical length of the L-shaped sliding plate end is greater than the thickness of the L-shaped sliding groove bottom.

[0010] Preferably, the side block and the blocking strip are made of the same material, and the side block and the blocking strip are both high-temperature-resistant resin.

[0011] Preferably, the blocking strip is provided with a tapered protrusion along the length direction away from the pin side, and the width of the blocking strip is less than the distance between adjacent pins.

[0012] Preferably, the side surface of the side block abutting the pin is provided with a rubber pad, and the side edge of the rubber pad is provided with anti-skid lines.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] The utility model discloses a L-shaped sliding groove is set up on the both sides of the integrated memory shell body near the pin, and the L-shaped sliding plate is slidably arranged in the L-shaped sliding groove, and the side block and the blocking strip are arranged on the L-shaped sliding plate corresponding to the position of the pin, which can protect the pin during transportation and avoid bending of the pin. In addition, during welding, the blocking strip can be moved between the two groups of pins, which plays a blocking role during welding, effectively avoids electrical connection between the adjacent pins, and ensures stable signal transmission. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the pin protection state of the utility model from below view;

[0016] Figure 2 It is the welding state structure of the utility model from below view;

[0017] Figure 3 It is the integrated memory shell body structure of the utility model from below view;

[0018] Figure 4 It is the end section view local structure diagram of the utility model.

[0019] In the drawing: 1, integrated memory shell body;

[0020] 2, pin;

[0021] 3, L-shaped sliding groove;

[0022] 4, L-shaped sliding plate;

[0023] 5, side block;

[0024] 6, blocking strip. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments.

[0026] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the claimed application, but merely represents some embodiments of the application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0027] It should be noted that the embodiments in the present application and the features and technical solutions in the embodiments can be combined with each other without conflict.

[0028] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0029] In the description of the present application, it should be noted that the terms "upper", "lower" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, or the orientation or positional relationship commonly understood by those skilled in the art, such terms are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only used for differentiation, and cannot be understood as indicating or implying relative importance.

[0030] Embodiment 1

[0031] As Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, this embodiment proposes an integrated information memory, including an integrated memory housing 1 and pins 2 located on both sides of the integrated memory housing 1. L-shaped grooves 3 are formed along the length direction on both sides of the integrated memory housing 1. L-shaped sliding plates 4 are slidably disposed inside the L-shaped grooves 3, and can slide along the length direction and vertically within the L-shaped grooves 3. Side blocks 5 are evenly installed at the ends of the L-shaped sliding plates 4 located outside the L-shaped grooves 3, and the side blocks 5 are attached to the outer side of the pins 2. A stop strip is fixed to the end of each side block 5 away from the L-shaped sliding plate 4, and this stop strip is attached to the bottom of the pin 2. 6. Before the integrated memory is used, the side block 5 and the baffle 6 are in contact with the pin 2, which protects the pin 2. When the integrated memory is soldered, the L-shaped slide plate 4 is dragged and slid horizontally inside the L-shaped slide groove 3 to move the baffle 6 between the two sets of pins 2. The L-shaped slide plate 4 is then controlled to slide up and down again, so that one side of the baffle 6 is attached to the bottom of the integrated memory housing 1 and the other side is attached to the surface of the circuit board. During the soldering process, an effective barrier is formed between the two sets of pins 2, preventing electrical connection between the solder liquid at adjacent pins.

[0032] Example 2

[0033] The solution in Example 1 will be further described below with reference to its specific working method.

[0034] like Figure 4 As shown, in a preferred embodiment, based on the above method, the thickness of the bottom of the L-shaped slide plate 4 is less than half the thickness of the bottom of the L-shaped groove 3, and the distance between the bottom of the L-shaped slide plate 4 and the bottom of the L-shaped groove 3 is greater than the thickness of the pin 2. The vertical length of the end of the L-shaped slide plate 4 is greater than the thickness of the bottom of the L-shaped groove 3. The L-shaped groove 3 can effectively limit the L-shaped slide plate 4 and prevent the L-shaped slide plate 4 from separating from the L-shaped groove 3. After the L-shaped slide plate 4 slides horizontally and separates the side block 5 and the baffle 6 from the pin 2, during installation, the baffle 6 will fit tightly against the integrated memory housing 1, while the bottom contacts the circuit board, forming upper and lower interception, improving the interception effect of solder liquid.

[0035] like Figure 4 As shown, in a preferred embodiment, based on the above method, the side block 5 and the baffle 6 are made of the same material. Both the side block 5 and the baffle 6 are made of high-temperature resistant resin. The high-temperature resistant resin has the characteristics of high temperature and insulation, which ensures the isolation effect.

[0036] like Figure 2 and Figure 4As shown, as a preferred embodiment, on the basis of the above-mentioned mode, further, the blocking strip 6 is provided with a tapered protrusion away from the side of the pin 2 along the length direction, and the width of the blocking strip 6 is smaller than the spacing between the adjacent pins 2, in the process of installation, the middle position of the bottom of the blocking strip 6 has a greater pressure on the circuit board, effectively preventing the solder liquid from flowing through.

[0037] As shown, as a preferred embodiment, on the basis of the above-mentioned mode, further, the blocking strip 6 is provided with a tapered protrusion away from the side of the pin 2 along the length direction, and the width of the blocking strip 6 is smaller than the spacing between the adjacent pins 2, in the process of installation, the middle position of the bottom of the blocking strip 6 has a greater pressure on the circuit board, effectively preventing the solder liquid from flowing through. Figure 4

[0038] Embodiment 3

[0039] The schemes in Embodiment 1 and Embodiment 2 are further introduced in combination with specific working modes, and details are described below:

[0040] Before the integrated memory is used, the side block 5 and the blocking strip 6 are in a state of being attached to the pins, the rubber pad on the side block 5 can ensure the attachment effect between the side block 5 and the pins 2 in the protection process, and the pins are safely protected, when the integrated memory is welded, the L-shaped sliding plate 4 is horizontally slid in the L-shaped sliding groove 3, the blocking strip 6 is moved to between the two groups of pins 2, and the L-shaped sliding plate 4 is controlled to slide up and down again, one side of the blocking strip 6 is attached to the bottom of the integrated memory shell 1, and the tapered protrusion on the other side is attached to the surface of the circuit board, the circuit board has a greater pressure, and the blocking strip 6 plays a good blocking role in welding, effectively preventing the solder liquid from flowing through, when the tapered protrusion is attached to the surface of the circuit board, the pins 2 and the welding points have a certain small gap therebetween, so that the solder liquid is connected between the pins 2 and the welding points, and the side of the pin 2 is wrapped, and the stability of the solder is increased.

[0041] The above is only a further embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and concept of the present application within the scope disclosed by the present application, and all of them belong to the protection scope of the present application.​

Claims

1. An information integrated memory comprising an integrated memory housing (1) and pins (2) on both sides of the integrated memory housing (1), characterized in that: The both sides of the integrated memory shell (1) are provided with L-shaped sliding grooves (3) along the length direction, the inside of the L-shaped sliding grooves (3) is provided with L-shaped sliding plates (4) slidingly, the L-shaped sliding plates (4) can slide along the length direction and the up-down direction in the L-shaped sliding grooves (3), the one end of the L-shaped sliding plates (4) outside the L-shaped sliding grooves (3) is uniformly provided with side stop blocks (5), the side stop blocks (5) are attached to the outside of the pins (2), the one end of the side stop blocks (5) away from the L-shaped sliding plates (4) is fixed with stop strips (6) attached to the bottom of the pins (2).

2. The information integration memory of claim 1, wherein: The thickness of the bottom of the L-shaped sliding plates (4) is less than half of the thickness of the bottom of the L-shaped sliding grooves (3), the distance between the bottom of the L-shaped sliding plates (4) and the inside bottom of the L-shaped sliding grooves (3) is greater than the thickness of the pins (2), and the vertical length of the end of the L-shaped sliding plates (4) is greater than the thickness of the bottom of the L-shaped sliding grooves (3).

3. The information integrated memory according to claim 2, wherein: The material of the side stop blocks (5) and the stop strips (6) is the same, and the side stop blocks (5) and the stop strips (6) are high-temperature-resistant resin.

4. The information integrated memory according to claim 3, wherein: The side away from the pins (2) of the stop strips (6) is provided with a tapered protrusion along the length direction, and the width of the stop strips (6) is less than the distance between the adjacent pins (2).

5. The information-integrated memory according to claim 1, wherein: The side of the side stop blocks (5) attached to the pins (2) is provided with a rubber pad, and the side of the rubber pad is provided with anti-slip lines.

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