Frame structure of semiconductor chip
By setting disconnect gaps and slots in the QFN frame structure and using tool cutting and green paint filling, the problems of limited pin count and short circuits are solved, resulting in a more efficient manufacturing process and reduced costs.
Patent Information
- Application Number
- CN202423163957.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-20
AI Technical Summary
In the existing QFN frame structure, the pin connecting ribs need to pass through the gaps between the outer ring pins, which limits the number of pins. Furthermore, cutting burrs may cause short circuits between the inner and outer ring pins, making the process complex and costly.
The method involves setting a break gap between the inner and outer ring pins on the front side of the pin connecting rib, forming a break groove by cutting with a tool, and filling it with green paint to avoid short circuits. This method replaces the etching process and simplifies the cutting process by using staggered cutting channels and extensions.
The increased number of pins in the inner and outer rings prevents short circuits, simplifies the manufacturing process, and reduces costs.
Smart Images
Figure CN223693126U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor packaging technical field especially relates to a frame structure of semiconductor chip. BACKGROUND
[0002] Double-circle QFN is a common integrated circuit packaging form, which has high integration and good electrical performance. The current QFN frame includes outer circle pins and inner circle pins, the outer circle pins are directly fixed on the webs, and the inner circle pins need to pass through the gap between the outer circle pins and then be fixed with the cutting web.
[0003] Such setting has the following defects: first, because the pin web needs to pass through the gap between the two outer circle pins, the gap between the two outer circle pins is too large, and the number of pins that can be placed is limited; second, in order to make the pin web of the inner circle pin pass through the gap between the two outer circle pins, a half-etching area needs to be designed on the front surface of the frame, which reduces the soldering space of the outer circle pin; third, after the web is cut, cutting burrs will be generated between the pin web and the outer circle pin, which will cause the pin web and the outer circle pin to contact and cause short circuit. SUMMARY
[0004] In view of the above shortcomings of the prior art, the technical problem to be solved by the utility model is to provide a frame structure of semiconductor chip, which solves the problem that the number of pins is limited due to the pin web passing through the gap between the outer circle pins in the prior art.
[0005] The utility model solves the technical problems by adopting the technical scheme of a frame structure of semiconductor chip, which comprises a plurality of packaging bodies, the packaging body comprises:
[0006] A base island is used to carry a chip;
[0007] The outer circle of the base island is provided with a plurality of pin webs connected head to tail, the front surface of the pin web is provided with a plurality of inner circle pins and a plurality of outer circle pins, and the inner circle pin and the outer circle pin have a disconnection gap therebetween;
[0008] The back surface of the pin web is provided with a cutting part, the pin web allows a cutter to cut along the cutting part to form a disconnection groove connected with the disconnection gap.
[0009] Further, the disconnection groove is filled with green paint.
[0010] Further, a plurality of base island webs are arranged between the pin web and the base island.
[0011] Further, the cutter is disc-shaped, the peripheral wall of the cutter can be in contact with the cutting part, and the cutter is rotated to cut the cutting part;
[0012] Each of the two ends of the pin web respectively extends outward to form an extension section, and when the cutter cuts to the end of the pin web, at least part of the cutter is above the extension section.
[0013] Further, the extension section of any of the pin webs is connected with the extension section of the adjacent pin web.
[0014] Further, a plurality of the pin webs are arranged transversely and longitudinally on the frame structure, and any of the pin webs is perpendicular, parallel or in the same straight line with another pin web.
[0015] Further, a cutting channel is arranged between any two adjacent parallel pin webs, and the cutter can cut along the cutting channel to divide the frame structure into a plurality of the packages.
[0016] Further, a plurality of the cutting channels are transversely and longitudinally staggered, and a plurality of the transversely arranged cutting channels are connected head to tail, and a plurality of the longitudinally arranged cutting channels are connected head to tail.
[0017] Compared with the prior art, the utility model has at least the following beneficial effects:
[0018] (1) When connecting the inner circle pin, no additional web is arranged to pass through the outer circle pin, the distance between the two outer circle pins can be reduced, the arrangement number of the inner and outer circle pins is improved, and the product performance is enhanced. At the same time, since no additional web is arranged to pass through the gap between the two outer circle pins, no half-etching area needs to be arranged on the front of the frame, and the process is simplified.
[0019] (2) After the cutter cuts off the pin web, the inner circle pin and the outer circle pin are completely separated, even if burrs are generated after cutting, the burrs cannot connect with the pin on the other side through the break groove, so that the short circuit between the inner circle pin and the outer circle pin caused by the cutting burrs is avoided.
[0020] (3) The break groove is filled with green paint, which can avoid the tin paste entering the break groove during the soldering process to cause the short circuit between the inner circle pin and the outer circle pin.
[0021] (4) The cutter is used to disconnect the inner circle pin and the outer circle pin, so as to replace the original scheme of disconnecting the inner and outer circle pins through etching process, and the manufacturing process difficulty and manufacturing cost of the package are reduced.
[0022] (5) The end of the pin web is provided with an extension section, which can allow the outermost side of the cutter to continue to cut after reaching the end of the pin web, so that the lowest point of the cutter can continue to cut towards the end of the pin web until the lowest point of the cutter cuts to the end of the pin web or directly through the end of the pin web to cut off the pin web, ensuring that the inner ring pins and the outer ring pins are completely disconnected. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 is a schematic view of the frame structure in the embodiment;
[0024] Figure 2 is a back view of the package in the embodiment;
[0025] Figure 3 is a schematic view of the package in the embodiment;
[0026] Figure 4 is a sectional view of the pin web in the embodiment;
[0027] In the drawings:
[0028] 100, package; 110, pin web; 111, disconnection gap; 112, disconnection groove; 120, inner ring pin; 130, outer ring pin; 140, cutting channel; 150, base island; 160, base island web. DETAILED DESCRIPTION
[0029] The following is a specific embodiment of the present application and further describes the technical solution of the present application in combination with the drawings, but the present application is not limited to these embodiments.
[0030] Please refer to Figures 1-4 The present application discloses a frame structure of a semiconductor chip, comprising a plurality of packages 100, wherein each package 100 comprises:
[0031] a base island 150 for carrying a chip;
[0032] The outer ring of the base island 150 is provided with a plurality of pin webs 110 connected head to tail, the front surface of the pin web 110 is provided with a plurality of inner ring pins 120 and a plurality of outer ring pins 130, and the inner ring pin 120 and the outer ring pin 130 have a disconnection gap 111 therebetween;
[0033] The back surface of the pin web 110 is provided with a cutting portion, and the pin web 110 allows a cutter to cut along the cutting portion to form a disconnection groove 112 connected with the disconnection gap 111.
[0034] Specifically, the application sets multiple pin webs 110 on the outer ring of the base island 150, sets inner ring pins 120 and outer ring pins 130 on the two sides of the front of the pin web 110 respectively, and has a disconnection gap 111 between the inner ring pin 120 and the outer ring pin 130; the back of the pin web 110 is provided with a cutting part, and the pin web 110 is cut along the cutting part by a cutter, thereby forming a disconnection groove 112 that can communicate with the disconnection gap 111. That is, after the pin web 110 is cut off by the cutter, the connection of the inner ring pin 120 and the outer ring pin 130 can be disconnected.
[0035] The above arrangement of the application realizes the arrangement of the inner and outer ring pins 130, and when the inner ring pin 120 is connected, it is not necessary to additionally set a web to pass through the outer ring pin 130, which can reduce the spacing between the two outer ring pins 130, increase the arrangement number of the inner and outer ring pins 130, and enhance the product performance. At the same time, since it is not necessary to additionally set a web to pass through the gap between the two outer ring pins 130, it is not necessary to set a half-etching area on the front of the frame, thereby simplifying the process. Furthermore, after the pin web 110 is cut off by the cutter, the inner ring pin 120 and the outer ring pin 130 are completely separated, and even if burrs are generated after cutting, these burrs cannot connect with the pins on the other side through the disconnection groove 112, thereby avoiding the short circuit of the inner ring pin 120 and the outer ring pin 130 caused by cutting burrs.
[0036] Further, the disconnection groove 112 is filled with green paint.
[0037] Specifically, filling the disconnection groove 112 with green paint can avoid the tin paste from entering the disconnection groove 112 during the soldering process, thereby avoiding the short circuit of the inner ring pin 120 and the outer ring pin 130.
[0038] Further, multiple base island webs 160 are arranged between the pin web 110 and the base island 150.
[0039] Specifically, the base island webs 160 connect the base island 150 and the pin web 110. The cross section of the base island 150 is in the shape of a quadrilateral, and four base island webs 160 are connected to the base island 150, and the four base island webs 160 are arranged at the four corners of the base island 150.
[0040] Further, the cutter is in the shape of a disc, the peripheral wall of the cutter can be in contact with the cutting part, and the cutter is rotated to cut the cutting part.
[0041] The two ends of each pin web 110 respectively extend outward to form an extension, and when the cutter cuts the end of the pin web 110, at least part of the cutter is above the extension.
[0042] It should be noted that the cutter is disc-shaped, and the peripheral wall of the disc-shaped cutter moves and cuts the leg connecting rib 110 by self-rotation of the disc-shaped cutter. However, because the cutter is disc-shaped, the part of the cutter that acts on the cutting is only the lowest point of the side wall. When the outermost side of the cutter is just at the end of the leg connecting rib 110, the lowest point of the cutter has not yet cut to the end of the leg connecting rib 110, and there is a problem that the cutter cannot continue to cut, but the leg connecting rib 110 has not been completely cut off.
[0043] Based on this, an extension section is arranged at the end of the leg connecting rib 110, which can allow the outermost side of the cutter to continue to cut after reaching the end of the leg connecting rib 110, so as to make the lowest point of the cutter continue to cut towards the end of the leg connecting rib 110 until the lowest point of the cutter cuts to the end of the leg connecting rib 110 or directly passes through the end of the leg connecting rib 110 to cut off the leg connecting rib 110, thereby ensuring that the inner ring leg 120 and the outer ring leg 130 are completely disconnected.
[0044] Furthermore, the disconnection of the inner ring leg 120 and the outer ring leg 130 is realized by the cutter, which replaces the original scheme of disconnecting the inner and outer ring legs 130 by etching process, thereby reducing the manufacturing process difficulty and manufacturing cost of the package.
[0045] Further, the extension section of any of the leg connecting ribs 110 is connected to the extension section of an adjacent leg connecting rib.
[0046] Further, a plurality of the leg connecting ribs 110 are arranged on the frame structure in a horizontal and vertical staggered manner, and any of the leg connecting ribs 110 is perpendicular to, parallel to, or in the same straight line as another leg connecting rib 110.
[0047] Specifically, a plurality of leg connecting ribs 110 are arranged in the same straight line, and the extension sections of the end portions of the adjacent two leg connecting ribs 110 are connected to each other, and the cutter only needs to cut in the same direction when cutting, without the need for multiple turns, so as to reduce the cutting difficulty.
[0048] Further, a cutting channel 140 is arranged between any two adjacent parallel leg connecting ribs 110, and the cutter can cut along the cutting channel 140 to divide the frame structure into a plurality of the packages 100.
[0049] Further, a plurality of the cutting channels 140 are distributed in a horizontal and vertical staggered manner, and the plurality of the cutting channels 140 arranged horizontally are connected end to end, and the plurality of the cutting channels 140 arranged vertically are connected end to end.
[0050] Specifically, the cutting channel 140 is arranged between the two connected and parallel leg connecting ribs 110, and the cutter cuts along the cutting channel 140 to divide the entire frame into a plurality of the packages 100.
[0051] Meanwhile, since the plurality of cutting channels 140 are arranged in a crisscross manner and the plurality of cutting channels 140 in the same straight line are connected end to end, the cutter only needs to feed in one direction in a single cutting, without turning, and after the cutting in the straight line is completed, the cutter can enter the next straight line for cutting.
[0052] It should be noted that all directional indications, such as upper, lower, left, right, front, back, etc., in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications will also change accordingly.
[0053] In addition, the descriptions such as "first", "second", "one" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0054] In the present application, unless otherwise specifically defined and limited, the terms "connection", "fixing" and the like should be understood in a broad sense, for example, "fixing" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0055] In addition, the technical solutions of each embodiment of the present application can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor is it within the scope of protection required by the present application.
Claims
1. A frame structure of a semiconductor chip, characterized by, The package includes a plurality of packages, the package comprising: a base island for carrying a chip; an outer ring of the base island is provided with a plurality of pin webs connected head to tail, a front surface of the pin web is provided with a plurality of inner ring pins and a plurality of outer ring pins, and the inner ring pins and the outer ring pins have a disconnection gap therebetween; a back surface of the pin web is provided with a cutting portion, the pin web allows a cutter to cut along the cutting portion to form a disconnection groove connected to the disconnection gap.
2. The frame structure of a semiconductor chip according to claim 1, wherein The disconnection groove is filled with green paint.
3. The frame structure of a semiconductor chip according to claim 1, wherein A plurality of base island webs are arranged between the pin web and the base island.
4. The frame structure of a semiconductor chip according to claim 1, wherein The cutter is disc-shaped, a peripheral wall of the cutter is in contact with the cutting portion, and the cutter is rotated to cut the cutting portion; two ends of each pin web respectively extend outward to form an extension segment, and when the cutter cuts to the end of the pin web, at least part of the cutter is above the extension segment.
5. The frame structure of a semiconductor chip according to claim 4, wherein The extension segment of any pin web is connected to the extension segment of an adjacent pin web.
6. The frame structure of a semiconductor chip according to claim 5, wherein A plurality of pin webs are arranged horizontally and vertically on the frame structure, and any pin web is perpendicular, parallel or in the same straight line with another pin web.
7. The frame structure of a semiconductor chip according to claim 6, wherein A cutting channel is arranged between any two adjacent parallel pin webs, and the cutter can cut along the cutting channel to divide the frame structure into a plurality of packages.
8. The frame structure of a semiconductor chip according to claim 7, wherein A plurality of cutting channels are horizontally and vertically staggered, a plurality of horizontally arranged cutting channels are connected head to tail, and a plurality of vertically arranged cutting channels are connected head to tail.