Interface circuit board, control board card and display equipment

Abstract

The utility model provides an interface circuit board, a control board card and a display device. The interface circuit board comprises a substrate, a first connection module, at least two signal ports and at least two routing modules. The first connecting modules, the signal ports and the wiring modules are all arranged on the substrate, the signal ports and the wiring modules are in one-to-one correspondence, the signal ports are electrically connected with the first connecting modules through a plurality of wires in the corresponding wiring modules, and the distance between every two adjacent wires in the wiring modules is adjustable. Wherein each signal port is used for being electrically connected with external equipment; the first connection module is used for electrically connecting a mainboard. According to the interface circuit board, the laminated signal ports are electrically connected with the main board in a circuit board mode, DIP design does not need to be adopted, the defects of the DIP design are overcome, the difficulty of impedance control is reduced, and the electromagnetic compatibility performance in a high-resolution use scene is improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of electronic equipment, in particular to an interface circuit board, a control board card and a display device. BACKGROUND

[0002] With the improvement of video definition and the increasing complexity of video processing, the High Definition Multimedia Interface (HDMI) is applied more and more widely in the video processing process. In the device with many HDMI branches, a laminated terminal layout is often used to save space, such as shown in FIG. 1, one HDMI terminal (1, 2) is laminated and arranged above and below, which not only saves space but also expands the video distribution function. Figure 1

[0003] In the current laminated HDMI terminal design, a Dual In-line Package (DIP) design is often used. However, in this design, the pin type pin is relied on to physically connect with the mainboard. With the continuous improvement of display resolution, the working clock frequency of the signal is getting higher and higher, and the impedance requirement of the signal transmission line is getting higher and higher. However, when the pin type pin is used to transmit high-resolution (i.e. high-definition) signals, the impedance of the pin type pin is difficult to control, which leads to electromagnetic compatibility problems, affecting the stability and quality of signal transmission. CONTENT OF THE UTILITY MODEL

[0004] Embodiments of the present application provide an interface circuit board, a control board card and a display device. By directly connecting the circuit board with the mainboard, the DIP design is not needed, and the electromagnetic compatibility problem caused by the DIP design in the related art is solved.

[0005] In a first aspect, embodiments of the present application provide an interface circuit board, which comprises a substrate, a first connection module, at least two signal ports and at least two wiring modules. The first connection module, the signal ports and the wiring modules are all arranged on the substrate. The signal ports correspond to the wiring modules one by one. Each signal port is electrically connected to the first connection module through a plurality of conductive lines in the corresponding wiring module. The distance between two adjacent conductive lines in the wiring module is adjustable. Each signal port is used to electrically connect an external device. The first connection module is used to electrically connect a mainboard.

[0006] ​In the interface circuit board, the signal ports in the stack are electrically connected with the main board in the form of a circuit board, without using DIP design, avoiding the defects of DIP design. In addition, in the DIP design, the distance between the pin type pins is fixed and limited by the packaging form, and it is difficult to flexibly adjust the distance between the pins according to actual needs, which makes impedance control difficult, and further affects the signal transmission quality and electromagnetic compatibility. In the interface circuit board provided in the application, the distance between the adjacent two wires in the wiring module is adjustable, so that the distance between the plurality of wires in the wiring module is smaller than the distance between the pin type pins in the DIP design. When designing and laying out the wiring module, the distance between the actual wires and the distance between the wires and the ground can be flexibly controlled by adjusting the distance between the adjacent two wires, which reduces the difficulty of impedance control, improves the electromagnetic compatibility performance in high-resolution use scenarios, and improves the stability and transmission quality in the signal transmission process.

[0007] In some embodiments, the signal port is a high-definition multimedia interface.

[0008] In this embodiment, the plurality of wires in the wiring module are used to transmit differential signals, and the distance between the differential signal lines and the distance between the differential signal lines and the ground can be actually simulated when designing and laying out the wiring module, which reduces the difficulty of impedance control and reduces the common mode noise generated by impedance mutation when transmitting differential signals, thereby improving the electromagnetic compatibility performance of the stacked HDMI terminal in high-resolution use scenarios.

[0009] In some embodiments, the first connection module is arranged at the first end of the substrate in the length direction of the substrate, and the first connection module extends out of the end surface of the first end of the substrate; or the first connection module is arranged at the first end of the substrate in the length direction, and the first connection module is flush with the end surface of the first end of the substrate.

[0010] In this embodiment, when the first connection module extends out of the end surface of the first end of the substrate, the connection with the main board is more convenient and intuitive, and the user or automatic equipment can more easily find and connect the first connection module, reducing the difficulty of installation and debugging. When the first connection module is flush with the end surface of the first end of the substrate, it helps to improve the stability of the interface circuit board when connected with the main board, and reduces the mechanical stress and vibration problems caused by unevenness.

[0011] In some embodiments, the first connection module includes a first wire module; one end of the first wire module is electrically connected to each of the wires, and the other end of the first wire module is used to be electrically connected with the main board.

[0012] In the embodiment, since the first wire module and the wire module are both composed of a plurality of wires, the first wire module can be designed simultaneously when the wire module is designed, thereby reducing the design cost.

[0013] In some embodiments, the first connecting module comprises a golden finger module; one end of the golden finger module is electrically connected with each wire, and the golden finger module is used for plugging the mainboard.

[0014] In the embodiment, since the golden finger can resist corrosion and wear, the electrical connection stability between the interface circuit board and the mainboard can be improved by using the golden finger module as the first connecting module, thereby ensuring the quality and stability of signal transmission. In addition, the golden finger module can reduce the difficulty of connection and disconnection between the interface circuit board and the mainboard, and the two can be connected and disconnected by plugging, without the need for complex welding or disassembly operation, thereby reducing the difficulty and cost of equipment maintenance or upgrading.

[0015] In some embodiments, the first connecting module, each wire module and each signal port are arranged on the first side of the substrate; or the first connecting module and each wire module are arranged on the first side of the substrate, and each signal port is arranged on the second side of the substrate, the first side and the second side being opposite; or each wire module and each signal port are arranged on the first side of the substrate, and the first connecting module is arranged on the second side of the substrate.

[0016] In the embodiment, the user can select to place the components on the first side or the second side according to the specific application requirement, so that the available area on the circuit board can be maximized, the overall space utilization is improved, and the layout design of the circuit board can be greatly simplified if all electronic components are concentrated on one side of the substrate, thereby reducing the design complexity and making the manufacturing and assembly process of the circuit board more efficient.

[0017] In some embodiments, each signal port is arranged at intervals along the length direction of the substrate.

[0018] In the embodiment, the transverse space of the interface circuit board can be saved by the above arrangement.

[0019] In a second aspect, the embodiments of the present application further provide a control board card, which comprises a mainboard and an interface circuit board as described in any one of the embodiments of the first aspect; the interface circuit board has a first connecting module, and the mainboard has a second connecting module, the second connecting module being electrically connected with the first connecting module.

[0020] In the control board card, the signal ports laminated on the interface circuit board are electrically connected with the main board in the form of a circuit board, without using DIP design, avoiding the defects of DIP design, and reducing the difficulty of impedance control, and improving the electromagnetic compatibility performance of the control board card in the high resolution use scenario.

[0021] In some embodiments, the second connection module comprises a second wire module or a slot; wherein the second wire module is used for electrical connection with the first connection module, and the slot is used for plugging with the first connection module.

[0022] In the embodiment, the second wire module or the slot can be selected as the second connection module according to actual needs in actual application, and the design flexibility is improved.

[0023] In a third aspect, the embodiments of the present application also provide a display device, comprising a display and a control board card according to any one of the embodiments of the second aspect; the display is electrically connected with the control board card.

[0024] In the display device, the signal ports laminated on the interface circuit board are electrically connected with the main board in the form of a circuit board, without using DIP design, avoiding the defects of DIP design, and reducing the difficulty of impedance control, and improving the electromagnetic compatibility performance of the display device in the high resolution use scenario. BRIEF DESCRIPTION OF DRAWINGS

[0025] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings, which do not constitute a limitation on the embodiments, and the elements / modules and steps with the same reference numerals in the drawings represent similar elements / modules and steps, unless otherwise specified, and the drawings do not constitute a proportional limitation.

[0026] Figure 1 is a structure diagram of a DIP design provided in the prior art;

[0027] Figure 2 is a structure diagram of an interface circuit board provided in the embodiments of the present application;

[0028] Figure 3 is another structure diagram of an interface circuit board provided in the embodiments of the present application;

[0029] Figure 4 is still another structure diagram of an interface circuit board provided in the embodiments of the present application;

[0030] Figure 5 is a side structure diagram of an interface circuit board provided in the embodiments of the present application;

[0031] Figure 6is another side structure schematic view of an interface circuit board provided by an embodiment of the present application;

[0032] Figure 7 is a structure block diagram of a control board provided by an embodiment of the present application;

[0033] Figure 8 is a structure schematic view of a mainboard provided by an embodiment of the present application. DETAILED DESCRIPTION

[0034] The present application will be described in detail below with specific embodiments. The following embodiments will help those skilled in the art to further understand the present application, but do not limit the present application in any form. It should be noted that, for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made. These are within the scope of protection of the present application.

[0035] In order to facilitate understanding of the present application, the present application will be described in more detail below in conjunction with the drawings and specific embodiments. Unless otherwise defined, all technical and scientific terms used in the specification have the same meaning as understood by those skilled in the art. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification includes any and all combinations of one or more related listed items.

[0036] It should be noted that, if there is no conflict, each feature in the embodiments of the present application can be combined with each other, and all within the scope of protection of the present application. In addition, although the functional modules are divided in the device schematic diagram, in some cases, the module division in the device can be different. In addition, the "first", "second" and the like used herein do not limit the data and execution order, but only distinguish the same items or similar items with basically the same function and effect.

[0037] In the related art, the HDMI terminal design of the laminated layer often adopts Figure 1 The physical connection between the HDMI terminal and the mainboard in this packaging structure depends on the pin type pin 3. The HDMI terminal transmits data using differential signal transmission mechanism, and the impedance control of the differential signal line will affect the stability of data transmission, and the impedance control of the differential signal line mainly depends on the distance between the differential line and the ground and the distance between the differential pairs. However, as Figure 1 As shown in the figure, the pin of the terminal in the DIP design is a pin type, and the pin pitch is relatively large, which directly leads to the increase of the difficulty of impedance control. With the continuous improvement of display resolution, the working clock frequency of the signal also rises, which puts forward more stringent requirements for impedance control. Therefore, in the use Figure 1The pin type pin shown in the signal transmission, electromagnetic compatibility problem is more prominent, difficult to effectively solve. Especially in the video definition leap to 1080P and above level, electromagnetic compatibility challenge has become particularly severe. And when facing the strict requirements of 4K resolution, the HDMI terminal using this structure design in electromagnetic compatibility almost face insurmountable obstacles, and the stability of electromagnetic compatibility is also difficult to effectively guarantee. In summary, with the rapid development of video technology, Figure 1 The design of the laminated HDMI terminal is more and more prominent, and more advanced solutions are needed to meet the growing demand for signal transmission.

[0038] To solve the above technical problems, the embodiment of the application provides an interface circuit board, a control board card and a display device. For the laminated signal terminal, the circuit board is connected with the mainboard without using the DIP design structure. The DIP is replaced by using a smaller circuit board and a connection mode that is easier to control impedance, thereby solving the electromagnetic compatibility problem caused by the defect of the laminated terminal. For the electromagnetic compatibility problem of the laminated signal terminal using the DIP design, the traditional DIP structure is abandoned, and the circuit board is directly connected with the mainboard. The use of small circuit board not only reduces the space occupation, but also adjusts the distance between the adjacent two wires in the wiring module, so that the distance between the multiple wires in the wiring module is smaller than the distance between the pin type pins in the DIP design. When designing and laying out the wiring module, the distance between the adjacent two wires is adjusted to flexibly control the distance between the actual wires and the distance between the wire and the ground, so that the distance between the differential signal lines is greatly shortened, the difficulty of impedance control is reduced, and the electromagnetic compatibility problem caused by the DIP design is solved.

[0039] In a first aspect, the application provides an interface circuit board, which is referred to Figure 2 The interface circuit board 100 comprises a substrate 110, at least two signal ports (121, 122), at least two wiring modules (131, 132), and a first connection module 140. The first connection module 140, the signal ports (121, 122) and the wiring modules (131, 132) are all arranged on the substrate 110. The signal ports (121, 122) correspond to the wiring modules (131, 132) one by one, and each signal port (121, 122) is electrically connected to the first connection module 140 through the multiple wires in the corresponding wiring module (131, 132). The distance between the adjacent two wires in the wiring module (131, 132) is adjustable. Each signal port (121, 122) is used to electrically connect an external device, and the first connection module 140 is used to electrically connect a mainboard 200.

[0040] The circuit board can be referred to as a printed wiring board or a printed circuit board. The substrate 110 refers to the carrier in the circuit board, which provides a mounting and support platform for other devices in the interface circuit board 100, at least two signal ports (121, 122), at least two trace modules (131, 132), and the first connection module 140. The substrate 110 is usually made of insulating materials such as glass fiber reinforced epoxy resin, phenolic resin, etc., which is used to provide stable physical support and ensure electrical insulation between devices.

[0041] The signal port (121, 122) refers to the connection port between the interface circuit board 100 and the external device, which can be used for signal transmission. The signal port (121, 122) can be used to transmit the audio and video signals of the external device to the mainboard through the corresponding trace module (131, 132) and the first connection module 140, or transmit the audio and video signals transmitted by the mainboard through the first connection module 140 and the trace module to the external device. The external device can be a display device with a display screen. The signal port (121, 122) can be a digital video interface (Digital Visual Interface, DVI), a display interface (DisplayPort, DP), etc.

[0042] The trace module (131, 132) refers to a module that provides electrical connection for the signal port (121, 122) and the first connection module 140. The trace module (131, 132) is usually composed of multiple wires, which are respectively connected to the corresponding signal port (121, 122) and the first connection module 140, so that electrical signals can be transmitted between the signal port (121, 122) and the first connection module 140. The distance between two adjacent wires in the trace module (131, 132) is not fixed, and the spacing can be adjusted according to actual needs. It should be noted that in the drawings in the present application, only three wires in the trace module (131, 132) are shown, but the number of wires is not limited to three in actual application, and the number of wires can be set according to actual needs, and the illustration in the drawing should not be strictly followed.

[0043] The first connection module 140 refers to a connection device for respectively connecting each wire and the mainboard 200. The first connection module 140 is usually designed to match the connector or slot on the mainboard 200 to ensure stable and reliable electrical connection. In addition, it can also be customized as needed to adapt to different mainboards 200 and interface requirements.

[0044] The motherboard 200 is a circuit board used to process audio and video signals. It can be the motherboard of a computer host or a TV box. The motherboard 200 usually has a dedicated processor or chip for processing audio and video signals. Its specific structure can refer to existing technology and is not limited here.

[0045] Specifically, in Figures 2 to 4 In this embodiment, there are two signal ports and two wiring modules. Signal port 121 is electrically connected to the first connection module 140 via multiple wires in the corresponding wiring module 131, and signal port 122 is electrically connected to the first connection module 140 via multiple wires in the corresponding wiring module 132. The routing of the multiple wires in wiring modules 131 and 132 can be configured according to actual needs, for example, in... Figure 2 In the wiring module 131, multiple wires can be laid out first perpendicular to the length direction L and then along the length direction L, or as follows: Figure 3 As shown, the layout is carried out directly along the length direction L. It should be noted that... Figure 3 Although multiple wires in the wiring module 131 pass through the signal port 122, they are not actually electrically connected to the signal port 122 because the internal pins of the signal port 122 are not electrically connected to the multiple wires in the wiring module 131. The length direction L refers to the direction of the longest side of the substrate 110.

[0046] In this interface circuit board 100, the signal ports (121, 122) are electrically connected to the motherboard 200 via a circuit board, eliminating the need for DIP design and avoiding its drawbacks. Furthermore, in DIP design, the distance between pins is fixed and limited by the package type, making it difficult to flexibly adjust the distance according to actual needs. This leads to difficulty in impedance control and precision, affecting signal quality and electromagnetic compatibility. In this embodiment, however, the distance between adjacent wires in the routing modules (131, 132) is adjustable, making the distance between multiple wires in the routing modules (131, 132) smaller than the distance between pins in a DIP design. Moreover, by adjusting the distance between adjacent wires when designing the routing modules (131, 132), the actual distance between wires and between wires and ground can be flexibly controlled, reducing the difficulty of impedance control and improving electromagnetic compatibility performance in high-resolution applications, thereby enhancing signal transmission stability and quality.

[0047] In some embodiments, the signal port may include a High-Definition Multimedia Interface (HDMI).

[0048] High-definition multimedia interface is a kind of digital video / audio interface technology, which is a special digital interface for image transmission, can transmit audio and video signals at the same time, and the maximum data transmission speed is 2.25 GB / s, without digital-to-analog or analog-to-digital conversion before signal transmission. The DP port can also transmit audio and video signals, which supports video output up to 8K resolution, meeting the growing demand for high-resolution video transmission. The specific structure of the two can refer to the prior art, which is not limited here. In actual application, HDMI can be selected as the signal port according to actual needs.

[0049] In addition, in the embodiment where the signal ports are all high-definition multimedia interfaces, the plurality of wires in the wiring module are used to transmit differential signals, and in the laminated terminal design structure provided in the present application, the distance between the differential signal lines and the distance between the differential signal lines and the ground can be actually simulated when designing the layout of the wiring module, reducing the difficulty of impedance control, reducing the common-mode noise generated due to impedance mutation when transmitting differential signals, and thus improving the electromagnetic compatibility performance of the HDMI terminal in high-resolution use scenarios.

[0050] In some embodiments, referring to Figure 5 The first connection module 140 is arranged at the first end of the substrate 110 in the length direction L of the substrate 110, and the first connection module 140 extends beyond the end surface P1 of the first end of the substrate 110. Alternatively, referring to Figure 6 The first connection module 140 is arranged at the first end of the substrate 110 in the length direction L, and the first connection module 140 is flush with the end surface P1 of the first end of the substrate 110.

[0051] The end surface P1 of the first end refers to a plane of the terminal end of the substrate 110 in the length direction L, which is perpendicular to the length direction L of the substrate 110.

[0052] The first connection module 140 extending beyond the end surface P1 of the first end of the substrate 110 refers to that part of the structure of the first connection module 140 extends beyond the end surface P1 of the first end of the substrate 110, that is, part of the structure of the first connection module 140 protrudes beyond the first end of the substrate 110.

[0053] The first connection module 140 flush with the end surface P1 of the first end of the substrate 110 refers to that the terminal end of the first connection module 140 in the length direction L is flush with the end surface P1 of the first end of the substrate 110, that is, the first connection module 140 will not protrude beyond the first end of the substrate 110.

[0054] In the embodiment, when the first connecting module 140 extends out of the end surface P1 of the first end of the substrate 110, part of the structure of the first connecting module 140 will protrude out of the first end of the substrate 110, which makes the connection with the mainboard 200 more convenient and intuitive, and the user or automatic equipment can more easily find and connect the first connecting module 140, reducing the difficulty of installation and debugging. When the first connecting module 140 is arranged flush with the end surface P1 of the first end of the substrate 110, it helps to improve the stability of the interface circuit board 100 when connected with the mainboard 200, helps to reduce the mechanical stress and vibration problems caused by unevenness, and at the same time, in an environment that needs to be moved or vibrated frequently, the flush design can reduce the risk of damage to the first connecting module 140 caused by collision or friction. In summary, the two designs each have unique benefits, and in actual application, they can be selected according to specific circumstances.

[0055] In some embodiments, the first connecting module 140 includes a first wire module; one end of the first wire module is electrically connected to the wires in each wire module, and the other end of the first wire module is used for electrical connection with the mainboard 200.

[0056] The first wire module is composed of a plurality of wires, and the total number of wires in the first wire module can be equal to the total number of wires in all wire modules, so that each wire in the first wire module can correspond to each wire in each wire module. In this way, one end of each wire in the first wire module is connected to a corresponding wire in the wire module, and the other end of each wire in the first wire module is electrically connected to the mainboard 200, for example, by welding, to ensure transmission between signals.

[0057] In the embodiment, since the first wire module and the wire module are both composed of a plurality of wires, when designing and laying out the wire module, the first wire module can be designed at the same time, reducing design cost. In addition, in some cases, part of the structure of the wire module can be directly used to constitute the first wire module, reducing additional design cost and time.

[0058] In some embodiments, the first connecting module 140 includes a gold finger module; one end of the gold finger module is electrically connected to each wire, and the gold finger module is used for plug-in connection with the mainboard 200.

[0059] The gold finger module includes a plurality of gold fingers, which are golden conductive pads, usually plated with gold or other noble metals to improve conductivity and corrosion resistance. The total number of gold fingers in the gold finger module can be equal to the total number of conductive lines in all the trace modules, so that each gold finger in the gold finger module can correspond to each conductive line in each trace module. In this way, one end of each gold finger in the gold finger module is connected to a corresponding conductive line in the trace module, and the other end of each gold finger in the gold finger module is inserted into the mainboard 200.

[0060] In this embodiment, by using the gold finger module as the first connection module 140, the electrical connection stability between the interface circuit board 100 and the mainboard 200 can be improved due to the corrosion and wear resistance of the gold fingers, thereby ensuring the quality and stability of signal transmission. In addition, the use of the gold finger module can reduce the difficulty of connection and disconnection between the interface circuit board 100 and the mainboard 200. Connection and disconnection between the two can be achieved by plugging, without the need for complex welding or disassembly operations, thereby reducing the difficulty and cost of equipment maintenance or upgrading.

[0061] In some embodiments, as shown in Figure 6 the first connection module 140, each trace module, and each signal port (121, 122) are arranged on the first side S1 of the substrate 110. Alternatively, the first connection module 140 and each trace module are arranged on the first side S1 of the substrate 110, and each signal port is arranged on the second side S2 of the substrate 110, with the first side S1 and the second side S2 being opposite each other. Alternatively, as shown in Figure 5 each trace module and each signal port (121, 122) are arranged on the first side S1 of the substrate 110, and the first connection module 140 is arranged on the second side S2 of the substrate 110.

[0062] In this embodiment, greater design flexibility is provided for the layout of various electronic components on the interface circuit board 100. Users can choose to place different components on the first side S1 or the second side S2 according to specific application requirements, thereby maximizing the use of available space on the circuit board and improving overall space utilization. In addition, all electronic components can be concentrated on one side of the substrate 110 according to actual needs, which greatly simplifies the layout design of the circuit board, reduces design complexity, and makes the manufacturing and assembly process of the circuit board more efficient.

[0063] In some embodiments, each signal port (121, 122) is arranged at intervals along the length direction L of the substrate 110.

[0064] The length direction L refers to the direction in which the longest side of the substrate 110 is located. Specifically, in Figures 2 to 4In the embodiment, the number of the signal port and the number of the wire module are both two, wherein the signal port 121 and the signal port 122 are arranged along the length direction L, and the signal port 121 and the signal port 122 can be completely overlapped, as shown in Figure 2 or Figure 3 partially overlapped, as shown in Figure 4 or not overlapped at all. The structure of the completely overlapped projection, as shown in Figure 2 or Figure 3 can save the layout space of the interface circuit board 100.

[0065] In the embodiment, the above arrangement avoids the disorderly arrangement of the signal port on the substrate 110, reduces the space waste, and saves the horizontal space of the interface circuit board 100.

[0066] In the second aspect, the embodiments of the present application provide a control board card, referring to Figure 7 and Figure 8 the control board card 1000 includes a main board 200 and the interface circuit board 100 as described in any one of the embodiments of the first aspect. The interface circuit board 100 has the first connection module 140, and the main board 200 has the second connection module 210, and the second connection module 210 is electrically connected to the first connection module 140.

[0067] In the embodiment, the interface circuit board 100 has the same structure and function as the interface circuit board described in any one of the embodiments of the first aspect, and will not be described here. The main board 200 is a circuit board for processing audio and video signals, which can be a main board of a computer host or a main board of a television box.

[0068] In the control board card 1000, the signal ports stacked on the interface circuit board 100 are electrically connected to the main board 200 in the form of a circuit board, without using DIP design, avoiding the defects of DIP design, and reducing the difficulty of impedance control and improving the electromagnetic compatibility performance of the control board card 1000 in high-resolution use scenarios.

[0069] In some embodiments, the second connection module 210 includes a second wire module or a slot. The second wire module is used to be electrically connected to the first connection module 140, and the slot is used to be plugged with the first connection module 140.

[0070] The second wire module is composed of a plurality of wires, and the total number of wires of the second wire module can be equal to the total number of wires or gold fingers in the first connection module 140, so that each wire in the second wire module can correspond to each wire or each gold finger in the first connection module 140, and the second wire module and the first connection module 140 can be electrically connected through welding to ensure the transmission between signals. The slot refers to a device that can be used to accommodate and fix the first connection module 140 and electrically contact the first connection module 140.

[0071] In the embodiment, the second wire module or the slot can be selected as the second connection module 210 according to actual needs in actual application, and the design flexibility is improved.

[0072] In a third aspect, the embodiment of the present application provides a display device, which comprises a display and a control board card as described in any one of the embodiments of the second aspect. The display is electrically connected to the control board card.

[0073] In the embodiment, the control board card has the same structure and function as the interface circuit board as described in any one of the embodiments of the second aspect, and will not be described here. The display can be a liquid crystal display screen, an organic light-emitting diode display screen, a light-emitting diode display screen, etc.

[0074] In the display device, the signal ports stacked on the interface circuit board are electrically connected to the mainboard in the form of a circuit board, without using DIP design, avoiding the defects of DIP design, and reducing the difficulty of impedance control and improving the electromagnetic compatibility performance of the display device in high-resolution use scenarios.

[0075] It should be noted that the apparatus embodiments described above are only schematic, and the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., they can be located in one place, or distributed on a plurality of network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment.

[0076] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not to limit them; under the idea of the present application, the technical features in the above examples or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in details for simplicity; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An interface circuit board, characterized by, The interface circuit board comprises: a substrate, a first connecting module, at least two signal ports and at least two wiring modules; the first connecting module, the signal ports and the wiring modules are all arranged on the substrate, the signal ports correspond to the wiring modules one by one, each signal port is electrically connected to the first connecting module through a plurality of conductive lines in the corresponding wiring module, and the distance between two adjacent conductive lines in the wiring module is adjustable; wherein each signal port is used for electrically connecting an external device, and the first connecting module is used for electrically connecting a mainboard.

2. The interface circuit board according to claim 1, wherein the signal ports are high-definition multimedia interfaces.

3. The interface circuit board according to claim 1, wherein the first connecting module is arranged at a first end of the substrate in a length direction of the substrate, and the first connecting module extends out of an end surface of the first end of the substrate; or the first connecting module is arranged at a first end of the substrate in the length direction, and the first connecting module is flush with an end surface of the first end of the substrate. The first connecting module comprises a first conductive line module; one end of the first conductive line module is electrically connected to each conductive line, and the other end of the first conductive line module is used for electrically connecting the mainboard.

4. The interface board of any of claims 1-3, wherein, The first connecting module comprises a gold finger module; one end of the gold finger module is electrically connected to each conductive line, and the gold finger module is used for plugging the mainboard.

5. The interface board of any of claims 1-3, wherein, 6. The interface circuit board according to any one of claims 1-3, wherein the first connecting module, each wiring module and each signal port are arranged on a first side of the substrate; or the first connecting module and each wiring module are arranged on a first side of the substrate, each signal port is arranged on a second side of the substrate, and the first side and the second side are opposite to each other; or each wiring module and each signal port are arranged on a first side of the substrate, and the first connecting module is arranged on a second side of the substrate.

7. The interface circuit board according to any one of claims 1-3, wherein each signal port is arranged at intervals along a length direction of the substrate. The control board card comprises a mainboard and an interface circuit board according to any one of claims 1-7; the interface circuit board has a first connecting module, and the mainboard has a second connecting module, and the second connecting module is electrically connected to the first connecting module. The second connecting module comprises a second conductive line module or a slot; wherein the second conductive line module is used for electrically connecting the first connecting module, and the slot is used for plugging the first connecting module.

8. A control board, characterized by The control board card comprises a display and an interface circuit board according to claim 8 or 9; the display is electrically connected to the control board card.

9. The control board card of claim 8, wherein, ​ ​ 10. A display device, characterized by comprising: ​ ​

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