PCB copper paste sintering equipment

Abstract

The utility model relates to the technical field of PCB processing equipment, in particular to PCB copper paste sintering equipment which comprises a box body, a workbench for placing a PCB substrate is arranged in the box body, and a printing steel mesh and a steel mesh moving part for driving the printing steel mesh to move downwards to press the workbench are arranged above the workbench; a scraping and sweeping piece for scraping and sweeping the steel mesh is arranged on the steel mesh moving piece; and a negative pressure device for enabling the interior of the box body to be in a negative pressure state is also arranged in the box body. The method has the effect of ensuring the sintering quality of the copper structure.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of PCB processing equipment, in particular to a PCB copper paste sintering device. BACKGROUND

[0002] Copper paste sintering refers to a process of treating a paste containing copper powder at high temperature to make the copper powder particles in the paste fuse and tightly bond together to form a copper layer or copper structure with electrical conductivity and mechanical strength.

[0003] Copper paste preparation: mix copper powder with organic glue or other binders to form a uniform copper paste. Copper powder serves as the conductive material, while the binder serves to bond the copper powder particles together.

[0004] Coating: coat the prepared copper paste on a substrate (such as a ceramic plate, a circuit board, etc.) to form the desired thickness and shape of the copper layer.

[0005] Baking: place the substrate coated with copper paste into an oven for baking. At high temperature, the organic glue or other binders will decompose and evaporate, leaving behind the copper powder particles.

[0006] Sintering: at high temperature, the copper powder particles will come into contact with each other and undergo metallurgical reactions to form a dense copper layer. During this process, the copper powder may undergo oxidation reactions to form a copper oxide layer, but will subsequently interact with the copper powder to form a denser copper layer.

[0007] Cooling: cool down the sintered substrate to obtain a copper layer or copper structure with electrical conductivity and mechanical strength.

[0008] If the copper paste is not evenly distributed or has defects such as air bubbles during the coating process, it may affect the performance of the copper layer after sintering. In addition, coating thickness that is too thick or too thin may also result in poor sintering results.

[0009] During the sintering process, the choice of atmosphere has a significant impact on the composition and performance of the product. If the sintering atmosphere contains too much oxygen or reducing gas, it may cause the copper powder in the copper paste to undergo oxidation or reduction reactions, thereby affecting the performance of the copper layer after sintering. CONTENT OF THE INVENTION

[0010] To solve the above technical problems, the application provides a PCB copper paste sintering device, which has the advantage of ensuring the sintering quality of the copper structure.

[0011] To achieve the above purpose, the technical scheme of the application is as follows:

[0012] A PCB copper paste sintering equipment, comprising a box, a workbench for placing a PCB substrate is arranged in the box, a printing steel mesh is arranged above the workbench, and a steel mesh moving piece for driving the printing steel mesh to move downward and press the workbench is arranged above the workbench.

[0013] A scraping piece for scraping the steel mesh is arranged on the steel mesh moving piece.

[0014] The box also has a negative pressure device for making the box in a negative pressure state.

[0015] The above technical solution is realized, that is, the copper powder is scraped on the corresponding printing groove of the printing steel mesh by scraping, the negative pressure device makes the box in a negative pressure state, so that the gas in the copper powder in the printing steel mesh can be released, and then the thickness and density of the copper powder are ensured by the combined action of the printing steel mesh, the scraping piece and the negative pressure device, so as to ensure the sintering effect.

[0016] As a preferred scheme of the present application, the steel mesh moving piece comprises a bearing frame and a double-track gantry sliding table for driving the bearing frame to move horizontally and vertically, the printing steel mesh is detachably arranged on the bearing frame, and the scraping piece is arranged on the bearing frame.

[0017] The above technical solution is realized, that is, the bearing plate is driven to move horizontally and vertically by the double-track gantry sliding table. The printing steel mesh is detachably arranged on the bearing frame, and the scraping piece is arranged on the bearing frame, so that the double-track gantry sliding table can drive the printing steel mesh and the scraping piece to move at the same time, thereby facilitating personnel to take and place products on the workbench.

[0018] As a preferred scheme of the present application, the scraping piece comprises a scraper and a scraping motor for driving the scraper to rotate and scrape the printing steel mesh.

[0019] The above technical solution is realized, that is, the scraper is driven to move back and forth by the scraping motor, so as to ensure that the copper powder is uniformly filled on the printing steel mesh. After the negative pressure device is started, it is still convenient for personnel to operate, so as to ensure the thickness and density of the copper powder.

[0020] As a preferred scheme of the present application, the negative pressure device comprises an air suction port arranged on the box, and the air suction port is connected with an air suction pump through a pipeline.

[0021] The above technical solution is realized, that is, the air suction pump is used to suck air, so that the box is in a negative pressure state, and then the gas in the copper powder can be discharged, thereby ensuring the sintering quality and reducing dust in the air.

[0022] In summary, the present application has at least one of the following beneficial technical effects:

[0023] 1. The copper powder is scraped in the corresponding printing groove of the printing steel mesh by scraping, the negative pressure device makes the box body present a negative pressure state, so that the gas in the copper powder in the printing steel mesh can be released, and then the thickness and density of the copper powder are ensured through the cooperation of the printing steel mesh, the scraping piece and the negative pressure device, so that the sintering effect is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0025] Figure 1 is a schematic diagram of the internal structure of the box body in the embodiment of the present application.

[0026] Figure 2 is a schematic diagram of the internal structure of the box body in the embodiment of the present application.

[0027] Figure 3 is a schematic diagram of the structure of the scraping piece in the embodiment of the present application.

[0028] Reference signs: 1, box body; 2, box cover; 3, workbench; 4, printing steel mesh; 5, steel mesh moving piece; 51, bearing frame; 52, double-rail gantry sliding table; 6, scraping piece; 61, scraper; 62, scraping motor; 7, negative pressure device; 71, air suction port; 72, air suction pump. DETAILED DESCRIPTION

[0029] The following will be described in combination with the drawings Figures 1-3 The present application will be further described in detail.

[0030] The embodiment of the present application discloses a PCB copper paste sintering equipment. Referring to Figure 1, PCB board copper paste sintering equipment: including box 1, box 1 is rotatably provided with box cover 2, for taking and placing product and closing box 1. Box 1 is provided with workbench 3 for placing PCB substrate, printing steel mesh 4 is arranged above workbench 3, and steel mesh moving part 5 is used to drive printing steel mesh 4 to move down and press workbench 3. That is, after the product is placed on the workbench 3, the steel mesh moving part 5 drives the printing steel mesh 4 to move above the workbench 3 and moves down to press the steel mesh on the product, and then the copper powder can be spread on the printing steel mesh 4. The scraping part 6 is arranged on the steel mesh moving part 5 for scraping the steel mesh. That is, the copper powder is scraped in the corresponding printing groove of the printing steel mesh 4 by scraping. The box 1 is also provided with a negative pressure device 7 for making the box 1 in a negative pressure state. The negative pressure device 7 makes the box 1 in a negative pressure state, so that the gas in the copper powder in the printing steel mesh 4 can be released, thereby preventing the thickness and density of the copper powder from being guaranteed by the combined action of the printing steel mesh 4, the scraping part 6 and the negative pressure device 7, thereby guaranteeing the sintering effect.

[0031] The steel mesh moving part 5 includes a bearing frame 51 and a double-track gantry sliding table 52 for driving the bearing frame 51 to move horizontally and vertically. The double-track gantry sliding table 52 includes a horizontal electric sliding table and a vertical cylinder, that is, the bearing plate is driven to move horizontally and vertically by the double-track gantry sliding table 52. The printing steel mesh 4 is detachably arranged on the bearing frame 51, and the scraping part 6 is arranged on the bearing frame 51, so that the double-track gantry sliding table 52 can move the printing steel mesh 4 and the scraping part 6 simultaneously, thereby facilitating personnel to take and place products on the workbench 3.

[0032] The scraping part 6 includes a scraper 61 and a scraping motor 62 for driving the scraper 61 to rotate and scrape the printing steel mesh 4. That is, the scraper 61 is driven to move back and forth by the scraping motor 62, so as to guarantee that the copper powder is uniformly filled on the printing steel mesh 4. When the negative pressure device 7 is started, it is still convenient for personnel to operate, so as to guarantee the thickness and density of the copper powder.

[0033] The negative pressure device 7 includes an air suction port 71 arranged on the box 1, and the air suction port 71 is connected to an air suction pump 72 through a pipeline. That is, the air suction pump 72 is used to suck air, so that the box 1 is in a negative pressure state, thereby enabling the gas in the copper powder to be discharged, thereby guaranteeing the sintering quality, and at the same time, reducing the possibility that dust, oil stains and other pollutants in the sintering environment may adhere to the surface of the copper paste or penetrate into the copper layer, thereby causing the performance of the sintered copper layer to decrease.

[0034] The implementation principle of the PCB board copper paste sintering equipment is that the copper powder is scraped in the corresponding printing groove of the printing steel mesh 4 by scraping, and the negative pressure device 7 makes the box 1 in a negative pressure state, so that the gas in the copper powder in the printing steel mesh 4 can be released, thereby preventing the thickness and density of the copper powder from being guaranteed by the combined action of the printing steel mesh 4, the scraping part 6 and the negative pressure device 7, thereby guaranteeing the sintering effect.

[0035] The above are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, and thus: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A PCB copper paste sintering device, characterized in that: The application relates to a printing device, which comprises a box (1) provided with a workbench (3) for placing a PCB substrate, a printing steel mesh (4) arranged above the workbench (3), and a steel mesh moving piece (5) for driving the printing steel mesh (4) to move downward and press against the workbench (3). A scraping piece (6) for scraping the steel mesh is arranged on the steel mesh moving piece (5). A negative pressure device (7) for keeping the box (1) in a negative pressure state is arranged in the box (1).

2. The PCB board copper paste sintering equipment according to claim 1, characterized in that: The steel mesh moving piece (5) comprises a bearing frame (51) and a double-track gantry sliding table (52) for driving the bearing frame (51) to move horizontally and vertically, the printing steel mesh (4) is detachably arranged on the bearing frame (51), and the scraping piece (6) is arranged on the bearing frame (51).

3. The PCB copper paste sintering apparatus according to claim 1, wherein: The scraping piece (6) comprises a scraper (61) and a scraping motor (62) for driving the scraper (61) to rotate and scrape the printing steel mesh (4).

4. The PCB copper paste sintering apparatus according to claim 1, characterized in that: The negative pressure device (7) comprises an air suction port (71) arranged on the box (1), and the air suction port (71) is connected with an air suction pump (72) through a pipeline.

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