LED light source device and mold thereof

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses an LED light source device and a die thereof, which comprise a support, a flip chip, a light-transmitting glue layer and a high-reflection glue layer. The light-transmitting glue layer covers the front surface and the side surface of the flip chip. The high-reflection glue layer is arranged on the side face of the light-transmitting glue layer. The light-transmitting adhesive layer comprises a first optical interface, a second optical interface and a third optical interface. And the second optical interface is a plane or a curved surface which forms a certain included angle with the side surface of the flip chip and is used for reflecting light emitted from the side surface to the front surface. The third optical interface is arranged to be a plane or a curved surface which forms a certain included angle with the upper surface of the flip chip and is used for shortening the distance of edge light passing through the light-transmitting glue layer. According to the utility model, the second optical interface can make the side light of the flip chip close to the optical axis after being reflected and be emitted from the front side, so that light energy is fully utilized, and the overall brightness is improved. The third optical interface greatly shortens the passing distance of the edge light emitted from the front side in the light-transmitting glue layer, and the light emitting uniformity is better.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor light emitting, and particularly relates to an LED light source device and a mold thereof. BACKGROUND

[0002] Flip chip is a kind of pinless structure, generally containing circuit unit. Flip chip is to deposit tin-lead ball on I / O pad, then flip the chip to heat and combine with ceramic substrate by using molten tin-lead ball, which replaces the conventional wire bonding and gradually becomes the mainstream of future packaging. At present, it is mainly applied to high clock CPU, GPU (Graphic Processor Unit) and Chipset products. Compared with COB, the chip structure and I / O end (tin ball) direction of this packaging form are downward, and since I / O lead end is distributed on the whole chip surface, Flip chip has reached the peak in packaging density and processing speed, especially it can be processed by means of similar SMT technology, so it is the final direction of chip packaging technology.

[0003] In use, in order to realize better light collection and achieve preset light spot shape and effect, the existing technology usually has two ways for the flip chip emitting light from five surfaces (front surface and side surfaces).

[0004] Existing technology one: refer to Figure 16 The flip chip 2 is fixed on the substrate 1, the front surface of the flip chip 2 is pre-covered with a light-transmitting glue layer 3, and the four side surfaces of the flip chip 2 are completely covered with a high-reflective glue layer 4, so as to cut off the light emission from the side surfaces and concentrate the light emission from the front surface. The existing problems are: 1. The light energy of the four side surfaces is not utilized, causing light energy waste and low overall brightness; 2. The edge light propagates a long distance D2 in the light-transmitting glue layer 3, and the light energy loss is large compared with the light energy loss of the middle light, so the light emission brightness is inconsistent; in addition, when the light-transmitting glue layer 3 is a fluorescent powder glue layer, the edge light is easy to excite excessive fluorescent powder, resulting in uneven color of the edge and the middle light emission, for example, the white light spot emitted after blue light passes through the fluorescent powder glue layer will appear yellow phenomenon at the edge, resulting in poor light spot quality and light efficiency of the packaging product.

[0005] Existing technology two: refer to Figure 17The LED light source device comprises a substrate 1, a flip chip 2 fixed on the substrate 1, a light-transmitting glue layer 3 covering the front surface and four side surfaces of the flip chip 2, and a high-reflection glue layer 4 covering the four side surfaces of the light-transmitting glue layer 3. The four side surfaces of the light-transmitting glue layer 3 are vertical planes, and the light emitted by the side surface of the flip chip 2 is returned to the side surface of the flip chip 2 after being incident on the vertical planes. The light emitted by the side surface of the flip chip 2 is propagated between the side surface of the flip chip 2 and the high-reflection glue layer 4, and is absorbed by the material after several times of back and forth transmission, so that the light emitted by the side surface of the flip chip 2 can hardly reach the front surface. Although the light energy utilization is improved compared with the prior art, there are still problems of waste of a large amount of light energy, low overall brightness, and color non-uniformity of the edge light and the central light when the light-transmitting glue layer 3 is a fluorescent powder glue layer.

[0006] Based on the above, the problems to be solved at present are to provide an LED light source device with front surface light emission, high light energy utilization, uniform, stable and high-quality light spot color, and a mold for manufacturing the LED light source device. Content of the utility model

[0007] The utility model discloses a LED light source device and a mold thereof, and aims to solve the problems of low side surface light energy utilization, insufficient brightness, non-uniform light spot brightness and color, and complex mold and low stability of the formed product in the prior art.

[0008] The utility model discloses a LED light source device, which comprises a substrate 1, a flip chip 2 fixed on the substrate 1, a light-transmitting glue layer 3 covering the front surface and four side surfaces of the flip chip 2, and a high-reflection glue layer 4 covering the four side surfaces of the light-transmitting glue layer 3.

[0009] A support is arranged on the substrate 1.

[0010] The flip chip is arranged on the support.

[0011] The light-transmitting glue layer covers the front surface and the side surface of the flip chip.

[0012] The high-reflection glue layer is arranged on the side surface of the light-transmitting glue layer.

[0013] The light-transmitting glue layer comprises a first optical interface of the front surface, a second optical interface of the side surface and a third optical interface arranged between the first optical interface and the second optical interface.

[0014] The second optical interface is arranged as a plane or a curved surface at an angle with the side surface of the flip chip, for reflecting the light emitted by the side surface to the front surface; the third optical interface is arranged as a plane or a curved surface at an angle with the upper surface of the flip chip, for shortening the distance of the edge light in the light-transmitting adhesive layer; the side of the second optical interface close to the third optical interface is provided with a first top corner, the first top corner is higher than or equal to the high-reflection adhesive layer, for preventing the high-reflection adhesive layer from covering the third optical interface.

[0015] Further, the second optical interface is connected with the third optical interface, and the connection of the second optical interface and the third optical interface forms the first top corner.

[0016] Or a transition surface is arranged between the second optical interface and the third optical interface, and the connection of the second optical interface and the transition surface forms the first top corner.

[0017] Further, the lens is arranged on the bracket and covers the light-transmitting adhesive layer and the high-reflection adhesive layer.

[0018] Further, the light-transmitting adhesive layer covers part of the side surface or all of the side surface of the flip chip.

[0019] Further, the lowest point of the third optical interface is higher than or equal to the upper surface of the flip chip, or the lowest point of the third optical interface is between the upper surface and the lower surface of the flip chip.

[0020] Further, the anti-overflow groove is arranged on the bracket and around the flip chip.

[0021] Further, the thickness of the light-transmitting adhesive layer is set to 50-150 um.

[0022] Further, the high-reflection adhesive layer completely covers the second optical interface.

[0023] A mold, the mold comprises a lower opening mold cavity, the mold cavity comprises a top surface, and a first side surface connected with the top surface, the first side surface is a plane or a curved surface at an angle with the top surface.

[0024] Further, the bottom surface is arranged on the opening of the mold cavity, the side of the bottom surface away from the mold cavity is connected with a second side surface, the connection of the second side surface and the bottom surface forms a second top corner, and the second top corner is used for forming the second optical interface and the first top corner.

[0025] Further, the bottom surface is arranged as a plane or an arc surface.

[0026] Compared with the prior art, the LED light source device and the mold thereof have the following beneficial effects:

[0027] Referring to Figure 15 The second optical interface 32 of the light-transmitting adhesive layer 3 is provided as an inclined surface with a certain angle with the side surface of the flip chip 2. Light is reflected at the interface between the second optical interface 32 and the high-reflection adhesive layer 4, and the surface type of the second optical interface 32 is arranged to make the reflected light converge to the optical axis and be emitted from the front surface, so that the light emitted from the side surface of the flip chip 2 is fully utilized, the light energy utilization rate is improved, and the overall light emission brightness is improved.

[0028] The third optical interface 33 of the light-transmitting adhesive layer 3 is provided as a plane or a curved surface with a certain angle with the upper surface of the flip chip 2, so as to shorten the distance of the edge light emitted by the flip chip 2 passing through the light-transmitting adhesive layer 3. Figures 15-17 The length of the edge light emitted from the front surface of the flip chip 2 passing through the light-transmitting adhesive layer 3 in the utility model, the prior art one and the prior art two is D1, D2 and D3 respectively, and D1 < D2 < D3 is satisfied. The utility model greatly shortens the distance of the edge light passing through the light-transmitting adhesive layer 3, so that the light emission uniformity is better, when the light-transmitting adhesive layer 3 is a phosphor layer, the excessive phosphor is not easily excited, the light spot will not appear the edge yellowing and the color difference between the middle and the edge, and the quality of the light spot is greatly improved.

[0029] The structure of the mold 6 of the utility model can form the first optical interface 31, the second optical interface 32 and the third optical interface 33 at one time, the process is simple, the operation is convenient, and the production efficiency is greatly improved. And by setting the bottom surface 62, the second side surface 63 and the top angle between the two, the second optical interface 32 is accurately formed, and the structure is stable. The mold 6 is simple and reasonable in structure, easy to operate and manufacture, and high in efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a cross-sectional structure schematic view of the LED light source device provided by the utility model;

[0031] Figure 2 is a cross-sectional structure schematic view of the mold provided by the utility model;

[0032] Figure 3 is a cross-sectional structure schematic view of another mold provided by the utility model;

[0033] Figure 4 is a state schematic view of one kind after step S1 of the manufacturing method of the light-transmitting adhesive layer provided by the utility model is implemented;

[0034] Figure 5 is another state schematic view after step S1 of the manufacturing method of the light-transmitting adhesive layer provided by the utility model is implemented;

[0035] Figure 6 This is a schematic diagram showing the state after step S2 of the method for manufacturing the light-transmitting adhesive layer provided by this utility model is implemented;

[0036] Figure 7 This is a schematic diagram showing the state after step S3 of the method for manufacturing the light-transmitting adhesive layer provided by this utility model is implemented;

[0037] Figure 8 This is a cross-sectional structural schematic diagram of the LED light source device according to Embodiment 1 of this utility model;

[0038] Figure 9 This is a cross-sectional structural schematic diagram of the LED light source device according to Embodiment 2 of this utility model;

[0039] Figure 10 This is a cross-sectional structural diagram of the LED light source device and mold assembly according to Embodiment 3 of this utility model;

[0040] Figure 11 This is a cross-sectional structural diagram of the LED light source device and mold assembly according to Embodiment 4 of this utility model;

[0041] Figure 12 This is a cross-sectional structural diagram of the LED light source device and mold assembly according to Embodiment 5 of this utility model;

[0042] Figure 13 This is a cross-sectional structural diagram of the LED light source device and mold assembly according to Embodiment Six of this utility model;

[0043] Figure 14 This is a cross-sectional structural diagram of the LED light source device and mold assembly according to Embodiment Seven of this utility model;

[0044] Figure 15 This is the optical path diagram of the LED light source device provided by this utility model;

[0045] Figure 16 This is the optical path diagram of an LED light source device provided by existing technology;

[0046] Figure 17 This is the optical path diagram of the LED light source device provided by prior art 2;

[0047] In the diagram: 1-Bracket; 11-Anti-overflow groove; 2-Flip chip; 3-Transparent adhesive layer; 31-First optical interface; 32-Second optical interface; 33-Third optical interface; 34-First apex corner; 4-High-reflectivity adhesive layer; 5-Lens; 6-Mold; 61-Mold cavity; 611-Top surface; 612-First side surface; 62-Bottom surface; 63-Second side surface; 64-Second apex corner. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following will make further detailed description to the utility model in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.

[0049] The implementation of the utility model will be described in detail in combination with specific examples.

[0050] The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the utility model, it should be understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, they are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationships in the drawings are only used for exemplary illustration, and cannot be understood as a limitation on the present patent, for those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0051] Referring to Figures 1-14 The preferred embodiment provided by the utility model is shown in the drawings.

[0052] Referring to Figure 1 An LED light source device, comprising: a support 1, a flip chip 2 fixed on the support 1, a light-transmitting adhesive layer 3 covering the flip chip 2, a high-reflection adhesive layer 4 arranged on the side surface of the light-transmitting adhesive layer 3, and a lens 5 covering the light-transmitting adhesive layer 3 and the high-reflection adhesive layer 4. The support 1 can be a flat plate support or a bowl cup-shaped support. The flip chip 2 can be a light-emitting chip that emits light from the front surface and the side surface, i.e. a five-surface light-emitting chip; or can be a light-emitting chip that emits light only from the front surface. The light-transmitting adhesive layer 3 covers the front surface and the side surface of the flip chip 2, specifically: 1. covering the entire front surface and part of the side surface of the flip chip 2; 2. covering the entire front surface and the entire side surface of the flip chip 2. The light-transmitting adhesive layer 3 can be connected with the support 1 or can not be connected with the support 1. The high-reflection adhesive layer 4 is wrapped on the side surface of the light-transmitting adhesive layer 3.

[0053] The light-transmitting adhesive layer 3 comprises a first optical interface 31 on the front side, a second optical interface 32 on the side, and a third optical interface 33 between the first optical interface 31 and the second optical interface 32. The first optical interface 31 is preferably a plane or a micro-arc surface with a relatively uniform thickness and good light emission uniformity. The second optical interface 32 is a plane or a curved surface at a certain angle with the side of the flip chip 2. The side light reaches the interface between the second optical interface 32 and the high-reflection adhesive layer 4 and is totally reflected. The angle is designed to make the reflected light converge towards the optical axis and be emitted from the front side. The second optical interface 32 can make full use of the side light of the flip chip 2 and improve the light emission brightness.

[0054] The third optical interface 33 is a plane or a curved surface at a certain angle with the upper surface of the flip chip 2. The highest point of the third optical interface 33 is lower than or equal to the lowest point of the first optical interface 31. The third optical interface 33 corresponds to the four edges where the upper surface and the side surface of the flip chip 2 meet and the adjacent positions. The third optical interface 33 is designed as an inclined surface that approaches the flip chip 2, which shortens the length of the edge light path, reduces energy loss, and makes the brightness of the edge light close to that of the light near the center, so that the energy distribution of the light spot is more uniform. When the light-transmitting adhesive layer 3 is a phosphor adhesive layer, the edge emitted light is less likely to cause excessive excitation of the phosphor. For example, when the emitted light is blue light, the edge of the light spot formed after the excitation of the phosphor will not appear yellow.

[0055] The side of the second optical interface 32 close to the third optical interface 33 is provided with a first top corner 34, which is higher than or equal to the high-reflection adhesive layer 4. The first top corner 34 is beneficial to the formation of the reflection surface of the second optical interface 32 and can effectively prevent the high-reflection adhesive layer 4 from covering the third optical interface 33. The second optical interface 32 is connected with the third optical interface 33, and the connection between the second optical interface 32 and the third optical interface 33 forms the first top corner 34. Alternatively, a transition surface is provided between the second optical interface 32 and the third optical interface 33, and the connection between the second optical interface 32 and the transition surface forms the first top corner 34.

[0056] The side of the flip chip 2 covered by the light-transmitting adhesive layer 3 can be partially or fully covered. The bottom of the light-transmitting adhesive layer 3 can be connected with the support 1 or be arranged on the side of the flip chip 2, which can be arranged as needed. The lowest point of the third optical interface 33 can be flush with the upper surface of the flip chip 2 or higher than the upper surface, or be arranged between the upper surface and the lower surface of the flip chip 2.

[0057] Preferably, the light-transmitting adhesive layer 3 is a phosphor adhesive layer for changing the light emission color of the flip chip 2. The thickness of the light-transmitting adhesive layer 3 is preferably 50-150 um.

[0058] For further optical shaping, a lens 5 can be provided on the bracket 1. The lower surface of the lens 5 is connected with the bracket 1. The flip chip 2, the transparent glue layer 3 and the high-reflective glue layer 4 are encapsulated between the lens 5 and the bracket 1.

[0059] A mold 6 for manufacturing the LED light source device mentioned above.

[0060] The mold 6 comprises a mold cavity 61 with an open bottom, referring to Figures 2-3 The mold cavity 61 comprises a top surface 611 for forming the first optical interface 31 and a first side surface 612 for forming the third optical interface 33. The first side surface 612 is connected with the top surface 611, and is a plane or a curved surface with a certain angle with the top surface 611. The first side surface 612 is a slope gradually approaching the opening direction of the mold cavity 61 from the top surface 611.

[0061] The mold 6 further comprises a bottom surface 62 provided on both sides of the opening of the mold cavity 61. The transparent glue in the mold cavity 61 spreads to the surface of the bottom surface 62 and the side surface of the flip chip 2 from the periphery of the opening during the pressing process, thereby forming the second optical interface 32. The bottom surface 62 can be provided as a plane or an arc surface, and a second side surface 63 is connected with the bottom surface 62 at the end of the bottom surface 62 away from the mold cavity 61, and the second side surface 63 forms a second vertex angle 64 with the bottom surface 62, and the surface tension of the transparent glue at the second vertex angle 64 forms the second optical interface 32 and the first vertex angle 34.

[0062] When the transparent glue spreads on the surface of the bottom surface 62 from the mold cavity 61 to the second side surface 63, when it encounters the second vertex angle 64 formed by the second side surface 63 and the bottom surface 62, the second optical interface 32 is formed below the bottom surface 62 due to the action of the tension. The amount of the transparent glue and the length of the bottom surface 62 are adjusted according to the inclination angle and the length of the second optical interface 32 to be formed.

[0063] The steps of the mold 6 for manufacturing the transparent glue layer are as follows:

[0064] Step S1, the transparent glue is distributed in the mold cavity 61 of the mold 6 or on the upper surface of the flip chip 2, referring to Figure 4 , Figure 5 .

[0065] Step S2, the mold cavity 61 of the mold 6 is directly opposite to the upper surface of the flip chip 2, and the transparent glue is pressed to the front surface and the side surface of the flip chip 2 by the mold 6, referring to Figure 6 .

[0066] Step S3, after curing, the mold 6 is removed, and the front surface and the side surface of the flip chip 2 are covered with the transparent glue layer 3, referring to Figure 7 . Specific embodiment one:

[0068] Referring to Figure 8, LED light source device includes support 1, flip chip 2, light-transmitting glue layer 3, high-reflective glue layer 4 and lens 5. Light-transmitting glue layer 3 includes first optical interface 31, second optical interface 32 and third optical interface 33. Light-transmitting glue layer 3 covers the front face and part of the side face of flip chip 2, and the lowest point of second optical interface 32 is between the upper face and the lower face of flip chip 2, i.e. the side face of flip chip 2 is semi-covered. The lowest point of third optical interface 33 is also between the upper face and the lower face of flip chip 2. Third optical interface 33 is an inclined plane. Specific embodiment two:

[0070] Referring to Figure 9 The main difference compared with embodiment one is that third optical interface 33 is an arc surface. The bottom face 62 of the mold 6 used to make the light-transmitting glue layer 3 is set as an arc surface. The bottom face 62 of the mold 6 used to make the light-transmitting glue layer 3 is set as a plane, so a platform is formed between second optical interface 32 and third optical interface 33. Other settings are the same. Specific embodiment three:

[0072] Referring to Figure 10 LED light source device includes support 1, flip chip 2, light-transmitting glue layer 3 and high-reflective glue layer 4. Light-transmitting glue layer 3 includes first optical interface 31, second optical interface 32 and third optical interface 33. The lowest point of third optical interface 33 is between the upper face and the lower face of flip chip 2. Light-transmitting glue layer 3 covers the front face and the whole side face of flip chip 2, and second optical interface 32 extends to the upper face of support 1, i.e. the side face of flip chip 2 is fully covered. The bottom face 62 of the mold 6 used to make the light-transmitting glue layer 3 is set as an arc surface, so second optical interface 32 and third optical interface 33 are connected by an inner concave arc transition surface. Specific embodiment four:

[0074] Referring to Figure 11 The main difference compared with embodiment three is that anti-overflow groove 11 is set on support 1 around flip chip 2 in this embodiment, which is used to accommodate excess light-transmitting glue and prevent too much light-transmitting glue from affecting the formation of second optical interface 32. Anti-overflow groove 11 is set apart from flip chip 2. Other settings are the same. Specific embodiment five:

[0076] Referring to Figure 12The LED light source device comprises a support 1, a flip chip 2, a light-transmitting glue layer 3 and a high-reflective glue layer 4. The lowest point of the third optical interface 33 is higher than or equal to the upper surface of the flip chip 2. The light-transmitting glue layer 3 comprises a first optical interface 31, a second optical interface 32 and a third optical interface 33. The light-transmitting glue layer 3 covers the front surface and part of the side surface of the flip chip 2, and the lowest point of the second optical interface 32 is located between the upper surface and the lower surface of the flip chip 2, i.e. the side surface of the flip chip 2 is semi-covered. The bottom surface 62 of the mold 6 used for manufacturing the light-transmitting glue layer 3 is provided as a curved surface, so that the second optical interface 32 and the third optical interface 33 are connected through the concave curved transition surface therebetween. Specific embodiment six:

[0078] With reference to Figure 13 The main difference compared with the embodiment five is that the light-transmitting glue layer 3 covers the front surface and the whole side surface of the flip chip 2, and the second optical interface 32 extends to the upper surface of the support 1, i.e. the side surface of the flip chip 2 is fully covered. The other settings are the same. Specific embodiment seven:

[0080] With reference to Figure 14 Compared with the embodiment six, the embodiment is provided with an anti-overflow groove 11 on the support 1 around the flip chip 2, which is used for accommodating the excess light-transmitting glue and preventing the excessive light-transmitting glue from affecting the forming of the second optical interface 32. The anti-overflow groove 11 is arranged in a spaced manner with the flip chip 2. The other settings are the same.

[0081] The utility model is not used to limit, any modification, equivalent replacement and improvement etc. made in the spirit and principle of the utility model should be contained in the protection scope of the utility model.

Claims

1. An LED light source device, characterized by, The LED light source device comprises: a bracket (1); a flip chip (2) arranged on the bracket (1); a light-transmitting adhesive layer (3) covering the front surface and the side surface of the flip chip (2); a high-reflection adhesive layer (4) arranged on the side surface of the light-transmitting adhesive layer (3); the light-transmitting adhesive layer (3) comprises a first optical interface (31) on the front surface, a second optical interface (32) on the side surface, and a third optical interface (33) arranged between the first optical interface (31) and the second optical interface (32); the second optical interface (32) is arranged as a plane or a curved surface at a certain angle with the side surface of the flip chip (2), for reflecting the light emitted from the side surface to the front surface; the third optical interface (33) is arranged as a plane or a curved surface at a certain angle with the upper surface of the flip chip (2), for shortening the distance of the edge light in the light-transmitting adhesive layer (3); the side of the second optical interface (32) close to the third optical interface (33) is provided with a first vertex angle (34), the first vertex angle (34) is higher than or equal to the high-reflection adhesive layer (4), for preventing the high-reflection adhesive layer (4) from covering the third optical interface (33).

2. The LED light source device according to claim 1, characterized in that, the second optical interface (32) is connected with the third optical interface (33), and the connection between the second optical interface (32) and the third optical interface (33) forms the first vertex angle (34); or a transition surface (35) is arranged between the second optical interface (32) and the third optical interface (33), and the connection between the second optical interface (32) and the transition surface (35) forms the first vertex angle (34).

3. The LED light source device according to claim 1, wherein the LED light source device further comprises a lens (5) arranged on the bracket (1) and covering the light-transmitting adhesive layer (3) and the high-reflection adhesive layer (4).

4. The LED light source device of claim 1, wherein, the light-transmitting adhesive layer (3) covers part of the side surface or all of the side surface of the flip chip (2).

5. The LED light source device of claim 1, wherein, the lowest point of the third optical interface (33) is higher than or equal to the upper surface of the flip chip (2), or the lowest point of the third optical interface (33) is between the upper surface and the lower surface of the flip chip (2).

6. The LED light source device of claim 1, wherein, an anti-overflow groove (11) is arranged on the bracket (1) around the flip chip (2).

7. The LED light source device of claim 1, wherein, the thickness of the light-transmitting adhesive layer (3) is set to 50-150 um.

8. The LED light source device of claim 1, wherein, the high-reflection adhesive layer (4) completely covers the second optical interface (32).

9. A mold characterized in that, the mold is a mold used for manufacturing any one of the LED light source devices according to claims 1-7. the mold comprises a mold cavity (61) with an opening at the bottom, the mold cavity (61) comprises a top surface (611) and a first side surface (612) connected with the top surface (611), the first side surface (612) is a plane or a curved surface at a certain angle with the top surface (611).

10. The mold of claim 9, wherein, Further comprising a bottom surface (62) arranged around the opening of the mold cavity (61), the bottom surface (62) is connected with a second side surface (63) away from one side of the mold cavity (61), the connection between the second side surface (63) and the bottom surface (62) forms a second top corner (64), and the second top corner (64) is used for forming the second optical interface (32) and the first top corner (34).

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