Chip storage mechanism

Abstract

The utility model provides a chip storage mechanism which comprises a storage substrate, a partition plate and a limiting assembly, the partition plate and the limiting assembly are arranged on the storage substrate, a storage groove is formed in the storage substrate, the storage groove is partitioned by the partition plate to form at least two storage positions, the storage positions are used for storing chips, and the limiting assembly is arranged on the storage substrate. The limiting assembly is used for limiting the chip in the storage position; the number of the storage base plates is multiple, the multiple storage base plates are stacked, and the adjacent storage base plates are connected in a clamped mode through clamping blocks, so that the bottom face of the storage base plate on the upper layer and the storage positions on the storage base plate on the lower layer define a closed space, and the safer storage space can be provided; the chips in the storage positions are protected, and the problem that the chips are damaged due to overlying storage can be avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip storage field, especially a chip storage mechanism. BACKGROUND

[0002] Chip refers to integrated circuit containing many gate circuits, is widely used in computer, communication equipment, robot or household electrical equipment etc., transistor invention and mass production, various solid state semiconductor components such as diode, transistor etc. are used in large quantities.

[0003] At present, in the chip production process needs to use the storage device to store chip temporarily, most factories adopt the way of stacking to store chip, and this storage mode can damage chip to a great extent. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the utility model aims at providing a chip storage mechanism to solve the problem in prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides a chip storage mechanism, including storage base plate, the baffle and limiting component on the storage base plate, the storage base plate is equipped with storage groove, the storage groove is cut off at least two storage positions by the baffle, the storage position is used to place chip, the limiting component is used to limit the chip in the storage position.

[0006] Among them, the number of storage base plate is multiple, multiple storage base plate is stacked, and adjacent storage base plate is connected by clamping block, so that the bottom surface of the storage base plate of the last layer and the storage position on the storage base plate of the next layer form an enclosed space.

[0007] The utility model has the advantages that: by setting the storage groove on the storage base plate, the storage groove is cut off at least two storage positions by the baffle, the chip is placed in the storage position, and then the limiting component is used to limit the chip in the storage position, so that the single chip independent storage purpose is realized, the damage of the chip caused by stacking storage can be avoided, then the adjacent storage base plate is connected by clamping block, so that the bottom surface of the storage base plate of the last layer and the storage position on the storage base plate of the next layer form an enclosed space, a more secure storage space is provided, the chip in the storage position is further protected, and the risk of chip damage is further reduced.

[0008] Preferably, the limiting component includes a receiving block, a first abutting block and a telescopic spring, the bottom of the receiving block is connected with the telescopic spring through a displacement block, the receiving block is hinged with the first abutting block, the receiving block is used to drive the telescopic spring to move away from the first abutting block, so that the first abutting block is abutted with the baffle after turning over.

[0009] Preferably, the bottom of the storage groove is provided with a mounting groove, the receiving block and the first abutting block are located in the mounting groove, and an end of the receiving block, which faces the first abutting block, is provided with a placing space from a groove wall of the mounting groove.

[0010] Preferably, the limiting assembly further comprises a second abutting block, the second abutting block is slidably connected to the receiving block through a sliding block, and the second abutting block is slid to an end of the receiving block, which is away from the first abutting block, through the sliding block.

[0011] Preferably, the bottom of the mounting groove is provided with a displacement groove, the displacement groove is matched with the displacement block, the displacement block is embedded in the displacement groove, and the telescopic spring is located in the displacement groove, and an end of the telescopic spring, which is away from the displacement block, is connected to a groove wall of the displacement groove.

[0012] Preferably, a limiting groove is formed in the storage base plate, the limiting groove is through the storage groove, and the sidewalls of the chip and the partition plate are limited in the limiting groove.

[0013] Preferably, the sidewalls of the limiting groove and the storage groove are both provided with elastic protective pads.

[0014] Preferably, a containing groove is formed in the storage base plate, a plurality of through holes are formed in the sidewall of the containing groove, the containing groove is through the storage groove through the through holes, and a dehumidifier is placed in the containing groove.

[0015] Preferably, the slot of the containing groove is provided with a cover plate, one end of the cover plate is hinged to the storage base plate, and the other end of the cover plate is clamped to the storage base plate.

[0016] Additional aspects and advantages of the present application will be given in part in the following description, become obvious from the following description, or be understood by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A structure schematic view of a chip storage mechanism in a first perspective provided by an embodiment of the present application is shown in the figure;

[0018] Figure 2 A structure schematic view of a chip storage mechanism in a second perspective provided by an embodiment of the present application is shown in the figure; Figure 1 An enlarged view of A in the figure;

[0019] Figure 3 A structure schematic view of a chip storage mechanism in a second perspective provided by an embodiment of the present application is shown in the figure;

[0020] Figure 4The structure schematic diagram of the limiting assembly is provided for the embodiment of the utility model.

[0021] Main element symbol explanation:

[0022] 10, store base plate; 12, limiting groove; 13, elastic protection pad; 14, through hole; 15, installation groove; 17, clamping block; 20, partition; 31, first abutting block; 32, receiving block; 33, second abutting block; 34, displacement block; 35, telescopic spring; 40, chip.

[0023] The following specific embodiments will further illustrate the utility model in combination with the above-mentioned drawings. Specific embodiments

[0024] In order to facilitate understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] Please refer to Figures 1 to 4 The chip 40 storage mechanism in the embodiment of the utility model, store base plate 10, partition 20 and limiting assembly.

[0028] The storage base plate 10 is provided with a storage groove, the storage groove is separated into four storage positions by the partition plate 20, and each storage position is used for placing the chip 40. In order to limit the chip 40 in the storage position in the vertical direction, a limiting groove 12 is formed in the storage base plate 10, the limiting groove 12 is through the storage groove, the sidewall of the chip 40 and the partition plate 20 are limited in the limiting groove 12, so that the chip 40 is limited in the vertical direction, and the limiting assembly is used for limiting the chip 40 and the partition plate 20 in the horizontal direction. It should be noted that the sidewall of the limiting groove 12 and the storage groove is provided with an elastic protective pad 13, so as to protect the chip 40.

[0029] In the embodiment, the limiting assembly comprises a receiving block 32, a first abutting block 31, a second abutting block 33 and a telescopic spring 35, the receiving block 32 is hinged with the first abutting block 31, the receiving block 32 is connected with the second abutting block 33 through a sliding block, the bottom of the receiving block 32 is connected with the telescopic spring 35 through a displacement block 34, in order to reasonably install the above structure, an installation groove 15 is formed in the bottom of the storage groove, the receiving block 32, the first abutting block 31 and the second abutting block 33 are located in the installation groove 15, a displacement groove is formed in the bottom of the installation groove 15, the displacement block 34 and the telescopic spring 35 are located in the displacement groove, the displacement block 34 is matched with the displacement groove, the displacement block 34 is in a trapezoidal structure in section, the telescopic spring 35 is located on the side of the displacement block 34 away from the abutting block, one end of the telescopic spring 35 is connected with the displacement block 34, and the other end of the telescopic spring 35 is connected with the sidewall of the displacement groove.

[0030] It should be noted that when the limiting assembly is in the initial state, the telescopic spring 35 is in the initial state without stretching or shrinking, the first abutting block 31 is stacked with the receiving block 32, the first abutting block 31 is located above the receiving block 32, the second abutting block 33 is located on one side of the receiving block 32, and the opposite ends of the receiving block 32 are respectively provided with a placing space between the corresponding slot walls in the mounting slot 15. When it is necessary to fix and limit the chip 40 through the limiting assembly, the receiving block 32 is turned to compress the telescopic spring 35, at this time, the telescopic spring 35 is in a contracted state, so that the receiving block 32 is expanded towards the placing space between the first abutting block 31 and the corresponding slot wall in the mounting slot 15, and the receiving block 32 is reduced towards the placing space between the second abutting block 33 and the corresponding slot wall in the mounting slot 15. Then, the first abutting block 31 is turned over until the first abutting block 31 is inserted into the expanded placing space, and the first abutting block 31 is perpendicular to the receiving block 32. At this time, the receiving block 32 is loosened to restore the telescopic spring 35 to the initial state. Then, the second abutting block 33 is moved relative to the receiving block 32 through the sliding block until the second abutting block 33 is moved into the placing space between the receiving block 32 and the second abutting block 33 and the corresponding slot wall in the mounting slot 15. At this time, the first abutting block 31 and the second abutting block 33 are respectively located at opposite ends of the receiving block 32, and the first abutting block 31 and the second abutting block 33 are in contact with the corresponding slot wall of the mounting slot 15 to limit the first abutting block 31, so that the first abutting block 31 abuts against the partition plate 20, thereby fixing and limiting the chip 40 in the storage site in the horizontal direction.

[0031] In the embodiment, in order to achieve the purpose of moving the second abutting block 33 relative to the receiving block 32, corresponding sliding grooves are respectively formed on the receiving block 32 and the bottom of the mounting slot 15, and the sliding block is located in the sliding groove, so that the second abutting block 33 can be connected with the receiving block 32 through the sliding block.

[0032] In the embodiment, the top of the storage substrate 10 is provided with the clamping block 17, the bottom of the storage substrate 10 is provided with the embedding groove, and the number of the storage substrate 10 is multiple. The multiple storage substrates 10 are stacked, specifically, the clamping block 17 on the storage substrate 10 of the next layer is embedded into the embedding groove on the storage substrate 10 of the previous layer, so as to realize the clamping between the adjacent storage substrates 10. At this time, the bottom surface of the storage substrate 10 of the previous layer and the storage site on the storage substrate 10 of the next layer form a closed space, so as to provide a safer storage space and further protect the chip 40 in the storage site.

[0033] In the embodiment, in order to provide a more suitable storage environment, the storage base plate 10 is provided with a containing groove, a plurality of through holes 14 are formed in the groove wall of the containing groove, the containing groove is communicated with the storage groove through the through holes 14, and a dehumidifying agent is placed in the containing groove. The dehumidifying agent can be activated carbon, so as to dehumidify the storage position or the closed space. It should be noted that the groove opening of the containing groove is provided with a cover plate, one end of the cover plate is connected with the storage base plate 10, and the other end of the cover plate is clamped with the storage base plate 10, so as to replace the activated carbon in the containing groove.

[0034] In specific implementation, the storage groove is formed in the storage base plate 10, the storage groove is separated into at least two storage positions by the partition plate 20, the chip 40 is placed in the storage position, and then the chip 40 is limited in the storage position by the limiting assembly, so as to realize the purpose of independent storage of the single chip 40, and the damage of the chip 40 caused by stacking storage can be avoided. Then, the adjacent storage base plates 10 are clamped by the clamping block 17, so that the bottom surface of the storage base plate 10 of the upper layer and the storage position of the storage base plate 10 of the lower layer form a closed space, so as to provide a safer storage space, further protect the chip 40 in the storage position, and further reduce the risk of damage of the chip 40.

[0035] It should be noted that the above implementation process is only for the purpose of illustrating the feasibility of the present application, but it does not mean that the chip storage mechanism of the present application has only the above-mentioned unique implementation process. On the contrary, as long as the chip storage mechanism of the present application can be implemented, it can be included in the feasible implementation scheme of the present application.

[0036] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above-described embodiments only express several implementation manners of the present application, the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A chip storage mechanism, characterized by, The application relates to a chip storage device, which comprises a storage substrate, a partition plate arranged on the storage substrate, and a limiting assembly, wherein a storage groove is arranged on the storage substrate, the storage groove is divided into at least two storage positions by the partition plate, and the limiting assembly is used for limiting a chip in the storage position. The number of the storage substrates is multiple, the multiple storage substrates are stacked, and adjacent storage substrates are clamped by clamping blocks, so that the bottom surface of the storage substrate of an upper layer and the storage position of a lower layer of the storage substrate enclose a closed space.

2. The chip storage mechanism according to claim 1, wherein, The limiting assembly comprises a receiving block, a first abutting block and a telescopic spring, the bottom of the receiving block is connected with the telescopic spring through a displacement block, the receiving block is hinged with the first abutting block, the receiving block is used for driving the telescopic spring to move away from the first abutting block, so that the first abutting block is abutted against the partition plate after being turned over.

3. The chip storage mechanism of claim 2, wherein, The bottom of the storage groove is provided with a mounting groove, the receiving block and the first abutting block are located in the mounting groove, the end of the receiving block towards the first abutting block is provided with a placing space with respect to the groove wall of the mounting groove, and the first abutting block is stacked with the receiving block in an initial state.

4. The chip storage mechanism of claim 2, wherein, The limiting assembly further comprises a second abutting block, the second abutting block is slidably connected with the receiving block through a sliding block, and the second abutting block is slid to the end of the receiving block away from the first abutting block through the sliding block.

5. The chip storage mechanism of claim 3, wherein, The bottom of the mounting groove is provided with a displacement groove, the displacement groove is matched with the displacement block, the displacement block is embedded in the displacement groove, and the telescopic spring is located in the displacement groove, and one end of the telescopic spring away from the displacement block is connected with the groove wall of the displacement groove.

6. The chip storage mechanism of claim 1, wherein, The storage substrate is provided with a limiting groove, the limiting groove is through with the storage groove, and the chip and the side wall of the partition plate are limited in the limiting groove.

7. The chip storage mechanism of claim 6, wherein, The groove walls of the limiting groove and the storage groove are both provided with elastic protective pads.

8. The chip storage mechanism of claim 1, wherein, The storage substrate is provided with an accommodating groove, the groove wall of the accommodating groove is provided with a plurality of through holes, the accommodating groove is through with the storage groove through the through holes, and a dehumidifier is placed in the accommodating groove.

9. The chip storage mechanism of claim 8, wherein, The slot of the accommodating groove is provided with a cover plate, one end of the cover plate is hinged with the storage substrate, and the other end of the cover plate is clamped with the storage substrate.

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