Radiator for LED lamp bead

Abstract

The utility model discloses a radiator for an LED lamp bead, and relates to the related technical field of lamps. Comprising a sunflower radiator, a stepped groove is formed in the top of the sunflower radiator, a lamp holder is clamped in a close fit mode through the stepped groove, tube plates are arranged at the upper end and the lower end of the lamp holder, heat pipes are inserted into the tube plates, inserting holes are evenly distributed in the sunflower radiator and correspond to round holes in the tube plates, and the bottom ends of the heat pipes penetrate through the inserting holes. According to the radiator for the LED lamp beads, the aluminum substrate is used for installing the LED lamp beads, the LED lamp beads can generate a large amount of heat in the working process, most of the heat can be conducted to the heat pipe through the thin copper plate, and the heat pipe absorbs the heat and rapidly conducts the heat to the sunflower radiator responsible for heat dissipation, so that efficient transfer of the heat is achieved; the sunflower radiator is used for being exposed in the external environment, it is ensured that heat can be rapidly dissipated to the surrounding air, and therefore the heat dissipation efficiency is remarkably improved, and the service life of the lamp is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, specifically a heat sink for LED beads. Background Technology

[0002] LED lights, also known as light-emitting diodes, are solid-state semiconductor devices that can convert electrical energy into visible light. They can directly convert electricity into light energy. With the continuous development of society, LED lights are widely used in various lighting and analytical equipment due to their high brightness and energy-saving properties. They are increasingly used in various occasions and are becoming more and more common.

[0003] Ordinary LED beads have relatively low individual power and insufficient brightness. To improve brightness, multiple LED beads are often combined into a single light source, fixed together on a circuit board and heat sink. Current ring bulbs typically have a flexible LED bead plate attached to the outer surface of a hollow cylindrical heat sink, with plastic wrapped inside and connected to a threaded lamp holder. The driver power supply is placed inside the heat sink cavity, and the outermost light-transmitting cover is riveted to the threaded lamp holder to form a closed cavity. When the light is on, the heat generated by the LED beads cannot be quickly dissipated, resulting in poor heat dissipation. Utility Model Content

[0004] This invention provides a heat sink for LED beads to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat sink for LED lamp beads, including a sunflower heat sink. The top of the sunflower heat sink is provided with a stepped groove, and a lamp holder is tightly fitted and snapped together through the stepped groove. The upper and lower ends of the lamp holder are provided with tube plates, and heat pipes are inserted into the tube plates. The sunflower heat sink is evenly distributed with insertion holes, and the insertion holes correspond to the positions of the round holes on the tube plates. The bottom end of the heat pipe passes through the insertion hole and extends out of the sunflower heat sink. A thin copper plate is soldered to the outside of the heat pipe, and an aluminum substrate is wrapped around the outside of the thin copper plate.

[0006] Furthermore, the top of the sunflower radiator is provided with a slot, and the slot is located at the outer edge of the sunflower radiator.

[0007] Furthermore, the bottom of the sunflower radiator is provided with an assembly cavity, and the assembly cavity is provided with a through hole, which is connected to the bottom of the stepped groove through the through hole.

[0008] Furthermore, the tube plate has a hollow structure, and the tube plate at the bottom of the lamp holder has a locking part.

[0009] Furthermore, the heat pipes are evenly distributed on the tube sheet, and the top of the heat pipes extends upward from the tube sheet.

[0010] Furthermore, the sockets are evenly distributed on the sunflower radiator, and the sockets are filled with a first layer of thermal conductive paste.

[0011] Furthermore, the outer surface of the thin copper plate is coated with a second thermally conductive paste layer, and the second thermally conductive paste layer is located between the aluminum substrate and the thin copper plate.

[0012] Compared with the prior art, the present invention provides a heat sink for LED lamp beads, which has the following beneficial effects:

[0013] This LED lamp bead heat sink uses an aluminum substrate to mount the LED lamp beads. During operation, the LED lamp beads generate a large amount of heat. Most of the heat can be conducted to the heat pipe through a thin copper plate. The heat pipe absorbs the heat and quickly conducts it to the sunflower heat sink responsible for heat dissipation, so as to achieve efficient heat transfer. The sunflower heat sink is exposed to the external environment to ensure that the heat can be quickly dissipated to the surrounding air, thereby significantly improving heat dissipation efficiency and extending the life of the lamp. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a top view of the present invention;

[0016] Figure 3 This is a cross-sectional view of the present invention.

[0017] In the diagram: 1. Sunflower radiator; 2. Stepped groove; 3. Lamp holder; 4. Tube sheet; 5. Heat pipe; 6. Insertion hole; 7. Thin copper plate; 8. Aluminum substrate; 9. Slot; 10. Assembly cavity; 11. Through hole; 12. Hollow structure; 13. Engaging part; 14. First thermal paste layer; 15. Second thermal paste layer. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1-3This utility model discloses a heat sink for LED lamp beads, including a sunflower heat sink 1. The top of the sunflower heat sink 1 is provided with a stepped groove 2, and a lamp holder 3 is tightly connected to it through the stepped groove 2. The upper and lower ends of the lamp holder 3 are provided with tube plates 4, and heat pipes 5 are inserted into the tube plates 4. The sunflower heat sink 1 is evenly distributed with insertion holes 6, and the insertion holes 6 correspond to the positions of the round holes on the tube plates 4. The bottom end of the heat pipe 5 passes through the insertion hole 6 and extends out of the sunflower heat sink 1. A thin copper plate 7 is soldered to the outside of the heat pipe 5. An aluminum substrate 8 is wrapped around the outside of the thin copper plate 7. The aluminum substrate 8 is used to install LED lamp beads. During operation, the LED lamp beads generate a lot of heat. Most of the heat can be conducted to the heat pipe 5 through the thin copper plate 7. The heat pipe 5 absorbs the heat and quickly conducts it to the sunflower heat sink 1, which is responsible for heat dissipation, so as to achieve efficient heat transfer. The sunflower heat sink 1 is exposed to the external environment to ensure that the heat can be quickly dissipated to the surrounding air, thereby significantly improving the heat dissipation efficiency and extending the service life of the lamp.

[0020] Specifically, the top of the sunflower radiator 1 is provided with a slot 9, and the slot 9 is located at the outer edge of the sunflower radiator 1.

[0021] In this implementation scheme, the sunflower radiator 1, with its unique design and efficient heat dissipation performance, can quickly conduct and dissipate the heat generated inside the equipment into the air, effectively preventing the equipment from being damaged or experiencing performance degradation due to overheating. Its large-area heat sink and free-flowing air design accelerate the heat conduction and dissipation process, ensuring that the equipment maintains a suitable temperature even under high load conditions. The slot 9 is used for the installation and fixing of the lampshade.

[0022] Specifically, the bottom of the sunflower radiator 1 is provided with an assembly cavity 10, and the assembly cavity 10 is provided with a through hole 11. The assembly cavity 10 is connected to the bottom of the stepped groove 2 through the through hole 11.

[0023] In this embodiment, the assembly cavity 10 is used to install the threaded lamp holder, and the through hole 11 facilitates the entry and exit of wiring.

[0024] Specifically, the tube plate 4 is provided with a hollow structure 12, and the tube plate 4 located at the bottom of the lamp holder 3 is provided with a locking part 13.

[0025] In this embodiment, the hollow structure 12 is for weight reduction while maintaining a certain amount of air circulation, and the snap-fit ​​part 13 is a connecting structure used for the installation and fixation between the lamp holder 3 and the sunflower radiator 1.

[0026] Specifically, the heat pipes 5 are evenly distributed on the tube sheet 4, and the top of the heat pipes 5 extends upward from the tube sheet 4.

[0027] In this embodiment, the tube sheet 4 is a circular plate with holes drilled in it, which are slightly larger than the outer diameter of the heat pipe 5, and are used to fix the heat pipe 5.

[0028] Specifically, the sockets 6 are evenly distributed on the sunflower radiator 1, and the sockets 6 are filled with a first thermal conductive paste layer 14.

[0029] In this embodiment, the socket 6 is a connection structure used to connect the lower part of the heat pipe 5 to the sunflower radiator 1, and reliably transfer heat under the action of the first thermal conductive paste layer 14. The heat pipe 5 is a device that uses the phase change and circulation of liquid to transfer heat. The heat pipe 5 is usually composed of a sealed pipe filled with a working medium. The working medium is generally a liquid that is easy to change phase, such as water or ethanol. When one end of the heat pipe 5 absorbs heat, the working medium evaporates into gas. The gas is transferred to the other end of the heat pipe 5 through the pressure difference, and then cools and condenses into liquid at the other end, releasing heat. This process is continuously cyclical, thereby achieving efficient heat transfer.

[0030] Specifically, the outer surface of the thin copper plate 7 is coated with a second thermally conductive paste layer 15, and the second thermally conductive paste layer 15 is located between the aluminum substrate 8 and the thin copper plate 7.

[0031] In this embodiment, thermal paste is also known as thermal grease, CPU paste, thermal gel, and thermal interface material. Its main function is to improve the heat transfer efficiency between components. Specifically, thermal paste fills the depressions on the surface of components, enabling heat to be transferred more effectively.

[0032] In use, the aluminum substrate 8 is used to mount LED beads. During operation, the LED beads generate a lot of heat. Most of the heat can be conducted to the heat pipe 5 through the thin copper plate 7. The heat pipe 5 absorbs the heat and quickly conducts it to the sunflower heat sink 1, which is responsible for heat dissipation, so as to achieve efficient heat transfer. The sunflower heat sink 1 is exposed to the external environment to ensure that the heat can be quickly dissipated to the surrounding air, thereby significantly improving the heat dissipation efficiency and extending the service life of the lamp.

[0033] In summary, the heat sink for this LED lamp bead uses an aluminum substrate 8 to mount the LED lamp bead. During operation, the LED lamp bead generates a large amount of heat, which is mostly conducted to the heat pipe 5 through the thin copper plate 7. The heat pipe 5 absorbs the heat and quickly conducts it to the sunflower heat sink 1, which is responsible for heat dissipation, to achieve efficient heat transfer. The sunflower heat sink 1 is exposed to the external environment to ensure that the heat can be quickly dissipated to the surrounding air, thereby significantly improving heat dissipation efficiency and extending the service life of the lamp.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat sink for LED beads, comprising a sunflower heat sink (1), characterized in that: The top of the sunflower radiator (1) is provided with a stepped groove (2), and a lamp holder (3) is tightly connected through the stepped groove (2). The upper and lower ends of the lamp holder (3) are provided with tube plates (4), and heat pipes (5) are inserted into the tube plates (4). The sunflower radiator (1) is evenly distributed with insertion holes (6), and the insertion holes (6) correspond to the positions of the round holes on the tube plates (4). The bottom end of the heat pipe (5) passes through the insertion hole (6) and extends out of the sunflower radiator (1). A thin copper plate (7) is soldered to the outside of the heat pipe (5), and an aluminum substrate (8) is wrapped around the outside of the thin copper plate (7).

2. The heat sink for LED beads according to claim 1, characterized in that: The top of the sunflower radiator (1) is provided with a slot (9), and the slot (9) is located at the outer edge of the sunflower radiator (1).

3. The heat sink for LED beads according to claim 1, characterized in that: The bottom of the sunflower radiator (1) is provided with an assembly cavity (10), and the assembly cavity (10) is provided with a through hole (11). The assembly cavity (10) is connected to the bottom of the stepped groove (2) through the through hole (11).

4. A heat sink for LED beads according to claim 1, characterized in that: The tube plate (4) is provided with a hollow structure (12), and the tube plate (4) located at the bottom of the lamp holder (3) is provided with a locking part (13).

5. A heat sink for LED beads according to claim 1, characterized in that: The heat pipes (5) are evenly distributed on the tube sheet (4), and the top of the heat pipes (5) extends upward from the tube sheet (4).

6. A heat sink for LED beads according to claim 1, characterized in that: The sockets (6) are evenly distributed on the sunflower radiator (1), and the sockets (6) are filled with a first thermal conductive paste layer (14).

7. A heat sink for LED beads according to claim 1, characterized in that: The outer surface of the thin copper plate (7) is coated with a second thermal paste layer (15), and the second thermal paste layer (15) is located between the aluminum substrate (8) and the thin copper plate (7).

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