Photoelectric integrated ceramic heat dissipation module

Abstract

The utility model discloses a photoelectric integrated ceramic heat dissipation module. The photoelectric integrated ceramic heat dissipation module comprises a radiator, a circuit board, an LED lamp sheet, a capacitor, a transformer and a driving electronic part, the radiator is made of ceramic materials and is in a disc shape, a plurality of vertically-arranged radiating fins are arranged at the bottom of the radiator, installation holes are formed in the two sides of the radiator, and the upper surface of the radiator is a flat and straight face. The circuit board is attached to the upper surface of the radiator; the circuit board is a sintered circuit; the LED lamp sheet, the capacitor, the transformer and the driving electronic part are attached to the upper surface of the radiator and electrically connected with the circuit board. And a pressure-reducing rubber mat is arranged in the mounting hole of the radiator. The photoelectric integrated ceramic heat dissipation module is simple and reasonable in design and stable and reliable in connection; design is simple and reasonable, and connection is stable and reliable; compared with a traditional mode, the module is short in heat transfer path, high in integration and faster in heat dissipation.

Description

TECHNICAL FIELD

[0001] The utility model relates to a lamp technical field, especially to a photoelectric integrated ceramic heat dissipation module. BACKGROUND

[0002] At present, some lamps on the market are provided with radiators, but the radiators are independent of the lamps, and the radiators need to be connected with the bases of the lamps through screws or other connecting members (or integrally arranged at the tail of the lamp base), which is not beautiful, has a high cost, and has a low heat dissipation efficiency.

[0003] The utility model discloses a photoelectric integrated ceramic heat dissipation module, the radiator adopts high heat conduction ceramic lamp body, and the circuit is sintered on the surface of the radiator, the light source and driving electronic piece are directly pasted on the front of the radiator through SMD, and form a photoelectric integrated module, the heat transfer path of the module is short, integrated, fast in heat dissipation, high in light efficiency and long in service life compared with the traditional mode, and the module is combined with plastic or metal structure to form light source products, cylinder spotlight products and various purposes, and is easy to assemble. UTILITY MODEL CONTENTS

[0004] The utility model discloses a photoelectric integrated ceramic heat dissipation module, and the design is very simple and reasonable, and stable and reliable in connection, the heat transfer path of the module is short, integrated, and fast in heat dissipation compared with the traditional mode.

[0005] In order to solve the above technical problems, the technical scheme of the utility model is as follows:

[0006] A photoelectric integrated ceramic heat dissipation module, comprising a radiator, a circuit board, an LED lamp sheet, a capacitor, a transformer, driving electronic pieces and the like.

[0007] The radiator is of ceramic material, is disc-shaped, is provided with a plurality of vertically arranged heat dissipation fins at the bottom, is provided with mounting holes at the two sides, and the upper surface is a flat surface.

[0008] The circuit board is attached to the upper surface of the radiator, preferably, the circuit board is a sintered circuit, the sintered circuit is a technology of sintering material powder or fiber-like material into a circuit board, which sintering material into a uniform and dense board through high-temperature pressure, compression, time and other process links, so as to form a circuit board, compared with the traditional circuit board manufacturing method, the circuit sintering technology has the advantages of time saving, material saving, high precision, stable quality and the like.

[0009] The upper surface of the radiator serves as the substrate of the sintered circuit, that is, as the bottom plate of the circuit board.

[0010] The LED lamp sheet, the capacitor, the transformer and the shell of the driving electronics are attached to the upper surface of the heat sink and are electrically connected to the circuit board through pins.

[0011] The ceramic heat sink has the disadvantage of being fragile, especially when it is fixed to the lamp shell by fasteners, the heat sink is easily broken under pressure. Therefore, a mounting pressure relief gasket is arranged in the mounting hole of the heat sink, and when the mounting screw is screwed, the screw does not directly press the heat sink, and the screw gives pressure to the heat sink through the mounting pressure relief gasket, so that the heat sink is not broken.

[0012] The mounting pressure relief gasket comprises an upper guard ring piece, a lower guard ring piece and a connecting column; the upper guard ring piece and the lower guard ring piece are arranged oppositely and have the same structure; the upper end and the lower end of the connecting column are connected to the upper guard ring piece and the lower guard ring piece respectively. The connecting column is a column body with a cylindrical cavity in the middle; the upper guard ring piece is a circular ring piece with a through hole in the middle. The upper guard ring piece, the lower guard ring piece and the connecting column are integrally formed.

[0013] The upper guard ring piece and the lower guard ring piece are respectively attached to the upper surface and the lower surface of the heat sink.

[0014] Because the heat-generating circuit and electronic components are all attached to the upper surface of the heat sink, the heat dissipation efficiency is very high.

[0015] The beneficial effects of the present application are as follows:

[0016] The design is very simple and reasonable, and the connection is stable and reliable; the heat transfer path of the module is relatively short, integrated and fast in heat dissipation compared with the traditional way. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is a structure diagram of the photoelectric integrated ceramic heat dissipation module of the present application;

[0018] Fig. 2 It is a bottom view of the photoelectric integrated ceramic heat dissipation module of the present application. DETAILED DESCRIPTION

[0019] The specific embodiments of the present application will be further described below in combination with the drawings. It should be noted that the description of these embodiments is used to help understand the present application, but does not constitute a limitation on the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.

[0020] As shown in Figs. 1-2 A photoelectric integrated ceramic heat dissipation module comprises a heat sink 1, a circuit board 2, an LED lamp sheet 3, a capacitor 4, a transformer 5, driving electronics and the like.

[0021] The heat radiator 1 is made of ceramic material, is discoid, is provided with a plurality of vertical heat dissipation fins 11 at the bottom, is provided with mounting holes 12 at the two sides, and the upper surface is a flat surface.

[0022] The circuit board 2 is attached to the upper surface of the heat radiator 1; preferably, the circuit board 2 is a sintered circuit, which is a technology of sintering material powder or fiber-like material into the circuit board 2. The material is sintered into a uniform and dense plate through multiple process links such as pressure, compression and time at high temperature, so as to form the circuit board 2. Compared with the traditional circuit board 2 manufacturing method, the circuit sintering technology has the advantages of time saving, material saving, high precision and stable quality. Preferably, the material is silver or copper.

[0023] The upper surface of the heat radiator 1 serves as the substrate of the sintered circuit, that is, the bottom plate of the circuit board 2.

[0024] The LED lamp sheet 3, the capacitor 4, the transformer 5 and the driving electronics are attached to the upper surface of the heat radiator 1 and are electrically connected with the circuit board 2.

[0025] The ceramic heat radiator 1 has the defect of being easy to break, especially when it is fixedly connected with the lamp shell through fasteners during assembly. The heat radiator 1 is easy to break under pressure. Therefore, the mounting hole 12 of the heat radiator 1 is provided with a mounting pressure-reducing rubber pad 6. When the mounting screw is screwed, the screw does not directly press the heat radiator 1. The screw gives pressure to the heat radiator 1 through the mounting pressure-reducing rubber pad 6, so as not to cause the heat radiator 1 to break.

[0026] The mounting pressure-reducing rubber pad 6 comprises an upper guard ring piece 61, a lower guard ring piece 62 and a connecting column 63. The upper guard ring piece 61 and the lower guard ring piece 62 are arranged oppositely and have the same structure. The connecting column 63 is connected with the upper guard ring piece 61 and the lower guard ring piece 62 at the upper end and the lower end respectively. The connecting column 63 is a column body provided with a cylindrical cavity in the middle. The upper guard ring piece 61 is a circular ring piece provided with a through hole in the middle. The upper guard ring piece 61, the lower guard ring piece 62 and the connecting column 63 are integrally formed.

[0027] The upper guard ring piece 61 and the lower guard ring piece 62 are attached to the upper surface and the lower surface of the heat radiator 1 respectively.

[0028] The embodiments of the utility model are described in detail in combination with the drawings, but the utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the utility model, and still fall within the protection scope of the utility model.

Claims

1. An optoelectronic integrated ceramic heat dissipation module, characterized in that: The heat sink, the circuit board, the LED lamp sheet, the capacitor, the transformer and the driving electronics are included. The heat sink is made of ceramic and has a disc shape, and a plurality of vertical heat dissipation fins are arranged on the bottom of the heat sink, and mounting holes are arranged on the two sides of the heat sink, and the upper surface of the heat sink is a flat surface. The circuit board is attached to the upper surface of the heat sink, and the circuit board is a sintered circuit. The LED lamp sheet, the capacitor, the transformer and the driving electronics are attached to the upper surface of the heat sink and are electrically connected to the circuit board. A mounting pressure relief rubber pad is arranged in the mounting hole of the heat sink. 2.The photoelectric integrated ceramic heat dissipation module according to claim 1, characterized in that: The mounting pressure relief rubber pad includes an upper guard ring piece, a lower guard ring piece and a connecting column, the upper guard ring piece and the lower guard ring piece are arranged oppositely, the connecting column is connected to the upper guard ring piece and the lower guard ring piece at the upper end and the lower end respectively, the connecting column is a column with a cylindrical cavity in the middle, the upper guard ring piece is a ring piece with a through hole in the middle, and the upper guard ring piece, the lower guard ring piece and the connecting column are integrally formed. The upper guard ring piece and the lower guard ring piece are attached to the upper surface and the lower surface of the heat sink respectively. 3.The photoelectric integrated ceramic heat dissipation module according to claim 2, characterized in that: The upper surface of the heat sink serves as a substrate of the sintered circuit.

4. The photoelectric integrated ceramic heat dissipation module according to claim 3, characterized in that: The material of the sintered circuit is silver.

5. The optoelectronic integrated ceramic heat spreading module of claim 3, wherein: The material of the sintered circuit is copper.

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