Dual-band TO packaging structure for temperature measurement detector

Abstract

The utility model relates to the technical field of temperature measurement detectors, in particular to a dual-band TO packaging structure for a temperature measurement detector, which comprises a shell and a tube socket, the shell is fixedly connected to the tube socket, a sealing cavity is formed between the shell and the tube socket, a first chip and a second chip are arranged in the sealing cavity, and the first chip and the second chip are arranged in the sealing cavity. A light-transmitting piece is arranged between the first chip and the second chip, the first chip and the second chip are stacked in a staggered mode, the first chip and the light-transmitting piece are arranged in an insulated mode, and the second chip and the light-transmitting piece are arranged in an electric conduction mode. According to the invention, the first chip and the second chip are stacked on the light-transmitting sheet in a staggered manner, so that the irradiation requirements of two wave band light sources can be met at the same time.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of temperature measuring detectors, in particular to a dual-band TO packaging structure for a temperature measuring detector. BACKGROUND

[0002] The temperature measuring detector is a detector for detecting the temperature of an environment by using a thermal sensitive method and giving an alarm, and is mainly used for detecting the temperature of a measured object and an environment, and when the temperature exceeds or is lower than a preset standard value, an alarm signal is given.

[0003] The TO packaging is a transistor packaging, and in the temperature measuring detector, the TO packaging is a common packaging form, which is usually composed of a shell, a pin and a sealing structure, the shell is used for protecting an infrared sensor chip inside, the pin is used for connecting the TO packaging and an external circuit, and the sealing structure is used for ensuring that the infrared sensor chip is not affected by the external environment.

[0004] The infrared sensor chip is a core element of the temperature measuring detector, and is responsible for receiving infrared radiation and converting the infrared radiation into an electric signal, and the existing TO packaging structure is mainly used for packaging a single infrared sensor chip, so that the reception of a single-band light source is supported, and the reception demand of different bands of light sources is limited.

[0005] Therefore, a dual-band TO packaging structure is needed to solve the problem that the reception demand of different bands of light sources is limited, so as to meet the reception demand of different bands of light sources at the same time. CONTENT OF THE INVENTION

[0006] In order to meet the reception demand of two bands of light sources at the same time, the application provides a dual-band TO packaging structure for a temperature measuring detector.

[0007] The dual-band TO packaging structure for the temperature measuring detector provided by the application adopts the following technical scheme: a dual-band TO packaging structure for a temperature measuring detector, which comprises a shell and a pipe seat, the shell is fixedly connected to the pipe seat, a sealing cavity is formed between the shell and the pipe seat, a chip one and a chip two are arranged in the sealing cavity, a light transmission sheet is arranged between the chip one and the chip two, the chip one and the chip two are staggered and stacked, the chip one and the light transmission sheet are insulatively arranged, and the chip two and the light transmission sheet are electrically conductive.

[0008] By adopting the above technical scheme, the shell is provided with the chip one and the chip two, the shell is used for protecting the chip one and the chip two inside, the pipe seat is fixedly connected to the shell, a sealing cavity is formed between the shell and the pipe seat, the chip one and the chip two are sealed in the sealing cavity, the protection effect of the chip one and the chip two is further enhanced, the sealing cavity is arranged, the chip one and the chip two are prevented from being affected by the external environment, oxygen in the air is effectively blocked, oxidation reaction of the chip one and the chip two is prevented, and the conductivity of the chip one and the chip two is affected. The light-transmitting sheet is arranged between the chip one and the chip two, electrical conduction between the chip one and the chip two is avoided, the light-transmitting sheet and the chip one are insulated, electrical conduction between the light-transmitting sheet and the chip one is avoided, and conversion of an electrical signal is affected. Compared with the prior art, the chip one and the chip two are staggered and stacked, and the receiving requirements of two waveband light sources can be met at the same time.

[0009] Optionally, the chip one and the chip two each include a light source area, and the light source areas of the chip one and the chip two partially overlap.

[0010] By adopting the above technical scheme, the light source areas of the chip one and the chip two partially overlap, the integration of the packaging structure is improved, and it is ensured that the temperature measuring sensor can accurately receive and identify infrared radiation of a target object.

[0011] Optionally, one side of the light-transmitting sheet is coplanar with one side of the chip one, and the opposite side of the light-transmitting sheet is coplanar with one side of the chip two.

[0012] By adopting the above technical scheme, one side of the light-transmitting sheet is coplanar with one side of the chip one, and the opposite side of the light-transmitting sheet is coplanar with one side of the chip two, so that the chip one and the chip two are more conducive to receiving infrared radiation of two wavebands when being attached to the light-transmitting sheet.

[0013] Optionally, the light-transmitting sheet includes a sapphire gold-plated light-transmitting sheet.

[0014] By adopting the above technical scheme, the light-transmitting sheet includes a sapphire gold-plated light-transmitting sheet, the insulation between the light-transmitting sheet and the chip one is ensured by using the insulation performance of sapphire, a part of the light-transmitting sheet is gold-plated, the chip two and the light-transmitting sheet can be electrically connected, sapphire has good light-transmitting effect, ensures that infrared radiation smoothly passes through the light-transmitting sheet and enters the chip two below the light-transmitting sheet, and sapphire has stable strength, which further enhances the stability of the chip one and the chip two.

[0015] Optionally, the packaging structure further includes a plurality of groups of pins, the pins are located in the sealing cavity and extend from the pipe seat, the chip one is provided with a wire one, the wire one is connected with one group of pins, the chip two is provided with a wire two, and the wire two is connected with another group or a plurality of groups of pins.

[0016] Through the above technical scheme, the electric signal of the chip one is conducted to a group of pins through the wire one, and then the electric signal of the chip one is outputted to the outside of the sealed cavity through the group of pins, the electric signal of the chip two is transmitted to another group or multiple groups of pins through the wire two, and then the electric signal of the chip two is outputted to the outside of the sealed cavity through the group or multiple groups of pins, and through the arrangement of the multiple groups of pins, the connection between the packaging structure and the external circuit is realized.

[0017] Optionally, a through hole is arranged on the pipe base for the pin to pass through, and an insulating layer is filled between the pin and the through hole.

[0018] Through the above technical scheme, the pin passes through the through hole to realize the connection between the packaging structure and the external circuit, the insulating layer is filled between the pin and the through hole to further enhance the sealing effect of the sealed cavity, and meanwhile, through the arrangement of the insulating layer, the electrical conduction between the pin and the pipe base is avoided to affect the transmission of the electric signal.

[0019] Optionally, a light transmission hole is arranged on the shell, and a light transmission piece for covering the light transmission hole is arranged in the sealed cavity.

[0020] Through the above technical scheme, the light transmission hole is arranged on the shell to ensure that the chip one and the chip two can successfully receive the infrared radiation, and the light transmission piece for covering the light transmission hole is arranged in the sealed cavity to ensure that the sealed cavity has a stable sealing effect.

[0021] Optionally, a heat dissipation table fixedly connected with the pipe base is arranged in the sealed cavity, and the heat dissipation table comprises a pad table made of oxygen-free copper.

[0022] Through the above technical scheme, the heat dissipation table comprises the pad table made of oxygen-free copper to ensure that the heat dissipation table has a good heat dissipation effect, and the heat dissipation table is fixed with the pipe base, so that the heat of the chip one and the chip two can be transmitted to the outside through the heat dissipation table and the pipe base.

[0023] In summary, the present application has at least one of the following beneficial technical effects:

[0024] 1. The shell is provided with chip one and chip two, the shell is used for protecting the internal chip one and chip two, the pipe seat is fixedly connected on the shell, a sealing cavity is formed between the shell and the pipe seat, the chip one and the chip two are sealed in the sealing cavity, the protection effect of the chip one and the chip two is further enhanced, meanwhile, by arranging the sealing cavity, the chip one and the chip two are prevented from being affected by the external environment, the oxygen in the air is effectively blocked, the oxidation reaction of the chip one and the chip two is prevented, and the conductivity of the chip one and the chip two is affected, by arranging the light-transmitting sheet, the chip one and the chip two are separated, the electrical conduction between the chip one and the chip two is avoided, the light-transmitting sheet and the chip one are insulated, the electrical conduction between the light-transmitting sheet and the chip one is avoided, the conversion of the electrical signal is affected, the light-transmitting sheet and the chip two are electrically connected, compared with the prior art, the chip one and the chip two are staggered and stacked, and the irradiation requirements of two kinds of waveband light sources can be met at the same time;

[0025] 2. The light-transmitting sheet comprises a sapphire gold-plated light-transmitting sheet, the insulating property of the sapphire is used to ensure that the light-transmitting sheet and the chip one are insulated, a part of the light-transmitting sheet is gold-plated, and then the chip two and the light-transmitting sheet can be electrically connected, the sapphire has good light-transmitting effect, ensures that the infrared radiation smoothly passes through the light-transmitting sheet and enters the chip two below the light-transmitting sheet, and the sapphire has stable strength, and further strengthens the stability of the chip one and the chip two;

[0026] 3. The electrical signal of the chip one is conducted to a group of pins through the wire one, the electrical signal of the chip one is outputted outside the sealing cavity through the group of pins, the electrical signal of the chip two is transmitted to another group or multiple groups of pins through the wire two, and the electrical signal of the chip two is outputted outside the sealing cavity through the group or multiple groups of pins, and the connection between the packaging structure and the external circuit is realized by arranging the multiple groups of pins. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a structural schematic view of the embodiment of the application;

[0028] Figure 2 It is a partial structural schematic view of the embodiment of the application, and is used for showing the positional relationship of the staggered and stacked chip one and chip two;

[0029] Figure 3 It is a partial sectional view of the embodiment of the application, and is used for showing the positional relationship of the pin extending out of the sealing cavity.

[0030] The drawings show that: 1, a packaging structure; 2, a shell; 3, a pipe seat; 4, a chip one; 5, a chip two; 6, a sealing cavity; 7, a light-transmitting sheet; 8, a light source area; 9, a pin; 10, a wire one; 11, a wire two; 12, a light-transmitting hole; 13, a light-transmitting piece; 14, a heat dissipation platform; 15, a through hole; 16, an insulating layer. DETAILED DESCRIPTION

[0031] The application will be further described in detail below with reference to the accompanying drawings. Figures 1-3 The application will be further described in detail below with reference to the accompanying drawings.

[0032] Embodiment

[0033] A double-band TO package structure for a temperature measuring probe, referring to Figure 1 And Figure 2 The package structure 1 comprises a shell 2 and a tube base 3, both of which are made of a material that can be welded and has stable airtightness. In this embodiment, both the shell 2 and the tube base 3 are made of Kovar. The shell 2 is internally provided with a chip 1 4 and a chip 2 5. The shell 2 is used to protect the internal chip 1 4 and chip 2 5. The shell 2 and the tube base 3 are welded together, and then Figure 3 The cavity in the shell 2 forms a completely sealed sealed cavity 6, which is filled with inert gas. In this embodiment, the inert gas is nitrogen, which effectively blocks oxygen in the air and prevents the chip 1 4 and the chip 2 5 from oxidizing.

[0034] Referring to Figure 2 The chip 1 4 and the chip 2 5 are provided with a light-transmitting sheet 7, which comprises a sapphire gold-plated light-transmitting sheet 7. The sapphire has stable light-transmitting effect, ensuring that the light-transmitting sheet 7 has good light-transmitting performance. The insulation performance of the sapphire ensures that the chip 1 4 and the light-transmitting sheet 7 are insulated. The light-transmitting sheet 7 made of sapphire is gold-plated on the upper part of the region, ensuring that the chip 2 5 and the light-transmitting sheet 7 can be electrically connected. The chip 1 4 and the chip 2 5 are staggered and stacked, which can meet the irradiation requirements of different wave bands at the same time.

[0035] Referring to Figure 2 The two sides of the light-transmitting sheet 7 are marked with corresponding scales according to the circuit positions inside the chip 1 4 and the chip 2 5. The marked positions on the light-transmitting sheet 7 are gold-plated to enhance the visibility and durability of the marked positions and avoid the marked positions from being worn. The chip 1 4 is adhered to the corresponding positioning area of the light-transmitting sheet 7 by optical insulation glue. The gold-plated area of the light-transmitting sheet 7 is completely insulated by the optical insulation glue, thereby realizing the insulation between the chip 1 4 and the light-transmitting sheet 7. Part of the chip 2 5 is adhered to the corresponding positioning area of the light-transmitting sheet 7 by optical insulation glue. Part of the gold-plated area of the light-transmitting sheet 7 is not coated with optical insulation glue, and the gold-plated area and the chip 2 5 are electrically connected.

[0036] Referring to Figure 2 And Figure 3The light source area 8 of the chip one 4 and the chip two 5 are overlapped by more than 90% after the chip one 4 and the chip two 5 are staggered and stacked on the light-transmitting sheet 7, one side of the light-transmitting sheet 7 is coplanar with one side of the chip one 4, and the opposite side of the light-transmitting sheet 7 is coplanar with one side of the chip two 5, the light source area 8 of the chip one 4 and the chip two 5 is overlapped better, the packaging structure 1 has higher integration, the overall volume is reduced, and the adaptability is further enhanced, the light-transmitting sheet 7 is horizontally arranged on the tube seat 3, and the chip one 4 and the chip two 5 on both sides of the light-transmitting sheet 7 are also horizontally placed in the sealed cavity 6, so that the angle of the chip one 4 and the chip two 5 receiving infrared radiation does not change.

[0037] With reference to Figure 1 And Figure 3 Two groups of pins 9 are arranged in the sealed cavity 6, the packaging structure 1 is connected with an external circuit, and the light-transmitting sheet 7 is arranged between the chip one 4 and the chip two 5. Figure 2 The chip one 4 is welded with a wire one 10, and the electrical signal of the chip one 4 is conducted to one group of pins 9 through the wire one 10, and then outputted to the outside of the sealed cavity 6 through the group of pins 9, the light-transmitting sheet 7 is welded with a wire two 11, and the chip two 5 is electrically connected to the light-transmitting sheet 7 through the gold-plated area of the light-transmitting sheet 7, and then transmitted to the other group of pins 9 through the wire two 11, and the electrical signal of the chip two 5 is outputted to the outside of the sealed cavity 6 through the group of pins 9, and in the embodiment, the wire one 10 and the wire two 11 are gold wires, so that the wire one 10 and the wire two 11 have stable wire performance.

[0038] With reference to Figure 3 The outer shell 2 is made of Kovar, and a light-transmitting hole 12 is arranged on the outer shell 2 to ensure that the chip one 4 and the chip two 5 can smoothly receive infrared radiation, and a light-transmitting piece 13 is arranged in the sealed cavity 6 to cover the light-transmitting hole 12, the light-transmitting piece 13 is a sapphire lens, the outer shell 2 can transmit light while ensuring that the sealed cavity 6 has stable sealing effect, and the light-transmitting piece 13 is attached to the peripheral wall of the outer shell 2 to ensure the stability of the sealing effect in the sealed cavity 6.

[0039] With reference to Figure 3The heat dissipation platform 14 is provided between the light-transmitting sheet 7 and the tube base 3, and the heat dissipation platform 14 includes a pad platform made of oxygen-free copper. One side of the heat dissipation platform 14 is attached to the chip two 5, and the opposite side is attached to the tube base 3, so that the heat of the chip one 4 and the chip two 5 is transmitted outward through the heat dissipation platform 14 and the tube base 3. The peripheral side of the heat dissipation platform 14 is sealed with the peripheral side of the shell 2, so as to further enhance the sealing effect of the sealed cavity 6. The heat dissipation platform 14 and the tube base 3 are both provided with a through hole 15 in communication. The through hole 15 is used for the pin 9 to extend out of the sealed cavity 6. An insulating layer 16 is filled between the pin 9 and the through hole 15. The insulating layer 16 is in the shape of a sleeve. In this embodiment, the insulating layer 16 is a glass layer made by burning glass beads. The insulating layer 16 avoids the pin 9 from being in conduction with the heat dissipation platform 14 and the tube base 3 when passing through the through hole 15, so as to affect the transmission of the electrical signal. Meanwhile, the insulating layer 16 further enhances the sealing performance of the sealed cavity 6.

[0040] The principle of the embodiment of the present application is as follows. The shell 2 and the tube base 3 are welded together to form the sealed cavity 6 for protecting the chip one 4 and the chip two 5. The sealed cavity 6 is filled with inert gas to prevent the chip one 4 and the chip two 5 from oxidation reaction. The sapphire gold-plated light-transmitting sheet 7 is provided between the chip one 4 and the chip two 5. The chip one 4 is insulated from the light-transmitting sheet 7, and the chip two 5 can be in electrical conduction with the light-transmitting sheet 7. The chip one 4 and the chip two 5 are staggered and stacked, so that the light source areas 8 of the chip one 4 and the chip two 5 partially overlap. The electrical signal of the chip one 4 is outputted to the outside of the sealed cavity 6 through the lead one 10 and a group of pins 9. The electrical signal of the chip two 5 is transmitted to the light-transmitting sheet 7, and then transmitted to another group of pins 9 through the lead two 11, and then connected to the circuit outside through the group of pins 9. The shell 2 realizes the light-transmitting effect through the light-transmitting hole 12. The light-transmitting piece 13 covers the light-transmitting hole 12 to ensure that the sealed cavity 6 has stable sealing effect. The heat dissipation platform 14 is provided between the light-transmitting sheet 7 and the tube base 3. The heat of the chip one 4 and the chip two 5 is transmitted outward through the heat dissipation platform 14 and the tube base 3. The heat dissipation platform 14 and the tube base 3 are both provided with a through hole 15 in communication. The pin 9 extends out of the sealed cavity 6 through the through hole 15 to realize the connection between the packaging structure 1 and the circuit outside. The insulating layer 16 is filled between the pin 9 and the through hole 15 to avoid the pin 9 from being in conduction with the heat dissipation platform 14 and the tube base 3 when passing through the through hole 15, so as to affect the transmission of the electrical signal.

[0041] The above are the preferred embodiments of the present application, which do not limit the protection scope of the present application. Any equivalent changes made according to the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A dual-band TO packaging structure for a temperature detector, comprising a housing (2) and a tube base (3), wherein the housing (2) is fixedly connected to the tube base (3), and a sealed cavity (6) is formed between the housing (2) and the tube base (3), characterized in that: The sealing cavity (6) is provided with a chip one (4) and a chip two (5), the chip one (4) and the chip two (5) are provided with a light transmission sheet (7), the chip one (4) and the chip two (5) are staggered and stacked, the chip one (4) and the light transmission sheet (7) are insulated, and the chip two (5) and the light transmission sheet (7) are electrically conductive.

2. The dual-band TO package structure for a temperature measuring probe according to claim 1, wherein: The chip one (4) and the chip two (5) are provided with light source areas (8), and the light source areas (8) of the chip one (4) and the chip two (5) are partially overlapped.

3. The dual-band TO package structure for a temperature measuring probe according to claim 1, wherein: One side of the light transmission sheet (7) is coplanar with one side of the chip one (4), and the opposite side of the light transmission sheet (7) is coplanar with one side of the chip two (5).

4. The dual-band TO package structure for a temperature measuring probe according to claim 1, wherein: The light transmission sheet (7) comprises a sapphire gold-plated light transmission sheet (7).

5. The dual-band TO package structure for a temperature measuring probe according to claim 1, wherein: The packaging structure (1) further comprises a plurality of groups of pins (9), the pins (9) are located in the sealing cavity (6) and extend from the tube base (3), the chip one (4) is provided with a wire one (10), the wire one (10) is connected with one group of pins (9), the chip two (5) is provided with a wire two (11), and the wire two (11) is connected with another group or a plurality of groups of pins (9).

6. The dual-band TO package structure for a temperature measuring probe according to claim 5, wherein: The tube base (3) is provided with a through hole (15) for the pins (9) to pass through, and the pins (9) and the through hole (15) are filled with an insulating layer (16).

7. The dual-band TO package structure for a temperature measuring probe according to claim 1, wherein: The shell (2) is provided with a light transmission hole (12), and the sealing cavity (6) is provided with a light transmission piece (13) covering the light transmission hole (12).

8. The dual-band TO package structure for a temperature measuring probe according to claim 1, wherein: The sealing cavity (6) is provided with a heat dissipation table (14) fixedly connected with the tube base (3), and the heat dissipation table (14) comprises a pad table made of oxygen-free copper.

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