Light engine

Abstract

The utility model relates to the technical field of optical communication, in particular to an optical engine, which comprises a silicon optical chip, an optical fiber array assembly, a mounting base and a bonding structure, the silicon optical chip and the optical fiber array assembly are fixedly arranged on the mounting base, the bonding structure is bonded with the upper surface and / or the lower surface of the silicon optical chip, the silicon optical chip is coupled with the optical fiber array assembly, and the bonding structure is used for increasing the bonding area of the silicon optical chip and the optical fiber array assembly. Through the arrangement of the bonding structure, the bonding structure is bonded on the upper surface or the lower surface of the silicon optical chip, so that the effective fixing area between the silicon optical chip and the optical fiber array assembly is increased, and the bonding reliability between the silicon optical chip and the optical fiber array assembly is improved.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to an optical engine. Background Technology

[0002] Currently, the iteration speed of optical modules for data centers is extremely rapid. From the mainstream 100G products of the past two years to the current 400G products, the increase in product speed means the development and improvement of technology and related processes. Furthermore, 400G marks a watershed moment. Before this, single-mode products for data centers primarily used distributed feedback (DFB) lasers, with direct modulation being the most common modulation method. 400G products, however, began to use electroabsorption modulated lasers (EML) in large quantities, shifting to indirect modulation. However, with further increases in product speed, traditional solutions are beginning to show disadvantages compared to silicon photonics solutions in terms of space, power consumption, and integration.

[0003] Most existing silicon photonics solutions involve externalizing the laser, coupling the light into the silicon photonic chip 1', modulating it, and then coupling it with the fiber array assembly 2' to transmit the signal. However, the current silicon photonic chip 1' is relatively thin, with a limited bonding area. During end-face coupling, the small bonding area 3' poses a risk of insufficient reliability (see...). Figure 1 and Figure 2 (As shown).

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Utility Model Content

[0005] The technical problem to be solved by this invention is that existing silicon photonics chip bonding solutions have problems such as small bonding area and insufficient reliability.

[0006] The present invention adopts the following technical solution:

[0007] On one hand, an optical engine includes: a silicon photonic chip 1, a fiber array assembly 2, a mounting base 4, and an adhesive structure;

[0008] The silicon photonic chip 1 and the fiber array assembly 2 are fixedly disposed on the mounting base 4. The adhesive structure is bonded to the upper and / or lower surface of the silicon photonic chip 1. The silicon photonic chip 1 is coupled to the fiber array assembly 2. The adhesive structure is used to increase the bonding area between the silicon photonic chip 1 and the fiber array assembly 2.

[0009] Preferably, the optical fiber array assembly 2 comprises a cover plate 20 and an optical fiber base 21 for placing optical fibers, the cover plate 20 covering the optical fiber base 21 and being fixedly connected with the optical fiber base 21.

[0010] Preferably, the adhesive structure is an adhesive block 3, or a protruding portion of the cover plate 20 protruding from the optical fiber base 21, or a combination of the adhesive block 3 and the protruding portion of the cover plate 20 protruding from the optical fiber base 21.

[0011] Preferably, when the adhesive structure is the protruding portion of the cover plate 20 protruding from the optical fiber base 21, or a combination of the adhesive block 3 and the protruding portion of the cover plate 20 protruding from the optical fiber base 21, the cover plate 20 protrudes from the optical fiber base 21 by a first preset distance to form the protruding portion, and a lower surface of the protruding portion of the cover plate 20 is adhered to an upper surface of the silicon optical chip 1.

[0012] Preferably, when the adhesive structure is the protruding portion of the cover plate 20 protruding from the optical fiber base 21, a top portion of the cover plate 20 is provided with a strip-shaped through hole 200 for providing a dispensing channel to dispense glue on the cover plate 20 and the silicon optical chip 1.

[0013] An end portion of the optical fiber base 21 coupled with the silicon optical chip 1 is provided with a limiting groove 211 for controlling a distance between the silicon optical chip 1 and the optical fiber.

[0014] Preferably, when the adhesive structure is the adhesive block 3, or a combination of the adhesive block 3 and the protruding portion of the cover plate 20 protruding from the optical fiber base 21, the adhesive block 3 protrudes from the silicon optical chip 1 by a second preset distance.

[0015] Preferably, when the adhesive structure is the adhesive block 3, the adhesive block 3 is adhered to a lower surface of the silicon optical chip 1, and an end surface of the adhesive block 3 is adhered to the optical fiber base 21 of the optical fiber array assembly 2.

[0016] Preferably, when the adhesive structure is the adhesive block 3, the adhesive block 3 is adhered to an upper surface of the silicon optical chip 1, and one end surface of the adhesive block 3 is adhered to the cover plate 20 of the optical fiber array assembly 2.

[0017] Preferably, when the adhesive structure is a combination of the adhesive block 3 and the protruding portion of the cover plate 20 protruding from the optical fiber base 21, the protruding portion of the cover plate 20 is provided with at least one notch 201, and the upper surface of the silicon optical chip 1 is provided with the adhesive block 3, the adhesive block 3 being coupled with the notch 201 to form the adhesive structure.

[0018] Preferably, when the adhesive structure is an adhesive block 3, the adhesive block 3 is L-shaped, the inner right-angle portion of the adhesive block 3 is bonded to the coupling end face and the lower surface of the silicon photonic chip 1, the vertical surface of the adhesive block 3 is attached with a first lens 30, the L-shaped inner surface of the first lens 30 is bonded to the bottom surface and the coupling end face of the silicon photonic chip 1, and a second lens 22 is provided in front of the fiber array of the fiber array assembly 2. The first lens 30 and the second lens 22 are used to converge the optical signal transmitted by the optical fiber into the silicon photonic chip 1.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting the adhesive structure, the adhesive structure is bonded to the upper surface and / or lower surface of the silicon photonic chip 1, thereby increasing the area that can effectively fix the silicon photonic chip 1 and the fiber array assembly 2, and improving the reliability of the bonding between the silicon photonic chip 1 and the fiber array assembly 2. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly described below. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0021] Figure 1 This is a front view of an existing bonding method for silicon photonics chips and fiber array components provided in an embodiment of this utility model;

[0022] Figure 2 This is a perspective view of a conventional bonding method for silicon photonics chips and fiber optic array components provided in an embodiment of this utility model;

[0023] Figure 3 This is a schematic diagram of the adhesive block provided in this embodiment of the invention being bonded to the lower surface of a silicon photonic chip;

[0024] Figure 4 This is provided by the embodiment of the present utility model. Figure 3 Enlarged view of region A in the middle;

[0025] Figure 5 This is a schematic diagram of a fiber optic array assembly provided in an embodiment of the present invention;

[0026] Figure 6a This is a schematic diagram of an adhesive block being bonded to the upper surface of a silicon photonic chip according to an embodiment of the present invention;

[0027] Figure 6b This is provided by the embodiment of the present utility model. Figure 6a The main view of the light engine is shown below;

[0028] Figure 7 This is an overall schematic diagram of a time engine with an extended cover plate provided in an embodiment of this utility model;

[0029] Figure 8 This is a schematic diagram of a cover plate for a light engine provided in an embodiment of the present utility model;

[0030] Figure 9 This is a schematic diagram of a limiting groove for a light engine provided in an embodiment of the present invention;

[0031] Figure 10a This is a schematic diagram of a light engine cover plate with a notch provided in an embodiment of the present invention;

[0032] Figure 10b This is a light engine provided in an embodiment of the present invention. Figure 10a Top view;

[0033] Figure 11a This is a schematic diagram of a cover plate for a light engine with two notches provided in an embodiment of the present invention;

[0034] Figure 11b This is a light engine provided in an embodiment of the present invention. Figure 11a Top view;

[0035] Figure 12 This is a schematic diagram of a light engine cover plate with multiple notches provided in an embodiment of the present invention;

[0036] Figure 13a This is a schematic diagram of the first lens and the second lens of a light engine provided in an embodiment of the present invention;

[0037] Figure 13b This is a light engine provided in an embodiment of the present invention. Figure 13a A three-dimensional image.

[0038] The attached figures are labeled as follows:

[0039] 1-Silicon photonic chip, 2-Fiber optic array assembly, 20-Cover plate, 200-Strip through-hole, 201-Notch, 21-Fiber optic base, 210-V-groove, 211-Limiting groove, 22-Second lens, 3-Adhesive block, 30-First lens, 4-Mounting base, 40-Tungsten copper substrate, 41-Optical collimator, 42-Optical isolator, 43-Converging lens, 44-Laser. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0041] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as openly inclusive, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0042] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0043] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, for example, the description may use the prefix "A" or "B" to describe the same type of nouns as two independent entities. In this case, the features defined with "A" and "B" are used only to distinguish between similar entities and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0044] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling" or "wireless connection." The embodiments disclosed herein are not necessarily limited to the scope of this invention.

[0045] In the description of this utility model, the expression "A and / or B" (where A and B are used to formally represent specific features) will be involved. The corresponding expression includes the following three combinations: only A, only B, and a combination of A and B.

[0046] As used in this invention, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the specified value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the specified quantity (i.e., the limitations of the measurement system).

[0047] Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0048] Example 1:

[0049] This utility model embodiment provides a light engine, such as Figure 3 As shown, the optical engine includes: a silicon photonic chip 1, a fiber array assembly 2, a mounting base 4, and an adhesive structure; the silicon photonic chip 1 and the fiber array assembly 2 are fixedly disposed on the mounting base 4, the adhesive structure is bonded to the upper surface and / or lower surface of the silicon photonic chip 1, the silicon photonic chip 1 is coupled to the fiber array assembly 2, and the adhesive structure is used to increase the bonding area between the silicon photonic chip 1 and the fiber array assembly 2.

[0050] By setting up an adhesive structure, the adhesive structure is bonded to the upper and / or lower surfaces of the silicon photonic chip 1, thereby increasing the area that can effectively fix the silicon photonic chip 1 and the fiber array assembly 2, and improving the reliability of the bonding between the silicon photonic chip 1 and the fiber array assembly 2.

[0051] To fully illustrate the technical solution provided by this utility model, the morphology and combination of the above structures will be described in further detail below.

[0052] like Figure 4and Figure 5 As shown, the fiber array assembly 2 includes a cover plate 20 and a fiber optic base 21. The fiber optic base 21 is used to place optical fibers, and the cover plate 20 covers the fiber optic base 21 and is fixedly connected to the fiber optic base 21. A V-shaped groove 210 is provided on the fiber optic base 21 for placing optical fibers. A tungsten copper substrate 40 is provided on the upper surface of the mounting base 4, and the silicon photonic chip 1 is fixedly disposed on the upper surface of the tungsten copper substrate 40 to achieve heat dissipation of the silicon photonic chip 1.

[0053] The specific form and placement of the adhesive structure can be chosen in various ways. In an optional embodiment, the adhesive structure adhesive block 3 (such as...) Figure 3 (as shown), or the protruding portion of the cover plate 20 protruding from the optical fiber base 21 (e.g. Figure 8 As shown in Figure 10), or formed by the bonding block 3 and the protruding part of the cover plate 20 protruding from the optical fiber base 21, respectively. Different forms and positions of the bonding structure will be described in detail below.

[0054] In the prior art, see [reference] Figure 1 and Figure 2 As shown, during the process of coupling and finding light with the silicon photonic chip 1', the fiber array assembly 2' often needs to contact the silicon photonic chip 1' to find a parallel position. During this contact process, problems such as damage or scratches to the silicon waveguide of the silicon photonic chip 1' may occur, resulting in the inability to achieve the target coupling value. The second preset distance or limiting groove 211 described in the following scheme (e.g.) Figure 9 The above problem can be solved by referring to the description below.

[0055] In this embodiment of the invention, the coupling process is described using the adhesive block 3 as an example. The coupling process between the silicon photonic chip 1 and the fiber array assembly 2 is as follows: First, the fiber array is placed into the corresponding fixture, with the rear of the fixture in contact with the displacement sensor. During coupling, the end face of the fiber array assembly 2 first contacts the adhesive block 3, or the cover plate 20 first contacts the upper surface of the silicon photonic chip 1. Then, parallelism is sought. After moving in various angular directions, the displacement sensor will provide a parallelism curve. The maximum value point on the curve is the position point corresponding to the parallelism. This process is repeated until parallelism is successfully found in all directions. Then, the light-finding operation begins until the maximum value is found.

[0056] When the adhesive structure 3, or the convex portion of the adhesive block 3 and the cover plate 20 protruding from the optical fiber base 21, are combined, the adhesive block 3 protrudes from the silicon photonic chip 1 by a second preset distance. This second preset distance can be 0.5μm-1.5μm, and is a safe distance between the silicon photonic chip 1 and the optical fiber array assembly 2 during coupling. This safe distance ensures that the optical fiber array assembly 2 will not scratch the silicon photonic chip 1 during coupling, and guarantees the stability of the bonding between the two. This effectively avoids potential damage or scratches to the silicon waveguide of the silicon photonic chip 1 when the optical fiber array assembly 2 contacts and couples with the silicon photonic chip 1. The second preset distance can be set according to actual conditions. The material of the adhesive block 3 can be glass, ceramic, or silicon wafer.

[0057] The first solution provided in this embodiment is referred to [reference needed]. Figure 3 and Figure 4 As shown, when the adhesive structure is an adhesive block 3, the adhesive block 3 is bonded to the lower surface of the silicon photonic chip 1, and the end face of the adhesive block 3 is bonded to the optical fiber base 21. The adhesive block 3 protrudes from the silicon photonic chip 1 by a second preset distance, so that when the optical fiber array assembly 2 is coupled to the adhesive block 3, the optical fiber base 21 contacts the adhesive block 3 first. This ensures a certain gap between the silicon photonic chip 1 and the optical fiber, preventing the optical fiber from contacting the silicon photonic chip 1 and causing wear. It also allows for further control of the adhesive thickness between the silicon photonic chip 1 and the optical fiber array assembly 2.

[0058] The second option is as follows: Figure 6a and Figure 6b As shown, when the adhesive structure is adhesive block 3, adhesive block 3 is bonded to the upper surface of the silicon photonic chip 1, and the end face of adhesive block 3 is bonded to the cover plate 20. The shape of adhesive block 3 can be L-shaped as shown in the figure, or it can be square.

[0059] In practical applications, adhesive blocks 3 can also be provided on both the upper and lower surfaces of the silicon photonics chip 1 to further increase the bonding area. The specific setting method and setting position can be selected according to the actual situation, and this embodiment does not impose specific limitations.

[0060] Compared to the first and second solutions, the third and fourth solutions will be provided below. The third solution uses the cover plate 20 as the bonding structure, and the fourth solution uses the adhesive block 3 in conjunction with the cover plate 20 as the bonding structure. Figure 7 and Figure 10aAs shown, when the cover plate 20 protrudes beyond the protruding portion of the optical fiber base 21, or when the adhesive block 3 and the cover plate 20 protruding beyond the protruding portion of the optical fiber base 21 are combined together, the cover plate 20 protrudes beyond the optical fiber base 21 by a first preset distance to form a protruding portion. The lower surface of the protruding portion of the cover plate 20 is bonded to the upper surface of the silicon photonic chip 1. The first preset distance can be 0.5 mm to 1.5 mm, ensuring a stable bonding distance between the cover plate 20 and the silicon photonic chip 1.

[0061] If the cover plate 20 is in the form of Figure 8 As shown, the end face on the upper surface of the silicon photonic chip 1 is flat. To facilitate the uniformity of adhesive dispensing and spreading during the bonding of the cover plate 20 and the silicon photonic chip 1, when the protruding portion of the cover plate 20 protruding from the fiber optic base 21 is formed in the bonding structure, a strip-shaped through hole 200 is provided on the top of the cover plate 20. The strip-shaped through hole 200 is used to provide a dispensing channel for dispensing adhesive between the cover plate 20 and the silicon photonic chip 1. In actual operation, after the cover plate 20 is moved to a suitable position on the silicon photonic chip 1, adhesive is dripped into the strip-shaped through hole 200. Compared with directly dispensing adhesive on the cover plate 20 or the silicon photonic chip 1 and then bonding, the design of the strip-shaped through hole 200 allows for more precise control of the amount of adhesive used. In a preferred embodiment, a drainage groove (not shown in the figure) can be provided on the bottom surface of the portion of the cover plate 20 protruding from the fiber optic base 21 to facilitate the flow of adhesive. Furthermore, as... Figure 9 As shown, a limiting groove 211 is provided at the end of the optical fiber base 21 that is coupled to the silicon photonic chip 1. The limiting groove 211 is used to control the distance between the silicon photonic chip 1 and the optical fiber. The limiting groove 211 serves to limit the distance between the silicon photonic chip 1 and the optical fiber array, which has the same effect as the adhesive block 3 protruding from the silicon photonic chip 1 by a second preset distance in this embodiment.

[0062] When the adhesive block 3 and the cover plate 20 protrude from the fiber optic base 21 to form the adhesive structure, as follows: Figure 10a and Figure 11a As shown, the protruding portion of the cover plate 20 is provided with at least one notch 201, and the silicon photonic chip 1 (not shown in the figure, see reference) Figure 6b The adhesive block 3 (not shown in the figure, see reference) is disposed on the upper surface of the surface in the indicated orientation. Figure 6b (as shown in the orientation), the adhesive block 3 is coupled to the notch 201 to form the adhesive structure.

[0063] See Figure 10a and Figure 10b As shown, when the protruding part of the cover plate 20 is provided with only one notch 201, the adhesive block 3 is adhered to the notch 201.

[0064] See Figure 11a and Figure 11b As shown, when the protruding portion of the cover plate 20 has a notch 201 on each side, forming a protruding shape in the middle of the cover plate 20, the adhesive block 3 has two protruding parts on both sides that are coupled to the notches 201 on both sides of the cover plate 20, and the coupled shape is as shown. Figure 11b As shown.

[0065] In practical applications, multiple notches 201 can be configured to form a pattern such as... Figure 12 Correspondingly, the adhesive block 3 should also have a protrusion corresponding to the notch 201 of the square tooth for coupling.

[0066] The design concept of the aforementioned four schemes is to use adhesive block 3 or cover plate 20 to increase the bonding area between silicon photonic chip 1 and fiber array assembly 2. In the fifth scheme, optical path coupling between silicon photonic chip 1 and fiber array assembly 2 does not require adhesive bonding. The specific scheme is as follows: Figure 13a and Figure 13b As shown, when the adhesive structure is adhesive block 3, adhesive block 3 is L-shaped. The inner right-angle portion of adhesive block 3 is bonded to the coupling end face and lower surface of the silicon photonic chip 1. A first lens 30 is attached to the vertical surface of adhesive block 3, and a second lens 22 is disposed in front of the fiber array of the fiber array assembly 2. The first lens 30 and the second lens 22 are used to converge the optical signal transmitted by the optical fiber into the silicon photonic chip 1. This directly avoids direct contact between the silicon photonic chip 1 and the fiber array, preventing damage or scratches to the silicon waveguide of the silicon photonic chip 1.

[0067] In this embodiment, refer to Figure 13b As shown, the mounting base 4 is also provided with an optical collimator 41, an optical isolator 42, a converging lens 43 and a laser 44 in sequence. The laser 44 is used to emit optical signals to the silicon photonic chip. The optical signals are transmitted into the silicon photonic chip 1 after passing through the optical collimator 41, the optical isolator 42 and the converging lens 43.

[0068] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A light engine, characterized in that, include: Silicon photonic chip (1), fiber array assembly (2), mounting base (4) and bonding structure; The silicon photonic chip (1) and the fiber array assembly (2) are fixedly disposed on the mounting base (4). The adhesive structure is bonded to the upper surface and / or lower surface of the silicon photonic chip (1). The silicon photonic chip (1) is coupled to the fiber array assembly (2). The adhesive structure is used to increase the bonding area between the silicon photonic chip (1) and the fiber array assembly (2).

2. The light engine according to claim 1, characterized in that, The fiber array assembly (2) includes a cover plate (20) and a fiber base (21). The fiber base (21) is used to place optical fibers. The cover plate (20) covers the fiber base (21) and is fixedly connected to the fiber base (21).

3. The light engine according to claim 2, characterized in that, The bonding structure is an adhesive block (3), or a protruding part of the cover plate (20) protruding from the optical fiber base (21); or it is formed by combining the adhesive block (3) and the protruding part of the cover plate (20) protruding from the optical fiber base (21).

4. The light engine according to claim 3, characterized in that, When the bonding structure is the protruding part of the cover plate (20) protruding from the optical fiber base (21), or is formed by the bonding block (3) and the protruding part of the cover plate (20) protruding from the optical fiber base (21) in combination, the cover plate (20) protrudes from the optical fiber base (21) by a first preset distance to form the protruding part, and the lower surface of the protruding part of the cover plate (20) is bonded to the upper surface of the silicon photonic chip (1).

5. The light engine according to claim 3, characterized in that, When the bonding structure is formed by the protruding part of the cover plate (20) protruding from the optical fiber base (21), the top of the cover plate (20) is provided with a strip-shaped through hole (200), which is used to provide a dispensing channel for dispensing the cover plate (20) and the silicon photonic chip (1). The fiber optic base (21) is provided with a limiting groove (211) at the end where it is coupled to the silicon photonic chip (1). The limiting groove (211) is used to control the distance between the silicon photonic chip (1) and the fiber.

6. The light engine according to claim 3, characterized in that, When the bonding structure is an adhesive block (3) or formed by the adhesive block (3) and the protruding part of the cover plate (20) protruding from the optical fiber base (21) in combination, the adhesive block (3) protrudes from the silicon photonic chip (1) by a second preset distance.

7. The light engine according to claim 3, characterized in that, When the bonding structure is a bonding block (3), the bonding block (3) is bonded to the lower surface of the silicon photonic chip (1), and the end face of the bonding block (3) is bonded to the fiber optic base (21) of the fiber optic array assembly (2).

8. The light engine according to claim 3, characterized in that, When the bonding structure is a bonding block (3), the bonding block (3) is bonded to the upper surface of the silicon photonic chip (1), and the end face of the bonding block (3) is bonded to the cover plate (20) of the fiber array assembly (2).

9. The light engine according to claim 3, characterized in that, When the bonding structure is formed by the bonding block (3) and the cover plate (20) protruding from the fiber optic base (21) and being combined with each other, the protruding part of the cover plate (20) is provided with at least one notch (201), the upper surface of the silicon photonic chip (1) is provided with the bonding block (3), and the bonding block (3) is coupled with the notch (201) to form the bonding structure.

10. The light engine according to claim 3, characterized in that, When the bonding structure is a bonding block (3), the bonding block (3) is L-shaped. The inner right-angle portion of the bonding block (3) is bonded to the coupling end face and the lower surface of the silicon photonic chip (1). A first lens (30) is attached to the vertical surface of the bonding block (3). A second lens (22) is provided in front of the fiber array of the fiber array assembly (2). The first lens (30) and the second lens (22) are used to converge the optical signal transmitted by the optical fiber into the silicon photonic chip (1).

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