SSD heat dissipation assembly and notebook computer

Abstract

The utility model discloses an SSD heat dissipation assembly and a notebook computer, the SSD heat dissipation assembly comprises a heat dissipation plate, the heat dissipation plate comprises a mounting wall surface, the mounting wall surface is used for mounting a circuit board, and the mounting wall surface comprises a first bearing part and a second bearing part which are different in height; and a first clearance space is formed between the first bearing part and the second bearing part. The circuit board comprises a first power component, a second power component and a plurality of electronic components, and the first gap space is used for accommodating at least part of the electronic components. And heat-conducting paste is arranged between the first bearing part and the first power part. And a heat conduction pad is arranged between the second bearing part and the second power part, so that the heat dissipation performance of the SSD heat dissipation assembly is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation, in particular to a SSD heat dissipation assembly. BACKGROUND

[0002] With the continuous updating of electronic technology, heat dissipation technology is also developing. Among them, for the heat dissipation scheme of SSD, the existing technology is to directly use heat-conducting silicone material to contact with electronic components on the circuit board for heat dissipation. However, the sizes of electronic components on the circuit board are usually different, especially various power components (such as chip, etc. main heat source components), the volume and height of which are usually larger, while the volume and height of resistors, capacitors, etc. are usually smaller, and it is difficult for heat-conducting silicone material to fully dissipate heat for various electronic components, which is difficult to adapt to the heat dissipation needs of high-power circuit boards. CONTENT OF THE UTILITY MODEL

[0003] The present application aims to provide a SSD heat dissipation assembly, and aims to improve the heat dissipation performance of the heat dissipation assembly.

[0004] In a first aspect, the present application provides a SSD heat dissipation assembly, comprising a heat dissipation plate, the heat dissipation plate comprising a mounting wall surface, the mounting wall surface being used for mounting a circuit board, the mounting wall surface comprising a first bearing part and a second bearing part with different heights, and the first bearing part and the second bearing part having a first gap space therebetween. The circuit board comprises a first power component and a second power component and a plurality of electronic components, and the first gap space is used for accommodating at least part of the electronic components. The first bearing part and the first power component are provided with heat-conducting paste therebetween. The second bearing part and the second power component are provided with heat-conducting pads therebetween.

[0005] In the above scheme, by providing the first bearing part and the second bearing part with different heights on the mounting wall surface, it can be applied to a specific circuit board, and better contact between the heat dissipation plate and the power components with different heights can be achieved, so that the heat can be effectively conducted from the power components to the heat dissipation plate, and the heat dissipation efficiency is improved. And the bearing part with appropriate height can provide a shorter and smoother path for heat transfer, and the resistance encountered by heat in the transfer process is smaller, and the heat transfer efficiency is higher.

[0006] At the same time, the first bearing part and the second bearing part with different heights have a first gap space therebetween, which can not only accommodate part of the electronic components, but also allow the heat generated by the part of the electronic components during work to be convected and dissipated through the first gap space, so as to accelerate heat dispersion and improve heat dissipation efficiency.

[0007] In addition, the heat-conducting paste and the heat-conducting pad between the heat-dissipating plate and the circuit board can play a good role in transferring heat, and the heat generated by the circuit board is transferred to the heat-dissipating plate through the heat-conducting effect of the two, so as to reduce the temperature of the circuit board during operation, and the heat-conducting paste and the heat-conducting pad have a certain buffering function, can effectively protect the first power component and the second power component, and can effectively fill the installation gap, which is beneficial to improve the heat dissipation efficiency.

[0008] Optionally, the SSD heat dissipation assembly further comprises a shell, the heat-dissipating plate is installed on the shell, the shell comprises a first inclined surface, the heat-dissipating plate comprises a second inclined surface away from the circuit board, and the first inclined surface is arranged in abutment with the second inclined surface. The shell can improve the stability of the heat dissipation assembly, the second inclined surface is arranged on the side of the heat-dissipating plate away from the circuit board, and the first inclined surface is arranged in abutment with the second inclined surface, so that the heat dissipation area of the heat-dissipating plate is increased through the inclined surfaces, and the heat dissipation efficiency is improved.

[0009] Further, the shell further comprises a plurality of limiting pieces and a first area, the plurality of limiting pieces are arranged around the first area, and the heat-dissipating plate is arranged in the first area. The plurality of limiting pieces arranged around the first area can not only improve the stability of the heat dissipation assembly, but also improve the installation efficiency during production and installation.

[0010] Further, the first inclined surface comprises a first sub-inclined surface and a second sub-inclined surface, the second inclined surface comprises a third sub-inclined surface and a fourth sub-inclined surface, the third sub-inclined surface is in abutment with the first sub-inclined surface, and the fourth sub-inclined surface is in abutment with the second sub-inclined surface. The abutment of the lower inclined surfaces is beneficial to increase the contact area of the heat-dissipating plate and the shell, so that more heat is transferred from the heat-dissipating plate to the shell per unit time, and the heat dissipation efficiency is improved.

[0011] Optionally, the material of the heat-dissipating plate is one of aluminum, copper or stainless steel, and each material has good heat-conducting performance, which is beneficial to improve the heat dissipation efficiency of the heat-dissipating plate.

[0012] Optionally, the heat-dissipating plate is provided with a plurality of first threaded holes, and the circuit board is provided with a plurality of penetrating second threaded holes. The SSD heat dissipation assembly further comprises a first screw, and the first screw is arranged in the first threaded hole and the second threaded hole. The screw connection of the heat-dissipating plate and the circuit board can make the installation and disassembly work more convenient, can improve the assembly and disassembly efficiency, and improve the product part fitting degree.

[0013] Further, the mounting wall is provided with a first support platform and a second support platform, the first support platform and the second support platform are oppositely arranged at two ends of the heat dissipation plate, and the first support platform and the second support platform are used for supporting the circuit board. The first support platform and the second support platform can enhance the structural strength of the heat dissipation plate and the stability of the heat dissipation assembly.

[0014] Further, the first threaded holes are arranged on the first support platform and the second support platform. Arranging the first threaded holes on the first support platform and the second support platform can make the heat dissipation plate better withstand the stress generated by the first screw, and reduce the damage caused by the internal stress to the heat dissipation plate.

[0015] Optionally, the first bearing part is provided with a first rough area, and the heat-conducting paste is arranged between the first rough area and the first power component. The heat-conducting paste is usually in a semi-solid and semi-liquid state. Arranging the heat-conducting paste in the first rough area can increase the adhesion between the heat-conducting paste and the heat dissipation plate, so that the heat-conducting paste can better connect the first power component and the heat dissipation plate, and the heat-conducting paste can fill the uneven structure of the first rough area, increase the heat dissipation area, and improve the heat conduction efficiency.

[0016] In a second aspect, the present application further provides a notebook computer comprising the SSD heat dissipation assembly according to any one of the above-mentioned solutions.

[0017] In the embodiments of the present application, the heat-conducting paste and the heat-conducting pad transmit the heat generated by the circuit board to the heat dissipation plate, and then transmit the heat outward through the structure of the heat dissipation plate, so that the circuit board with the SSD can be more efficiently cooled when working efficiently.

[0018] Additional aspects and advantages of the embodiments of the present application will be in part apparent and in part pointed out hereinafter. DETAILED DESCRIPTION

[0019] One or more embodiments are illustrated by way of example in the accompanying drawings that are not intended to be limiting of the embodiments of the application, in which like references indicate similar elements. The drawings are briefly described as follows.

[0020] Figure 1 An exploded view of the heat dissipation assembly of some embodiments of the present application;

[0021] Figure 2 A top view of the heat dissipation plate of some embodiments of the present application;

[0022] Figure 3 A bottom view of the heat dissipation plate of some embodiments of the present application;

[0023] Figure 4 Bottom view of the circuit board of some embodiments of the application;

[0024] Figure 5 Top view of the housing of some embodiments of the application.

[0025] BRIEF DESCRIPTION OF DRAWINGS

[0026] 1, heat sink; 11, mounting wall surface; 12, first bearing portion; 13, second bearing portion; 14, first gap space; 15, second inclined surface; 151, third sub-inclined surface; 152, fourth sub-inclined surface; 16, first threaded hole; 17, first support platform; 18, second support platform;

[0027] 2, thermal paste;

[0028] 3, thermal pad;

[0029] 4, circuit board; 41, first power component; 42, second power component; 43, second threaded hole; 44, first screw;

[0030] 5, housing; 51, first inclined surface; 52, limiting component; 53, first region. DETAILED DESCRIPTION

[0031] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application.

[0032] In the present application, the phrase “embodiment” means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment, nor is it an independent or alternative embodiment that is not mutually exclusive with other embodiments.

[0033] In the description of the embodiments of the present application, the technical terms “first”, “second” and the like are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of “multiple” is two or more, unless otherwise specifically limited.

[0034] The technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0035] In a first aspect, the present application provides a SSD heat dissipation assembly, please refer to Figure 1 and Figure 3The SSD heat dissipation assembly includes a heat dissipation plate 1, the heat dissipation plate 1 includes a mounting wall surface 11 for mounting the circuit board 4, for example, the mounting wall surface 11 is shaped to match the shape of the circuit board 4, and the mounting area of the mounting wall surface 11 can be slightly larger than the mounting area of the circuit board 4, and a detachable mounting method such as a screw or a bolt can be used.

[0036] For the above-mentioned circuit board 4, please refer to Figure 1 and Figure 4 . The circuit board 4 includes a first power component 41 and a second power component 42 and a plurality of electronic components (not shown in the figure). It can be understood that the first power component 41 and the second power component 42 are the main components on the circuit board 4, which have a high temperature when working. In some embodiments, the first power component 41 is the main chip of the circuit board 4, such as a CPU or a north-south bridge chip. The second power component 42 is other main electronic components, such as resistors, capacitors, etc.

[0037] For the above-mentioned heat dissipation plate 1, please refer to Figures 1 to 3 , the mounting wall surface 11 of the heat dissipation plate 1 includes a first bearing part 12 and a second bearing part 13 with different heights, which are arranged corresponding to the first power component 41 and the second power component 42 on the circuit board 4, and can bear the electronic components of the circuit board 4 respectively, which can reduce the situation of the components falling off the circuit board 4 when working.

[0038] The first bearing part 12 and the second bearing part 13 have a first gap space 14 between them, which not only can accommodate electronic components, but also is beneficial to the flow of air, improving the heat dissipation performance.

[0039] For the above-mentioned heat conduction paste 2, please refer to Figure 1 , the heat conduction paste 2 is arranged between the heat dissipation plate 1 and the circuit board 4. The first bearing part 12 and the first power component 41 are provided with the heat conduction paste 2.

[0040] It can be understood that the components of the heat conduction paste 2 can be silicone oil, silicone rubber or epoxy resin, etc., which can fill the small gap between the first power component 41 and the first bearing part 12, thereby increasing the heat dissipation area and improving the heat dissipation effect. Among them, the silicone oil has good fluidity and moderate viscosity, which is the preferred scheme of the present application. For example, the heat conduction filler of the heat conduction paste 2 can be a metal material, a carbon material or a ceramic material, among which the metal material has a higher thermal conductivity coefficient, which is the preferred scheme of the present application. For example, the auxiliary agent of the heat conduction paste 2 can be a silane coupling agent, an antioxidant or an anti-rust agent, which can be selected according to actual needs. The heat conduction paste 2 connects the circuit board 4 and the heat dissipation plate 1, and can form a tightly connected heat conduction channel, enhance heat conduction, make heat quickly transfer from the circuit board 4 to the heat dissipation plate 1, thereby effectively reducing the temperature of the circuit board 4.

[0041] A heat-conducting pad 3 is arranged between the second bearing part 13 and the second power component 42. For the heat-conducting pad 3, please refer to Figure 1 The heat-conducting pad 3 is arranged between the heat-dissipating plate 1 and the circuit board 4. It can be understood that the heat-conducting pad 3 can be a silicon-based heat-conducting pad, a ceramic heat-conducting pad, or a graphite heat-conducting pad, etc. Among them, the graphite heat-conducting pad is made of natural graphite or artificially synthesized graphite, has a high thermal conductivity, and has outstanding heat-conducting performance in the plane, which is the preferred scheme of the present application. Through the high thermal conductivity and compressibility of the heat-conducting pad 3, the heat generated by the circuit board 4 can be well transmitted to the heat-dissipating plate 1, effectively reducing the temperature of the circuit board 4. The heat-conducting pad 3 is arranged between the second bearing part 13 and the second power component 42.

[0042] In the embodiments of the present application, the circuit board 4 is installed on the installation wall surface 11, and by arranging the first bearing part 12 and the second bearing part 13 with different heights on the installation wall surface 11, it can be suitable for specific circuit boards 4, and can make the heat-dissipating plate 1 better contact with power components of different heights, thereby effectively conducting heat from the power components to the heat-dissipating plate 1, improving the heat dissipation efficiency. Moreover, the bearing part with appropriate height can provide a shorter and smoother path for heat transfer, and the heat encounters less resistance during transmission, so the heat transfer efficiency is higher.

[0043] At the same time, the first bearing part 12 and the second bearing part 13 with different heights have a first gap space 14, which not only can accommodate part of the electronic components, but also can make the heat generated by the part of the electronic components during work convect and dissipate through the first gap space 14, accelerate heat dispersion, and improve the heat dissipation efficiency.

[0044] In addition, the heat-conducting paste 2 and the heat-conducting pad 3 between the heat-dissipating plate 1 and the circuit board 4 can play a good role in transferring heat, and through the heat-conducting effect of the two, the heat generated by the circuit board 4 can be transmitted to the heat-dissipating plate 1, thereby reducing the temperature of the circuit board 4 during work.

[0045] In some embodiments, it also includes a shell 5, please refer to Figure 1 and Figure 5 The shell 5 includes a first inclined surface 51. The heat-dissipating plate 1 also includes a second inclined surface 15. The first inclined surface 51 and the second inclined surface 15 are arranged in abutment. It can be understood that the first inclined surface 51 and the second inclined surface 15 have corresponding inclination directions and slopes, and the second inclined surface 15 can make the heat-dissipating area of the heat-dissipating plate 1 larger, the shell 5 can provide a supporting surface for the heat-dissipating plate 1, and the abutment arrangement of the first inclined surface 51 and the second inclined surface 15 can improve the stability of the heat-dissipating assembly.

[0046] Further, the shell 5 further comprises a plurality of limiting members 52 and a first region 53, the plurality of limiting members 52 are arranged around the first region 53, and the heat dissipation plate 1 is arranged on the first region 53. The plurality of limiting members 52 can be arranged on the shell 5 by screws, bolts or other installation methods. It can be understood that the area of the first region 53 is larger than the mounting area of the heat dissipation plate 1. The plurality of limiting members 52 are arranged around the first region 53, which can not only improve the stability of the SSD heat dissipation assembly, but also improve the installation efficiency during production and installation.

[0047] In other embodiments, the first inclined surface 51 comprises a first sub-inclined surface (not shown in the figure) and a second sub-inclined surface (not shown in the figure). The second inclined surface 15 comprises a third sub-inclined surface 151 and a fourth sub-inclined surface 152, the third sub-inclined surface 151 is in contact with the first sub-inclined surface, and the fourth sub-inclined surface 152 is in contact with the second sub-inclined surface. The arrangement of the third sub-inclined surface 151 and the fourth sub-inclined surface 152 can increase the heat dissipation area and improve the heat dissipation efficiency. It can be understood that the inclination direction and slope of the third sub-inclined surface 151 and the fourth sub-inclined surface 152 can be arranged respectively, so that the second inclined surface 15 can better contact the first inclined surface 51.

[0048] In some embodiments, the material of the heat dissipation plate 1 is one of aluminum, copper or stainless steel. Each material has good heat conduction performance, which is beneficial to improve the heat dissipation efficiency of the heat dissipation plate 1. Among them, the copper material has good heat conduction performance, but the cost is relatively high. The aluminum material has good heat conduction performance compared with the stainless steel material, and its cost is not high, which has high cost performance. The preferred material of the heat dissipation plate 1 in the present application is aluminum.

[0049] In some embodiments, the heat dissipation plate 1 is provided with a plurality of first threaded holes 16, and the circuit board 4 is provided with a plurality of second threaded holes 43. The heat dissipation assembly further comprises a first screw 44, and the first screw 44 is arranged in the first threaded hole 16 and the second threaded hole 43. It can be understood that the plurality of first threaded holes 16 and the plurality of second threaded holes 43 are arranged correspondingly. The connection of the heat dissipation plate 1 and the circuit board 4 by the screw can make the installation and disassembly work more convenient, can improve the installation and disassembly efficiency, and improve the product part fitting degree.

[0050] Further, the mounting wall 11 is provided with a first support platform 17 and a second support platform 18, the first support platform 17 and the second support platform 18 are arranged opposite to the two ends of the heat dissipation plate 1, and the first support platform 17 and the second support platform 18 are used for supporting the circuit board 4. The first support platform 17 and the second support platform 18 can strengthen the structure of the heat dissipation plate 1 and enhance the stability of the heat dissipation assembly.

[0051] Further, a plurality of first threaded holes 16 are arranged on the first support platform 17 and the second support platform 18. Arranging the first threaded holes 16 on the first support platform 17 and the second support platform 18 can make the heat dissipation plate 1 better withstand the stress generated by the first screw 44, reduce the damage caused by the internal stress to the heat dissipation plate 1, and improve the service life of the heat dissipation assembly.

[0052] In some embodiments, the first bearing part 12 is provided with a first rough area (not shown in the figure), and the heat-conducting paste 2 is arranged between the first rough area and the first power component 41. It can be understood that the heat-conducting paste 2 is in a semi-solid and semi-liquid state, and arranging the first rough area on the first bearing part 12 and arranging the heat-conducting paste 2 in the area can increase the friction between the heat-conducting paste 2 and the heat dissipation plate 1, so that the heat-conducting paste 2 can better connect the first power component 41 and the heat dissipation plate 1, improve the heat-conducting efficiency, and improve the heat dissipation performance.

[0053] In a second aspect, the present application further provides a notebook computer comprising the SSD heat dissipation assembly of any one of the embodiments of the first aspect.

[0054] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; under the idea of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in details for simplicity; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An SSD heat dissipation assembly, comprising: The heat dissipation plate comprises a mounting wall surface for mounting a circuit board, the mounting wall surface comprises a first bearing part and a second bearing part with different heights, and a first gap space is provided between the first bearing part and the second bearing part; The circuit board comprises a first power component and a second power component and a plurality of electronic components, and the first gap space is used for accommodating at least part of the electronic components; A heat-conducting paste is provided between the first bearing part and the first power component; A heat-conducting pad is provided between the second bearing part and the second power component.

2. The SSD heat dissipation assembly of claim 1, wherein, The SSD heat dissipation assembly further comprises a shell, the heat dissipation plate is mounted on the shell, the shell comprises a first inclined surface, the heat dissipation plate comprises a second inclined surface facing away from the circuit board, and the first inclined surface and the second inclined surface are arranged in abutment.

3. The SSD heat dissipation assembly of claim 2, wherein, The shell further comprises a plurality of limiting parts and a first area, the plurality of limiting parts are arranged around the first area, and the heat dissipation plate is arranged in the first area.

4. The SSD heat dissipation assembly of claim 2, wherein, The first inclined surface comprises a first sub-inclined surface and a second sub-inclined surface; The second inclined surface comprises a third sub-inclined surface and a fourth sub-inclined surface, the third sub-inclined surface is in abutment with the first sub-inclined surface, and the fourth sub-inclined surface is in abutment with the second sub-inclined surface.

5. The SSD heat dissipation assembly of claim 1, wherein, The material of the heat dissipation plate is one of aluminum, copper or stainless steel.

6. The SSD heat dissipation assembly of claim 1, wherein, The heat dissipation plate is provided with a plurality of first threaded holes, and the circuit board is provided with a plurality of second threaded holes penetrating through; The SSD heat dissipation assembly further comprises a first screw, and the first screw is arranged in the first threaded hole and the second threaded hole.

7. The SSD heat dissipation assembly of claim 6, wherein, The mounting wall surface is provided with a first support table and a second support table, the first support table and the second support table are arranged at opposite ends of the heat dissipation plate, and the first support table and the second support table are used for supporting the circuit board.

8. The SSD heat dissipation assembly of claim 7, wherein, The plurality of first threaded holes are arranged on the first support table and the second support table.

9. The SSD heat dissipation assembly of claim 1, wherein, The first bearing part is provided with a first rough area, and the heat-conducting paste is arranged between the first rough area and the first power component.

10. A notebook computer, comprising: The SSD heat dissipation assembly comprises any one of claims 1 to 9. The SSD heat dissipation assembly comprises any one of claims 1 to 9.

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