AI server with good heat dissipation performance

Abstract

The utility model discloses an AI server with good heat dissipation performance, which comprises a mounting plate, a cabinet body and a refrigeration mechanism, the mounting plate is electrically connected with a plurality of GPU (Graphics Processing Unit) arranged at intervals, the cabinet body is rotatably provided with a cabinet door, the cabinet body is internally provided with a first accommodating cavity and a second accommodating cavity, the mounting plate is arranged in the first accommodating cavity, and the refrigeration mechanism is arranged in the second accommodating cavity. A refrigeration air duct and a heat dissipation air duct are arranged in the second containing cavity, one end of the refrigeration air duct is communicated with the first containing cavity, the heat dissipation air duct penetrates through the cabinet body and is communicated with the outside, the refrigeration end of the refrigeration mechanism is arranged in the refrigeration air duct, the heat dissipation end of the refrigeration mechanism is arranged in the heat dissipation air duct, and a cold air pipe is arranged on the outer side of the cabinet body. And one end of the cold air pipe is communicated with the other end of the refrigeration air duct. And the other end of the cold air pipe is communicated with the first accommodating cavity. The AI server is good in heat dissipation performance, the heat dissipation efficiency of the server is improved, and the interior of the server can be kept dry.

Description

TECHNICAL FIELD

[0001] The utility model relates to GUP server field especially relates to an AI server with good heat dissipation performance. BACKGROUND

[0002] In recent years, with the rapid development of artificial intelligence technology, GPU servers are widely used in deep learning, model training and other high-intensity computing scenarios due to their parallel computing capabilities. However, when continuously executing large-scale AI tasks, GPU cores will generate a large amount of heat due to intensive floating-point operations, resulting in a significant increase in their operating temperature. If the heat dissipation efficiency is insufficient, the high-temperature environment will not only trigger the frequency reduction protection mechanism of the GPU chip, causing a significant decline in its computing performance, but also may cause accelerated hardware aging, decreased circuit stability, and even permanent damage, seriously affecting the reliability and task execution efficiency of the server system. Therefore, optimizing the heat management efficiency and reducing the impact of the heat dissipation system on the overall energy consumption and structural design of the server have become key challenges to improve the performance and reliability of AI computing devices. SUMMARY

[0003] The utility model aims at providing an AI server with good heat dissipation performance, improving the heat dissipation efficiency of the server, and keeping the internal server dry.

[0004] The utility model discloses an AI server with good heat dissipation performance adopts the technical scheme of:

[0005] The utility model discloses an AI server with good heat dissipation performance adopts the technical scheme of:

[0006] As a preferred scheme, the refrigeration mechanism includes an evaporator, a motor and a condenser assembly. The evaporator is placed in the refrigeration air duct. A cross-flow fan blade close to the evaporator is rotatably connected in the refrigeration air duct. The output shaft of the motor is connected with the cross-flow fan blade. The condenser assembly is placed in the heat dissipation air duct. A compressor and an expansion valve are provided in the second receiving cavity. The evaporator is connected with the compressor. The compressor is connected with the condenser assembly. The condenser assembly is connected with the expansion valve. The expansion valve is connected with the evaporator.

[0007] As a preferred solution, the condenser assembly comprises a first condenser and a second condenser, the compressor is communicated with the first condenser, the first condenser is communicated with the second condenser, the second condenser is communicated with the expansion valve, and the fan is arranged between the first condenser and the second condenser.

[0008] As a preferred solution, the condenser assembly comprises a first condenser and a second condenser, the compressor is communicated with the first condenser, the first condenser is communicated with the second condenser, the second condenser is communicated with the expansion valve, and the fan is arranged between the first condenser and the second condenser.

[0009] The AI server with good heat dissipation performance has the following beneficial effects:

[0010] The refrigeration end of the refrigeration mechanism continuously extracts hot air from the first containing cavity, and converts the hot air into dry cold air after phase change refrigeration treatment, and the cold air is delivered to the first containing cavity through the cold air pipe, and the GPU module is forced to flow and exchange heat, so that the chip working temperature is effectively reduced, the operation efficiency is improved, and the system stability is guaranteed; the air temperature rises after heat exchange, and since the first containing cavity, the refrigeration air duct and the cold air pipe are in a closed loop state, the hot air reenters the refrigeration air duct for circulation treatment.

[0011] Since the refrigeration end of the refrigeration mechanism converts the moisture in the hot air into condensed water when converting the hot air, the moisture content in the cold air is reduced, thereby keeping the server internal dry, and through the continuous dehumidification mechanism, the problem of GPU operation stability and service life reduction caused by high environmental humidity is effectively solved, and the risk of circuit board condensation and component corrosion is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a structure schematic view of the AI server with good heat dissipation performance.

[0013] Figure 2 It is a partial sectional view of the AI server with good heat dissipation performance.

[0014] Figure 3 It is a sectional view of the second containing cavity of the AI server with good heat dissipation performance.

[0015] Figure 4 It is a sectional view of the refrigeration air duct and the heat dissipation air duct of the AI server with good heat dissipation performance.

[0016] Figure 5 It is a structure schematic view of the refrigeration mechanism of the AI server with good heat dissipation performance. DETAILED DESCRIPTION

[0017] The utility model will be further described and explained in combination with specific embodiment and description of drawings:

[0018] Please refer to Figures 1-3 .

[0019] The utility model discloses an AI server that good heat dissipation performance, including mounting plate 1, cabinet 2 and refrigeration mechanism 3.

[0020] A plurality of interval arrangement's GPU 11 are electrically connected on mounting plate 1, and the channel is formed between two adjacent GPU 11, and the plurality of channels are perpendicular to ground.

[0021] The cabinet door 21 is rotatably installed on the cabinet 2, and the first receiving cavity 22 and the second receiving cavity 23 are arranged in the cabinet 2, the mounting plate 1 is arranged in the first receiving cavity 22, the cabinet door 21 is arranged on the first receiving cavity 22, and the first receiving cavity 22 is communicated with the outside by opening the cabinet door 21, which is convenient for the maintenance and repair of the GPU 11 arranged in the first receiving cavity 22 by the technical personnel.

[0022] Further, the second receiving cavity 23 is provided with a refrigeration air duct 231 and a heat dissipation air duct 233, one end of the refrigeration air duct 231 is communicated with the first receiving cavity 22, the first filter screen 221 is arranged on the communication part between the cold air pipe 24 and the first receiving cavity 22, the first filter screen 221 can filter the hot air entering the refrigeration air duct 231, and the content of dust in the hot air is reduced, and since the first filter screen 221 is arranged in the first receiving cavity 22, the technical personnel can conveniently clean and maintain the first filter screen 221.

[0023] The heat dissipation air duct 233 is communicated with the outside through the cabinet 2, two ends of the heat dissipation air duct 233 form two convection openings on the cabinet 2, and the second filter screen 234 and the third filter screen 235 are arranged on the two ends of the heat dissipation air duct 233, respectively, the second filter screen 234 and the third filter screen 235 can filter the air entering the heat dissipation air duct 233, and the content of dust in the air is reduced.

[0024] The refrigeration end of the refrigeration mechanism 3 is arranged in the refrigeration air duct 231, and the heat dissipation end of the refrigeration mechanism 3 is arranged in the heat dissipation air duct 233.

[0025] The outer side of the cabinet 2 is provided with the cold air pipe 24, the outer side of the cold air pipe 24 is wrapped with a heat preservation layer, the heat preservation layer can effectively block the heat conduction of the external environment, effectively inhibit the heat convection between the inner wall and the outer wall of the cold air pipe 24, and reduce the cold loss of the cold air in the transmission process in the cold air pipe 24; one end of the cold air pipe 24 is communicated with the other end of the refrigeration air duct 231, the other end of the cold air pipe 24 is communicated with the first receiving cavity 22, when the cabinet door 21 is closed, the cabinet door 21 seals the first receiving cavity 22, and the first receiving cavity 22, the refrigeration air duct 231 and the cold air pipe 24 form a closed loop state of air flow;

[0026] The communication position of the cold air pipe 24 with the first containing cavity 22 is at the bottom of the first containing cavity 22, and the communication position of the refrigeration air duct 231 with the first containing cavity 22 is at the top of the first containing cavity 22, so that the cold air entering the first containing cavity 22 from the cold air pipe 24 can gradually descend and pass through the passage to contact and exchange heat with each GPU 11.

[0027] Please refer to Figures 3-5 .

[0028] The refrigeration mechanism 3 comprises an evaporator 31, a motor and a condenser assembly 34, and the refrigeration end of the refrigeration mechanism 3 is the evaporator 31 and the cross-flow fan blade 311; the evaporator 31 is arranged in the refrigeration air duct 231, the evaporator 31 is close to the first filter screen 221, the cross-flow fan blade 311 close to the evaporator 31 is rotatably connected in the refrigeration air duct 231, the evaporator 31 is located above the cross-flow fan blade 311, and the refrigeration air duct 231 is preferably provided with a 90° bending portion, and the bending portion is a circular arc shape matched with the outer contour of the cross-flow fan blade 311, so that the wind power generated by the cross-flow fan blade 311 can be guided to one end of the cold air pipe 24; the motor is fixedly connected to the outside of the refrigeration air duct 231, the output shaft of the motor penetrates through the refrigeration air duct 231 and the cross-flow fan blade 311, and the motor drives the cross-flow fan blade 311 to draw and push air to flow in the first containing cavity 22, the refrigeration air duct 231 and the cold air pipe 24;

[0029] Further, the water tank 232 is arranged in the refrigeration air duct 231, the water tank 232 is located between the cross-flow fan blade 311 and the cold air pipe 24, the water tank 232 is communicated with the drain pipe, and the drain pipe penetrates out of the cabinet 2;

[0030] The cross-flow fan blade 311 draws hot air from the first containing cavity 22, the hot air is converted into cold air after being in contact with the evaporator 31 and being subjected to phase change refrigeration treatment, the cross-flow fan blade 311 pushes the cold air to flow through the cold air pipe 24 and into the first containing cavity 22, and the cold air is subjected to forced convection heat exchange with the GPU 11 module, so that the working temperature of the chip is effectively reduced, the operation efficiency is improved, and the system stability is guaranteed; the temperature of the air after completing the heat exchange rises again, and since the first containing cavity 22, the refrigeration air duct 231 and the cold air pipe 24 are in a closed loop state, the hot air reenters the refrigeration air duct 231 for circulation treatment.

[0031] Since the evaporator 31 converts the water in the hot air into condensed water when converting the hot air, the water content in the cold air is reduced, and the inside of the server is kept dry, thereby effectively solving the problems of the GPU 11 operation stability and service life reduction caused by high environmental humidity, avoiding the risks of circuit board condensation and component corrosion, and the like; the condensed water flows into the water tank 232 and is discharged out of the cabinet 2 through the drain pipe.

[0032] The second accommodating cavity 23 is internally provided with a compressor 32 and an expansion valve 33, the air outlet end of the evaporator 31 is communicated with the air inlet end of the compressor 32, and the air outlet end of the expansion valve 33 is communicated with the air inlet end of the evaporator 31.

[0033] The condenser assembly 34 is arranged in the heat dissipation air duct 233, the condenser assembly 34 comprises a first condenser 341 and a second condenser 342, and the fan 343 is arranged between the first condenser 341 and the second condenser 342; the air outlet end of the compressor 32 is communicated with the air inlet end of the first condenser 341, the air outlet end of the first condenser 341 is communicated with the air inlet end of the second condenser 342, and the air outlet end of the second condenser 342 is communicated with the air inlet end of the expansion valve 33.

[0034] When the fan 343 is in normal rotation, the fan 343 draws cold air from the outside through the second filter screen 234, the second filter screen 234 intercepts dust in the cold air, so that the content of dust in the cold air is reduced, and the cold air sequentially passes through the first condenser 341, the fan 343 and the second condenser 342 and exchanges heat with the first condenser 341 and the second condenser 342, so that the first condenser 341 and the second condenser 342 are cooled, and the design of the double condensers can further improve the cooling effect of the condenser device on the refrigerant; the converted hot air passes through the third filter screen 235 and is discharged from the heat dissipation channel, and the hot air flushes the dust on the third filter screen 235 when passing through the third filter screen 235, so that the third filter screen 235 is cleaned.

[0035] When the dust on the second filter screen 234 accumulates too much, the fan 343 is in reverse rotation, the fan 343 draws cold air from the outside through the third filter screen 235, the third filter screen 235 intercepts dust in the cold air, the hot air passes through the second filter screen 234 and is discharged from the heat dissipation channel, and the hot air flushes the dust on the second filter screen 234 when passing through the second filter screen 234, so that the second filter screen 234 is cleaned; the fan 343 is in normal rotation or reverse rotation to alternately clean the second filter screen 234 and the third filter screen 235, and since the first filter screen 221 is arranged in the first accommodating cavity 22, and the air flow in the first accommodating cavity 22 is closed loop, the first filter screen 221 is not easy to accumulate dust, so that the period of maintaining the equipment by the technical personnel is prolonged.

[0036] The AI server has good heat dissipation performance, the refrigeration end of the refrigeration mechanism continuously draws hot air from the first accommodating cavity, the hot air is converted into dry cold air after phase change refrigeration treatment, the cold air flows through the cold air pipeline and is delivered into the first accommodating cavity, the cold air exchanges heat with the GPU module by forced convection, the working temperature of the chip is effectively reduced, the operation efficiency is improved, and the system stability is guaranteed; the temperature of the air after heat exchange rises again, and since the first accommodating cavity, the refrigeration air duct and the cold air pipeline are in a closed loop state, the hot air reenters the refrigeration air duct for circulation treatment.

[0037] The refrigeration end of the refrigeration mechanism can convert the water in the hot air into condensed water when converting the hot air, so as to reduce the water content in the cold air, and further realize keeping the server dry, and effectively solve the problem of the GPU operation stability and service life reduction caused by the high environmental humidity through the continuous dehumidification mechanism, and avoid the risks of circuit board condensation, component corrosion and the like.

[0038] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the scope of protection of the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the present application.

Claims

1. An AI server with good heat dissipation performance, comprising a mounting plate, a plurality of GPUs are electrically connected to the mounting plate and arranged at intervals, characterized in that, Also include cabinet and refrigeration mechanism; The cabinet is provided with a cabinet door which is rotatably installed on the cabinet, a first receiving cavity and a second receiving cavity are arranged in the cabinet, the mounting plate is arranged in the first receiving cavity, a refrigeration air duct and a heat dissipation air duct are arranged in the second receiving cavity, one end of the refrigeration air duct is communicated with the first receiving cavity, the heat dissipation air duct penetrates through the cabinet and is communicated with the outside, a refrigeration end of the refrigeration mechanism is arranged in the refrigeration air duct, and a heat dissipation end of the refrigeration mechanism is arranged in the heat dissipation air duct. The outer side of the cabinet is provided with a cold air pipe, one end of the cold air pipe is communicated with the other end of the refrigeration air duct, and the other end of the cold air pipe is communicated with the first receiving cavity.

2. The AI server with good heat dissipation performance according to claim 1, wherein The refrigeration mechanism comprises an evaporator, a motor and a condenser assembly, the evaporator is arranged in the refrigeration air duct, a cross-flow fan blade close to the evaporator is rotatably connected in the refrigeration air duct, an output shaft of the motor is connected with the cross-flow fan blade, the condenser assembly is arranged in the heat dissipation air duct, a compressor and an expansion valve are arranged in the second receiving cavity, the evaporator is communicated with the compressor, the compressor is communicated with the condenser assembly, the condenser assembly is communicated with the expansion valve, and the expansion valve is communicated with the evaporator.

3. The AI server of claim 2, wherein the AI server is configured to perform the AI operation by using the AI chip and the AI accelerator. The condenser assembly comprises a first condenser and a second condenser, the compressor is communicated with the first condenser, the first condenser is communicated with the second condenser, the second condenser is communicated with the expansion valve, and a fan is arranged between the first condenser and the second condenser.

4. The AI server of claim 3, wherein the AI server is configured to perform the AI operation by using the AI chip and the AI server. First filter screens are arranged on the communication positions of the cold air pipe and the first receiving cavity, and second filter screens and third filter screens are arranged on the two ends of the heat dissipation air duct respectively.

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