Material frame for wafer cleaning
By designing a material frame for wafer cleaning, and utilizing multiple material handling structures and sleeve structures, efficient cleaning of multiple wafers was achieved, solving the problem that the mechanical gripper could only pick up one wafer at a time, thus improving cleaning efficiency and effectiveness.
Patent Information
- Application Number
- CN202423297737.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-30
AI Technical Summary
In existing technologies, mechanical grippers can only pick up one wafer at a time, resulting in low wafer cleaning efficiency.
Design a material frame for wafer cleaning, setting multiple material placement structures to limit multiple wafers, and allowing air probes to pass through the frame via sleeve holes, combined with multiple sets of flow channels for ultrasonic cleaning to achieve efficient cleaning.
It improves wafer cleaning efficiency, enhances ultrasonic cleaning effect, reduces pressure when the storage frame is immersed in water, and improves cleaning effect and stability.
Smart Images
Figure CN223712728U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer cleaning technical field, concretely relates to a material frame for wafer cleaning. BACKGROUND
[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon, high-purity polycrystalline silicon is dissolved and then added into silicon crystal seed, then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, wafer.
[0003] After wafer processing, the cavitation effect, acceleration effect and direct flow effect of ultrasonic waves in liquid directly or indirectly act on liquid and dirt, so that the dirt layer is dispersed, emulsified and peeled to achieve the cleaning purpose. In the existing wafer cleaning process, mechanical claws are used to clamp and clean wafers. However, the mechanical claws can only clamp one wafer at a time, which causes the problem of cleaning only one wafer at a time. Therefore, the wafer cleaning efficiency is low. UTILITY MODEL CONTENT
[0004] (I) Technical problem solved
[0005] In view of the deficiencies of the prior art, the utility model provides a material frame for wafer cleaning, which solves the problem of cleaning only one wafer at a time in the existing wafer cleaning process.
[0006] (II) Technical scheme
[0007] To achieve the above purpose, the utility model is realized by the following technical scheme:
[0008] In the utility model, the material frame for wafer cleaning is used for cleaning wafer, which comprises a storage frame, and a plurality of material placing structures are arranged at the opening end of the storage frame.
[0009] A plurality of wafer pieces are placed in the storage frame, and each wafer piece is inserted into the storage frame through the limiting groove in the corresponding material placing structure.
[0010] A plurality of through holes are formed in the bottom of the storage frame.
[0011] During cleaning, the storage frame is located in the ultrasonic cleaner, and the air probe is sleeved on the corresponding air probe in the ultrasonic cleaner through the plurality of through holes, and the air probe passes through the corresponding through hole and is located in the storage frame.
[0012] Further, a plurality of cleaning structures one are formed in the bottom of the storage frame and communicate with the frame bottom.
[0013] Each of the cleaning structures is located below the corresponding material placing structure;
[0014] Each of the cleaning structures includes a plurality of flow-through slots two and a plurality of flow-through slots three.
[0015] The flow-through slot three has a smaller slot flow than the flow-through slot two.
[0016] Further, the material placing frame is provided with a plurality of flow-through slots one on the side surface perpendicular to the wafer in the material placing structure.
[0017] Further, each of the material placing structures is detachably connected with the material placing frame.
[0018] Further, the material frame further includes a limiting frame located at the bottom of the ultrasonic cleaner and fixed with the ultrasonic cleaner, for limiting the material placing frame.
[0019] The material placing frame is inserted into the limiting frame.
[0020] (Three) beneficial effects
[0021] The utility model provides a material frame for wafer cleaning, compared with prior art, has the following beneficial effects:
[0022] By setting the material placing frame, a plurality of material placing structures are arranged on the material placing frame for limiting a plurality of wafers to be cleaned, and the sleeve hole is used to enable the air probe to pass through the material placing frame and be located in the interior of the material placing frame, which can enhance the ultrasonic cleaning effect in the material placing frame and realize efficient cleaning. DRAWINGS
[0023] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.
[0024] Figure 1 It is a perspective view of a material frame for wafer cleaning.
[0025] Figure 2 It is a structural schematic view. Figure 1
[0026] It is a structural schematic view. Figure 3 Figure 2 It is an isometric side sectional view of A-A in the figure.
[0027] Figure 4 It is a structural schematic view when the material placing frame does not place wafer.
[0028] Figure label:
[0029] 1. Limiting frame; 2. Storage frame; 20. Material placement structure; 21. Limiting groove; 22. Flow groove one; 23. Flow groove two; 231. Flow groove three; 24. Sleeve hole; 3. Wafer. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0031] This application provides a material frame for wafer cleaning, which solves the problem that existing wafer cleaning methods, which use mechanical grippers to pick up and clean wafers, can only pick up one wafer at a time, resulting in only one wafer being cleaned at a time, thus achieving efficient cleaning.
[0032] The technical solution in this application is to solve the above-mentioned technical problems, and the general idea is as follows:
[0033] In the current wafer cleaning process, mechanical grippers are used to pick up the wafers for cleaning. However, the mechanical grippers can only pick up one wafer at a time, resulting in the problem that only one wafer can be cleaned at a time. Therefore, the wafer cleaning efficiency is low.
[0034] Research has found that, for example Figures 1-4 As shown, by setting up a storage frame and setting multiple material placement structures on the storage frame to limit multiple wafers to be cleaned, and by using a sleeve hole to allow the air probe to pass through the storage frame and be located inside the storage frame, the ultrasonic cleaning effect inside the storage frame can be enhanced, achieving efficient cleaning.
[0035] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.
[0036] Example:
[0037] like Figure 1 and Figure 4 As shown, a material frame for wafer cleaning is used for cleaning wafer 3, including a storage frame 2, wherein the open end of the storage frame 2 is provided with multiple material placement structures 20.
[0038] The storage frame 2 contains a plurality of wafers 3, and each wafer 3 is inserted into the storage frame 2 through a limiting groove 21 in the corresponding stacking structure 20.
[0039] The bottom of the storage frame 2 is provided with a plurality of through holes 24.
[0040] During cleaning, the storage frame 2 is located in the ultrasonic cleaner and is sleeved on the corresponding air probe in the ultrasonic cleaner through the plurality of through holes 24, and the air probe passes through the corresponding through hole 24 and is located in the storage frame 2.
[0041] By arranging the storage frame 2 and arranging a plurality of material placing structures 20 on the storage frame 2 for limiting a plurality of to-be-cleaned wafer pieces 3, efficient cleaning is realized.
[0042] At the same time, the through holes 24 arranged at the bottom of the storage frame 2 can facilitate the water flow in the ultrasonic cleaner to enter the storage frame 2, reduce the pressure suffered by the storage frame 2 when immersed in water, and utilize the through holes 24 to realize that the air probe passes through the storage frame 2 and is located inside the storage frame 2, which can enhance the ultrasonic cleaning effect inside the storage frame 2.
[0043] As shown in Figures 3-4 The bottom of the storage frame 2 is provided with a plurality of cleaning structures one through the frame bottom.
[0044] Each of the cleaning structures one is located below the corresponding material placing structure 20.
[0045] Each of the cleaning structures one includes a plurality of flow-through slots two 23 and a plurality of flow-through slots three 231.
[0046] The flow rate of each of the flow-through slots three 231 is less than the flow rate of each of the flow-through slots two 23.
[0047] By arranging a plurality of cleaning structures one at the bottom of the storage frame 2 and arranging the cleaning structures one below the corresponding material placing structure 20, during the process of placing the storage frame 2 into the ultrasonic cleaner, the water flow passes through the cleaning structures one to flush the wafer piece 3 placed in the corresponding material placing structure 20, thereby enhancing the cleaning effect of the wafer piece 3.
[0048] At the same time, when the cleaning structure is arranged, the cleaning structure one is arranged in the form of a plurality of flow-through slots two 23 and a plurality of flow-through slots three 231, and the flow rate of each of the flow-through slots three 231 is less than the flow rate of each of the flow-through slots two 23, thereby reducing the pressure intensity of the whole during the descending process of the storage frame 2, improving the local pressure, and further enhancing the cleaning effect of the wafer piece 3 during the descending process by utilizing the cleaning structure one.
[0049] As shown in Figures 1-4 The storage frame 2 is provided with a plurality of flow-through slots one 22 on the side surface perpendicular to the wafer piece 3 located in the material placing structure 20.
[0050] Through the multiple flow through slots one 22 opened on the side vertical to the wafer 3 in the material placing structure 20, combined with the multiple flow through slots two 23 and the multiple flow through slots three 231, the preliminary flushing can be realized during the process of the material frame 2 immersed in the clean water, and through the distribution of the multiple flow through slots one 22, the multiple flow through slots two 23 and the multiple flow through slots three 231 around the corresponding wafer 3, the wafer 3 can be flushed in a targeted manner, and the preliminary cleaning effect is improved.
[0051] As shown in Figure 4 Each of the material placing structure 20 is detachably connected with the material frame 2.
[0052] Specifically, each of the material placing structure 20 is inserted and fixed with the material frame 2.
[0053] Through the detachable installation of the material placing structure 20 with the material frame 2, the replacement of the material placing structure 20 can be facilitated, the material placing structure 20 with the limiting groove 21 is replaced according to the thickness of the wafer 3, so as to improve the stability of the wafer 3 in the material placing structure 20, and facilitate the ultrasonic cleaning.
[0054] As shown in Figures 1-3 The material frame further comprises a limiting frame 1, the limiting frame 1 is located at the bottom of the ultrasonic cleaning machine and is fixed with the ultrasonic cleaning machine, and is used for limiting the material frame 2.
[0055] The material frame 2 is inserted into the limiting frame 1.
[0056] Through the limiting frame 1, the material frame 2 is limited by the limiting frame 1, the stability of the material frame 2 is improved, and the multiple wafers 3 in the material frame 2 are facilitated to be cleaned.
[0057] During work, according to the thickness of the wafer 3 to be cleaned, the material placing structure 20 with the limiting groove 21 is installed, and the wafer 3 to be cleaned is inserted into the limiting groove 21 arranged on the corresponding material placing structure 20.
[0058] And the material frame 2 is slowly immersed into the ultrasonic cleaning machine by the mechanical claw, and in the process of immersion, the clean water in the ultrasonic cleaning machine flushes the wafer 3 in the material frame 2 through the multiple flow through slots one 22, the multiple flow through slots two 23 and the multiple flow through slots three 231.
[0059] Under the action of the mechanical claw, the material frame 2 continues to descend until the material frame 2 is inserted into the limiting frame 1, and the wafer 3 is completely immersed in the clean water, at this time, the sleeve hole 24 is sleeved on the corresponding air probe, the ultrasonic cleaning machine is started, the air probe performs cavitation effect, acceleration effect and straight flow effect on the liquid and the dirt directly and indirectly, so that the dirt layer is dispersed, emulsified and peeled off to achieve the cleaning effect.
[0060] After the extraction of the storage frame 2 to the middle of the ultrasonic cleaning machine, the water is drained, and after the water is drained, the mechanical claw continues to drive the storage frame 2 to move upwards, and the wafer 3 after cleaning is taken out from the storage frame 2, and the whole cleaning process is completed.
[0061] Specifically, according to actual needs, clamping ears can be arranged on the side surface of the storage frame 2 to improve the convenience of clamping by the mechanical claw.
[0062] Compared with the prior art, the present application has the following beneficial effects:
[0063] 1. The storage frame 2 is arranged, and a plurality of material placing structures 20 are arranged on the storage frame 2 to limit a plurality of wafers 3 to be cleaned, so that efficient cleaning is achieved.
[0064] Meanwhile, the sleeve hole 24 arranged at the bottom of the storage frame 2 can facilitate the water flow in the ultrasonic cleaning machine to enter the storage frame 2, reduce the pressure received by the storage frame 2 when immersed in water, and utilize the sleeve hole 24 to realize that the air probe passes through the storage frame 2 and is located inside the storage frame 2, which can enhance the ultrasonic cleaning effect inside the storage frame 2.
[0065] 2. A plurality of cleaning structures one are arranged at the bottom of the storage frame 2, and the cleaning structure one is arranged below the corresponding material placing structure 20. During the process of placing the storage frame 2 into the ultrasonic cleaning machine, the water flow passes through the cleaning structure one to flush the wafer 3 placed in the corresponding material placing structure 20, thereby enhancing the cleaning effect of the wafer 3.
[0066] 3. Meanwhile, when the cleaning structure is arranged, the cleaning structure one is arranged in the form of a plurality of flow-through slots two 23 and a plurality of flow-through slots three 231, and the flow rate of each flow-through slot three 231 is smaller than that of each flow-through slot two 23. The size of the overall pressure received by the storage frame 2 during the descending process is reduced, the local pressure is increased, and thus the cleaning effect generated by the cleaning structure one is enhanced during the descending process of the wafer 3.
[0067] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or equipment including the element.
[0068] The above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A material frame for wafer cleaning, characterized by, The application discloses a cleaning device for wafer (3), which comprises a placing frame (2), and a plurality of material arrangement structures (20) are arranged on the opening end of the placing frame (2). A plurality of wafer (3) are placed in the placing frame (2), and each wafer (3) is inserted into the placing frame (2) through a limiting groove (21) in the corresponding material arrangement structure (20). A plurality of sleeve holes (24) are arranged on the bottom of the placing frame (2). During cleaning, the placing frame (2) is arranged in an ultrasonic cleaner, and the sleeve holes (24) are sleeved on corresponding air probes in the ultrasonic cleaner, and the air probes are arranged in the placing frame (2) through the sleeve holes (24).
2. The material frame for wafer cleaning as recited in claim 1, wherein, A plurality of cleaning structures I are arranged on the bottom of the placing frame (2) and penetrate the bottom of the placing frame (2). Each cleaning structure I is arranged below the corresponding material arrangement structure (20). Each cleaning structure I comprises a plurality of flow-through grooves II (23) and a plurality of flow-through grooves III (231). The flow rate of each flow-through groove III (231) is smaller than that of each flow-through groove II (23).
3. A material frame for wafer cleaning as recited in claim 2, wherein, A plurality of flow-through grooves I (22) are arranged on the side of the placing frame (2) which is perpendicular to the wafer (3) arranged in the material arrangement structure (20).
4. The material frame for wafer cleaning as recited in claim 1, wherein, Each material arrangement structure (20) is detachably connected with the placing frame (2).
5. The material frame for wafer cleaning as recited in claim 1, wherein, The material frame further comprises a limiting frame (1), the limiting frame (1) is arranged at the bottom of the ultrasonic cleaner and is fixed with the ultrasonic cleaner, and is used for limiting the placing frame (2). The placing frame (2) is inserted into the limiting frame (1).