Golden finger and electroplated lead structure thereof
By using a blind hole structure to cut off the plating branches after gold finger plating, the connectivity problem caused by secondary drilling was solved, ensuring signal quality and substrate integrity.
Patent Information
- Application Number
- CN202423216650.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In existing technology, when the connection is broken by secondary drilling after the gold finger is plated, it can easily affect the pattern on the other side, resulting in poor connectivity or damage to the ground copper structure.
A blind via structure is used to cut off the electroplating branch line between the gold finger and the electroplating bus, so as to avoid affecting the high-speed signal performance and protect the structural integrity of the other side of the substrate.
This effectively avoids the impact on high-speed signal performance, while reducing the damage to the other side of the substrate caused by blind vias, lowering the probability of burrs, and improving connection stability.
Smart Images
Figure CN223714284U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to a connecting finger and a plating lead structure thereof. BACKGROUND
[0002] A connecting finger refers to a plurality of conductive copper sheets made on the top and bottom surfaces of a PCB, and is called a connecting finger because of the shape like a finger. In order to improve the oxidation resistance and reduce the contact resistance of the connecting finger, a layer of gold is plated on the surface of the copper sheet. In order to realize the plating of the connecting finger, a lead is designed to extend to the edge of the board, and the lead is electrified to realize the plating of the connecting finger.
[0003] In the related art, in order to avoid affecting the appearance or the quality of the high-speed signal, after the plating is completed, the connection between the signal PIN and the plating lead is drilled by a secondary drilling process (through hole) to avoid short circuit with the ground PIN and reduce the residual lead. Since the secondary drilling is a through hole, when the connection between the signal PIN and the plating lead on one side is drilled, the pattern on the other side may be affected, for example, the ground copper on the other side may be drilled, resulting in poor connectivity, and even the ground copper may be drilled, affecting use. CONTENT OF THE UTILITY MODEL
[0004] The purpose of the present disclosure is to provide a connecting finger and a plating lead structure thereof, which at least partially solves the problems in the related art.
[0005] In order to achieve the above purpose, according to a first aspect of the present disclosure, a plating lead structure of a connecting finger is provided, the connecting finger comprising a first connecting finger and a second connecting finger arranged on a substrate, the first connecting finger being connected with a ground hole located on one side in a first direction of the first connecting finger, and the plating lead structure comprising:
[0006] a plating bus and a plating branch; the plating bus is connected with at least part of the ground holes located on one side in the first direction of the connecting finger, and the plating branch is connected with the second connecting finger and the plating bus;
[0007] The plating lead structure further comprises a blind hole for disconnecting the plating branch and the plating bus of the second connecting finger.
[0008] Optionally, the blind hole is located between the plating bus and the second connecting finger, and is used to cut off the plating branch.
[0009] Optionally, the blind hole disconnects the plating branch and part of the plating bus.
[0010] Optionally, the blind hole is a circular hole.
[0011] Optionally, the diameter of the blind via is greater than or equal to 10 mil.
[0012] Optionally, the electroplated bus is configured to extend a metal piece in a second direction, and opposite ends of the metal piece extend to opposite sides of the substrate.
[0013] Optionally, the electroplated bus includes a first bus segment and a second bus segment.
[0014] The first bus segment is disposed on one side of the substrate in the second direction and connected to the ground via corresponding to the first gold finger on the most edge of the side.
[0015] The second bus segment is disposed on the other side of the substrate in the second direction and connected to the ground via corresponding to the first gold finger on the most edge of the side.
[0016] The electroplated branch line connects the second gold finger and the first bus segment; and / or
[0017] The electroplated branch line connects the second gold finger and the second bus segment.
[0018] Optionally, in the first direction, the length of the second gold finger is less than the length of the first gold finger.
[0019] Optionally, the substrate includes opposite first and second side surfaces.
[0020] The projections of at least part of the second gold finger on the first side surface and at least part of the first gold finger on the second side surface on the plane of the substrate coincide.
[0021] According to a second aspect of the present disclosure, a gold finger is also provided, including the above-mentioned electroplated lead structure.
[0022] Through the above technical solution, i.e., the electroplated lead structure of the present disclosure, including an electroplated bus and an electroplated branch line, wherein the electroplated bus is connected to at least part of the ground via on one side of the gold finger in the first direction (e.g., the ground via on one side of the first gold finger in the first direction), the electroplated branch line connects the electroplated bus and the second gold finger, and the electroplated branch line between the second gold finger and the electroplated bus is truncated by the blind via, avoiding the performance of the high-speed signal carried by the gold finger from being affected, and at the same time, because the blind via structure is adopted, no damage is caused to the structure of the other side surface of the substrate.
[0023] Other features and advantages of the present disclosure will be described in detail in the following detailed description section. BRIEF DESCRIPTION OF DRAWINGS
[0024] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, illustrate embodiments of the present disclosure and are used to explain the present disclosure together with the specific embodiments described in the specific embodiments section, but are not intended to limit the present disclosure. In the drawings:
[0025] Figure 1 is a plated lead structure of a gold finger provided by some embodiments of the present disclosure, wherein the plated branch line is not truncated;
[0026] Figure 2 is a plated lead structure of a gold finger provided by some embodiments of the present disclosure, wherein the plated branch line is truncated by a blind hole;
[0027] Figure 3 is a plated lead structure of a gold finger provided by some embodiments of the present disclosure, wherein the plated branch line is truncated by a blind hole;
[0028] Figure 4 is a plated lead structure of a gold finger provided by some embodiments of the present disclosure, wherein the plated branch line is not truncated;
[0029] Figure 5 is a plated lead structure of a gold finger provided by some embodiments of the present disclosure, wherein the plated branch line is truncated by a blind hole;
[0030] Figure 6 is a partial schematic view of a plated lead structure of a first side provided by some embodiments of the present disclosure;
[0031] Figure 7 is a partial schematic view of a plated lead structure of a second side provided by some embodiments of the present disclosure.
[0032] Legend of reference signs
[0033] 10 - substrate; 10a - first side; 10b - second side; 11 - first gold finger; 12 - second gold finger; 13 - ground hole;
[0034] 110 - plated bus line; 111 - metal piece; 112 - first bus segment; 113 - second bus segment; 120 - plated branch line; 130 - blind hole. DETAILED DESCRIPTION
[0035] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.
[0036] In the disclosure, unless otherwise stated, the orientation words such as "up, down, left, right" generally refer to up, down, left, right in the drawings; "inner, outer" refers to the inner and outer of the profile of the corresponding components; "far, near" refers to the corresponding structure or the corresponding component far away or close to another structure or component. X in the drawings of the disclosure represents the first direction; Y represents the second direction. In addition, the terms "first", "second" and the like used in the disclosure are used to distinguish one element from another element, and do not have sequential and important meanings. Furthermore, in the following description, when referring to the drawings, the same reference numerals in different drawings represent the same or similar elements, unless otherwise explained. The above definitions are only used to explain and illustrate the disclosure, and should not be understood as a limitation of the disclosure.
[0037] To achieve the above-mentioned purpose, as Figures 1 to 7 shown, according to a first aspect of the disclosure, a gold finger electroplating lead structure is provided, the gold finger includes a first gold finger 11 and a second gold finger 12 arranged on a substrate 10, the first gold finger 11 is connected with a ground hole 13 located on one side of the first gold finger 11 in the first direction of the gold finger, the electroplating lead structure includes an electroplating bus 110 and an electroplating branch 120; the electroplating bus 110 is connected with at least part of the ground hole 13 located on one side of the first direction of the gold finger, the electroplating branch 120 is connected with the second gold finger 12 and the electroplating bus 110; the electroplating lead structure further includes a blind hole 130 for disconnecting the electroplating branch 120 of the second gold finger 12 and the electroplating bus 110. Wherein, the substrate 10 can be a PCB or a printed circuit board.
[0038] Through the above technical solution, that is, the electroplating lead structure of the disclosure, including an electroplating bus 110 and an electroplating branch 120, wherein the electroplating bus 110 is connected with at least part of the ground hole 13 located on one side of the first direction of the gold finger (for example, the ground hole 13 located on one side of the first direction of the first gold finger 11), the electroplating branch 120 is connected with the electroplating bus 110 and the second gold finger 12, and the electroplating branch 120 between the second gold finger 12 and the electroplating bus 110 is cut off through the blind hole 130, avoiding the performance of the high-speed signal carried by the gold finger from being affected, and at the same time, because the blind hole 130 structure is adopted, the structure of the other side of the substrate 10 will not be damaged.
[0039] The gold finger of the embodiment of the disclosure can be a PCIE (peripheral component interconnect express) gold finger, and can also be extended to other applicable range of gold finger. Wherein, PCIE refers to the abbreviation of high-speed serial computer expansion bus standard. Including PCIE GEN5 and PCIE GEN6, wherein, PCIE GEN5 refers to the 5th generation PCIE technology, and PCIE GEN6 refers to the 6th generation PCIE technology.
[0040] It should be noted that the first gold fingers 11 can be ground network gold fingers, and the second gold fingers 12 can be non-ground network gold fingers.
[0041] As shown in Figure 1 , the gold fingers can include a plurality of first gold fingers 11 and a plurality of second gold fingers 12 arranged on the substrate 10 in a first direction, and the first gold fingers 11 and the second gold fingers 12 both extend in a second direction. Among them, two second gold fingers 12 are arranged between two adjacent first gold fingers 11, and the two sides of the first gold fingers 11 and the second gold fingers 12 in the second direction are respectively provided with ground holes 13, and the two ends of the first gold fingers 11 are respectively connected with the ground holes 13 located at the two ends.
[0042] In order to realize the electroplating of the first gold fingers 11 and the second gold fingers 12, the embodiments of the present disclosure provide an electroplating bus 110 and an electroplating branch 120, the electroplating bus 110 connects a plurality of first gold fingers 11, and at the same time, the electroplating branch 120 connects the second gold fingers 12 with the electroplating assembly, so as to form an electrical connection between the first gold fingers 11 and the second gold fingers 12.
[0043] It can be understood that, as shown in Figure 2 , after the electroplating is completed, the blind hole 130 is used to disconnect the second gold fingers 12 and the electroplating bus 110, and the blind hole 130 is a hole with a certain depth, compared with the through hole in the related art, it can guarantee not to damage the structure of the other side of the substrate 10, and avoid affecting the pattern on the other side to cause poor connectivity. The depth of the blind hole 130 can be controlled according to actual needs, which will not be described here.
[0044] In some embodiments, the diameter of the blind hole 130 can be greater than or equal to 10 mil. Among them, in the case of double drilling with a through hole, that is, when the connection between the signal PIN and the electroplated wire is disconnected, the edge of the through hole inevitably produces burrs. The larger the aperture of the through hole, the smaller the probability of burr generation. Since the influence of the through hole on the circuit on the other side needs to be considered, the aperture of the through hole cannot be made very large, generally 8 mil and below. After the through hole of the embodiment of the present disclosure becomes the blind hole 130, the aperture is not limited by the pattern on the other side, and can be made larger, for example, 10 mil and above, which can significantly reduce the probability of burrs. It should be noted that the diameter of the blind hole 10 can also be less than 10 mil, since it will not pass through the other side of the substrate 10, it can also at least partially reduce the burrs.
[0045] As shown in Figure 6 and Figure 7As shown, the substrate 10 can include opposite first side 10a and second side 10b; at least part of the second gold fingers 12 of the first side 10a corresponds to at least part of the first gold fingers 11 of the second side 10b, i.e. the projection of at least part of the second gold fingers 12 of the first side 10a and at least part of the first gold fingers 11 of the second side 10b on the plane where the substrate 10 is located coincide. Among them, the first side 10a can be arranged with a plurality of first gold fingers 11 and second gold fingers 12, and the second side 10b can also be arranged with a plurality of first gold fingers 11 and second gold fingers 12, and at least one second gold finger 12 of the first side 10a corresponds to one first gold finger 11 of the second side 10b. If the through hole in the related art is used to cut off the second gold finger 12 of the first side 10a, the through hole will damage the first gold finger 11 of the first side 10a or the ground copper structure connecting the first gold finger 11 and the ground hole 13, resulting in poor connection performance. While the blind hole 130 of the present disclosure meets the requirement of "cutting off" the electroplated branch line 120 connecting the second gold finger 12 of the first side 10a, it does not penetrate the second side 10b, thereby ensuring the integrity of the first gold finger 11 of the second side 10b and ensuring the connection performance.
[0046] Since the blind hole 130 is used to cut off the connection between the second gold finger 12 and the electroplated bus 110, the blind hole 130 can adopt any suitable structure, such as Figure 2 As shown, in some embodiments, the blind hole 130 is located between the electroplated bus 110 and the second gold finger 12 for cutting off the electroplated branch line 120. Among them, the blind hole 130 is arranged between the electroplated bus 110 and the second gold finger 12, and can cut off the electroplated branch line 120 connecting the second gold finger 12 and the electroplated bus 110, so as to avoid short circuit with the first gold finger 11 and reduce the lead residue.
[0047] As shown, in some embodiments, the blind hole 130 is located between the electroplated bus 110 and the second gold finger 12 for cutting off the electroplated branch line 120. Among them, the blind hole 130 is arranged between the electroplated bus 110 and the second gold finger 12, and can cut off the electroplated branch line 120 connecting the second gold finger 12 and the electroplated bus 110, so as to avoid short circuit with the first gold finger 11 and reduce the lead residue. Figure 3 As shown, in some embodiments, the blind hole 130 is located between the electroplated bus 110 and the second gold finger 12 for cutting off the electroplated branch line 120. Among them, the blind hole 130 is arranged between the electroplated bus 110 and the second gold finger 12, and can cut off the electroplated branch line 120 connecting the second gold finger 12 and the electroplated bus 110, so as to avoid short circuit with the first gold finger 11 and reduce the lead residue.
[0048] Figure 2 It should be noted that the blind hole 130 can adopt any suitable shape, for example, a circular hole, an elliptical hole or other polygonal hole. As shown, Figure 3 As shown, in some embodiments of the present disclosure, the blind hole 130 can be a circular hole, which can be realized by depth control drilling, facilitating processing and simplifying structure.
[0049] The electroplating bus 110 and the electroplating branch 120 can be constructed in any suitable structure, such as Figure 2 and Figure 3 In some embodiments of the present disclosure, the electroplating bus 110 is configured to extend the metal piece 111 in the second direction, and the opposite ends of the metal piece 111 extend to at least the opposite sides of the substrate 10, wherein the first direction is perpendicular to the second direction.
[0050] The electroplating bus 110 can be a strip-shaped metal piece 111 arranged on the substrate 10 and above the first gold finger 11 and the second gold finger 12 in the first direction, connecting the plurality of ground holes 13 above, and the two ends of the strip-shaped metal piece 111 in the second direction can be located at or beyond the opposite side edges of the substrate 10 in the second direction for electrical connection with the electroplating circuit, and the plurality of electroplating branches 120 are respectively connected between the second gold finger 12 and the electroplating bus 110, the blind hole 130 can be located between the electroplating bus 110 and the second gold finger 12, or above the second gold finger 12, and part of the electroplating bus 110 is cut off, avoiding short circuit while improving high-speed signal quality.
[0051] As shown in Figure 4 and Figure 5 In some embodiments of the present disclosure, the electroplating bus 110 includes a first bus segment 112 and a second bus segment 113; the first bus segment 112 is arranged on one side of the substrate 10 in the second direction and connected to the ground hole 13 corresponding to the first gold finger 11 at the edge of the side; the second bus segment 113 is arranged on the other side of the substrate 10 in the second direction and connected to the ground hole 13 corresponding to the first gold finger 11 at the edge of the side; the electroplating branch 120 connects the second gold finger 12 and the first bus segment 112; and / or the electroplating branch 120 connects the second gold finger 12 and the second bus segment 113.
[0052] The electroplating bus 110 can also be split, for example, the electroplating bus 110 includes a first bus segment 112 and a second bus segment 113, and the first bus segment 112 and the second bus segment 113 can be arranged at the two ends of the substrate 10 in the second direction, extending to at least the edge of the substrate 10, or can also extend to the outside of the substrate 10 for connection with the electroplating circuit. In addition, the first bus segment 112 can connect the leftmost first gold finger 11 and the ground hole 13 connected to the first gold finger 11, the second bus segment 113 can connect the rightmost first gold finger 11 and the ground hole 13 connected to the first gold finger 11, the electroplating branch 120 connects the two first gold fingers 11 at the edge, simultaneously connects the second gold finger 12 and the first gold finger 11 in the middle, and then connects at least one of the first bus segment 112 and the second bus segment 113, thereby meeting the needs of electroplating. After electroplating is completed, as shown in Figure 5As shown, the connection between the first bus segment 112 above the second gold finger 12 and the plated branch line 120 of the second gold finger 12 can be cut off by the blind hole 130. By setting the plated bus 110 as the first bus segment 112 and the second bus segment 113, the plating requirement can also be met.
[0053] It should be noted that in some embodiments, especially for the case where the second direction dimension of the substrate 10 is large, the plurality of first gold fingers 11 at the intermediate position and the corresponding ground holes 13 thereof can be connected by a third bus segment (not shown in the figure), and the first bus segment 112, the second bus segment 113 and the third bus segment are connected by the plated branch line 120, and the second gold finger 12 at the intermediate position is connected to the third bus segment by the plated branch line 120, so that the electrical connection can be realized, thereby meeting the plating requirement. After plating is completed, the electrical connection can be cut off by drilling a hole in the plated branch line 120 above the second gold finger 12.
[0054] In some embodiments of the present disclosure, in the first direction, the length of the second gold finger 12 is less than the length of the first gold finger 11. For example, the application scenario is a PCIE gold finger. It can be understood that the plated lead structure of the embodiments of the present disclosure is also applicable to the scenario where the length of the second gold finger 12 is equal to or greater than the length of the first gold finger 11.
[0055] According to the second aspect of the present disclosure, a gold finger is also provided, which comprises the plated lead structure described above, and therefore, the gold finger also has all the advantages of the plated lead structure described above. The gold finger is not limited to a PCIE gold finger, but is also applicable to any other gold finger.
[0056] The gold finger and the plated lead structure thereof of the present disclosure, the plated lead structure comprising a plated bus 110 and a plated branch line 120, wherein the plated bus 110 is connected to at least part of the ground holes 13 (for example, the ground holes 13 on the first direction side of the first gold finger 11) on one side of the gold finger in the first direction, and the plated branch line 120 connects the plated bus 110 and the second gold finger 12, and cuts off the plated branch line 120 between the second gold finger 12 and the plated bus 110 through the blind hole 130, thereby avoiding the performance of the high-speed signal carried by the gold finger from being affected, and at the same time, because the blind hole 130 structure is adopted, the structure of the other side of the substrate 10 will not be damaged.
[0057] Further, since the plated branch line 120 is cut off by the blind hole 130, the aperture will not be limited by the pattern on the other side, and can be made larger, for example, 10 mil or more, which can significantly reduce the probability of burrs.
[0058] The preferred embodiments of the present disclosure are described in detail above with reference to the drawings, but the present disclosure is not limited to the specific details in the above-described embodiments. Various simple modifications can be made to the technical solutions of the present disclosure within the technical concept of the present disclosure, and all these simple modifications shall fall within the protection scope of the present disclosure.
[0059] In addition, it should be noted that each specific technical feature described in the above-described specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, various possible combinations are not described again in the present disclosure.
[0060] In addition, various different embodiments of the present disclosure can also be combined in any appropriate manner, as long as it does not deviate from the idea of the present disclosure, and it should be considered as disclosed in the present disclosure.
Claims
1. A gold finger electroplating lead structure, characterized by, The gold fingers include first and second gold fingers arranged on a substrate, the first gold finger is connected with a ground hole located laterally in a first direction of the first gold finger, and the electroplated lead structure includes: an electroplated bus and an electroplated branch; the electroplated bus is connected with at least part of the ground holes located on one side in a first direction of the gold fingers, and the electroplated branch is connected with the second gold finger and the electroplated bus; The electroplated lead structure further includes a blind hole for disconnecting the electroplated branch and the electroplated bus of the second gold finger.
2. The electroplated lead structure of claim 1, wherein, The blind hole is located between the electroplated bus and the second gold finger, and is used to cut off the electroplated branch.
3. The electroplated lead structure of claim 1, wherein, The blind hole disconnects the electroplated branch and part of the electroplated bus.
4. The electroplated lead structure of claim 1, wherein, The blind hole is a circular hole.
5. The electroplated lead structure of claim 1, wherein, The diameter of the blind hole is greater than or equal to 10 mil.
6. The electroplated lead structure according to any one of claims 1 to 5, wherein The electroplated bus is configured to extend a metal piece in a second direction, and opposite ends of the metal piece extend to opposite sides of the substrate, wherein the first direction is perpendicular to the second direction.
7. The electroplated lead structure according to any one of claims 1 to 5, wherein The electroplated bus includes first and second bus segments; The first bus segment is arranged on one side of the substrate in the second direction and is connected with the ground hole corresponding to the first gold finger at the most edge of the side; The second bus segment is arranged on the other side of the substrate in the second direction and is connected with the ground hole corresponding to the first gold finger at the most edge of the side; The electroplated branch connects the second gold finger and the first bus segment; And / or The electroplated branch connects the second gold finger and the second bus segment.
8. The electroplated lead structure of claim 1, wherein, In the first direction, the length of the second gold finger is less than the length of the first gold finger.
9. The electroplated lead structure of claim 1, wherein, The substrate includes opposite first and second side surfaces; At least part of the second gold finger of the first side surface and at least part of the first gold finger of the second side surface coincide in projection on the plane where the substrate is located.
10. A gold finger, characterized in that, The electroplated lead structure includes any one of claims 1-9.