Energy dissipation mechanism of aluminum-based circuit board

Abstract

The utility model relates to the technical field of circuit boards, and discloses an energy dissipation mechanism of an aluminum-based circuit board, which comprises a recovery water tank, the inner bottom wall of the recovery water tank is fixedly connected with a submersible pump, the output end of the submersible pump is fixedly connected with a liquid delivery pipe, and the top end of the liquid delivery pipe is fixedly connected with a connecting pipe. According to the utility model, liquid in the snakelike condensation pipe is used for circulating heat dissipation, the submersible pump pumps out water in the recovery water tank, the water is conveyed to the snakelike condensation pipe through the liquid conveying pipe and the connecting pipe, and the water flows back to the recovery water tank after absorbing circuit board heat conducted by the heat dissipation grease sheet, so that a large amount of heat can be effectively taken away through the water cooling mode, and the preliminary heat dissipation of the circuit board is ensured; according to the heat dissipation device, the heat dissipation fins are arranged in the heat dissipation box, cyclic utilization of water resources is achieved, waste of the water resources is reduced, personnel can guide residual heat around or on the surfaces of the heat dissipation fins into the heat dissipation box by starting the heat absorption pump, secondary cooling is conducted through the heat dissipation fins in the heat dissipation box, a dual-mode heat dissipation system is formed, and the overall heat dissipation capacity is enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, especially to an energy dissipation mechanism of aluminum base circuit board. BACKGROUND

[0002] With the rapid development of electronic technology, aluminum base circuit board is increasingly widely used in various electronic devices. Modern electronic devices are constantly developing towards miniaturization, high performance and high integration, which greatly increases the density of electronic components on the aluminum base circuit board. For example, in the field of smart phones, computer graphics cards and industrial control devices, more functions are integrated into smaller circuit board space.

[0003] The high-density integration of electronic components causes the circuit board to generate a large amount of heat when working. If this heat cannot be effectively dissipated in time, it will have a serious impact on the performance and life of the circuit board. Traditional air cooling is a common circuit board cooling method. Air cooling mainly relies on air convection to carry away heat, and its cooling efficiency is limited by the low thermal conductivity of air. In the application scenario of high-power and high-heat aluminum base circuit board, air cooling often cannot meet the cooling demand. Moreover, as the integration of the circuit board continues to improve, air cooling systems need larger fans or higher wind speed to achieve the purpose of heat dissipation, which will increase the volume, power consumption and noise of the equipment. SUMMARY

[0004] To solve the above technical problems, the utility model provides an energy dissipation mechanism of aluminum base circuit board.

[0005] The utility model adopts the following technical scheme: an energy dissipation mechanism of aluminum base circuit board, comprising a recovery water tank, the inner bottom wall of the recovery water tank is fixedly connected with a submersible pump, the output end of the submersible pump is fixedly connected with a liquid delivery pipe, the top end of the liquid delivery pipe is fixedly connected with a connecting pipe, the top end of the connecting pipe is fixedly connected with a serpentine condenser pipe, the surface of the serpentine condenser pipe is fixedly connected with a recovery pipe, the recovery pipe is arranged in the inside of the recovery water tank, the upper surface of the serpentine condenser pipe is provided with a heat dissipation paste piece, the outer surface of the recovery water tank is fixedly connected with a heat dissipation box, the inside of the heat dissipation box is provided with a heat dissipation fin.

[0006] Through the above technical scheme, through the double heat dissipation mechanism of liquid circulation in the serpentine condenser pipe and the heat dissipation fin in the heat dissipation box, the temperature of the circuit board can be effectively reduced, ensuring that the circuit board works in a suitable temperature environment and improving the stability and service life of the circuit board.

[0007] As a further improvement of the above scheme, the upper surface of the recovery water tank is fixedly connected with a plurality of support columns, the top end of the support column is fixedly connected with a mounting frame, the outer surface of the serpentine condenser pipe is sleeved with a pipe rack, and the pipe rack is fixedly connected to the inner wall of the mounting frame.

[0008] The above technical solution ensures a stable structure, allowing the serpentine condenser tube to continuously and effectively cool the thermal paste, thus guaranteeing stable heat dissipation for the circuit board. It also prevents the serpentine condenser tube from affecting heat dissipation efficiency due to shaking or instability.

[0009] As a further improvement to the above solution, a heat absorption pump is fixedly installed on the upper surface of the heat sink by bolts, a suction cup is fixedly connected to the input end of the heat absorption pump, and a bracket is fixedly connected to the outer surface of the suction cup.

[0010] The above technical solution can accurately absorb the remaining heat on the circuit board, further enhance the heat dissipation effect, and ensure that the temperature of the circuit board can be quickly reduced to a suitable range.

[0011] As a further improvement to the above solution, the suction cup is located on one side of the heat dissipation paste, and the output end of the heat pump is fixedly connected to a heat delivery pipe, the bottom end of which is located inside the heat dissipation box.

[0012] The above technical solution enables heat to be efficiently transferred from the circuit board to the interior of the heat sink, and facilitates secondary heat dissipation through heat sink fins inside the heat sink.

[0013] As a further improvement to the above solution, the heat supply pipe is located above the heat dissipation fins, and a heat exchange groove is provided on the outer surface of the heat dissipation box.

[0014] The above technical solution enhances the heat exchange between the inside and outside of the heat sink, improves the heat dissipation efficiency of the heat sink, and helps to further reduce the temperature of the circuit board.

[0015] As a further improvement to the above solution, an extension frame is fixedly connected to the outer surface of the recycling tank, and a top plate is fixedly connected to the surface of the extension frame.

[0016] As a further improvement to the above solution, an auxiliary fan is fixedly installed on the lower surface of the top plate by bolts, and an air hole is opened on the surface of the top plate for the auxiliary fan to enter air.

[0017] By using the above technical solutions, increasing the airflow speed can enhance the heat dissipation effect, further improve the heat dissipation capacity of the entire energy dissipation mechanism for the circuit board, and enable the circuit board to cool down faster.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] This invention utilizes liquid circulation for heat dissipation within a serpentine condenser tube. A submersible pump draws water from a recovery tank, which is then delivered to the serpentine condenser tube via a delivery pipe and connecting pipe. The condenser tube absorbs heat from the circuit board conducted by the thermal paste and then flows back to the recovery tank. This water-cooling method effectively removes a large amount of heat, ensuring initial heat dissipation for the circuit board. It also achieves water resource recycling, reducing water waste. Personnel can activate a heat absorption pump to transfer the remaining heat around or on the surface of the thermal paste into the heat dissipation box, where the heat dissipation fins provide secondary cooling. This dual-mode heat dissipation system enhances the overall heat dissipation capacity. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the serpentine condenser tube of this utility model;

[0022] Figure 3 This is a cross-sectional view of the heat dissipation fins of this utility model.

[0023] Figure 4 This is a schematic diagram of the exploded structure of the submersible pump of this utility model;

[0024] Figure 5 This is a schematic diagram of the auxiliary fan of this utility model.

[0025] Explanation of key symbols:

[0026] 1. Recycle water tank; 2. Submersible pump; 3. Liquid delivery pipe; 4. Connecting pipe; 5. Serpentine condenser tube; 6. Recycle pipe; 7. Thermal paste; 8. Support column; 9. Mounting frame; 10. Pipe rack; 11. Heat sink; 12. Heat dissipation fins; 13. Heat absorption pump; 14. Suction cup; 15. Stand; 16. Heat delivery pipe; 17. Heat exchange tank; 18. Extension rack; 19. Top plate; 20. Auxiliary fan; 21. Vent. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0028] Example:

[0029] Please combine Figures 1-5This embodiment of an energy dissipation mechanism for an aluminum-based circuit board includes a recovery water tank 1. A submersible pump 2 is fixedly connected to the inner bottom wall of the recovery water tank 1. A liquid delivery pipe 3 is fixedly connected to the output end of the submersible pump 2. A connecting pipe 4 is fixedly connected to the top end of the liquid delivery pipe 3. A serpentine condenser pipe 5 is fixedly connected to the top end of the connecting pipe 4. A recovery pipe 6 is fixedly connected to the surface of the serpentine condenser pipe 5. The recovery pipe 6 is disposed inside the recovery water tank 1. A heat dissipation grease 7 is disposed on the upper surface of the serpentine condenser pipe 5. A heat dissipation box 11 is fixedly connected to the outer surface of the recovery water tank 1. The inner surface of the heat dissipation box 11... The circuit board is equipped with heat dissipation fins 12. The submersible pump 2 draws water from the bottom of the recovery water tank 1 and sends the water to the serpentine condenser tube 5 through the liquid delivery pipe 3 and the connecting pipe 4. When the circuit board is placed on the surface of the heat dissipation paste 7, the liquid flowing in the serpentine condenser tube 5 absorbs the heat of the heat dissipation paste 7, thereby dissipating heat from the circuit board. Then, the recovery pipe 6 returns the water in the serpentine condenser tube 5 to the recovery water tank 1. At the same time, the remaining heat after the heat dissipation paste 7 absorbs the heat from the circuit board is introduced into the heat dissipation box 11 through the heat absorption pump 13. The heat dissipation fins 12 in the heat dissipation box 11 perform secondary cooling of the heat.

[0030] Several support columns 8 are fixedly connected to the upper surface of the water recovery tank 1. An installation frame 9 is fixedly connected to the top of the support columns 8. A pipe bracket 10 is fitted onto the outer surface of the serpentine condenser tube 5. The pipe bracket 10 is fixedly connected to the inner wall of the installation frame 9. The support columns 8 on the water recovery tank 1 support the installation frame 9. The pipe bracket 10 on the inner wall of the installation frame 9 is fitted onto the outer surface of the serpentine condenser tube 5, which serves to fix and support the serpentine condenser tube 5, ensuring the stability of the serpentine condenser tube 5 during operation and ensuring its normal heat dissipation function.

[0031] A heat pump 13 is fixedly installed on the upper surface of the heat sink 11 by bolts. A suction cup 14 is fixedly connected to the input end of the heat pump 13. A bracket 15 is fixedly connected to the outer surface of the suction cup 14. The heat pump 13 contacts the surface of the circuit board through the suction cup 14. The suction force of the heat pump 13 is used to remove the heat remaining after the heatsink 7 absorbs the heat of the circuit board. Then, the heat is transported to the inside of the heat sink 11 through the heat delivery pipe 16.

[0032] The suction cup 14 is located on one side of the thermal paste 7. The output end of the heat pump 13 is fixedly connected to the heat delivery pipe 16. The bottom end of the heat delivery pipe 16 is located inside the heat sink 11. The suction cup 14 is located on one side of the thermal paste 7, which can effectively absorb the remaining heat of the circuit board around the thermal paste 7. The heat pump 13 transfers the heat through the heat delivery pipe 16, and the heat delivery pipe 16 delivers the heat to the inside of the heat sink 11. The heat delivery pipe 16 is located above the heat sink fins 12, which facilitates the further dissipation of heat inside the heat sink 11.

[0033] The heat pipe 16 is located above the heat dissipation fins 12, and heat exchange grooves 17 are formed on the outer surface of the heat sink 11. The heat pipe 16 delivers heat into the heat sink 11 and is located above the heat dissipation fins 12. The heat is dissipated on the heat dissipation fins 12, and the heat exchange grooves 17 on the outer surface of the heat sink 11 facilitate the exchange of heat between the inside of the heat sink 11 and the outside air.

[0034] An extension frame 18 is fixedly connected to the outer surface of the water recycling tank 1, and a top plate 19 is fixedly connected to the surface of the extension frame 18.

[0035] An auxiliary fan 20 is fixedly installed on the lower surface of the top plate 19 by bolts. The surface of the top plate 19 has an air hole 21 for the auxiliary fan 20 to take in air. The auxiliary fan 20 takes in air through the air hole 21 on the top plate 19 and then blows the air towards the heat sink 11 and the circuit board to accelerate the airflow and promote heat dissipation.

[0036] The implementation principle of the energy dissipation mechanism for an aluminum-based circuit board in this embodiment is as follows: First, the aluminum-based circuit board is placed on the surface of the thermal paste 7. Then, the submersible pump 2 is started. The submersible pump 2 draws water from the bottom of the recovery water tank 1. The water is sent to the serpentine condenser tube 5 through the liquid delivery pipe 3 and the connecting pipe 4. The liquid flowing inside the serpentine condenser tube 5 begins to absorb the heat from the thermal paste 7, thereby dissipating heat from the circuit board. Afterwards, the recovery pipe 6 returns the water from the serpentine condenser tube 5 to the recovery water tank 1. The remaining heat after the thermal paste 7 absorbs the heat from the circuit board is absorbed by the heat absorption pump 13. The plate 14 contacts the surface of the circuit board. The heat pump 13 uses suction to remove the remaining heat. The heat pump 13 transfers the heat to the inside of the heat sink 11 through the heat delivery pipe 16. The heat dissipation fins 12 inside the heat sink 11 perform secondary cooling of the heat. At the same time, the heat exchange grooves 17 on the outer surface of the heat sink 11 facilitate the exchange of heat inside the heat sink 11 with the outside air. The auxiliary fan 20 is started. The auxiliary fan 20 draws in air through the air holes 21 on the top plate 19 and then blows the air to the heat sink 11 and the area around the circuit board, accelerating the airflow and further promoting the dissipation of heat.

[0037] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. An energy dissipation mechanism for an aluminum-based circuit board, characterized in that, The system includes a water recovery tank (1), a submersible pump (2) is fixedly connected to the inner bottom wall of the water recovery tank (1), a liquid delivery pipe (3) is fixedly connected to the output end of the submersible pump (2), a connecting pipe (4) is fixedly connected to the top end of the liquid delivery pipe (3), a serpentine condenser pipe (5) is fixedly connected to the top end of the connecting pipe (4), a recovery pipe (6) is fixedly connected to the surface of the serpentine condenser pipe (5), the recovery pipe (6) is located inside the water recovery tank (1), a heat dissipation grease (7) is provided on the upper surface of the serpentine condenser pipe (5), a heat dissipation box (11) is fixedly connected to the outer surface of the water recovery tank (1), and heat dissipation fins (12) are provided inside the heat dissipation box (11).

2. The energy dissipation mechanism for an aluminum-based circuit board as described in claim 1, characterized in that: The upper surface of the water recovery tank (1) is fixedly connected to several support columns (8), and the top of the support columns (8) is fixedly connected to an installation frame (9). The outer surface of the serpentine condenser tube (5) is fitted with a pipe rack (10), and the pipe rack (10) is fixedly connected to the inner wall of the installation frame (9).

3. The energy dissipation mechanism for an aluminum-based circuit board as described in claim 1, characterized in that: A heat absorption pump (13) is fixedly installed on the upper surface of the heat sink (11) by bolts. A suction cup (14) is fixedly connected to the input end of the heat absorption pump (13), and a bracket (15) is fixedly connected to the outer surface of the suction cup (14).

4. The energy dissipation mechanism for an aluminum-based circuit board as described in claim 3, characterized in that: The suction cup (14) is located on one side of the heat dissipation paste (7), and the output end of the heat pump (13) is fixedly connected to the heat delivery pipe (16), the bottom end of the heat delivery pipe (16) is located inside the heat dissipation box (11).

5. The energy dissipation mechanism for an aluminum-based circuit board as described in claim 4, characterized in that: The heat supply pipe (16) is located above the heat dissipation fins (12), and the outer surface of the heat dissipation box (11) is provided with heat exchange grooves (17).

6. The energy dissipation mechanism for an aluminum-based circuit board as described in claim 1, characterized in that: An extension frame (18) is fixedly connected to the outer surface of the recycling tank (1), and a top plate (19) is fixedly connected to the surface of the extension frame (18).

7. The energy dissipation mechanism for an aluminum-based circuit board as described in claim 6, characterized in that: An auxiliary fan (20) is fixedly installed on the lower surface of the top plate (19) by bolts, and an air hole (21) is opened on the surface of the top plate (19) for the auxiliary fan (20) to enter air.

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