Data center chip-level jet type liquid cooling heat dissipation device

Abstract

The utility model discloses a data center chip-level jet type liquid cooling heat dissipation device which comprises a heat exchange unit II, a liquid storage tank, an infusion pump, a heat exchange unit I, a liquid filter and a membrane contactor which are sequentially connected through a pipeline. The system further comprises a plurality of groups of chip-level jet type liquid cooling heat dissipation units arranged in the data center cabinet, and each group of chip-level jet type liquid cooling heat dissipation units is respectively connected with the membrane contactor and the heat exchange unit II through pipelines. A plurality of insulating supporting platforms are arranged on a bottom plate in the data center cabinet, a server is placed on each insulating supporting platform, a group of chip-level jet type liquid cooling heat dissipation units are arranged above each server, a liquid outlet I and a liquid outlet II are formed in the bottom plate in the data center cabinet, and the liquid outlet I and the liquid outlet II are communicated with the liquid outlet I and the liquid outlet II. And the liquid outlet I and the liquid outlet II are connected with the heat exchange unit II through pipelines. Compared with a traditional air cooling system and a liquid cooling system, the device is lower in energy consumption under the same heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of multiphase flow cooling technology, and particularly relates to a data center chip-level jet type liquid cooling heat dissipation device. BACKGROUND

[0002] With the rapid development of computing-intensive applications such as artificial intelligence, the Internet of Things, AR / VR, etc., AIGC triggers the demand for computing power, intelligent computing power enters the fast lane, and the increasing computing demand makes data centers gradually develop towards "high performance, high density and high energy consumption". The heat flux density of electronic equipment shows an increasingly large trend with the continuous improvement of the miniaturization and high performance demand of the equipment itself. The low heat dissipation capacity makes it difficult to apply air cooling technology to the heat dissipation of future high heat flux density electronic equipment.

[0003] The current research focus of electronic equipment heat dissipation technology is liquid cooling technology, mainly due to the advantages of strong fluidity and high heat transfer coefficient of liquid. The cold plate type liquid cooling transfers heat through indirect contact between the cold plate and the heating element, and can only dissipate heat from the heating element in contact with the cold plate, the heat dissipation range is limited, and the heat dissipation is uneven, and the heat dissipation effect of some elements not in contact with the cold plate is poor. The design and installation of the immersion type liquid cooling system are complex, and great adjustments need to be made to the structure and layout of the computer room, including sealing treatment, cooling liquid storage and installation of the circulation system, etc., and the construction cost is high. UTILITARIAN CONTENT

[0004] The utility model aims at providing data center chip-level jet type liquid cooling heat dissipation device, compared with traditional air cooling system, liquid cooling system can be lower in energy consumption under same heat dissipation effect, and the cooling mode of the device is close to server, effectively solve the problem of high heat flux density and high heat dissipation power consumption of electronic equipment.

[0005] The utility model adopts the technical scheme, data center chip-level jet type liquid cooling heat dissipation device, including heat exchange unit II, liquid storage tank, liquid pump, heat exchange unit I, liquid filter and membrane contactor that are sequentially connected through pipeline, still including the several groups of chip-level jet type liquid cooling heat dissipation unit that are arranged in data center rack, and each chip-level jet type liquid cooling heat dissipation unit is connected with membrane contactor and heat exchange unit II respectively through pipeline;

[0006] The bottom plate in data center rack is provided with several insulating support platforms, each insulating support platform is placed with server, each server top is provided with a group of chip-level jet type liquid cooling heat dissipation unit, and the bottom plate in data center rack is provided with liquid outlet I and liquid outlet II, and liquid outlet I and liquid outlet II are connected with heat exchange unit II through pipeline.

[0007] The utility model has the characteristics that:

[0008] The heat exchange unit II comprises a heat exchanger II and a constant temperature water bath box II which are connected with each other; the liquid outlet I is connected with a pipeline G4, the liquid outlet II is connected with a pipeline G5, the pipeline G4 and the pipeline G5 are communicated with a pipeline G6, the pipeline G6 is further connected with a hot end liquid inlet of the heat exchanger II, and a hot end liquid outlet of the heat exchanger II is connected with a liquid storage tank through a pipeline G7; a cold end liquid inlet and a cold end liquid outlet of the heat exchanger II are connected with the constant temperature water bath box II through pipelines respectively.

[0009] A plurality of groups of chip-level jet liquid cooling heat dissipation units are connected with the constant temperature water bath box II through the pipeline G9 and the pipeline G10.

[0010] The chip-level jet liquid cooling heat dissipation unit comprises a condenser coil and a pressure cyclone nozzle which are arranged above the server.

[0011] The cooling water inlet pipeline of the condenser coil is connected with the pipeline G10, the cooling water outlet pipeline of the condenser coil is connected with the pipeline G9, and the pressure cyclone nozzle is connected with the pipeline G3 through a pipeline.

[0012] The heat exchange unit I comprises a heat exchanger I and a constant temperature water bath box I which are connected with each other; a hot end liquid inlet of the heat exchanger I is connected with a liquid delivery pump through a pipeline G1, and a hot end liquid outlet of the heat exchanger I is connected with a liquid filter through a pipeline G2.

[0013] A cold end liquid inlet and a cold end liquid outlet of the heat exchanger I are connected with the constant temperature water bath box I through pipelines respectively.

[0014] The liquid storage tank is further communicated with the pipeline G1 through a pipeline G8, and a valve I is arranged on the pipeline G8.

[0015] A valve II is arranged on the pipeline G2.

[0016] A turbine flow meter and a valve III are arranged on the pipeline G3.

[0017] A vacuum pump and a pipeline G11 are further arranged, one end of the pipeline G11 is connected with the vacuum pump, the other end of the pipeline G11 is arranged in the data center cabinet through a cabinet cover plate, and a valve IV is arranged on the pipeline G11.

[0018] The insulation support platform is a square ceramic insulation support platform, and the liquid delivery pump is a magnetic coupling gear pump.

[0019] The membrane contactor comprises a shell, a hollow fiber membrane assembly is arranged in the shell, the hollow fiber membrane assembly comprises a plurality of hollow fiber membrane bundles and two tube plates, and the two tube plates are respectively used for fixing two ends of the plurality of hollow fiber membrane bundles.

[0020] The first end of each hollow fiber membrane bundle is sleeved with a liquid inlet branch pipe, each liquid inlet branch pipe also communicates with the pipeline G2, the second end of each hollow fiber membrane bundle is sleeved with a liquid outlet branch pipe, and each liquid outlet branch pipe also communicates with the pipeline G3;

[0021] The degassing port is connected with a gas pump through a pipeline.

[0022] The utility model discloses a beneficial effect is:

[0023] (1) the utility model discloses data center chip level jet type liquid cooling heat sink, compared with traditional air cooling system, liquid cooling system can be lower in energy consumption under the same heat dissipation effect, the device is close to the server, effectively solve the electronic equipment such as heat flux density, the problem of high heat dissipation power consumption.

[0024] (2) the utility model discloses data center chip level jet type liquid cooling heat sink, utilize the nozzle in the cabinet and spray cooling take away the server surface temperature, through the impact of several high-speed fine liquid drops on the server surface, in the instant of contacting high temperature server, cooling liquid gives full play to the heat dissipation effect of working medium evaporation cooling, wherein contains multiple heat exchange modes, mainly the evaporation of cooling liquid, also includes other heat transfer characteristics, for example, the convection heat exchange between the upper wall surface of the server and the thin liquid film, gas-liquid phase interface evaporation cooling heat exchange, splashing liquid drop takes away heat, server wall surface radiation and boiling heat exchange etc.

[0025] (3) the utility model discloses device through pipeline connection's liquid storage tank, liquid delivery pump, heat exchange unit I, liquid filter, membrane contactor, flow meter and several groups of chip level jet type liquid cooling heat sink unit, cabinet and heat exchange unit II jointly form cooling liquid circulation loop, can according to the different data center cabinet load demand dynamic adjustment cooling liquid flow, to adapt to the change of data center, improve the flexibility and response capability of system.

[0026] (4) spray type liquid cooling can be overall covered spray to the whole heating area, and the heat dissipation is more uniform, and need not make too big change to the facility of machine room, can provide good cooling performance. The utility model discloses data center chip level jet type liquid cooling heat sink utilizes the nozzle and atomizes liquid working medium into small liquid drop, sprays to the heat exchange surface and forms a continuous cooling film, along with liquid film flow or small diameter liquid drop rapid evaporation heat absorption and take away heat, thereby effectively reducing the server surface temperature, and the spray itself brings local intense convection heat exchange also strengthens the capacity of taking away server heat. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is the system schematic diagram of the utility model discloses data center chip level jet type liquid cooling heat sink device;

[0028] Figure 2The utility model discloses hollow fiber membrane bundle's structural schematic diagram in device,

[0029] Figure 3 The utility model discloses pressure rotational flow nozzle sprays the spray cooling state schematic diagram of state in device.

[0030] In the drawing, 1. liquid storage tank, 2. infusion pump, 3. valve I, 4. heat exchanger I, 5. constant temperature water bath box I, 6. valve II, 7. liquid filter, 8. membrane contactor, 9. turbine flowmeter, 10. valve III, 11. data center rack, 12. rack cover plate, 13. condensing coil, 14. pressure rotational flow nozzle, 15. server, 16. insulating support platform, 17. liquid outlet I, 18. liquid outlet II, 19. valve IV, 20. vacuum pump, 21. heat exchanger II, 22. constant temperature water bath box II, 23. bubble, 24. liquid film, 25. liquid drop, 26. hollow fiber membrane assembly, 27. hollow fiber membrane bundle, 28. hollow fiber membrane silk, 29. shell, 30. tube plate, 31. liquid inlet branch pipe, 32. liquid outlet branch pipe, 33. degassing port, 34. air pump. DETAILED DESCRIPTION

[0031] The utility model will be explained in detail below combining with the drawings and specific embodiment.

[0032] The utility model provides data center chip level jet type liquid cooling heat dissipation device, as Figures 1-3 As shown, comprising the heat exchange unit II, liquid storage tank 1, infusion pump 2, heat exchange unit I, liquid filter 7 and membrane contactor 8 that are connected in proper order through pipeline, still include the chip level jet type liquid cooling heat dissipation unit of setting in data center rack 11, and each chip level jet type liquid cooling heat dissipation unit is connected with membrane contactor 8 and heat exchange unit II respectively through pipeline,

[0033] The bottom plate in data center rack 11 is provided with several insulating support platforms 16, and each insulating support platform 16 is placed with server 15, and each server 15 is provided with a group of chip level jet type liquid cooling heat dissipation unit, and the bottom plate in data center rack 11 is provided with liquid outlet I 17 and liquid outlet II 18, and liquid outlet I 17 and liquid outlet II 18 are connected with heat exchange unit II through pipeline.

[0034] Heat exchange unit II includes heat exchanger II 21 and constant temperature water bath box II 22 that are connected with each other, and pipeline G4 is connected to liquid outlet I 17, and pipeline G5 is connected to liquid outlet II 18, and pipeline G4 and pipeline G5 are communicated with pipeline G6, and pipeline G6 is also connected with the hot end liquid inlet of heat exchanger II 21, and the hot end liquid outlet of heat exchanger II 21 is connected with liquid storage tank 1 through pipeline G7, and the cold end liquid inlet and the cold end liquid outlet of heat exchanger II 21 are connected with constant temperature water bath box II 22 through pipeline respectively, and

[0035] Several groups of chip-level jet liquid cooling heat dissipation units are connected with the constant-temperature water bath box II 22 through the pipeline G9 and the pipeline G10.

[0036] The chip-level jet liquid cooling heat dissipation unit includes the condenser coil 13 and the pressure rotational flow nozzle 14 arranged above the server 15.

[0037] The cooling water inlet of the condenser coil 13 is connected with the pipeline G10 through the pipeline, and the cooling water outlet pipeline of the condenser coil 13 is connected with the pipeline G9.

[0038] The pressure rotational flow nozzle 14 is connected with the pipeline G3 through the pipeline.

[0039] The heat exchange unit I includes the heat exchanger I 4 and the constant-temperature water bath box I 5 connected with each other; the hot end liquid inlet of the heat exchanger I 4 is connected with the infusion pump 2 through the pipeline G1, and the hot end liquid outlet of the heat exchanger I 4 is connected with the liquid filter 7 through the pipeline G2.

[0040] The cold end liquid inlet and the cold end liquid outlet of the heat exchanger I 4 are respectively connected with the constant-temperature water bath box I 5 through the pipeline.

[0041] The liquid storage tank 1 is also communicated with the pipeline G1 through the pipeline G8, and the valve I 3 is arranged on the pipeline G8.

[0042] The valve II 6 is arranged on the pipeline G2.

[0043] The turbine flow meter 9 and the valve III 10 are arranged on the pipeline G3.

[0044] The vacuum pump 22 and the pipeline G11 are further included, one end of the pipeline G11 is connected with the vacuum pump 20, the other end of the pipeline G11 is arranged in the data center cabinet 11 through the cabinet cover plate 12; the valve IV 19 is arranged on the pipeline G11. The vacuum pump 20 functions to control the negative pressure of the cabinet environment, and air in the cabinet 11 is extracted to the external environment, the vacuum degree can be adjusted through different gears, and the vacuum degree in the cabinet 11 is generally controlled at-0.1 bar.

[0045] The insulation support platform 16 is a square ceramic insulation support platform, and the infusion pump 2 is a magnetic coupling gear pump.

[0046] As shown in Figure 1 , Figure 3 The membrane contactor 8 includes the shell 29, the hollow fiber membrane assembly 26 is arranged inside the shell 29, the hollow fiber membrane assembly 26 includes a plurality of hollow fiber membrane bundles 27 and two tube plates 30; the two tube plates 30 are respectively used for fixing two ends of the plurality of hollow fiber membrane bundles 27.

[0047] The first end of each hollow fiber membrane bundle 27 is sleeved with a liquid inlet branch pipe 31, each liquid inlet branch pipe 31 is also communicated with the pipeline G2, the second end of each hollow fiber membrane bundle 27 is sleeved with a liquid outlet branch pipe 32, each liquid outlet branch pipe 32 is also communicated with the pipeline G3;

[0048] A degassing port 33 is arranged on the top wall of the shell 29 between the two tube plates 30, and the degassing port 33 is connected with a gas pump 34 through a pipeline.

[0049] The hollow fiber membrane bundle 27 is composed of a plurality of small hollow fiber membrane filaments 28, the gap between adjacent hollow fiber membrane bundles 27 is sealed by the two end corresponding tube plates 30, the two end hollow fiber membrane filaments 28 are slightly longer than the distance between the two tube plates 30, and the outer diameter of the hollow fiber membrane filament 28 is usually 500-600um, and the inner diameter is 200-300um.

[0050] In the cooling liquid circulation part of the device, a plurality of condensing coils 13, heat exchange unit II, liquid storage tank 1, liquid pump 2, heat exchange unit I, liquid filter 7, membrane contactor 8, turbine flow meter 9 and a plurality of pressure cyclone nozzles 14 are sequentially connected, and the cooling liquid flows out from the liquid outlet I 17 and the liquid outlet II 18, respectively passes through the pipeline G4 and the pipeline G5, sequentially passes through the pipeline G6, the pipeline G7, the pipeline G1, the pipeline G2 and the pipeline G3, and completes the cooling liquid circulation.

[0051] The cooling liquid condensing part of the device comprises heat exchanger II 21, constant temperature water bath box II 22, pipeline G9, pipeline G10 and a plurality of condensing coils 13. The constant temperature water bath box II 22 provides cold water for the condensing coils 13 in the cabinet 11 and the heat exchanger II 21 for condensing the cooling liquid.

[0052] As shown in the figure, Figure 2 The cooling liquid will pass through the pressure cyclone nozzle 14 into the server cabinet 11, the generated liquid droplets 25 impact on the hot surface of the server 15, form the bubbles 23 and the liquid film 24, and the process takes away the heat of the server 15 through the liquid droplet impact, the liquid film convection, the evaporation and the boiling.

[0053] The working process of the device of the utility model is as follows:

[0054] First, open the valve IV 19, start the vacuum pump 20, extract the server cabinet air, ensure a certain negative pressure environment, generally control the vacuum degree is -0.1 bar. Then close the valve IV 19 and vacuum pump 20, open the infusion pump 2, valve II 6, valve III 10, start the constant temperature water bath box I 5 and constant temperature water bath box II 22, the coolant is transported from the liquid tank 1 to the pipeline G1, the coolant temperature (generally 40-45 DEG C) is controlled by the heat exchanger I 4 connected to the constant temperature water bath box I 5, the cold water provided by the constant temperature water bath box I 5 exchanges heat with the coolant in the pipeline G1 in the heat exchanger I 4, the coolant temperature is cooled, and then passes through the pipeline G2, the pipeline G2 is provided with the valve II 6 and the liquid filter I 7, which is used to filter particles, impurities and the like in the liquid. The coolant then passes through the membrane contactor 8, and under the action of the air pump 34, the gas in the coolant will continuously overflow from the membrane structure hole of the hollow fiber membrane 28, and the coolant after removing the air flows to the pipeline G3 through the liquid outlet branch pipe 32. The pipeline G8 is a bypass pipe. If the turbine flow meter 9 on the pipeline G3 shows that the flow of the coolant in the pipeline is too large, the coolant will form a thick liquid film or a large amount of liquid droplets on the surface of the server 15 after being sprayed. This may cause uneven distribution of the coolant, and the coolant cannot be fully evaporated in time, which affects the overall cooling efficiency. At this time, the valve I 3 can be opened to return to the liquid tank 1 through the bypass circuit G8 to adjust the flow. If the turbine flow meter 9 shows that the flow of the coolant in the pipeline is too small, the coolant may be heated and evaporated after being sprayed to reach the surface of the server 15, so that the entire surface cannot be covered, thereby causing local overheating and insufficient cooling. At this time, the bypass circuit is not opened, that is, the valve I 3 is closed, and the frequency of the infusion pump 2 is adjusted to increase the flow of the coolant.

[0055] Then, the coolant passes through the pressure cyclone nozzle 14 into each chip-level jet liquid cooling heat dissipation unit in the data center cabinet 11, and the fine droplets 25 generated by the pressure cyclone nozzle 14 impact on the hot surface of the server 15. The steam bubbles 23 formed by the impact of the droplets float to the condensation coil 13 below the cabinet cover plate 12, and the constant temperature water bath box II 22 provides cold water to the condensation coil 13 through the pipeline G9, so that the steam generated in the two-phase state is condensed. The used cold water returns to the constant temperature water bath box II 22 through the pipeline G10.

[0056] And the condensed coolant or the coolant that has not been fully evaporated flows out through the bottom liquid outlet I 117 and the liquid outlet II 118. The condensed liquid passes through the pipeline G4, the pipeline G5 and the pipeline G6 to reach the heat exchanger II 21, completing the cooling liquid condensation part. The constant temperature water bath box II 22 simultaneously provides cold water for the heat exchanger II 21, and the cooled coolant returns to the liquid tank 1 through the pipeline G7.

[0057] The utility model discloses a device uses the standard rack type server architecture, and the whole sealed structure basically keeps traditional form, and the traditional server is reformed for fanless design based on it, and the corresponding spraying device is deployed, and the cooling liquid enters the cabinet by the nozzle, when the cooling liquid sprays to the server top, the high temperature makes the cooling liquid evaporate rapidly, and the steam generated is recycled by the condensing coil under the cabinet cover plate, and the condensed cooling liquid flows out through the cooling liquid outlet at the bottom of the cabinet.

[0058] The utility model discloses a device through constant temperature water bath box II provides cold water for the condensing coil in the cabinet and the heat exchanger II of cooling condensate.

[0059] The utility model discloses a device in cooling liquid circuit part utilizes the magnetic coupling gear pump to transport the cooling liquid in the liquid storage tank, and the rotation speed of pump is adjusted to set the flow roughly.

[0060] The utility model discloses a device in heat exchanger II with constant temperature water bath box I can control the cooling liquid temperature. The utility model discloses a device in pipeline G2 supplements the degassing method of pipeline air, namely, the membrane contactor is set after the liquid filter, and is used for blocking the air in the pipeline. The minimum unit of membrane contactor is many small hollow fiber membrane filaments, and since the multilayer membrane structure wall of hollow fiber membrane filament has small holes, water molecules cannot pass through, but gas molecules can pass through. When working, the cooling liquid passes through the hollow fiber membrane filament, and the outside of the membrane bundle is extracted under the air pump, and the gas in the cooling liquid continuously overflows to the outside through the small holes of the membrane filament, so that the purpose of removing the gas in the cooling liquid is achieved.

[0061] The utility model discloses a device in liquid filter uses PP cotton filter core filter, and is used for ensuring the fluid cleanliness. At the same time, silicon rubber and other fluorinated materials should be avoided in the facility as far as possible to prevent the contamination from leaching into the fluid.

[0062] The utility model discloses a device uses the nozzle below the server cabinet cover plate to spray cooling and take away the chip surface temperature, uses the condensing coil below the cover plate to recycle the steam generated under two-phase state, returns to the liquid storage tank through the coolant backflow part, and forms the loop circulation through liquid pump, filter and the like in proper order, and the coolant flow is adjusted through the flowmeter reading. The server cabinet is connected with a vacuum pump, and the air in it is extracted, and is used for guaranteeing certain negative pressure environment (for example, -0.1bar), and the negative pressure environment is favorable for enhancing the evaporation of the cooling liquid, thereby improving the cooling efficiency.

[0063] The device cooling mode directly sprays the cooling liquid to the server surface, is closer to the chip side, utilizes the cooling effect of deionized water, fluorinated liquid and other coolants, and simultaneously effectively recycles the steam generated under two-phase state, and forms a circulating loop.

[0064] Example 1

[0065] A data center chip-level jet liquid cooling heat dissipation device, as shown in the figure, comprises a heat exchange unit II, a liquid storage tank 1, a liquid pump 2, a heat exchange unit I, a liquid filter 7 and a membrane contactor 8 connected in sequence through pipelines; and further comprises a plurality of groups of chip-level jet liquid cooling heat dissipation units arranged in a data center cabinet 11, each group of chip-level jet liquid cooling heat dissipation units being connected with the membrane contactor 8 and the heat exchange unit II through pipelines respectively. Figures 1-3

[0066] A plurality of insulating support platforms 16 are arranged on the bottom plate in the data center cabinet 11, each insulating support platform 16 having a server 15 placed thereon, and each server 15 having a group of chip-level jet liquid cooling heat dissipation units arranged above it. The bottom plate in the data center cabinet 11 is provided with a liquid outlet I 17 and a liquid outlet II 18, both of which are connected with the heat exchange unit II through pipelines.

[0067] Embodiment 2

[0068] A data center chip-level jet liquid cooling heat dissipation device, as shown in the figure, comprises a heat exchange unit II, a liquid storage tank 1, a liquid pump 2, a heat exchange unit I, a liquid filter 7 and a membrane contactor 8 connected in sequence through pipelines; and further comprises a plurality of groups of chip-level jet liquid cooling heat dissipation units arranged in a data center cabinet 11, each group of chip-level jet liquid cooling heat dissipation units being connected with the membrane contactor 8 and the heat exchange unit II through pipelines respectively. Figures 1-3

[0069] A plurality of insulating support platforms 16 are arranged on the bottom plate in the data center cabinet 11, each insulating support platform 16 having a server 15 placed thereon, and each server 15 having a group of chip-level jet liquid cooling heat dissipation units arranged above it. The bottom plate in the data center cabinet 11 is provided with a liquid outlet I 17 and a liquid outlet II 18, both of which are connected with the heat exchange unit II through pipelines.

[0070] The heat exchange unit II comprises a heat exchanger II 21 and a constant-temperature water bath box II 22 connected with each other. The liquid outlet I 17 is connected with a pipeline G4, and the liquid outlet II 18 is connected with a pipeline G5. The pipeline G4 and the pipeline G5 are communicated with a pipeline G6, and the pipeline G6 is further connected with a hot end liquid inlet of the heat exchanger II 21. A hot end liquid outlet of the heat exchanger II 21 is connected with the liquid storage tank 1 through a pipeline G7. A cold end liquid inlet and a cold end liquid outlet of the heat exchanger II 21 are connected with the constant-temperature water bath box II 22 through pipelines respectively.

[0071] The plurality of groups of chip-level jet liquid cooling heat dissipation units are connected with the constant-temperature water bath box II 22 through a pipeline G9 and a pipeline G10.

[0072] Embodiment 3 ​​

[0073] The data center chip-level jet liquid cooling heat dissipation device, as shown in Figures 1-3 includes heat exchange unit II, liquid storage tank 1, liquid pump 2, heat exchange unit I, liquid filter 7 and membrane contactor 8 connected in sequence through pipelines; further includes several groups of chip-level jet liquid cooling heat dissipation units arranged in the data center cabinet 11, each group of chip-level jet liquid cooling heat dissipation unit is connected with the membrane contactor 8 and the heat exchange unit II through pipelines respectively;

[0074] The bottom plate in the data center cabinet 11 is provided with several insulating support platforms 16, each insulating support platform 16 is placed with a server 15, and each server 15 is provided with a group of chip-level jet liquid cooling heat dissipation units; the bottom plate in the data center cabinet 11 is provided with liquid outlet I 17 and liquid outlet II 18, and the liquid outlet I 17 and the liquid outlet II 18 are connected with the heat exchange unit II through pipelines.

[0075] The heat exchange unit II includes heat exchanger II 21 and constant temperature water bath box II 22 connected with each other; the liquid outlet I 17 is connected with pipeline G4, and the liquid outlet II 18 is connected with pipeline G5; the pipeline G4 and the pipeline G5 are communicated with pipeline G6, the pipeline G6 is further connected with the hot end liquid inlet of the heat exchanger II 21, and the hot end liquid outlet of the heat exchanger II 21 is connected with the liquid storage tank 1 through pipeline G7; the cold end liquid inlet and the cold end liquid outlet of the heat exchanger II 21 are connected with the constant temperature water bath box II 22 through pipelines respectively;

[0076] The several groups of chip-level jet liquid cooling heat dissipation units are connected with the constant temperature water bath box II 22 through pipeline G9 and pipeline G10.

[0077] The chip-level jet liquid cooling heat dissipation unit includes condensing coil 13 arranged above the server 15 and pressure rotational flow nozzle 14;

[0078] The cooling water inlet of the condensing coil 13 is connected with the pipeline G10 through the pipeline, and the cooling water outlet pipeline of the condensing coil 13 is connected with the pipeline G9;

[0079] The pressure rotational flow nozzle 14 is connected with the pipeline G3 through the pipeline.

[0080] Embodiment 4

[0081] The data center chip-level jet liquid cooling heat dissipation device, as shown in Figures 1-3 includes heat exchange unit II, liquid storage tank 1, liquid pump 2, heat exchange unit I, liquid filter 7 and membrane contactor 8 connected in sequence through pipelines; further includes several groups of chip-level jet liquid cooling heat dissipation units arranged in the data center cabinet 11, each group of chip-level jet liquid cooling heat dissipation unit is connected with the membrane contactor 8 and the heat exchange unit II through pipelines respectively;

[0082] Several insulated support platforms 16 are installed on the base plate inside the data center rack 11. Each insulated support platform 16 holds a server 15. Each server 15 is equipped with a set of chip-level jet liquid cooling heat dissipation units. The base plate inside the data center rack 11 is equipped with liquid outlet I 17 and liquid outlet II 18. Both liquid outlet I 17 and liquid outlet II 18 are connected to heat exchange unit II through pipes.

[0083] The heat exchange unit II includes a heat exchanger II21 and a constant temperature water bath II22 connected to each other; a pipe G4 is connected to the liquid outlet I17, and a pipe G5 is connected to the liquid outlet II18. Both pipes G4 and G5 are connected to pipe G6, which is also connected to the hot end inlet of the heat exchanger II21. The hot end outlet of the heat exchanger II21 is connected to the liquid storage tank 1 through pipe G7; the cold end inlet and cold end outlet of the heat exchanger II21 are respectively connected to the constant temperature water bath II22 through pipes.

[0084] Several sets of chip-level jet liquid cooling heat dissipation units are connected to the constant temperature water bath II22 through pipes G9 and G10.

[0085] The chip-level jet liquid cooling unit includes a condenser coil 13 and a pressure swirl nozzle 14 mounted above the server 15.

[0086] The cooling water inlet of the condenser coil 13 is connected to pipe G10 through a pipe, and the cooling water outlet pipe of the condenser coil 13 is connected to pipe G9.

[0087] The pressure swirl nozzle 14 is connected to pipe G3 via a pipe.

[0088] The heat exchange unit I includes a heat exchanger I4 and a constant temperature water bath I5 connected to each other; the hot end inlet of the heat exchanger I4 is connected to the infusion pump 2 through pipe G1, and the hot end outlet of the heat exchanger I4 is connected to the liquid filter 7 through pipe G2.

[0089] The cold end inlet and cold end outlet of heat exchanger I4 are connected to constant temperature water bath I5 via pipes.

[0090] Example 5

[0091] Data center chip-level jet liquid cooling system, such as Figures 1-3 As shown, it includes a heat exchange unit II, a liquid storage tank 1, a liquid pump 2, a heat exchange unit I, a liquid filter 7, and a membrane contactor 8 connected in sequence by pipes; it also includes several sets of chip-level jet liquid cooling heat dissipation units installed in the data center cabinet 11, each set of chip-level jet liquid cooling heat dissipation units being connected to the membrane contactor 8 and the heat exchange unit II by pipes respectively.

[0092] A plurality of insulating support platforms 16 are arranged on the bottom plate in the data center cabinet 11, and each of the insulating support platforms 16 is arranged with a server 15; a group of chip-level jet liquid cooling heat dissipation units are arranged above each of the servers 15; and a liquid outlet I 17 and a liquid outlet II 18 are arranged on the bottom plate in the data center cabinet 11, and the liquid outlet I 17 and the liquid outlet II 18 are connected with a heat exchange unit II through pipelines.

[0093] The heat exchange unit II comprises a heat exchanger II 21 and a constant-temperature water bath box II 22 which are connected with each other; the liquid outlet I 17 is connected with a pipeline G4, the liquid outlet II 18 is connected with a pipeline G5, the pipeline G4 and the pipeline G5 are communicated with a pipeline G6, the pipeline G6 is further connected with a hot end liquid inlet of the heat exchanger II 21, and a hot end liquid outlet of the heat exchanger II 21 is connected with the liquid storage tank 1 through a pipeline G7; a cold end liquid inlet and a cold end liquid outlet of the heat exchanger II 21 are connected with the constant-temperature water bath box II 22 through pipelines respectively;

[0094] The plurality of groups of chip-level jet liquid cooling heat dissipation units are connected with the constant-temperature water bath box II 22 through pipelines G9 and G10.

[0095] The chip-level jet liquid cooling heat dissipation unit comprises a condensing coil 13 and a pressure rotational flow nozzle 14 which are arranged above the server 15;

[0096] The cooling water inlet of the condensing coil 13 is connected with the pipeline G10 through a pipeline, and the cooling water outlet pipeline of the condensing coil 13 is connected with the pipeline G9;

[0097] The pressure rotational flow nozzle 14 is connected with the pipeline G3 through a pipeline.

[0098] The heat exchange unit I comprises a heat exchanger I 4 and a constant-temperature water bath box I 5 which are connected with each other; a hot end liquid inlet of the heat exchanger I 4 is connected with the liquid delivery pump 2 through a pipeline G1, and a hot end liquid outlet of the heat exchanger I 4 is connected with the liquid filter 7 through a pipeline G2;

[0099] A cold end liquid inlet and a cold end liquid outlet of the heat exchanger I 4 are connected with the constant-temperature water bath box I 5 through pipelines respectively.

[0100] The liquid storage tank 1 is further communicated with the pipeline G1 through a pipeline G8, and a valve I 3 is arranged on the pipeline G8.

[0101] A valve II 6 is arranged on the pipeline G2.

[0102] Embodiment 6

[0103] The data center chip-level jet liquid cooling heat dissipation device comprises a liquid storage tank 1, a liquid delivery pump 2, a liquid filter 7, a heat exchange unit I, a heat exchange unit II, a plurality of groups of chip-level jet liquid cooling heat dissipation units, and a plurality of servers 15; Figures 1-3As shown, it comprises heat exchange unit II, liquid storage tank 1, infusion pump 2, heat exchange unit I, liquid filter 7 and membrane contactor 8 connected in sequence through pipelines; it also comprises several groups of chip-level jet liquid cooling heat dissipation units arranged in the data center cabinet 11, each group of chip-level jet liquid cooling heat dissipation unit is connected with the membrane contactor 8 and the heat exchange unit II through pipelines respectively;

[0104] The bottom plate in the data center cabinet 11 is provided with several insulating support platforms 16, each insulating support platform 16 is placed with a server 15, the top of each server 15 is provided with a group of chip-level jet liquid cooling heat dissipation units, the bottom plate in the data center cabinet 11 is provided with liquid outlet I 17 and liquid outlet II 18, the liquid outlet I 17 and the liquid outlet II 18 are connected with the heat exchange unit II through pipelines.

[0105] The heat exchange unit II comprises heat exchanger II 21 and constant temperature water bath box II 22 connected with each other; the liquid outlet I 17 is connected with pipeline G4, the liquid outlet II 18 is connected with pipeline G5, the pipeline G4 and the pipeline G5 are communicated with the pipeline G6, the pipeline G6 is also connected with the hot end liquid inlet of the heat exchanger II 21, the hot end liquid outlet of the heat exchanger II 21 is connected with the liquid storage tank 1 through the pipeline G7; the cold end liquid inlet and the cold end liquid outlet of the heat exchanger II 21 are connected with the constant temperature water bath box II 22 through pipelines respectively;

[0106] The several groups of chip-level jet liquid cooling heat dissipation units are connected with the constant temperature water bath box II 22 through the pipeline G9 and the pipeline G10.

[0107] The chip-level jet liquid cooling heat dissipation unit comprises condensing coil 13 and pressure rotational flow nozzle 14 arranged above the server 15;

[0108] The cooling water inlet of the condensing coil 13 is connected with the pipeline G10 through the pipeline, the cooling water outlet pipeline of the condensing coil 13 is connected with the pipeline G9;

[0109] The pressure rotational flow nozzle 14 is connected with the pipeline G3 through the pipeline.

[0110] The heat exchange unit I comprises heat exchanger I 4 and constant temperature water bath box I 5 connected with each other; the hot end liquid inlet of the heat exchanger I 4 is connected with the infusion pump 2 through the pipeline G1, the hot end liquid outlet of the heat exchanger I 4 is connected with the liquid filter 7 through the pipeline G2;

[0111] The cold end liquid inlet and the cold end liquid outlet of the heat exchanger I 4 are connected with the constant temperature water bath box I 5 through pipelines respectively.

[0112] The liquid storage tank 1 is also communicated with the pipeline G1 through the pipeline G8, the pipeline G8 is provided with valve I 3.

[0113] The pipeline G2 is provided with valve II 6.

[0114] A turbine flowmeter 9 and a valve III 10 are provided on the conduit G3.

Claims

1. A data center chip-level jet impingement liquid cooling heat sink, characterized in that, It includes heat exchange unit II, liquid storage tank (1), infusion pump (2), heat exchange unit I, liquid filter (7) and membrane contactor (8) connected in sequence through pipes; it also includes a plurality of groups of chip-level jet liquid cooling heat dissipation units arranged in the data center cabinet (11), each group of chip-level jet liquid cooling heat dissipation unit is connected with the membrane contactor (8) and the heat exchange unit II through pipes respectively; A plurality of insulating support platforms (16) are arranged on the bottom plate in the data center cabinet (11), each insulating support platform (16) is arranged on the top of each server (15), a group of chip-level jet liquid cooling heat dissipation units are arranged above each server (15), a liquid outlet I (17) and a liquid outlet II (18) are arranged on the bottom plate in the data center cabinet (11), the liquid outlet I (17) and the liquid outlet II (18) are connected with the heat exchange unit II through pipes.

2. The datacenter chip-level jet impingement liquid cooling heat sink of claim 1, wherein, The heat exchange unit II includes heat exchanger II (21) and constant temperature water bath box II (22) connected with each other; the liquid outlet I (17) is connected with pipe G4, the liquid outlet II (18) is connected with pipe G5, the pipe G4 and the pipe G5 are communicated with pipe G6, the pipe G6 is also connected with the hot end liquid inlet of the heat exchanger II (21), the hot end liquid outlet of the heat exchanger II (21) is connected with the liquid storage tank (1) through pipe G7; the cold end liquid inlet and the cold end liquid outlet of the heat exchanger II (21) are connected with the constant temperature water bath box II (22) through pipes respectively; A plurality of groups of chip-level jet liquid cooling heat dissipation units are connected with the constant temperature water bath box II (22) through pipes G9 and G10.

3. The datacenter chip-level jet impingement liquid cooling heat sink of claim 2, wherein, The chip-level jet liquid cooling heat dissipation unit includes condensing coil (13) and pressure rotational flow nozzle (14) arranged above the server (15); The cooling water inlet pipe of the condensing coil (13) is connected with the pipe G10, the cooling water outlet pipe of the condensing coil (13) is connected with the pipe G9; The pressure rotational flow nozzle (14) is connected with the pipe G3 through pipes.

4. The datacenter chip-level jet impingement liquid cooling heat sink of claim 3, wherein, The heat exchange unit I includes heat exchanger I (4) and constant temperature water bath box I (5) connected with each other; the hot end liquid inlet of the heat exchanger I (4) is connected with the infusion pump (2) through pipe G1, the hot end liquid outlet of the heat exchanger I (4) is connected with the liquid filter (7) through pipe G2; The cold end liquid inlet and the cold end liquid outlet of the heat exchanger I (4) are connected with the constant temperature water bath box I (5) through pipes respectively.

5. The datacenter chip-level jet impingement liquid cooling heat sink of claim 4, wherein, The liquid storage tank (1) is also communicated with the pipe G1 through pipe G8, the valve I (3) is arranged on the pipe G8.

6. The datacenter chip-level jet impingement liquid cooling heat sink of claim 4, wherein, The valve II (6) is arranged on the pipe G2.

7. The datacenter chip-level jet impingement liquid cooling heat sink of claim 3, wherein, The turbine flow meter (9) and the valve III (10) are arranged on the pipe G3.

8. The datacenter chip-level jet impingement liquid cooling heat sink of claim 6, wherein, It also includes vacuum pump (20) and pipe G11, one end of the pipe G11 is connected with the vacuum pump (20), the other end of the pipe G11 is arranged in the data center cabinet (11) through the cabinet cover plate (12); the valve IV (19) is arranged on the pipe G11.

9. The datacenter chip-level jet impingement liquid cooling heat sink of claim 6, wherein, The insulating support platform (16) is a square ceramic insulating support platform, the infusion pump (2) is a magnetic coupling gear pump.

10. The datacenter chip-level jet impingement liquid cooling heat sink of claim 6, wherein, The membrane contactor (8) comprises a shell (29) provided with a hollow fiber membrane assembly (26) inside, the hollow fiber membrane assembly (26) comprises a plurality of hollow fiber membrane bundles (27) and two tube plates (30); the two tube plates (30) are respectively used for fixing two ends of the plurality of hollow fiber membrane bundles (27); The first end of each hollow fiber membrane bundle (27) is sleeved with a liquid inlet branch pipe (31), each liquid inlet branch pipe (31) is also communicated with the pipeline G2, the second end of each hollow fiber membrane bundle (27) is sleeved with a liquid outlet branch pipe (32), and each liquid outlet branch pipe (32) is also communicated with the pipeline G3; A degassing port (33) is arranged on the top wall of the shell (29) corresponding to the two tube plates (30), and the degassing port (33) is connected with an air pump (34) through a pipeline.

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