Heat dissipation structure of inverter and inverter
By adopting a structural design that combines a heat-conducting base plate with a heat sink in the inverter, and utilizing a fan to remove heat, while optimizing the ventilation openings and the integrated structure, the problem of low heat dissipation efficiency of the inverter is solved, achieving efficient heat dissipation and stable operation.
Patent Information
- Application Number
- CN202423316143.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-31
AI Technical Summary
How to provide a heat dissipation structure and inverter with reasonable structural design, high heat dissipation efficiency, and conducive to ensuring reliable and stable operation of the inverter.
The heat sink is combined with a heat-conducting base plate inside the housing. The heat sink is equipped with heat sink fins and a fan. The heat from the electrical components is conducted to the heat sink fins through the heat-conducting base plate. The fan blows air to remove the heat. The ventilation port design is optimized to improve heat dissipation efficiency. The connection rigidity is enhanced by an integrated structure and support plate to reduce noise.
This achieves efficient heat dissipation for the inverter, extends the lifespan of the capacitors, ensures reliable and stable operation of the inverter, and reduces noise.
Smart Images

Figure CN223714446U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to inverter technical field, especially a kind of heat dissipation structure and inverter of inverter. BACKGROUND
[0002] With the extensive application of electronic technology, the application of inverter is particularly important, and its various performance indicators also improve, so the requirement of its heat dissipation performance is higher and higher. Inverter is provided with electronic components inside, and a large amount of heat is generated by each electronic component during work, which greatly increases the heat during long-time operation. If not cooled in time, it is easy to cause damage to electronic components. The greater the power of inverter, the greater the heat, and how to efficiently cool the high-power inverter becomes a problem to be solved. SUMMARY
[0003] In view of the above technical problems of the prior art, the technical problem to be solved by the utility model is to provide a heat dissipation structure and inverter with reasonable structure design, high heat dissipation efficiency and favorable to ensure reliable and stable operation of inverter.
[0004] In order to solve the above technical problems, the utility model adopts the following technical scheme:
[0005] A kind of heat dissipation structure of inverter, including shell, the heat-conducting bottom plate for installing electrical components is provided in the shell, the back of the heat-conducting bottom plate is attached with radiator;The transverse or longitudinal side of the shell is equipped with vent, any the vent is provided with heat dissipation fan towards the radiator;The radiator includes the heat dissipation plate attached on the heat-conducting bottom plate, the heat dissipation plate is vertically provided with equidistantly arranged heat dissipation fin, and the heat dissipation air duct is formed between adjacent two heat dissipation fins, and the through direction of the heat dissipation air duct is towards the vent.
[0006] The above structure is adopted, the electrical components are installed on the heat-conducting bottom plate, the radiator is attached on the heat-conducting bottom plate, the heat generated during the working process of electrical components is conducted to the radiator by the heat-conducting bottom plate, and is evenly distributed to the heat dissipation fin of radiator, the airflow blown by heat dissipation fan flows through the heat dissipation air duct between heat dissipation fin, the heat on heat dissipation fin is taken away, and is blown out from the vent of the other end, so as to reduce the temperature in shell, realize the cooling of electrical components.
[0007] Further, the first mounting plate is provided on one side of the heat-conducting bottom plate towards any the vent, the capacitor is provided on the first mounting plate, the capacitor is equidistantly arranged in multiple along transverse and longitudinal directions, and the heat dissipation channel is formed between adjacent two capacitors.
[0008] In this way, the air flow blown by the heat dissipation fan passes through the heat dissipation channels between the capacitors, and the heat on the surface of the capacitors is taken away by the air flow, thereby achieving the cooling of the capacitors and prolonging the service life of the capacitors.
[0009] Further, the heat dissipation fan is installed on the air vent away from the capacitor.
[0010] Since the electrical components, especially the switching components, generate more heat, the heat dissipation fan is installed on the air vent away from the capacitor, so that the low-temperature air flow blown by the heat dissipation fan first cools the heat sink and then cools the capacitor, thereby achieving better heat dissipation effect.
[0011] Further, the two air vents are respectively arranged at the top and bottom of the shell; and the heat sink is located above the capacitor.
[0012] Further, the heat dissipation fan is a axial flow fan.
[0013] Further, a support plate is arranged at any of the air vents, the support plate is provided with mounting holes penetrating through the support plate, at least two mounting holes are arranged along the length direction of the support plate, and the axial flow fan is installed on the mounting holes.
[0014] Further, the two sides of the support plate in the width direction are bent upwards to form reinforcing plates, and the reinforcing plates close to the heat-conducting bottom plate are bent outwards to form first connecting plates, and the first connecting plates are connected to the upper end of the heat-conducting bottom plate by bolts.
[0015] In this way, the reinforcing plates are formed by bending, which can increase the overall rigidity of the support plate, avoid plate vibration during operation of the heat dissipation fan, and be beneficial to reduce noise.
[0016] Further, the two sides of the support plate in the length direction are bent downwards to form second connecting plates, the second connecting plates are provided with fixing holes penetrating through the second connecting plates, and the second connecting plates are connected to the side wall of the shell by bolts passing through the fixing holes.
[0017] In this way, the connection strength between the support plate and the shell can be increased.
[0018] Further, the heat dissipation plate and the heat-conducting bottom plate are an integral structure, one side of the heat dissipation plate away from the heat dissipation fins is provided with first threaded holes for connecting the shell and second threaded holes for installing electrical components, the first threaded holes are located on the two sides close to the air vent and are uniformly arranged along the edge; the first mounting plate is connected to the first threaded holes of the heat dissipation plate by bolts, the other end of the heat dissipation plate is connected to the second mounting plate through the first threaded holes, and the other end of the first mounting plate and the second mounting plate is connected to the shell.
[0019] In this way, integrating the heat sink and the heat-conducting base plate avoids the impact of a separate structure on heat transfer efficiency, allowing the heat from electrical components to be quickly dispersed by the heat sink, thereby improving heat dissipation efficiency. Furthermore, the first and second mounting plates not only allow the heat sink to be installed inside the housing, but also divide the enclosure into functional and heat dissipation zones, enabling the cooling fan to flow more efficiently over the heat sink, further enhancing heat dissipation efficiency.
[0020] An inverter, comprising the heat dissipation structure of the inverter as described above.
[0021] In summary, this utility model has the advantages of providing a structure with reasonable design, high heat dissipation efficiency, and the ability to ensure reliable and stable operation of the inverter. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the overall structure of this embodiment.
[0023] Figure 2 for Figure 1 A schematic diagram of the internal structure.
[0024] Figure 3 for Figure 1 A schematic diagram of the internal structure on the other side.
[0025] Figure 4 This is a schematic diagram of the support plate. Detailed Implementation
[0026] The present invention will be further described in detail below with reference to the embodiments.
[0027] In practical implementation: such as Figures 1-4 As shown, an inverter includes a housing 1. A thermally conductive base plate 4 for mounting electrical components is disposed within the housing 1. A heat sink 3 is attached to the back of the thermally conductive base plate 4. Ventilation openings 2 are provided on both sides of the housing 1, either horizontally or vertically. Each ventilation opening 2 has a cooling fan 5 facing the heat sink 3. The heat sink 3 includes a heat dissipation plate 31 mounted on the thermally conductive base plate 4. Equally spaced heat dissipation fins 32 are vertically arranged on the heat dissipation plate 31, and a heat dissipation channel is formed between adjacent heat dissipation fins 32, with the channel's direction of penetration towards the ventilation opening 2. A first mounting plate 7 is provided on the side of the thermally conductive base plate 4 facing either ventilation opening 2. A capacitor is disposed on the first mounting plate 7, and multiple capacitors are evenly distributed horizontally and vertically, with heat dissipation channels formed between adjacent capacitors.
[0028] In the embodiment, two ventilation openings 2 are arranged at the top and bottom of the shell 1 respectively; the heat sink 3 is located above the capacitor, and the cooling fan 5 is an axial flow fan. The heat sink plate 31 and the heat-conducting bottom plate 4 are in an integrated structure, the heat sink plate 31 has first threaded holes for connecting the shell and second threaded holes for mounting electrical elements on the side away from the cooling fins 32, the first threaded holes are arranged near the two sides of the ventilation opening 2 and are uniformly distributed along the edge; the first mounting plate 7 is connected to the first threaded holes of the heat sink plate 31 through bolts, the other end of the heat sink plate 31 is connected to the second mounting plate 8 through the first threaded holes, and the other end of the first mounting plate 7 and the second mounting plate 8 is connected to the shell 1. Integrating the heat sink plate and the heat-conducting bottom plate can avoid the influence of the split structure on the heat conduction efficiency, so that the heat of the electrical elements can be quickly dispersed by the cooling fins, thereby improving the heat dissipation efficiency. In addition, the first mounting plate and the second mounting plate can not only mount the heat sink plate in the shell, but also separate the cabinet into functional areas and cooling areas by the first mounting plate, the second mounting plate and the heat sink plate, so that the airflow of the cooling fan can flow through the cooling fins more efficiently, thereby improving the heat dissipation efficiency.
[0029] Among them, the support plate 6 is arranged at the ventilation opening 2 away from the capacitor, the support plate 6 has mounting holes 61 arranged through it, at least two of which are arranged at intervals along the length direction of the support plate 6, and the axial flow fan is mounted on the mounting hole 61. Because the electrical elements, especially the switching elements, generate more heat, arranging the cooling fan at the ventilation opening away from the capacitor can first cool the heat sink with the low-temperature airflow blown by the cooling fan, and then cool the capacitor, thereby achieving better heat dissipation effect.
[0030] The two sides of the support plate 6 in the width direction are bent upwards to form reinforcing plates 62, and the reinforcing plates 62 close to the heat-conducting bottom plate 4 are bent outwards to form first connecting plates 63, which are connected to the upper end of the heat-conducting bottom plate 4 by bolts. The two sides of the support plate 6 in the length direction are bent downwards to form second connecting plates 64, which have fixing holes arranged through them, and the second connecting plates 64 are connected to the side wall of the shell 1 by bolts passing through the fixing holes. By bending the reinforcing plates, the overall stiffness of the support plate can be increased, and the plate vibration during the operation of the cooling fan can be avoided, which is conducive to reducing noise.
[0031] The inverter of the embodiment, the electrical elements are installed on the heat-conducting bottom plate, i.e. the radiating plate of the radiator, the heat generated during the operation of the electrical elements will be directly and evenly distributed to the radiating fins through the radiating plate, the airflow blown in by the radiating fan flows through the radiating air duct between the radiating fins, takes away the heat on the radiating fins, and is blown out from the air vent at the other end, thereby reducing the temperature in the shell and realizing the cooling of the electrical elements.
[0032] The above merely describes the preferred embodiments of the present application, and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A heat dissipation structure of an inverter, characterized by comprising: The application relates to a heat dissipation structure of an inverter, which comprises a shell (1), a heat-conducting bottom plate (4) for mounting electrical elements is arranged in the shell (1), a heat radiator (3) is attached to the back of the heat-conducting bottom plate (4), ventilation openings (2) are arranged on the two sides of the shell (1) in the transverse or longitudinal direction, a heat dissipation fan (5) is arranged on any ventilation opening (2) and faces the heat radiator (3), the heat radiator (3) comprises a heat dissipation plate (31) which is attached to the heat-conducting bottom plate (4), a plurality of heat dissipation fins (32) are vertically arranged on the heat dissipation plate (31) at equal intervals, heat dissipation air ducts are formed between any two adjacent heat dissipation fins (32), and the through direction of the heat dissipation air ducts faces the ventilation opening (2).
2. The heat dissipating structure of an inverter according to claim 1, wherein A first mounting plate (7) is arranged on one side of the heat-conducting bottom plate (4) which faces any ventilation opening (2), capacitors are arranged on the first mounting plate (7), and a plurality of capacitors are arranged on the first mounting plate (7) at equal intervals in the transverse and longitudinal directions.
3. The heat dissipating structure of an inverter according to claim 2, wherein The heat dissipation fan (5) is arranged on the ventilation opening (2) which is far away from the capacitors.
4. The heat dissipating structure of an inverter according to claim 2, wherein The two ventilation openings (2) are arranged on the top and bottom of the shell (1) respectively, and the heat radiator (3) is arranged above the capacitors.
5. The heat dissipating structure of an inverter according to claim 2, wherein The heat dissipation fan (5) is an axial flow fan.
6. The heat dissipating structure of an inverter according to claim 5, wherein A support plate (6) is arranged at any ventilation opening (2), the support plate (6) is provided with mounting holes (61) which are arranged at equal intervals along the length direction of the support plate (6), and the axial flow fan is arranged on the mounting holes (61).
7. The heat dissipating structure of an inverter according to claim 6, wherein The two sides of the support plate (6) in the width direction are bent upwards to form reinforcing plates (62), the reinforcing plates (62) which are close to the heat-conducting bottom plate (4) are bent outwards to form first connecting plates (63), and the first connecting plates (63) are connected to the upper end of the heat-conducting bottom plate (4) through bolts.
8. The heat dissipating structure of an inverter according to claim 6, wherein The two sides of the support plate (6) in the length direction are bent downwards to form second connecting plates (64), the second connecting plates (64) are provided with fixing holes which are arranged at equal intervals, and the second connecting plates (64) are connected to the side wall of the shell (1) through bolts which pass through the fixing holes.
9. The heat dissipating structure of an inverter according to Claim 2, wherein The heat dissipation plate (31) and the heat-conducting bottom plate (4) are integrated, one side of the heat dissipation plate (31) which is away from the heat dissipation fins (32) is provided with first screw holes which are used for connecting the shell and second screw holes which are used for mounting electrical elements, the first screw holes are arranged at equal intervals on the two sides which are close to the ventilation openings (2) and along the edges, the first mounting plate (7) is connected to the first screw holes of the heat dissipation plate (31) through bolts, the other end of the heat dissipation plate (31) is connected to a second mounting plate through the first screw holes, and the other end of the first mounting plate (7) and the second mounting plate is connected to the shell (1).
10. An inverter, characterized by comprising: The application further relates to a heat dissipation structure of an inverter.