Wafer cleaning device

Abstract

The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device which comprises a base, a spraying assembly, a first rolling brush assembly, a second rolling brush assembly and a plurality of clamping assemblies. A wafer cleaning area is arranged above the base; each clamping assembly comprises a clamping roller, and the clamping rollers of the multiple clamping assemblies are arranged along the edge of the wafer cleaning area; the first rolling brush assembly comprises a first brush wheel, and the first brush wheel is connected to the base; the second rolling brush assembly comprises a second brush wheel, and the second brush wheel is connected to the base; the spraying assembly comprises a spray head, an energy converter and a swing arm, the swing arm is connected to the spray head and rotationally connected to the base, the energy converter is arranged on the spray head, and the swing arm rotates; the wafer cleaning device disclosed by the utility model has relatively comprehensive and powerful cleaning capability on particle impurities on the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field especially is related to a wafer cleaning device. BACKGROUND

[0002] At present, in the processing of cutting, processing, polishing and the like, various physical impurities will be attached to the surface of the wafer and touch various chemical substances, if the wafer is not cleaned, the accuracy and efficiency of subsequent process steps will be affected, therefore, cleaning the wafer is a crucial link in the semiconductor manufacturing process.

[0003] Generally, the wafer cleaning device clamps the wafer through multiple rollers and drives it to rotate, then brushes the two end faces of the wafer through the upper and lower roller brushes and sprays the cleaning liquid to the surface of the wafer through the nozzle to clean it, under the friction of the brush, the particles will be taken away with the rotation of the wafer. However, this device only cleans the wafer through the brush, which can only remove large particle impurities on the wafer, and it is difficult to remove strong adsorption impurities and small particle impurities, and the cleaning capacity is poor. SUMMARY

[0004] The utility model aims at providing a wafer cleaning device to solve the technical problem that the general wafer cleaning device is difficult to remove strong adsorption impurities and small particle impurities and has poor cleaning capacity.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a wafer cleaning device, which comprises a base, a spraying assembly, a first roller brush assembly, a second roller brush assembly and multiple clamping assemblies.

[0006] The upper side of the base is provided with a wafer cleaning area, and the wafer cleaning area is used for placing the wafer.

[0007] The clamping assembly comprises a clamping roller, the clamping rollers of multiple clamping assemblies are arranged along the edge of the wafer cleaning area, the side surface of the clamping roller is used for abutting against the side surface of the wafer, the rotation axis of the clamping roller is perpendicular to the horizontal plane, and the clamping roller rotates to make the wafer rotate.

[0008] The first roller brush assembly comprises a first brush roller, the first brush roller is connected to the base, and the first brush roller can move to the upper side of the wafer cleaning area to brush the top surface of the wafer in the wafer cleaning area.

[0009] The second roller brush assembly comprises a second brush roller, the second brush roller is connected to the base, and the first brush roller can move to the lower side of the wafer cleaning area to brush the bottom surface of the wafer in the wafer cleaning area.

[0010] The spray assembly comprises a spray head, a transducer and a swing arm, the swing arm is connected to the spray head, the swing arm is rotationally connected to the base, the transducer is arranged on the spray head, and the swing arm rotates to enable the spray head to reciprocate between the edge of the wafer cleaning area and the center of the wafer cleaning area.

[0011] Optionally, the base comprises a bottom plate and two side plates, the two side plates are arranged on the top surface of the bottom plate in a first direction, the wafer cleaning area is arranged above the bottom plate and between the two side plates, the first brush wheel and the second brush wheel are arranged between the two side plates and connected to the side plates, and the swing arm is rotationally connected to the side plates.

[0012] Optionally, the side surface of the side plate is provided with a first extension groove extending in a second direction and a second extension groove extending in a vertical direction, the first extension groove is higher than the wafer cleaning area, the second extension groove is lower than the wafer cleaning area, the first brush wheel is inserted into the first extension groove to be connected to the side plate, and the second brush wheel is inserted into the second extension groove to be connected to the side plate.

[0013] Optionally, the first brush wheel is adjustably connected to the base in the second direction, and the second brush wheel is adjustably connected to the base in the vertical direction.

[0014] Optionally, the first brush wheel is slidingly connected to the base in the second direction, the first brush wheel assembly further comprises a first movement driver connected to the first brush wheel, and the first movement driver is used to drive the first brush wheel to move in the second direction.

[0015] The second brush wheel is slidingly connected to the base in the vertical direction, the second brush wheel assembly further comprises a second movement driver connected to the second brush wheel, and the second movement driver is used to drive the second brush wheel to move in the vertical direction.

[0016] Optionally, the clamping assembly further comprises a clamping driver connected to the clamping roller, and the clamping driver can drive the clamping roller to rotate.

[0017] The spray assembly further comprises a swing driver connected to the swing arm, and the swing driver is used to drive the swing arm to rotate.

[0018] The first brush wheel assembly further comprises a first rolling driver connected to the first brush wheel, and the first rolling driver is used to drive the first brush wheel to rotate.

[0019] The second rolling brush assembly further comprises a second rolling driver connected to the second brush wheel, and the second rolling driver is used to drive the second brush wheel to rotate.

[0020] Optionally, the clamping assembly further comprises a supporting column, a bottom end of the supporting column is connected to the base, and a top end of the supporting column is connected to the clamping roller.

[0021] Optionally, part or all of the clamping assembly further comprises an adjusting block, the adjusting block is arranged between the clamping roller and the supporting column, a top surface of the supporting column is connected to a bottom surface of the adjusting block, and the clamping roller is adjustably connected to a top surface of the adjusting block.

[0022] Optionally, the clamping roller gradually increases in diameter from top to bottom.

[0023] Optionally, the rotating connection between the swing arm and the base and the first rolling brush assembly has a first interval extending in a second direction, and the rotating connection between the swing arm and the base and the second rolling brush assembly has a second interval extending in the second direction.

[0024] Compared with the prior art, the wafer cleaning device has the beneficial effects that:

[0025] The utility model discloses a wafer cleaning device, base is the main part for bearing, connecting each part, first set a wafer cleaning area in the upper of base, and the wafer is cleaned in the wafer cleaning area, and the shape (generally circular) and size of wafer cleaning area and wafer are matched (can have certain error), with this wafer cleaning area as the benchmark, set up multiple clamping assemblies for fixing wafer, specifically, the clamping roller of clamping assembly is along the edge of wafer cleaning area and is set up, and the side of clamping roller abuts at the side of wafer to fix wafer, and the rotation of clamping roller can make wafer rotate, further, first brush wheel and second brush wheel can be moved to the upper and lower of wafer cleaning area respectively, and the top surface and bottom surface of wafer are brushed respectively, further, when wafer rotates, the spray head of spray assembly reciprocates between the upper of the edge of wafer cleaning area or lower and the center of wafer cleaning area through the swing arm of rotation connection in base, and the spray head can spray the end surface of wafer, further, the transducer can send megahertz level high energy sound wave and promote cleaning liquid to improve the frequency of cleaning liquid, when the cleaning liquid that is accelerated by transducer is sprayed to the end surface of wafer, the high speed fluid mechanics layer that the cleaning liquid is impacted on the end surface of wafer in succession by strong sound pressure gradient and acoustic flow effect makes the particle attached on the surface be forced to remove and enter into the medium liquid, further, the cleaning process of the utility model discloses wafer cleaning device is as follows: S1, place wafer in wafer cleaning area, multiple clamping rollers cooperate and fix the wafer, and the spray head is accelerated by the transducer and is sprayed to the end surface of wafer with cleaning liquid, S2, first brush wheel and second brush wheel are moved to the upper and lower of wafer cleaning area respectively, and the top surface and bottom surface of wafer are brushed respectively, in this process, the spray head can also accelerate by the transducer and is sprayed to the end surface of wafer with cleaning liquid, S3, the spray head sprays deionized water to the end surface of wafer to clean residual chemical liquid and particulate impurities, in conclusion, the wafer cleaning device of the utility model can clean the tiny particulate impurities on the end surface of wafer through the spray head and transducer, and can clean the large particulate impurities on the end surface of wafer through brush wheel, and has comprehensive and powerful cleaning capacity to the particulate impurities on wafer. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is the top view of the utility model discloses wafer cleaning device.

[0027] Figure 2 It is Figure 1 It is the section view of A-A in Fig.

[0028] Sign meaning: 1, base; 11, bottom plate; 12, side plate; 121, first extension groove; 122, second extension groove; 2, spray assembly; 21, spray head; 22, swing arm; 3, first brush roller assembly; 31, first brush wheel; 4, second brush roller assembly; 41, second brush wheel; 5, clamping assembly; 51, clamping roller; 52, support column; 53, adjusting block; 6, wafer. DETAILED DESCRIPTION

[0029] The specific embodiments of the present application will be further described in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0030] In the description of the present application, it should be understood that the terms "top", "bottom", "inner", "outer", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0031] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0032] As shown in Figure 1 and 2 The wafer cleaning device of the present application comprises a base 1, a spraying assembly 2, a first rolling brush assembly 3, a second rolling brush assembly 4 and a plurality of clamping assemblies 5. The upper part of the base 1 is provided with a wafer cleaning area, and the wafer cleaning area is used for placing a wafer 6. The clamping assembly 5 comprises a clamping roller 51, and the clamping rollers 51 of the plurality of clamping assemblies 5 are arranged along the edge of the wafer cleaning area. The side surface of the clamping roller 51 is used for abutting against the side surface of the wafer 6, and the rotation axis of the clamping roller 51 is perpendicular to the horizontal plane. The clamping roller 51 rotates to rotate the wafer 6. The first rolling brush assembly 3 comprises a first brush roller 31, and the first brush roller 31 is connected to the base 1. The first brush roller 31 can move above the wafer cleaning area to brush and wash the top surface of the wafer 6 in the wafer cleaning area. The second rolling brush assembly 4 comprises a second brush roller 41, and the second brush roller 41 is connected to the base 1. The first brush roller 31 can move below the wafer cleaning area to brush and wash the bottom surface of the wafer 6 in the wafer cleaning area. The spraying assembly 2 comprises a spray head 21, a transducer and a swing arm 22. The swing arm 22 is connected to the spray head 21, and the swing arm 22 is rotationally connected to the base 1. The transducer is arranged on the spray head 21. The swing arm 22 rotates to move the spray head 21 reciprocally between above the edge of the wafer cleaning area or below the edge and the center of the wafer cleaning area.

[0033] In the above technical solution, the base 1 serves as a main body for bearing and connecting various components. A wafer cleaning area above the base 1 is first set, and a wafer 6 is cleaned in the wafer cleaning area. The wafer cleaning area and the wafer 6 are matched in shape (generally circular) and size (with a certain error). Based on the wafer cleaning area, a plurality of clamping assemblies 5 for fixing the wafer 6 are set. Specifically, clamping rollers 51 of the clamping assemblies 5 are arranged along the edge of the wafer cleaning area, and the side surface of the clamping roller 51 abuts against the side surface of the wafer 6 to fix the wafer 6. In addition, the clamping roller 51 can rotate to rotate the wafer 6. Further, the first brush wheel 31 and the second brush wheel 41 can be moved above and below the wafer cleaning area, respectively, to brush the top surface and the bottom surface of the wafer 6, respectively. Further, when the wafer 6 rotates, the spray head 21 of the spray assembly 2 reciprocates between above or below the edge of the wafer cleaning area and the center of the wafer cleaning area through the swing arm 22 connected to the base. The spray head 21 can spray the end surface of the wafer 6. Further, the transducer can emit megahertz-level high-energy sound waves to push the cleaning liquid to increase the frequency of the cleaning liquid. When the cleaning liquid accelerated by the transducer is sprayed to the end surface of the wafer 6, the high-speed fluid mechanics layer generated by the strong sound pressure gradient and acoustic flow effect continuously impacts the end surface of the wafer 6, so that the particles attached to the surface are forced to enter the medium liquid. Further, the cleaning process of the wafer cleaning device of the utility model is as follows: S1, the wafer 6 is placed in the wafer cleaning area, and the plurality of clamping rollers 51 cooperate to fix the wafer 6. The spray head 21 sprays the cleaning liquid accelerated by the transducer to the end surface of the wafer 6. S2, the first brush wheel 31 and the second brush wheel 41 are moved above and below the wafer cleaning area, respectively, to brush the top surface and the bottom surface of the wafer 6, respectively. In this process, the spray head 21 can also spray the cleaning liquid accelerated by the transducer to the end surface of the wafer 6. S3, the spray head 21 sprays deionized water to the end surface of the wafer 6 to clean the residual liquid medicine and particulate impurities. In summary, the wafer cleaning device of the utility model can clean the small particulate impurities on the end surface of the wafer 6 through the spray head 21 and the transducer, and clean the large particulate impurities on the end surface of the wafer 6 through the brush wheel, so as to have a comprehensive and strong cleaning capacity for the particulate impurities on the wafer 6.

[0034] Further, one spray assembly 2 sprays one end surface of the wafer 6, and two spray assemblies 2 can spray the top surface and the bottom surface of the wafer 6, respectively.

[0035] Further, the base 1 comprises a bottom plate 11 and two side plates 12, the two side plates 12 are arranged on the top surface of the bottom plate 11 along the first direction, the wafer cleaning area is arranged above the bottom plate 11 and between the two side plates 12, the first brush wheel 31 and the second brush wheel 41 are arranged between the two side plates 12 and connected to the side plates 12, and the swing arm 22 is rotationally connected to the side plates 12. Wherein, the base 1 has a longer length along the second direction, and the side plates 12 can shield both sides of the wafer cleaning area along the first direction, so that the particulate impurities are accumulated on the top surface of the bottom plate 11 and the side wall of the side plate 12, preventing the particulate impurities from flying everywhere, and facilitating the staff to clean the particulate impurities.

[0036] Further, the side surface of the side plate 12 is provided with a first extension groove 121 extending along the second direction and a second extension groove 122 extending along the vertical direction, the first extension groove 121 is higher than the wafer cleaning area, and the second extension groove 122 is lower than the wafer cleaning area, the first brush wheel 31 is inserted into the first extension groove 121 to be connected to the side plate 12, and the second brush wheel 41 is inserted into the second extension groove 122 to be connected to the side plate 12, so that the first brush wheel 31 can move along the second direction through the first extension groove 121, and the second brush wheel 41 can move along the vertical direction through the second extension groove 122; in one embodiment, the first brush wheel 31 is adjustably connected to the base 1 along the second direction, and the second brush wheel 41 is adjustably connected to the base 1 along the vertical direction; in another embodiment, the first brush wheel 31 is slidingly connected to the base 1 along the second direction, and the first brush wheel assembly 3 further comprises a first moving driver connected to the first brush wheel 31, the first moving driver being used to drive the first brush wheel 31 to move along the second direction; the second brush wheel 41 is slidingly connected to the base 1 along the vertical direction, and the second brush wheel assembly 4 further comprises a second moving driver connected to the second brush wheel 41, the second moving driver being used to drive the second brush wheel 41 to move along the vertical direction; wherein the first moving driver and the second moving driver can be motors.

[0037] Further, the clamping assembly 5 further comprises a clamping driver connected to the clamping roller 51, the clamping driver being capable of driving the clamping roller 51 to rotate; the spraying assembly 2 further comprises a swinging driver connected to the swinging arm 22, the swinging driver being capable of driving the swinging arm 22 to rotate; the first rolling brush assembly 3 further comprises a first rolling driver connected to the first brush roller 31, the first rolling driver being capable of driving the first brush roller 31 to rotate; the second rolling brush assembly 4 further comprises a second rolling driver connected to the second brush roller 41, the second rolling driver being capable of driving the second brush roller 41 to rotate, so that the rotation of the clamping roller 51, the rotation of the swinging arm 22, the rotation of the first brush roller 31 and the rotation of the second brush roller 41 can be automatically performed, wherein the clamping driver, the swinging driver, the first rolling driver and the second rolling driver can be motors.

[0038] Further, the clamping assembly 5 further comprises a support column 52, the bottom end of the support column 52 being connected to the base 1 and the top end of the support column 52 being connected to the clamping roller 51, so that the clamping roller 51 can be away from the top surface of the base 1, preventing the impurities accumulated on the top surface of the base 1 from interfering with the operation of the clamping roller 51 and the wafer 6.

[0039] Further, part or all of the clamping assembly 5 further comprises an adjusting block 53 arranged between the clamping roller 51 and the support column 52, the top surface of the support column 52 being connected to the bottom surface of the adjusting block 53, and the clamping roller 51 being adjustably connected to the top surface of the adjusting block 53, the position of the clamping roller 51 in the horizontal direction being adjusted to change the distance between the clamping roller 51 and the wafer cleaning area, thereby facilitating the clamping of the wafer 6 between the clamping rollers 51, wherein the top surface of the adjusting block 53 can be provided with an adjusting groove extending radially along the wafer cleaning area, and the bottom surface of the clamping roller 51 is provided with a sliding block slidingly connected to the adjusting groove, the sliding block can be locked by adjusting the screw, or a spring can be provided to continuously apply a force to the sliding block towards the center of the wafer cleaning area to fix the wafer 6.

[0040] Further, the diameter of the clamping roller 51 gradually increases from top to bottom, so as to facilitate the placement of the wafer 6 from top to bottom between the clamping rollers 51.

[0041] Further, the swinging arm 22 and the rotating connection between the base 1 and the first rolling brush assembly 3 have a first interval extending in the second direction, and the swinging arm 22 and the rotating connection between the base 1 and the second rolling brush assembly 4 have a second interval extending in the second direction, so as to reduce the probability of mutual interference between the spraying assembly 2 and the rolling brush assembly.

[0042] Further, the specific connection mode of the fixed setting and fixed connection refers to the relative position relationship between the two components that can be fixed, including fixing through a connecting piece, fixing through welding, fixing through an adhesive, fixing through one-piece forming, and fixing through a buckle connection.

[0043] Further, the sliding connection refers to the sliding of one component on another component along a fixed track between the two components that are connected, including connecting through a sliding block sliding into a sliding groove and connecting through a sliding rod inserted into a hole with a matching size profile.

[0044] Further, the specific connection mode of the adjustable connection refers to the adjustment of the mutual position relationship between the two components that are connected before being fixed, and the aforementioned adjustment and fixing process can be repeated, including connecting through a long hole and a connecting piece and connecting through a sliding connection plus a detachable connection.

[0045] Further, the rotating connection refers to the rotation between the two components that are connected, including connecting through a bearing and connecting through a clearance fit.

[0046] Further, the connecting piece includes a fastener, a strap, a binding rope, a pneumatic connecting element, a hydraulic connecting element, a flange plate, a magic tape, and a button.

[0047] In summary, the embodiments of the utility model provide a wafer cleaning device, and the technical effects are as follows:

[0048] The utility model discloses a wafer cleaning device, base 1 is as the main part for bearing, connecting each part, first set a wafer cleaning area in the upper of base 1, and the wafer 6 is cleaned in the wafer cleaning area, and the shape (generally circular) and size of wafer cleaning area and wafer 6 are matched (can have certain error), and the wafer cleaning area is the reference, and sets up a plurality of clamping assembly 5 for fixing wafer 6, specifically, the clamping roller 51 of clamping assembly 5 is along the edge of wafer cleaning area and is set, and the side of clamping roller 51 is abutted to the side of wafer 6 to fix wafer 6, and the rotation of clamping roller 51 can make wafer 6 rotate, further, first brush wheel 31 and second brush wheel 41 can be moved to the upper and lower of wafer cleaning area respectively, and the top surface and bottom surface of wafer 6 are brushed respectively, further, when wafer 6 rotates, the spray head 21 of spray assembly 2 reciprocates between the upper of the edge of wafer cleaning area or the lower and the center of wafer cleaning area through the swing arm 22 of rotation connection in base, and the spray head 21 can spray the end surface of wafer 6, further, the transducer can send megahertz level high-energy sound wave to push cleaning liquid to improve the frequency of cleaning liquid, when the cleaning liquid that is accelerated by transducer is sprayed to the end surface of wafer 6, the high-speed fluid mechanics layer that the cleaning liquid is impacted on the end surface of wafer 6 in succession by virtue of strong sound pressure gradient and acoustic flow effect makes the particles adhered to the surface be forced to remove and enter into the medium liquid, further, the cleaning process of the utility model discloses wafer cleaning device is as follows: S1, places wafer 6 in wafer 6 cleaning area, and a plurality of clamping rollers 51 cooperate to fix the wafer 6, and the spray head 21 is accelerated by the transducer to spray the cleaning liquid to the end surface of wafer 6, S2, first brush wheel 31 and second brush wheel 41 are moved to the upper and lower of wafer cleaning area respectively, and the top surface and bottom surface of wafer 6 are brushed respectively, in the process, the spray head 21 can also accelerate the cleaning liquid by the transducer to spray to the end surface of wafer 6, S3, the spray head 21 sprays deionized water to the end surface of wafer 6 to clean residual chemical liquid and particulate impurities, in conclusion, the wafer cleaning device of the utility model can clean the tiny particulate impurities on the end surface of wafer 6 through the spray head 21 and transducer, and can clean the large particulate impurities on the end surface of wafer 6 through brush wheel, and has comprehensive and strong cleaning capacity to the particulate impurities on wafer 6.

[0049] The above only is the preferred implementation of the utility model, should point out, for the ordinary skill of the technical field, on the premise of not departing from the technical principle of the utility model, can make a number of improvements and substitutions, these improvements and substitutions also should be considered the protection range of the utility model.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The base (1), the spray assembly (2), the first rolling brush assembly (3), the second rolling brush assembly (4) and the plurality of clamping assemblies (5) are included. The upper portion of the base (1) is provided with a wafer cleaning area, and the wafer cleaning area is used for placing a wafer (6). The clamping assembly (5) includes a clamping roller (51), and the clamping rollers (51) of the plurality of clamping assemblies (5) are arranged along the edge of the wafer cleaning area, the side surface of the clamping roller (51) is used for abutting against the side surface of the wafer (6), the rotation axis of the clamping roller (51) is perpendicular to the horizontal plane, and the clamping roller (51) rotates to rotate the wafer (6). The first rolling brush assembly (3) includes a first brush roller (31), and the first brush roller (31) is connected to the base (1) and can move above the wafer cleaning area to brush the top surface of the wafer (6) in the wafer cleaning area. The second rolling brush assembly (4) includes a second brush roller (41), and the second brush roller (41) is connected to the base (1) and can move below the wafer cleaning area to brush the bottom surface of the wafer (6) in the wafer cleaning area. The spray assembly (2) includes a spray head (21), a transducer and a swing arm (22), the swing arm (22) is connected to the spray head (21), the swing arm (22) is rotationally connected to the base (1), the transducer is arranged on the spray head (21), and the swing arm (22) rotates to move the spray head (21) reciprocally between the edge of the wafer cleaning area and the center of the wafer cleaning area.

2. The wafer cleaning apparatus according to claim 1, wherein The base (1) includes a bottom plate (11) and two side plates (12), the two side plates (12) are arranged on the top surface of the bottom plate (11) in a first direction, the wafer cleaning area is arranged above the bottom plate (11) and between the two side plates (12), the first brush roller (31) and the second brush roller (41) are arranged between the two side plates (12) and connected to the side plates (12), and the swing arm (22) is rotationally connected to the side plates (12).

3. The wafer cleaning apparatus according to claim 2, wherein The side surface of the side plate (12) is provided with a first extension groove (121) extending in a second direction and a second extension groove (122) extending in a vertical direction, the first extension groove (121) is higher than the wafer cleaning area, the second extension groove (122) is lower than the wafer cleaning area, the first brush roller (31) is inserted into the first extension groove (121) to be connected to the side plate (12), and the second brush roller (41) is inserted into the second extension groove (122) to be connected to the side plate (12).

4. The wafer cleaning apparatus according to claim 1 or 3, wherein The first brush roller (31) is adjustably connected to the base (1) in the second direction, and the second brush roller (41) is adjustably connected to the base (1) in the vertical direction.

5. The wafer cleaning apparatus according to claim 1 or 3, wherein The first brush wheel (31) is slidingly connected to the base (1) along a second direction, and the first brush wheel assembly (3) further comprises a first moving driver connected to the first brush wheel (31), and the first moving driver is configured to drive the first brush wheel (31) to move along the second direction. The second brush wheel (41) is slidingly connected to the base (1) along a vertical direction, and the second brush wheel assembly (4) further comprises a second moving driver connected to the second brush wheel (41), and the second moving driver is configured to drive the second brush wheel (41) to move along the vertical direction.

6. The wafer cleaning apparatus of claim 1, wherein The clamping assembly (5) further comprises a clamping driver connected to the clamping roller (51), and the clamping driver is configured to drive the clamping roller (51) to rotate. The spraying assembly (2) further comprises a swinging driver connected to the swing arm (22), and the swinging driver is configured to drive the swing arm (22) to rotate. The first brush wheel assembly (3) further comprises a first rolling driver connected to the first brush wheel (31), and the first rolling driver is configured to drive the first brush wheel (31) to rotate. The second brush wheel assembly (4) further comprises a second rolling driver connected to the second brush wheel (41), and the second rolling driver is configured to drive the second brush wheel (41) to rotate.

7. The wafer cleaning apparatus of claim 1, wherein The clamping assembly (5) further comprises a support column (52) connected at a bottom end to the base (1) and at a top end to the clamping roller (51).

8. The wafer cleaning apparatus according to claim 7, wherein Part or all of the clamping assembly (5) further comprises an adjusting block (53) arranged between the clamping roller (51) and the support column (52), a top surface of the support column (52) is connected to a bottom surface of the adjusting block (53), and the clamping roller (51) is adjustably connected to a top surface of the adjusting block (53), and the position of the clamping roller (51) along the horizontal direction is adjusted to change the distance between the clamping roller (51) and the wafer cleaning area.

9. The wafer cleaning apparatus of claim 1, wherein The diameter of the clamping roller (51) gradually increases from top to bottom.

10. The wafer cleaning apparatus of claim 1, wherein The swing arm (22) and the rotating connection between the base (1) and the first brush wheel assembly (3) have a first interval extending along the second direction, and the swing arm (22) and the rotating connection between the base (1) and the second brush wheel assembly (4) have a second interval extending along the second direction.

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