Printing device of silk screen main grid

Abstract

The utility model discloses a printing device of a silk screen main grid. Comprising a printing table top, a spray head device arranged above the printing table top, a grouting machine connected with the spray head device through a pipeline, a driving device for driving the spray head device to move, a scanning device for scanning a silicon wafer placed on the printing table top and a control device connected with the scanning device, the control system is electrically connected with the spraying head device and the driving device, the scanning device is arranged above the printing table top, and the control system controls the spraying head device to spray slurry to a laser grooving area of a silicon wafer according to silicon wafer data obtained by the scanning device. According to the utility model, the slurry is sprayed to the laser slotting area through the nozzle, so that the cost of a screen printing plate and a series of risk points caused by the use of the screen printing plate are saved, the printing linearity is ensured not to be higher than the surface of the battery piece and the coverage edge area, the light receiving area of the whole battery piece is greatly improved, and the conversion efficiency of the battery is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar cell electrode printing technical field, concretely relates to a printing device of silk screen main grid. BACKGROUND

[0002] With the increasingly scarce of non-renewable resources, and some non-renewable resources in people's life and industrial production caused various pollution problems, therefore all countries are using various policy or legal means to gradually increase the development and utilization of renewable energy and clean energy, and strive to improve its proportion in the whole energy use. In clean and renewable energy, solar energy is one of the most important energy, solar cell panel as the most important equipment in solar energy utilization, the quality of each component needs to be strictly controlled to improve the utilization rate of solar energy and prolong the service life of solar cell panel.

[0003] After the solar cell is made into PN junction through texturing, diffusion and PECVD processes, current can be generated under light. In order to lead out the current, electrodes need to be prepared on the surface of the cell. Screen printing is the most common process technology for preparing contact electrodes of solar cells at present. The height and width of grid lines and the gap between grid lines are very important for optical shading loss, resistance and silver loss.

[0004] The screen used in screen printing process is a key consumable material in photovoltaic industry, which is mainly used for electrode forming and conductivity improvement. The slurry (such as silver, aluminum, etc.) is accurately coated on the silicon wafer by screen printing to form an electrode structure. This component will greatly affect the line width and appearance of the grid line after printing and the amount of silver paste used, and then affect the cost and photoelectric conversion efficiency of the cell wafer.

[0005] The traditional screen printing adopts screen printing process, which is limited by the service life of the screen. The increase of the service life of the screen will cause the deterioration of the printing linearity, which will greatly affect the conversion efficiency of the cell wafer. At the same time, the screen printing process has the risk of screen explosion, which greatly increases the cost of screen and slurry. At the same time, this process has a common problem: the printed grid line is higher than the surface of the cell wafer, and the slurry on the edge of the grid line may cover the surface of the cell wafer, thereby reducing the overall light receiving area of the cell wafer and reducing the conversion efficiency of the cell. SUMMARY

[0006] To solve at least one technical problem of the prior art, the utility model provides a printing device of silk screen main grid.

[0007] To achieve the above-mentioned utility model purposes, a technical scheme of the utility model is: a printing device of a silk screen main grid, which comprises a printing table top, a nozzle device arranged above the printing table top, a grouting machine connected with the nozzle device through a pipeline, a driving device for driving the nozzle device to move, a scanning device for scanning a silicon wafer placed on the printing table top, and a control system electrically connected with the scanning device, the nozzle device and the driving device, the scanning device is arranged above the printing table top, and the control system controls the nozzle device to spray slurry to a laser grooving area of the silicon wafer according to silicon wafer data obtained by the scanning device.

[0008] Further, the nozzle device comprises a mounting seat and a plurality of nozzles detachably mounted on the mounting seat, and the plurality of nozzles are linearly mounted on the mounting seat along the length direction of the mounting seat.

[0009] Further, the mounting seat is provided with a plurality of mounting through holes along the length direction, the plurality of mounting through holes are linearly distributed on the mounting seat, one end of the mounting through hole is provided with an internal thread, and the nozzle is provided with an external thread matched with the internal thread.

[0010] Further, the nozzle device further comprises a plurality of valves mounted on the mounting seat, and the valves are one-to-one mounted in the mounting through holes.

[0011] Further, the printing device of the silk screen main grid further comprises a flow meter connected with the control system, and the flow meter is mounted on the pipeline.

[0012] Further, the driving device comprises a vertical air cylinder for driving the nozzle device to approach or move away from the printing table top and a horizontal air cylinder for driving the nozzle device to move along the silicon wafer grooving.

[0013] Compared with the prior art, the utility model has the advantages that: the utility model sprays slurry to the laser grooving area through the nozzle, not only saves the cost of the screen and a series of risk points caused by the use of the screen, but also ensures that the printing linearity will not be higher than the surface of the battery piece and the edge area, greatly improves the light receiving area of the whole battery piece, and greatly improves the battery conversion efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a connection schematic view of the printing device of the silk screen main grid in an embodiment of the utility model. DETAILED DESCRIPTION

[0015] In order to make the personnel in the technical field better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the present application.

[0016] It should be noted that the terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0017] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0018] In addition, in addition to being used to indicate the orientation or positional relationship, the above-mentioned part of the terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For the person skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0019] In addition, the terms "mounting", "setting", "provided with", "connecting", "connecting", "sleeving" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For the person skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0020] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0021] With reference to Figure 1 The utility model provides a printing device of silk screen main grid, including printing mesa 1, spray head device 2, injection machine 3, drive arrangement, scanning device 4 and control system, wherein, printing mesa 1 is used to place silicon wafer 6, spray head device 2 sets up above printing mesa 1, spray head device 2 is used to spray slurry to the fluting area of silicon wafer 6, injection machine 3 is connected with spray head device 2 through pipeline 5, injection machine 3 is used to provide slurry for spray head device 2, drive arrangement is connected with spray head device 2, drive arrangement is used to drive spray head device 2 to move to complete slurry spraying, scanning device 4 sets up above printing mesa 1, scanning device 4 is used to scan the silicon wafer 6 of placing to in printing mesa 1 to obtain the fluting data of silicon wafer 6, such as the fluting number, fluting width and fluting depth of silicon wafer 6, control system is electrically connected with scanning device 4, spray head device 2 and drive arrangement respectively, and control system controls spray head device 2 to spray slurry to the laser fluting area of silicon wafer according to the silicon wafer data obtained by scanning device 4.

[0022] The utility model through spray head device 2 sprays slurry to the laser fluting area of silicon wafer 6, not only saves the screen cost and uses the screen to bring a series of risk points, also guarantees that printing linearity will not be higher than battery piece surface and covers edge area, greatly promotes the light receiving area of whole battery piece, greatly improves battery conversion efficiency.

[0023] Further, the spray head device 2 includes a mounting seat 21 and a plurality of spray heads 22 detachably mounted on the mounting seat 21, and the plurality of spray heads 22 are linearly mounted on the mounting seat 21 along the length direction of the mounting seat 21.

[0024] Further, the mounting seat 21 is provided with a plurality of mounting through holes along the length direction, the plurality of mounting through holes are linearly distributed on the mounting seat 21, one end of the mounting through hole is provided with an internal thread, and the spray head 22 is provided with an external thread matched with the internal thread. When not in production, the spray head 22 can be detached for maintenance to prevent the small spray head port of the spray head 22 from being blocked by slurry solidification.

[0025] The utility model can control the number of the main grid of the silicon wafer 6 by manually installing and detaching the spray head 22 according to different requirements of products.

[0026] Further, the spray head device 2 further includes a plurality of valves mounted on the mounting seat, the valves are one-to-one mounted in the mounting through holes, and the valves are connected with the control system to control the opening and closing of the valves by the control system, thereby controlling the number of the spray heads 22.

[0027] Further, the printing device of the silk screen main grid further comprises a flow meter connected with the control system, the flow meter is installed on the pipeline 5, the control system calculates the amount of slurry required by the laser grooving unit volume of the silicon wafer according to the scanning result of the scanning device 4, and then the amount of slurry is regulated to the flow meter to accurately control the slurry supplied to the nozzle device 2.

[0028] As a preferred embodiment, the nozzle device 2 is provided with a slurry cavity above the mounting seat 21, and the slurry cavity is communicated with the pipeline 5 and the plurality of valves respectively.

[0029] Further, the driving device comprises a vertical cylinder for driving the nozzle device 2 to approach or move away from the printing table 1, and a horizontal cylinder for driving the nozzle device 2 to move along the slotting of the silicon wafer.

[0030] The operation process of the printing device of the silk screen main grid is as follows:

[0031] 1. Place the silicon wafer 6 to be sprayed on the printing table 1, the scanning device 4 scans the silicon wafer 6, and transmits the scanning result to the control system;

[0032] 2. The control system calculates the amount of slurry required by the silicon wafer according to the scanning result, and controls the opening degree of the flow meter and the opening number of the valve according to the number of main grids on the silicon wafer, and controls the driving device to drive the nozzle device 2 to approach the silicon wafer 6 and move along the extension direction of the slotting of the main grid to complete the slurry spraying;

[0033] 3. After spraying is completed, the control system controls the valve to be closed, and controls the driving device to drive the nozzle device 2 to return to the original position.

[0034] Further, when the nozzle device 2 sprays, the nozzle device 2 is located below the scanning device 4, and when the nozzle device 2 returns to the original position, the nozzle device 2 will not block the scanning of the silicon wafer 6 by the scanning device 4.

[0035] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to the above-described embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the above-described embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A printing device of a screen main grid, characterized by, The printing device comprises a printing table (1), a nozzle device (2) arranged above the printing table (1), a dispensing machine (3) connected with the nozzle device (2) through a pipeline (5), a driving device for driving the nozzle device (2) to move, a scanning device (4) for scanning a silicon wafer (6) placed on the printing table (1), and a control system electrically connected with the scanning device (4), the nozzle device (2) and the driving device, wherein the control system controls the nozzle device (2) to spray slurry to a laser grooving area of the silicon wafer according to silicon wafer data obtained by the scanning device (4).

2. The screen main grid printing apparatus according to claim 1, characterized by, The nozzle device (2) comprises a mounting seat (21) and a plurality of nozzles (22) detachably mounted on the mounting seat (21), and the plurality of nozzles (22) are linearly arranged along the length direction of the mounting seat (21).

3. The screen main grid printing apparatus according to claim 2, wherein The mounting seat (21) is provided with a plurality of mounting through holes along the length direction, and the plurality of mounting through holes are linearly arranged on the mounting seat (21), one end of each mounting through hole is provided with an internal thread, and the nozzle (22) is provided with an external thread matched with the internal thread.

4. The screen main grid printing apparatus according to claim 3, wherein The nozzle device (2) further comprises a plurality of valves mounted on the mounting seat, and each valve is one-to-one mounted in the mounting through hole.

5. The screen main grid printing apparatus according to any one of claims 1 to 4, characterized by, The printing device further comprises a flow meter connected with the control system, and the flow meter is mounted on the pipeline (5).

6. The screen main grid printing apparatus according to any one of claims 1 to 4, characterized by The driving device comprises a vertical air cylinder for driving the nozzle device (2) to move close to or away from the printing table (1), and a horizontal air cylinder for driving the nozzle device (2) to move along the silicon wafer groove.

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