Semiconductor lead frame unwinding device

Abstract

The utility model provides a semiconductor lead frame unwinding device, and belongs to the technical field of semiconductor lead frame unwinding. The semiconductor lead frame unwinding device comprises a main board, supporting legs are installed at the bottom of the main board, an adjusting mechanism is arranged on the front side of the main board and comprises a first rotating plate, a moving plate, a first fixing block and an adjusting plate, the first rotating plate is arranged on the front side of the main board, a main shaft is fixedly installed on the front side of the first rotating plate, and the moving plate is arranged on the front side of the main board. The number of the moving plates is two. According to the utility model, through the arrangement of the adjusting mechanism, the reel core of the semiconductor coiled material is aligned with the main shaft for sleeving, and when the two moving plates move in opposite directions, the plurality of adjusting plates move in the radial direction away from the main shaft at the same time until the adjusting plates are in contact with the inner wall of the coiled material; and a worker can adapt to coiled materials with reel cores of different sizes through radial movement of the adjusting plate, and compared with the prior art, the application range is wider.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor lead frame unwinding technical field, specifically, relate to a semiconductor lead frame unwinding device. BACKGROUND

[0002] Semiconductor lead frame is the key basic material of semiconductor package, it provides physical support and electrical connection for chip, colloquially, it is like the skeleton and nervous system of chip, connects chip and external circuit, in the manufacturing process of semiconductor lead frame, the unwinding of raw material is the first step of the whole production procedure.

[0003] The existing equipment is usually sleeved with the coiled material on the main shaft during use, and the coiled material is unwound through the rotation of the main shaft, however, due to the different production scales, the sizes of the reel cores are also different, when facing different sizes of reel cores, the staff can only replace the equipment with different sizes of main shafts, which is inconvenient for the staff to use. UTILITY MODEL CONTENTS

[0004] In order to make up for the above shortcomings, the utility model provides a semiconductor lead frame unwinding device which overcomes the above technical problems or at least partially solves the above problems.

[0005] The utility model is realized as follows:

[0006] The utility model provides a semiconductor lead frame unwinding device, including mainboard, the bottom of mainboard is installed with support leg, the front side of mainboard is provided with adjusting mechanism, the adjusting mechanism includes,

[0007] First rotating plate, the first rotating plate is arranged at the front side of mainboard, and the front side of the first rotating plate is fixedly installed with the main shaft;

[0008] Moving plate, the moving plate is provided with two, and the two moving plates are slidably sleeved on the surface of the main shaft;

[0009] First fixed block, the first fixed block is fixedly installed on the surface of the moving plate, and the first fixed block is rotatably installed with the rotating rod in the inside;

[0010] Adjusting plate, the adjusting plate is slidably installed at the front side of the first rotating plate, the second fixed block is fixedly installed on the side close to the main shaft of the adjusting plate, and the other end of the rotating rod is rotatably connected with the second fixed block.

[0011] In a preferred scheme, the front side of the main shaft is fixedly installed with the connecting plate, the rear side of the connecting plate is rotatably installed with the bidirectional screw rod, the two moving plates are sleeved at the two ends opposite in the screw direction of the bidirectional screw rod respectively, and the two moving plates are screw-connected with the bidirectional screw rod.

[0012] In a preferred scheme, the first rotating plate is provided with a front-to-rear through limiting slot, a limiting rod is slidably sleeved in the limiting slot, the front side of the limiting rod is fixedly connected with the rear side of the adjusting plate, and the rear side of the limiting rod is fixedly installed with a limiting block.

[0013] In a preferred scheme, the front side of the main plate is provided with a driving mechanism, the driving mechanism comprises a second rotating plate, the second rotating plate is rotationally installed on the front side of the main plate, the front side of the second rotating plate is installed with an extension rod, and the other end of the extension rod is fixedly connected with the rear side of the first rotating plate.

[0014] In a preferred scheme, the front side of the second rotating plate is rotationally installed with a spline sleeve, a spline shaft is slidably sleeved in the spline sleeve, and the front side of the spline shaft is fixedly connected with the rear side of the bidirectional screw rod.

[0015] In a preferred scheme, the front side of the spline sleeve penetrates to the front side of the first rotating plate, the surface of the spline sleeve is provided with a threaded groove, and the spline sleeve is threadedly connected with the first rotating plate through the threaded groove.

[0016] In a preferred scheme, the front side of the second rotating plate is rotationally installed with a driving screw rod, the driving screw rod is sleeved in the interiors of the first rotating plate and the main shaft, and is threadedly connected with the main shaft and the first rotating plate.

[0017] In a preferred scheme, the interior of the second rotating plate is fixedly installed with a first motor, the output end of the first motor is fixedly connected with the rear side of the driving screw rod, the rear side of the main plate is fixedly installed with a second motor, and the output end of the second motor is fixedly connected with the rear side of the second rotating plate.

[0018] The semiconductor lead frame unwinding device has the following beneficial effects:

[0019] 1. By setting the adjusting mechanism, the reel core of the semiconductor coiled material is sleeved with the main shaft, when the two moving plates move in opposite directions, the plurality of adjusting plates simultaneously move radially away from the main shaft until the adjusting plates contact the inner wall of the coiled material, and the staff can adapt to the coiled material of different sizes of reel cores through the radial movement of the adjusting plate, and compared with the prior art, the application range is wider.

[0020] 2. By setting the driving mechanism, when the spline sleeve rotates, the spline sleeve and the spline shaft key teeth are meshed, the spline shaft can slide forward and backward without being affected, the spline sleeve can drive the spline shaft to rotate, and driving force is provided for the rotation of the bidirectional screw rod. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the embodiments of the present application will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0022] Figure 1 is a schematic diagram of the overall structure provided by the embodiments of the present application;

[0023] Figure 2 is a schematic diagram of the structure from the right side provided by the embodiments of the present application;

[0024] Figure 3 is a partial sectional view of the first rotating plate provided by the embodiments of the present application;

[0025] Figure 4 is a partial sectional view of the first rotating plate from the left side provided by the embodiments of the present application.

[0026] In the figure: 1, main plate; 2, supporting leg; 301, first rotating plate; 302, main shaft; 303, moving plate; 304, first fixed block; 305, rotating rod; 306, adjusting plate; 307, second fixed block; 308, connecting plate; 309, bidirectional screw rod; 310, limiting groove; 311, limiting rod; 312, limiting block; 401, second rotating plate; 402, telescopic rod; 403, spline sleeve; 404, spline shaft; 405, threaded groove; 406, driving screw rod; 407, first motor; 408, second motor. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] Embodiment one

[0029] Reference Figures 1-4The utility model provides a technical scheme: a semiconductor lead frame unwinding device, including mainboard 1, the bottom of mainboard 1 is installed with support leg 2, the front side of mainboard 1 is provided with adjusting mechanism, and adjusting mechanism includes first rotating plate 301, moving plate 303, first fixed block 304 and adjusting plate 306, first rotating plate 301 sets up at the front side of mainboard 1, and the front side fixed mounting of first rotating plate 301 has main shaft 302, moving plate 303 is provided with two, and two moving plate 303 are all slidingly covered in the surface of main shaft 302, and first fixed block 304 is fixedly installed in the surface of moving plate 303, and the inside rotation of first fixed block 304 is installed with rotating rod 305, and adjusting plate 306 slidingly installs at the front side of first rotating plate 301, and the side fixed mounting of adjusting plate 306 close to main shaft 302 has second fixed block 307, and the other end of rotating rod 305 is rotationally connected with second fixed block 307, and the front and rear through limiting slot 310 is seted up on first rotating plate 301, and the inside slidingly covered in limiting slot 310 has limiting rod 311, and the front side of limiting rod 311 is fixedly connected with the rear side of adjusting plate 306, and the rear side of limiting rod 311 is fixedly installed with limiting block 312, by setting adjusting mechanism, the reel core of semiconductor coiled material is aligned with main shaft 302 and is covered, when two moving plate 303 move to the opposite direction, drive first fixed block 304 to move, because one end of rotating rod 305 is rotationally connected with first fixed block 304, and the other end is rotationally connected with second fixed block 307, and at the same time, by the cooperation of limiting slot 310 and limiting rod 311, multiple adjusting plate 306 moves radially to the direction away from main shaft 302 simultaneously, until adjusting plate 306 and the inner wall of coiled material contact, rotate main shaft 302, so that adjusting plate 306 drives coiled material to unwind, to complete the unwinding link of semiconductor lead frame manufacturing, and staff can adapt to the coiled material of reel core of different sizes through the radial movement of adjusting plate 306, compared with prior art, the application range is wider,

[0030] Referring to Figures 1-4 The front side of main shaft 302 is fixedly installed with connecting plate 308, the rear side of connecting plate 308 is rotationally installed with bidirectional screw rod 309, two moving plates 303 are respectively covered in the two ends of bidirectional screw rod 309 in the opposite screw thread directions, and the two moving plates 303 are all screw-connected with bidirectional screw rod 309, by setting bidirectional screw rod 309, when bidirectional screw rod 309 rotates, because two moving plates 303 are screw-covered in the surface of bidirectional screw rod 309, and the screw thread directions of two sides of bidirectional screw rod 309 are opposite, so that two moving plates 303 can simultaneously move towards or oppositely move;

[0031] Embodiment two

[0032] Referring to Figures 1-4The front side of the main plate 1 is provided with a driving mechanism, the driving mechanism comprises a second rotating plate 401, the second rotating plate 401 is rotatably installed on the front side of the main plate 1, a telescopic rod 402 is installed on the front side of the second rotating plate 401, the other end of the telescopic rod 402 is fixedly connected with the rear side of the first rotating plate 301, a spline sleeve 403 is rotatably installed on the front side of the second rotating plate 401, the spline sleeve 403 is sleeved with a spline shaft 404 in a sliding mode, the front side of the spline shaft 404 is fixedly connected with the rear side of the bidirectional screw rod 309, when the spline sleeve 403 rotates, the spline teeth of the spline sleeve 403 and the spline shaft 404 are engaged, so that the spline shaft 404 can slide forward and backward without being affected, and the spline shaft 404 can be driven to rotate by the spline sleeve 403, thereby providing driving force for the rotation of the bidirectional screw rod 309;

[0033] With reference to Figures 1-4 The front side of the spline sleeve 403 penetrates to the front side of the first rotating plate 301, the surface of the spline sleeve 403 is provided with a threaded groove 405, the spline sleeve 403 is threadedly connected with the first rotating plate 301 through the threaded groove 405, a driving screw rod 406 is rotatably installed on the front side of the second rotating plate 401, the driving screw rod 406 is sleeved in the first rotating plate 301 and the main shaft 302, and is threadedly connected with the main shaft 302 and the first rotating plate 301, a first motor 407 is fixedly installed in the second rotating plate 401, the output end of the first motor 407 is fixedly connected with the rear side of the driving screw rod 406, a second motor 408 is fixedly installed on the rear side of the main plate 1, the output end of the second motor 408 is fixedly connected with the rear side of the second rotating plate 401, the driving screw rod 406 is provided, the first motor 407 is started, the driving screw rod 406 is driven to rotate, the first rotating plate 301 and the main shaft 302 are moved forward through the threaded connection of the driving screw rod 406, the first rotating plate 301 and the main shaft 302, and the spline sleeve 403 is rotated through the threaded connection of the threaded groove 405 and the first rotating plate 301 on the surface of the spline sleeve 403, thereby driving the spline shaft 404 and the bidirectional screw rod 309 to rotate, when the position adjustment of the adjusting plate 306 is completed, the second motor 408 is started, the second rotating plate 401 is driven to rotate, the first rotating plate 301 is driven to rotate through the cooperation of the telescopic rod 402, and the unwinding of the semiconductor coiled material is completed.

[0034] Specifically, the working process or working principle of the semiconductor lead frame unwinding device is as follows: in use, the core of the semiconductor roll is sleeved on the main shaft 302, the first motor 407 is started to drive the drive screw 406 to rotate, the first rotating plate 301 and the main shaft 302 are moved forward through the threaded connection of the drive screw 406, the first rotating plate 301 and the main shaft 302, the first rotating plate 301 is moved, the spline sleeve 403 is rotated due to the threaded connection of the surface of the spline sleeve 403 and the first rotating plate 301, the spline sleeve 403 is rotated, the spline shaft 404 is rotated through the meshing of the spline sleeve 403 and the spline teeth of the spline shaft 404, the spline shaft 404 is not affected by the forward and backward sliding, the spline shaft 404 is rotated through the spline sleeve 403, the driving force for the rotation of the bidirectional screw 309 is provided, the bidirectional screw 309 is rotated, the two moving plates 303 are threaded on the surface of the bidirectional screw 309, the two moving plates 303 can move in opposite directions at the same time, the first fixed block 304 is moved, one end of the rotating rod 305 is rotationally connected with the first fixed block 304, the other end is rotationally connected with the second fixed block 307, the plurality of adjusting plates 306 are simultaneously moved away from the main shaft 302 in the radial direction through the cooperation of the limiting groove 310 and the limiting rod 311, the adjusting plate 306 and the inner wall of the roll are in contact, the second motor 408 is started to drive the second rotating plate 401 to rotate, the first rotating plate 301 is rotated through the cooperation of the telescopic rod 402.

Claims

1. A semiconductor lead frame unwinding device, comprising a main plate (1), the bottom of the main plate (1) is provided with a supporting leg (2), characterized in that: The front side of the main plate (1) is provided with an adjusting mechanism, the adjusting mechanism comprises, The first rotating plate (301) is provided on the front side of the main plate (1), and the front side of the first rotating plate (301) is fixedly installed with a main shaft (302); Two moving plates (303) are provided, and the two moving plates (303) are both slidingly sleeved on the surface of the main shaft (302); A first fixed block (304) is fixedly installed on the surface of the moving plate (303), and a rotating rod (305) is rotatably installed in the first fixed block (304); An adjusting plate (306) is slidingly installed on the front side of the first rotating plate (301), a second fixed block (307) is fixedly installed on the side of the adjusting plate (306) close to the main shaft (302), and the other end of the rotating rod (305) is rotatably connected with the second fixed block (307); A connecting plate (308) is fixedly installed on the front side of the main shaft (302), a bidirectional screw rod (309) is rotatably installed on the rear side of the connecting plate (308), the two moving plates (303) are respectively sleeved on the two ends of the bidirectional screw rod (309) in opposite screwing directions, and the two moving plates (303) are both in threaded connection with the bidirectional screw rod (309); A limiting slot (310) penetrating through the front and rear sides of the first rotating plate (301) is formed, a limiting rod (311) is slidingly sleeved in the limiting slot (310), the front side of the limiting rod (311) is fixedly connected with the rear side of the adjusting plate (306), and a limiting block (312) is fixedly installed on the rear side of the limiting rod (311); A driving mechanism is arranged on the front side of the main plate (1), the driving mechanism comprises a second rotating plate (401) rotatably installed on the front side of the main plate (1), and a telescopic rod (402) is installed on the front side of the second rotating plate (401), and the other end of the telescopic rod (402) is fixedly connected with the rear side of the first rotating plate (301); A spline sleeve (403) is rotatably installed on the front side of the second rotating plate (401), a spline shaft (404) is slidingly sleeved in the spline sleeve (403), and the front side of the spline shaft (404) is fixedly connected with the rear side of the bidirectional screw rod (309).

2. The semiconductor lead frame unwinding device according to claim 1, wherein The front side of the spline sleeve (403) penetrates to the front side of the first rotating plate (301), a threaded groove (405) is formed in the surface of the spline sleeve (403), and the spline sleeve (403) is in threaded connection with the first rotating plate (301) through the threaded groove (405).

3. The semiconductor lead frame unwinding device according to claim 2, wherein A driving screw rod (406) is rotatably installed on the front side of the second rotating plate (401), the driving screw rod (406) is sleeved in the interiors of the first rotating plate (301) and the main shaft (302), and is in threaded connection with the main shaft (302) and the first rotating plate (301).

4. The semiconductor lead frame unwinding device according to claim 3, wherein The inside of the second rotating plate (401) is fixedly installed with a first motor (407), the output end of the first motor (407) is fixedly connected with the rear side of the drive lead screw (406), the rear side of the main plate (1) is fixedly installed with a second motor (408), and the output end of the second motor (408) is fixedly connected with the rear side of the second rotating plate (401).

Images