Film coating equipment for chip

Abstract

The utility model discloses coating equipment for chips, which relates to the field of chip processing and comprises a device shell, the device shell is of a hollow structure, a supporting plate is arranged in the device shell, a crucible structure is arranged at the bottom of the supporting plate, the crucible structure comprises a plurality of high-temperature crucibles, and the high-temperature crucibles are arranged in the device shell. The plurality of high-temperature crucibles are uniformly arranged at a certain angle, and an opening matched with the crucible structure is formed in the supporting plate. According to the utility model, the partition plates are matched with the partition plates to divide the space in the device shell into a plurality of spaces by being matched with the high-temperature crucible, and then the crucible is controlled up and down and is matched with the upper top chip placement structure to simultaneously carry out coating operation on a plurality of chips, so that efficient chip coating is realized; and a new chip can be replaced for film coating by rotating the position of the high-temperature crucible, so that the target material can perform film coating operation on different chips, and the film coating operation is more flexible.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of chip processing, specifically is a kind of film equipment for chip. BACKGROUND

[0002] Chip, also known as Integrated Circuit (IC), is the core component of modern electronic devices and computing systems. It is a microelectronic circuit that integrates a large number of tiny electronic components (such as transistors, resistors, capacitors, etc.) on a single semiconductor substrate.

[0003] In the field of semiconductor manufacturing, chip plating technology is a crucial process that involves depositing one or more thin films on the surface of a chip to improve its performance, protect it from environmental erosion, and enhance its reliability and durability. With the rapid development of technology, the requirements for chip plating technology are increasingly high, especially in terms of plating efficiency, uniformity, and the selection and control of plating materials.

[0004] Traditional chip plating equipment selects appropriate target materials and heats them in a crucible before bombarding them onto the surface of a chip using an electron gun to deposit a film.

[0005] However, existing chips can only be plated with one type of target material at a time, and if another type of target material is needed, the crucible must be replaced and the target material must be changed, resulting in low chip plating efficiency. SUMMARY

[0006] Therefore, the utility model aims to provide a film equipment for chip to solve the technical problem of low chip plating efficiency caused by the fact that existing chips can only be plated with one type of target material at a time, and if another type of target material is needed, the crucible must be replaced and the target material must be changed.

[0007] To achieve the above object, the utility model provides following technical scheme: a kind of film plating equipment for chip, including device shell, the device shell is set to hollow structure, support plate is arranged in the device shell, the support plate bottom is provided with crucible structure, the crucible structure includes several high-temperature crucible, the several high-temperature crucible is evenly arranged at a certain angle, the support plate is provided with opening on cooperation crucible structure, the support plate is provided with partition plate on cooperation high-temperature crucible, the partition plate is provided with several pieces according to high-temperature crucible quantity, the support plate is provided with limit cover on cooperation partition plate, the limit cover cooperation partition plate forms several spaces, cooperation high-temperature crucible is arranged, the high-temperature crucible is provided with placing opening, the placing opening is movably provided with target material container, the bottom of the several high-temperature crucible is provided with several support base plates on cooperation several high-temperature crucibles, the support base plate bottom is provided with second transmission shaft, the second transmission shaft extends to the outside of device shell, the device shell is provided with third motor on cooperation second transmission shaft outside.

[0008] By adopting the above technical scheme, the device shell is divided into several spaces by the partition and the limit cover according to the crucible, and then the film plating operation is simultaneously performed on several chips, so that the chip film plating efficiency is improved.

[0009] The utility model further sets up, several third motor bottom are provided with support turntable, the support turntable bottom is provided with first transmission shaft, the first transmission shaft is connected second motor, the device shell bottom is provided with guide groove on cooperation several second transmission shafts.

[0010] By adopting the above technical scheme, the support turntable is controlled to rotate by the second motor, the position of the high-temperature crucible is controlled, and then the crucible position is replaced according to different film plating requirements.

[0011] The utility model further sets up, the device shell top is provided with chip setting structure on cooperation several high-temperature crucibles, the chip setting structure includes support main shaft, the support main shaft top is provided with central control device, the support main shaft is provided with several connecting rods on cooperation several high-temperature crucibles at the bottom of central control device, the connecting rod bottom is provided with hydraulic rod, the connecting rod top surface is provided with first motor on cooperation hydraulic rod, the other end of hydraulic rod is provided with mounting plate, the mounting plate bottom is provided with chip fixing device, the device shell is provided with setting opening on cooperation chip fixing device.

[0012] By adopting the above technical scheme, the hydraulic rod is controlled to press down by the first motor, so that the pressing down of the mounting plate is controlled, and the control of the chip film plating is realized.

[0013] The utility model further sets up, the chip fixed device includes the setting plate, the setting groove is set to the one side of setting plate near high temperature crucible, the one side of setting plate near high temperature crucibble still is provided with fixed shaft symmetrically, the fixed shaft is rotationally provided with the limit stop lever.

[0014] Through the above technical scheme, the substrate bearing the chip is limited by the limit stop lever, and then the film plating operation of the chip is carried out.

[0015] The utility model further sets up, a pair of fixed shafts are provided with a check valve, and a suction pump is arranged on the mounting plate in cooperation with the check valve.

[0016] Through the above technical scheme, the device housing is evacuated by the check valve and the suction pump, ensuring the stability of the chip plating.

[0017] The utility model further sets up, the partition plate bottom is provided with the baffle, and the high temperature crucible is provided with a baffle groove in cooperation with the baffle.

[0018] Through the above technical scheme, the space separated by the partition plate is airtight sealed by the baffle groove and the baffle.

[0019] The utility model further sets up, one side of the device housing is rotationally provided with a door, a support frame is arranged on the support main shaft, and the support frame is in contact with the ground.

[0020] Through the above technical scheme, the space between the partition plates facing the door can also be vacuumed by the door, and the chip setting structure is supported by the support frame.

[0021] In summary, the utility model mainly has the following beneficial effects:

[0022] The utility model divides the space in the device housing into several spaces by the partition plate and the partition plate in cooperation with the high temperature crucible, then controls the crucible up and down, cooperates the chip setting structure on the top, and carries out the film plating operation on the multiple chips, realizes the efficient chip plating, and through such setting, after the film plating is completed, the new chip is replaced for film plating, also can be rotated the high temperature crucible position, makes the target material to the different chip film plating operation, and the film plating operation is more flexible. DRAWINGS

[0023] Figure 1 It is the whole structure schematic diagram of the utility model;

[0024] Figure 2 It is the device internal structure schematic diagram of the utility model;

[0025] Figure 3It is the internal overall structure schematic view of the utility model;

[0026] Figure 4 It is the partial structure schematic view of the utility model;

[0027] Figure 5 It is the chip fixing device structure schematic view of the utility model;

[0028] Figure 6 It is the device shell structure schematic view of the utility model.

[0029] In the drawing: 1, device shell; 2, cover door; 3, first motor; 4, central control device; 5, mounting plate; 6, hydraulic rod; 7, support frame; 8, support turntable; 9, second motor; 10, connecting rod; 11, partition plate; 12, limit cover; 13, target material container; 14, support plate; 15, high-temperature crucible; 16, first transmission shaft; 17, support base plate; 18, third motor; 19, second transmission shaft; 20, chip fixing device; 21, placing opening; 22, blocking plate; 23, blocking groove; 24, setting opening; 25, guide groove; 26, setting plate; 27, fixed shaft; 28, limit stop lever; 29, setting groove; 30, air suction pump; 31, one-way valve; 32, support main shaft. DETAILED DESCRIPTION

[0030] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are used for explaining the utility model only, and cannot be understood as the limitation of the utility model.

[0031] The embodiments of the utility model will be described below according to the overall structure of the utility model.

[0032] A kind of film plating equipment for chip, such as Figures 1-6As shown, including device shell 1, the device shell 1 is set to hollow structure, the device shell 1 is provided with support plate 14, the support plate 14 bottom is provided with crucible structure, the crucible structure includes several high temperature crucible 15, the several high temperature crucible 15 is evenly arranged at a certain angle, the support plate 14 is provided with opening on the matching crucible structure, the support plate 14 is provided with partition plate 11 matching high temperature crucible 15, the partition plate 11 is provided with several pieces according to the number of high temperature crucible 15, the support plate 14 is provided with limit cover 12 matching partition plate 11, the limit cover 12 forms several spaces matching partition plate 11, and is matched with high temperature crucible 15, the high temperature crucible 15 is provided with placing opening 21, the placing opening 21 is movably provided with target material container 13, in actual use, the metal target material is prevented in the target material container 13, and is prevented into the placing opening 21 by high temperature crucible 15 for heating, the bottom of the several high temperature crucible 15 is provided with several support base plates 17 matching the several high temperature crucible 15, the bottom of the support base plate 17 is provided with the second transmission shaft 19, the second transmission shaft 19 extends to the outside of the device shell 1, the third motor 18 is provided outside the device shell 1 matching the second transmission shaft 19, the second transmission shaft 19 is controlled to move up and down by the third motor 18, and then the high temperature crucible 15 is controlled to move up and down, and the bottom of the matching partition plate 11 is provided with the blocking plate 22, the high temperature crucible 15 is provided with the blocking groove 23 matching the blocking plate 22, by such setting, the high temperature crucible 15 is moved upwards to make the blocking plate 22 enter the blocking groove 23 to realize the partition of the space between the partition plate 11 and the high temperature crucible 15 and the outside, further, the several third motors 18 are arranged to separately control the several high temperature crucibles 15, so that the device can simultaneously perform film plating operation on several chips without affecting each other, at the same time, the device shell 1 is rotatably provided with a cover door 2, the support frame 7 is arranged on the support main shaft 32, and the support frame 7 is in contact with the ground, so that after the target material is placed, the cover door 2 is closed, and the chip film plating operation in all spaces can be simultaneously performed.

[0033] At the same time, the bottom of the several third motors 18 is provided with a support turntable 8, the bottom of the support turntable 8 is provided with a first transmission shaft 16, the first transmission shaft 16 is connected with a second motor 9, the bottom of the device shell 1 is provided with a guide groove 25 matching the several second transmission shafts 19, the first transmission shaft 16 is driven to rotate by the second motor 9, and then the support turntable 8 is driven to rotate, the several third motors 18 on the support turntable 8 are driven to rotate, the position of the high temperature crucible 15 changes, and the purpose of replacing the crucible position according to different chip film plating requirements is realized.

[0034] Based on the above structure, the top of the device housing 1 is fitted with several high-temperature crucibles 15 and a chip placement structure is provided. The chip placement structure includes a supporting spindle 32, and a central control device 4 is provided on the top of the supporting spindle 32. Several connecting rods 10 are provided around the bottom of the supporting spindle 32 and the central control device 4, with several high-temperature crucibles 15. A hydraulic rod 6 is provided at the bottom of the connecting rod 10, and a first motor 3 is provided on the top surface of the connecting rod 10 in conjunction with the hydraulic rod 6. A mounting plate 5 is provided at the other end of the hydraulic rod 6, and a chip fixing device 20 is provided at the bottom of the mounting plate 5. The device housing 1 has a placement opening 24 for the chip fixing device 20. The central control device 4 controls the first motor 3, which in turn controls the hydraulic rod 6 to press down, causing the mounting plate 5 to press down and push the chip fixing device 20 into the device housing 1 through the placement opening 24. At this time, the mounting plate 5 provides an airtight seal, ensuring that a hollow environment can be formed inside the device. In particular, the position of the chip fixing device 20 corresponds to the position of the high-temperature crucibles 15.

[0035] The chip fixing device 20 includes a mounting plate 26. The mounting plate 26 has a mounting groove 29 on the side near the high-temperature crucible 15. The mounting plate 26 also has symmetrically arranged fixing shafts 27 on the side near the high-temperature crucible 15. A limit stop bar 28 is rotatably mounted on the fixing shaft 27. A one-way valve 31 is arranged between the pair of fixing shafts 27. A vacuum pump 30 is arranged on the mounting plate 5 in conjunction with the one-way valve 31. The substrate and the chip are installed into the mounting groove 29. Then, by rotating the limit stop bar 28 onto the substrate, the substrate is limited so that the chip can be coated. The vacuum pump 30 is used to evacuate the gas inside the device housing 1 through the one-way valve 31, so that a vacuum is formed inside the device housing 1.

[0036] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A coating apparatus for chips, comprising a device housing (1), characterized in that: The device shell (1) is provided with a hollow structure, the device shell (1) is provided with a support plate (14), the bottom of the support plate (14) is provided with a crucible structure, the crucible structure comprises a plurality of high-temperature crucibles (15), the plurality of high-temperature crucibles (15) are uniformly arranged at a certain angle, the support plate (14) is provided with an opening matched with the crucible structure, the support plate (14) is provided with a partition plate (11) matched with the high-temperature crucible (15), the partition plate (11) is provided with a plurality of blocks according to the number of high-temperature crucibles (15), the support plate (14) is provided with a limiting cover (12) matched with the partition plate (11), the limiting cover (12) forms a plurality of spaces matched with the partition plate (11) and the high-temperature crucible (15), the high-temperature crucible (15) is provided with a placing opening (21), the target container (13) is movably arranged in the placing opening (21), the bottom of the plurality of high-temperature crucibles (15) is provided with a plurality of support base plates (17) matched with the plurality of high-temperature crucibles (15), the bottom of the support base plate (17) is provided with a second transmission shaft (19), the second transmission shaft (19) extends out of the device shell (1), and the device shell (1) is provided with a third motor (18) matched with the second transmission shaft (19) outside.

2. The coating apparatus for a chip according to claim 1, wherein: The bottom of the plurality of third motors (18) is provided with a support turntable (8), the bottom of the support turntable (8) is provided with a first transmission shaft (16), the first transmission shaft (16) is connected with a second motor (9), and the bottom of the device shell (1) is provided with a guide groove (25) matched with the plurality of second transmission shafts (19).

3. The coating apparatus for a chip according to claim 1, wherein: The top of the device shell (1) is provided with a chip mounting structure matched with the plurality of high-temperature crucibles (15), the chip mounting structure comprises a support main shaft (32), the top of the support main shaft (32) is provided with a central control device (4), a plurality of connecting rods (10) are arranged on the bottom of the support main shaft (32) and matched with the plurality of high-temperature crucibles (15) around the central control device (4), the bottom of the connecting rod (10) is provided with a hydraulic rod (6), the top surface of the connecting rod (10) is provided with a first motor (3) matched with the hydraulic rod (6), the other end of the hydraulic rod (6) is provided with a mounting plate (5), the bottom of the mounting plate (5) is provided with a chip fixing device (20), and the device shell (1) is provided with a mounting opening (24) matched with the chip fixing device (20).

4. The coating apparatus for a chip according to claim 3, wherein: The chip fixing device (20) comprises a mounting plate (26), one side of the mounting plate (26) close to the high-temperature crucible (15) is provided with a mounting groove (29), and the other side of the mounting plate (26) close to the high-temperature crucible (15) is also provided with a fixing shaft (27) symmetrically, the fixing shaft (27) is rotatably provided with a limiting stop rod (28).

5. The coating apparatus for a chip according to claim 4, wherein: A one-way valve (31) is arranged between a pair of fixing shafts (27), and a gas suction pump (30) is arranged on the mounting plate (5) matched with the one-way valve (31).

6. The coating apparatus for a chip according to claim 1, wherein: The bottom of the partition plate (11) is provided with a blocking plate (22), and the high-temperature crucible (15) is provided with a blocking groove (23) matched with the blocking plate (22).

7. The coating apparatus for a chip according to claim 3, wherein: The device housing (1) is provided with a cover door (2) on one side, the supporting main shaft (32) is provided with a supporting frame (7), and the supporting frame (7) is in contact with the ground.

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