Partitioned anode mechanism
By setting corresponding anode structures in the electroplating area through a partitioned anode mechanism, precise control of each electroplating area is achieved, solving the problem of inconsistent electroplating thickness and improving product quality and electroplating efficiency.
Patent Information
- Application Number
- CN202520032507.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-07
AI Technical Summary
In the current electroplating process of the iridium-titanium anode integrated packaging substrate, factors such as chemical agents, agent stirring, and substrate material can cause multiple electroplating areas of different thicknesses to be generated on the electroplating surface, affecting product quality.
By adopting a zoned anode mechanism, corresponding anode structures are set in different electroplating areas and connected to an external power source through conductive components, so as to achieve separate control of each electroplating area and achieve thickness consistency by adjusting the current or voltage.
It improves the thickness uniformity of the electroplating area, enhances product quality, reduces interference from external factors, and improves electroplating efficiency and effectiveness.
Smart Images
Figure CN223723266U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electroplating equipment, in particular to a partitioned anode mechanism. BACKGROUND
[0002] The partitioned anode mechanism is applied to a board-level vertical electroplating equipment, and is mainly used for electroplating a packaging substrate. The existing iridium-titanium anode is of an integrated structure, and the packaging substrate is composed of a glass fiber substrate, stainless steel and glass. When the anode electroplates the packaging substrate, the anode current is consistent. Due to the influence of various factors such as chemical reagents, reagent stirring and packaging substrate material, multiple electroplating regions with different thicknesses are often generated on the electroplated surface of the substrate, thereby affecting the product quality. CONTENT OF THE UTILITY MODEL
[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a partitioned anode mechanism to solve the problem that multiple electroplating regions with different thicknesses are generated on the electroplated surface of a traditional substrate.
[0004] The present application provides a partitioned anode mechanism, comprising: a partitioned main plate, a partitioning member, at least two anode structures and at least two conductive members corresponding to the anode structures one by one.
[0005] The at least two anode structures are arranged on a first surface of the partitioned main plate, the projection range of the same anode structure on the first surface corresponds to the same electroplating region on the substrate, and the anode structures are separated by the partitioning member between every two adjacent anode structures. The anode structures are electrically connected to an external power supply through the corresponding conductive members.
[0006] The partitioned main plate is used for connecting the substrate.
[0007] Based on the partitioned anode mechanism, the corresponding anode structures are arranged in different electroplating regions for electroplating, which can realize the separate control of all electroplating regions, thereby improving the thickness consistency of all electroplating regions and improving the quality of products.
[0008] Optionally, the resistances of the at least two anode structures are the same.
[0009] Further, based on the above partitioned anode mechanism, the thickness of all electroplating regions can be precisely controlled by only adjusting the current or voltage of the external power supply of different anode structures, thereby further improving the thickness consistency of all electroplating regions.
[0010] Optionally, the at least two conductive members are respectively connected to two external power supplies.
[0011] Optionally, the first surface is arranged in parallel with the electroplated surface of the substrate.
[0012] Further, based on the above-mentioned partitioned anode mechanism, the anode structure is attached to the electroplating surface, thereby improving the electroplating efficiency and electroplating effect and reducing the interference of other factors from the outside.
[0013] Optionally, one side of the partitioned main plate is provided with a fixing frame, and at least one of the conductive parts is connected with the fixing frame.
[0014] Further, based on the above-mentioned fixing frame, the conductive parts connected with the anode structure can be fixed, thereby improving the integrity of the entire partitioned anode mechanism and reducing the influence of the instability of the conductive parts on the electroplating process.
[0015] Optionally, at least two fixing structures are arranged at intervals on the fixing frame, and the fixing structures are used for fixing one of the conductive parts.
[0016] Further, based on the above-mentioned fixing frame, all the conductive parts can be fixed on the same side of the partitioned main plate, which facilitates the arrangement of the external power supply and can also fix all the conductive parts.
[0017] Optionally, the partitioned main plate is further provided with a connecting part, and the connecting part is detachably connected with the substrate.
[0018] Further, based on the above-mentioned connecting part, the connection and separation of the partitioned main plate and the substrate can be facilitated, and the connection can be achieved through bolts, buckles or the like, wherein the connecting part can have a fitting surface with the substrate, thereby ensuring the connection reliability of the partitioned main plate and the substrate.
[0019] Optionally, at least two of the anode structures are arranged in a back-to-back manner on the first surface of the partitioned main plate, the isolation part is in a ring structure and is sleeved between two adjacent anode structures.
[0020] Further, based on the above-mentioned anode structure and isolation part, the insulation effect of the isolation part can be improved, and the end or gap that affects the electroplating effect between two adjacent anode structures can be avoided.
[0021] Optionally, the number of the anode structures is three, which are a first anode structure, a second anode structure and a third anode structure, the first anode structure is in a square structure and is located at the center position of the first surface, the second anode structure is in a ring structure and is sleeved on the outer circumferential side of the first anode structure, and the third anode structure is in a ring structure and is sleeved on the outer circumferential side of the second anode structure.
[0022] Further, based on the above-mentioned anode structure, the anode structure can be accurately arranged according to the electroplating area on the substrate, thereby further improving the electroplating effect on the substrate and further improving the thickness consistency of different electroplating areas on the electroplating surface of the substrate.
[0023] Optionally, the anode structure located at the inner side has a connecting point on the surface facing away from the substrate, which is connected with the conductive member;
[0024] The anode structure located at the outermost side has a connecting point on the surface facing away from the substrate, which is connected with the conductive member, or the anode structure located at the outermost side has a connecting point on the circumferential side, which is connected with the conductive member.
[0025] Further, based on the conductive member, the length and volume of the conductive member can be reduced, the stability of the whole can be improved, and the space occupation can be reduced, facilitating arrangement.
[0026] The additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS
[0027] The disclosure of the present application will become more apparent with reference to the drawings. It should be understood by those skilled in the art that the drawings are only for the purpose of illustration, and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the figures are used to represent similar components, wherein:
[0028] Figure 1 Structure schematic diagram of the partitioned anode mechanism described in the embodiments of the present application;
[0029] Figure 2 Structure schematic diagram of the partitioned anode mechanism described in the embodiments of the present application installed on the substrate;
[0030] Figure 3 Top view of the partitioned anode mechanism described in the embodiments of the present application;
[0031] Figure 4 Side view of the partitioned anode mechanism described in the embodiments of the present application.
[0032] BRIEF DESCRIPTION OF DRAWINGS
[0033] 1, partitioned mainboard; 11, fixing frame; 111, fixing structure; 12, connecting part; 2, isolation member; 31, first anode structure; 32, second anode structure; 33, third anode structure; 4, substrate; 51, first conductive member; 52, second conductive member; 53, third conductive member. DETAILED DESCRIPTION
[0034] Some embodiments of the present application will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application, and are not intended to limit the scope of protection of the present application.
[0035] When the anode is used to electroplate the packaging substrate, the anode current is consistent. However, due to various factors such as chemical agents, agent stirring, and packaging substrate material, multiple electroplating areas of different thicknesses are often generated on the electroplating surface of the substrate, which in turn affects the product quality.
[0036] Based on this, this application provides a partitioned anode mechanism, which enables separate control of all electroplating areas by setting corresponding anode structures in different electroplating areas for electroplating, thereby improving the thickness consistency of all electroplating areas and enhancing product quality.
[0037] The present application will be described in detail below through specific embodiments.
[0038] Reference Figures 1 to 4 As shown, this embodiment provides a partitioned anode mechanism, including: a partitioned main board 1, an isolator 2, at least two anode structures, and at least two conductive elements corresponding one-to-one with the anode structures; at least two anode structures are arranged on a first surface of the partitioned main board 1, which may be the surface of the partitioned main board 1 facing the substrate 4. The projection range of the same anode structure on the first surface corresponds to the same electroplating area on the substrate 4. The same electroplating area of the substrate 4 refers to the fact that after electroplating, the surface of the traditional substrate 4 will form multiple areas of different thicknesses. Electroplating areas of the same thickness are the same electroplating area. Each pair of adjacent anode structures is separated by the isolator 2 to achieve insulation between them. The anode structures are electrically connected to an external power source through the corresponding conductive elements; the partitioned main board 1 is used to connect the substrate 4.
[0039] The partitioned anode mechanism provided in this embodiment enables separate control of all electroplating areas by setting corresponding anode structures in different electroplating areas, thereby improving the thickness consistency of all electroplating areas and enhancing product quality.
[0040] In some embodiments, at least two anode structures have the same resistance. Further, at least two anode structures may have the same projected area on the first surface, the same thickness in the direction perpendicular to the first surface, and the same material. When the anode structure is a mesh structure, it is also necessary to ensure that the arrangement of the perforations and the size of the perforations are the same. All anode structures may be metal mesh structures of the same thickness formed by cutting them into a set shape. Specifically, the metal mesh structure may be an iridium-titanium mesh structure.
[0041] Based on the aforementioned partitioned anode mechanism, the thickness of all electroplating areas can be precisely controlled simply by adjusting the current or voltage of the external power supply for different anode structures, thereby further improving the thickness consistency of all electroplating areas.
[0042] In further some embodiments, the at least two conductive members are respectively connected with two external power sources, wherein the two external power sources refer to power sources with different output currents or voltages, or the same power source with different output currents or voltages, that is, two anode structures with the same resistance need to be respectively connected with power sources with different output currents or voltages, so as to realize the unification of the electroplated layers with different thicknesses into the same thickness.
[0043] In some embodiments, the first surface is parallel to the electroplating surface of the substrate 4, and the anode structure is located in the gap between the first surface and the electroplating surface, and the anode structure can be a plate structure as a whole, and the inner and outer surfaces are respectively attached to the first surface and the electroplating surface.
[0044] Based on the above-mentioned partitioned anode structure, the anode structure is attached to the electroplating surface, thereby improving the electroplating efficiency and electroplating effect, and reducing the interference of other factors from the outside.
[0045] Referring back to Figures 1 to 3 As shown, the partitioned main plate 1 is provided with a fixing frame 11, and the at least one conductive member is connected with the fixing frame 11.
[0046] Based on the above-mentioned fixing frame 11, the conductive member connected with the anode structure can be fixed, thereby improving the integrity of the entire partitioned anode structure and reducing the influence of the instability of the conductive member on the electroplating process.
[0047] In some embodiments, the fixing frame 11 is provided with at least two fixing structures 111 at intervals, and the fixing structure 111 is used to fix one of the conductive members, specifically, the number of the fixing structures 111 on the fixing frame 11 is the same as the number of the conductive members, that is, the number of the fixing structures 111, the conductive members and the anode structure is the same.
[0048] Based on the above-mentioned fixing frame 11, all the conductive members can be fixed on the same side of the partitioned main plate 1, which facilitates the arrangement of the external power source and also enables the fixation of all the conductive members.
[0049] Referring back to Figures 1 to 4 As shown, the partitioned main plate 1 is further provided with a connecting portion 12, and the connecting portion 12 is detachably connected with the substrate 4.
[0050] Based on the above-mentioned connecting portion 12, the connection and separation of the partitioned main plate 1 and the substrate 4 can be facilitated, and the connection can be achieved through bolts, buckles or the like, wherein the connecting portion 12 can have an attaching surface with the substrate 4, thereby ensuring the connection reliability of the partitioned main plate 1 and the substrate 4.
[0051] In some embodiments, at least two anode structures are arranged in a U-shape on the first surface of the partition motherboard 1, and the spacer 2 is an annular structure and is sleeved between two adjacent anode structures. One anode structure may be a square or circular structure, and the other anode structure may be an annular structure sleeved outside the square anode structure. Alternatively, one annular anode structure may be sleeved outside the other annular anode structure.
[0052] Based on the above anode structure and the isolation element 2, the insulation effect of the isolation element 2 can be improved, and the presence of ends or gaps can be avoided, which would affect the electroplating effect between two adjacent anode structures.
[0053] Continue to refer to Figure 1 and Figure 2 As shown, there are three anode structures: a first anode structure 31, a second anode structure 32, and a third anode structure 33. The first anode structure 31 is a square structure and is located at the center of the first surface. The second anode structure 32 is a ring structure and is fitted around the outer periphery of the first anode structure 31. The third anode structure 33 is a ring structure and is fitted around the outer periphery of the second anode structure 32. It should be understood that the number of anode structures can also be four or more, as long as they are fitted together sequentially according to the electroplating areas on the substrate 4.
[0054] Based on the above anode structure, the anode structure can be accurately arranged according to the electroplating area on the substrate 4, thereby further improving the electroplating effect on the substrate 4 and further improving the thickness consistency of different electroplating areas on the electroplating surface of the substrate 4.
[0055] Optionally, the anode structure located at the inner side has a connecting point on the surface facing away from the substrate 4 connected with the conductive piece; the anode structure located at the outermost side has a connecting point on the surface facing away from the substrate 4 connected with the conductive piece, or the anode structure located at the outermost side has a connecting point on the circumferential side connected with the conductive piece; wherein, when the number of the anode structures and the conductive pieces are both three, the three anode structures are the first anode structure 31, the second anode structure 32 and the third anode structure 33, the three conductive pieces are the first conductive piece 51, the second conductive piece 52 and the third conductive piece 53, the three anode structures are sequentially sleeved from inside to outside, the first anode structure 31 located at the innermost side is a square or circular plate structure, one end of the first conductive piece 51 is connected with the surface of the first anode structure 31 facing away from the substrate 4, and specifically can be connected with any point of the outer frame or the central area of the first anode structure 31, the middle part of the first conductive piece 51 can be connected with the fixed structure 111, and the other end of the first conductive piece 51 is connected with an external power supply; one end of the second conductive piece 52 is connected with the surface of the second anode structure 32 facing away from the substrate 4, and specifically can be connected with any point of the outer frame or the central area of the second anode structure 32, the middle part of the second conductive piece 52 can be connected with the fixed structure 111, and the other end of the second conductive piece 52 is connected with an external power supply; one end of the third conductive piece 53 is connected with the surface of the third anode structure 33 facing away from the substrate 4, and specifically can be connected with any point of the outer frame or the central area of the third anode structure 33, the middle part of the third conductive piece 53 can be connected with the fixed structure 111, and the other end of the third conductive piece 53 is connected with an external power supply.
[0056] Further, the first conductive piece 51 can be connected with the frame of the first anode structure 31 close to the fixed structure 111, the second conductive piece 52 can be connected with the frame of the second anode structure 32 close to the fixed structure 111, and the third conductive piece 53 can be connected with the frame of the third anode structure 33 close to the fixed structure 111, based on the above conductive pieces, the length and volume of the conductive pieces can be reduced, the stability of the whole can be improved, and the space occupation can be reduced, facilitating arrangement.
[0057] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0058] In addition, the terms "first", "second", etc. are used only for the purpose of description, and should not be understood as indicating or implying relative importance or a specific number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0059] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.
Claims
1. A zoned anode mechanism, characterized by, The partitioned main plate (1), the partitioning piece (2), at least two anode structures, and at least two conductive pieces corresponding to the anode structures; The at least two anode structures are arranged on a first surface of the partitioned main plate (1), the projection range of the same anode structure on the first surface corresponds to the same electroplating area on the substrate (4), and the anode structures are separated by the partitioning piece (2) between every two adjacent anode structures, and the anode structures are electrically connected with external power supply through the corresponding conductive pieces. The partitioned main plate (1) is used for connecting the substrate (4). The resistances of the at least two anode structures are the same.
2. The zoned anode mechanism of claim 1, wherein, The at least two conductive pieces are respectively connected with two external power supplies.
3. The zoned anode mechanism of claim 2, wherein, The first surface is arranged in parallel with the electroplating surface of the substrate (4).
4. The zoned anode mechanism of claim 1, wherein, One side of the partitioned main plate (1) is provided with a fixing frame (11), and the at least one conductive piece is connected with the fixing frame (11).
5. The zoned anode mechanism of claim 1, wherein, The fixing frame (11) is provided with at least two fixing structures (111) at intervals, and the fixing structures (111) are used for fixing one of the conductive pieces.
6. The zoned anode mechanism of claim 5, wherein, The partitioned main plate (1) is further provided with a connecting part (12), and the connecting part (12) is detachably connected with the substrate (4).
7. The zoned anode mechanism of claim 1, wherein, The at least two anode structures are arranged in a back type on the first surface of the partitioned main plate (1), the partitioning piece (2) is a ring structure and is sleeved between two adjacent anode structures.
8. The zoned anode arrangement according to any one of claims 1 to 7, characterized in that The number of the anode structures is three, which are a first anode structure (31), a second anode structure (32) and a third anode structure (33), the first anode structure (31) is a square structure and is located at the center position of the first surface, the second anode structure (32) is a ring structure and is sleeved on the outer circumferential side of the first anode structure (31), and the third anode structure (33) is a ring structure and is sleeved on the outer circumferential side of the second anode structure (32).
9. The zoned anode mechanism of claim 8, wherein, 10. The partitioned anode mechanism according to claim 8, wherein The anode structure located on the inner side has a connecting point connected with the conductive piece on the surface away from the substrate (4); The anode structure located on the outermost side has a connecting point connected with the conductive piece on the surface away from the substrate (4), or the anode structure located on the outermost side has a connecting point connected with the conductive piece on the circumferential side.