Heat dissipation module for light-emitting diode (LED)

Abstract

A heat dissipation module for an LED comprises two heat dissipation modules, any heat dissipation module comprises a first substrate, and the two sides of the first substrate are obliquely connected with a second substrate and a third substrate in the same direction respectively; at least two first fins are vertically arranged on the surface of the first substrate, and the first fins and the first substrate are integrally formed; a first riveting structure is arranged on the side face of the second substrate, a second riveting structure is arranged on the side face of the third substrate, and the first riveting structure and the second riveting structure in one heat dissipation module are connected with the second riveting structure and the first riveting structure in the other heat dissipation module respectively. The fins and the substrates are integrally formed, the heat dissipation effect is improved, the two heat dissipation modules are combined into the annular heat dissipation module for the LED through the riveting structure, components can be installed on all the substrates, the use requirement of multi-face assembly is met, the machining process is simple, and cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to physical field especially relates to LED heat dissipation technology, a kind of heat dissipation module for LED particularly. BACKGROUND

[0002] With the rapid development of LED technology, LED lamps are more and more widely used in the field of lighting. A large amount of heat will be generated during the working process of LED lamps, which will seriously affect the service life and luminous efficiency of LED. In the prior art, the LED is installed on the heat dissipation module, and the rib plate and the substrate of the heat dissipation module adopt a split structure, which has high manufacturing cost and unsatisfactory heat dissipation effect. In addition, the mounting surface of the heat dissipation module is located on the upper and lower sides, and only components can be installed on the upper and lower sides, resulting in a small installation area and the inability to install a large number of components, which makes it difficult to increase the power. SUMMARY

[0003] The utility model aims at providing a kind of heat dissipation module for LED, the heat dissipation module for LED solves the technical problems of the rib plate and the substrate in the prior art, which adopt a split structure, have unsatisfactory heat dissipation effect and small installation area.

[0004] The utility model relates to a kind of heat dissipation module for LED, including two heat dissipation modules, any one heat dissipation module each includes first substrate, and the two sides of first substrate are respectively inclinedly connected with one second substrate and one third substrate in the same direction;

[0005] The surface of the first substrate is vertically provided with at least two first ribs, the first rib is integrally formed with the first substrate, the first rib is arranged along the width direction of the first substrate, and the length direction of the first rib is parallel to the length direction of the first substrate;

[0006] The surface of the second substrate is vertically provided with at least two second ribs, the second rib is integrally formed with the second substrate, the second rib is arranged along the width direction of the second substrate, and the length direction of the second rib is parallel to the length direction of the second substrate;

[0007] The surface of the third substrate is vertically provided with at least two third ribs, the third rib is integrally formed with the third substrate, the third rib is arranged along the width direction of the third substrate, and the length direction of the third rib is parallel to the length direction of the third substrate;

[0008] The side surface of the second substrate is provided with a first riveting structure, the side surface of the third substrate is provided with a second riveting structure, the first riveting structure and the second riveting structure in one of the heat dissipation modules are connected with the second riveting structure and the first riveting structure in the other heat dissipation module, respectively.

[0009] Further, the height of each first, second and third fin decreases from the middle of the first, second and third substrate to both sides in turn.

[0010] Further, the second and third substrate forms an angle of 60° with the first substrate.

[0011] Compared with the prior art, the effect of the utility model is positive and obvious. The fin and the substrate are integrally formed, the heat dissipation effect is improved, two heat dissipation modules are combined into a ring-shaped LED heat dissipation module by riveting structure, components can be installed on each substrate, the use requirement of multi-surface assembly is met, the processing process is simple, and the cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a schematic diagram of a LED heat dissipation module.

[0013] Figure 2 It is a structural schematic diagram of the heat sink body.

[0014] Figure 3 It is a structural schematic diagram of the pressure jig.

[0015] Figure 4 It is a structural schematic diagram of the riveting jig.

[0016] Figure 5 It is a schematic diagram of the heat sink body inserted into the pressure jig.

[0017] Figure 6 It is a schematic diagram of the heat sink body deformed under the action of the riveting jig.

[0018] Figure 7 It is a schematic diagram of a heat dissipation module in the LED heat dissipation module.

[0019] Figure 8 It is a schematic diagram of the two heat dissipation modules being riveted in the riveting jig. DETAILED DESCRIPTION

[0020] The utility model is further described below in combination with the embodiments, but the utility model is not limited to the embodiments, and any similar change of the utility model should be included in the protection scope of the utility model. The use of the directions such as up, down, front, back, left, right, middle, inside and outside in the utility model is only for the convenience of clear description, and not for the limitation of the technical scheme of the utility model.

[0021] As Figure 1As shown, a heat dissipation module for LEDs according to this utility model includes two heat dissipation modules 4. Each heat dissipation module 4 includes a first substrate 1. A second substrate 2 and a third substrate 3 are respectively connected to the two sides of the first substrate 1 in the same direction.

[0022] At least two first ribs 5 are vertically disposed on the surface of the first substrate 1. The first ribs 5 are integrally formed with the first substrate 1. The first ribs 5 are spaced apart along the width direction of the first substrate 1, and the length direction of the first ribs 5 is parallel to the length direction of the first substrate 1.

[0023] At least two second ribs are vertically disposed on the surface of the second substrate 2. The second ribs are integrally formed with the second substrate 2. The second ribs are spaced apart along the width direction of the second substrate 2, and the length direction of the second ribs is parallel to the length direction of the second substrate 2.

[0024] At least two third ribs are vertically disposed on the surface of the third substrate 3. The third ribs are integrally formed with the third substrate 3. The third ribs are spaced apart along the width direction of the third substrate 3, and the length direction of the third ribs is parallel to the length direction of the third substrate 3.

[0025] The second substrate 2 has a first riveting structure 6 on its side, and the third substrate 3 has a second riveting structure 7 on its side.

[0026] The first riveting structure 6 and the second riveting structure 7 in one heat dissipation module 4 are respectively connected to the second riveting structure 7 and the first riveting structure 6 in another heat dissipation module 4.

[0027] Furthermore, the heights of each of the first rib 5, the second rib, and the third rib decrease sequentially from the middle of the first substrate 1, the second substrate 2, and the third substrate 3 to both sides.

[0028] Furthermore, the second substrate 2, the third substrate 3, and the first substrate 1 are all at a 60° angle to each other.

[0029] Specifically, the specific structure and principle of the substrate, ribs, riveting structure and other components in this utility model, as well as other aspects not described in detail, all adopt well-known solutions in the prior art, which are already understood by those skilled in the art, and will not be elaborated here.

[0030] The assembly process of LED heat dissipation modules: (e.g.) Figure 2 The image shows the heat sink body. V-grooves are provided between the first substrate 1 and the second substrate 2, and between the first substrate 1 and the third substrate 3 within the heat sink body. Figure 3 As a pressure-bearing fixture, Figure 4 For riveting fixtures, such as Figure 5 As shown, first insert the radiator body into the pressure fixture, such as... Figure 6As shown, the downward pressure of the riveting jig on the radiator body makes the radiator body deformed until the riveting jig and the pressure jig are attached, and the deformation of the radiator body is completed. Figure 7 As shown, a radiator module 4 is formed, and the pressure jig is removed. Another radiator module 4 is formed in the same way as above. As shown, Figure 8 As shown, two radiator modules 4 are respectively loaded into two riveting jigs, and pressure is applied to one of the riveting jigs, so that the two riveting jigs are completely attached, and the first riveting structure 6 and the second riveting structure 7 of one of the radiator modules 4 are respectively buckled with the first riveting structure 6 and the second riveting structure 7 of the other radiator module 4. The riveting jig is removed, and the LED radiator module combination is completed.

[0031] The rib plate and the substrate are integrally formed, the heat dissipation effect is improved, two radiator modules 4 are combined into an annular LED radiator module by the riveting structure, components can be installed on each substrate, the use demand of multi-surface assembly is met, the processing process is simple, and the cost is reduced.

Claims

1. A heat dissipation module for LEDs, characterized in that, It includes two heat dissipation modules, each of which includes a first substrate. A second substrate and a third substrate are respectively connected to the two sides of the first substrate in the same direction. At least two first ribs are vertically disposed on the surface of the first substrate. The first ribs are integrally formed with the first substrate. The first ribs are spaced apart along the width direction of the first substrate, and the length direction of the first ribs is parallel to the length direction of the first substrate. At least two second ribs are vertically disposed on the surface of the second substrate. The second ribs are integrally formed with the second substrate. The second ribs are spaced apart along the width direction of the second substrate, and the length direction of the second ribs is parallel to the length direction of the second substrate. At least two third ribs are vertically disposed on the surface of the third substrate. The third ribs are integrally formed with the third substrate. The third ribs are spaced apart along the width direction of the third substrate, and the length direction of the third ribs is parallel to the length direction of the third substrate. The second substrate has a first riveting structure on its side, and the third substrate has a second riveting structure on its side. The first riveting structure and the second riveting structure in one of the heat dissipation modules are respectively connected to the second riveting structure and the first riveting structure in the other heat dissipation module.

2. The heat dissipation module for LEDs according to claim 1, characterized in that, The heights of the first, second, and third ribs decrease sequentially from the middle of the first, second, and third substrates towards both sides.

3. The heat dissipation module for LEDs according to claim 1, characterized in that, The second substrate, the third substrate, and the first substrate are all at a 60° angle to each other.

Images