Switching fixture applied to negative impedance test of quartz oscillator IC

Abstract

The utility model discloses a switching jig applied to a quartz oscillator IC negative impedance test, which belongs to the field of quartz crystal oscillator detection jigs, and is characterized in that a placing groove module comprises n placing grooves which are sequentially arranged from bottom to top, and four metal columns are arranged on the periphery of each placing groove; n represents a natural number greater than or equal to 2; the plane area of the placing groove in the lower layer is smaller than that of the placing groove in the upper layer; the bottom of the metal column penetrates through the PCB, and a connecting section protrudes from the bottom surface of the PCB; and a pressing table is arranged below the cover plate and is used for pressing the quartz crystal oscillator placed in the placing groove. The utility model aims to provide the switching jig applied to the negative impedance test of the quartz oscillator IC, the problem of welding connection of the quartz crystal oscillator and the negative impedance tester is avoided, and the test efficiency and the test precision are greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of quartz crystal oscillator detection fixture, specifically relates to a switching fixture for quartz oscillator IC negative impedance test. BACKGROUND

[0002] Quartz crystal oscillator negative impedance refers to the reverse compensation parameter index increased by design approach for improving the crystal oscillator starting ability.

[0003] Quartz crystal oscillator negative impedance test is a necessary test (such as: CN206649083U), and the purpose is to avoid that crystal oscillator cannot start.

[0004] At present, in the test process of quartz oscillator negative impedance, the oscillator is connected with negative impedance tester mainly by artificial soldering connection line. However, the artificial soldering connection line has the following shortcomings:

[0005] Shortcoming one: the length of soldered lead, impurities in soldering tin and other factors can cause the fluctuation of test line stray capacitance, thereby affecting the test result.

[0006] Shortcoming two: the soldering lead PAD of the oscillator is small, and the artificial soldering is difficult, and in addition, the soldering can cause product damage in the process of repeated test products.

[0007] Shortcoming three: when different products need to be replaced for testing, the soldering method is slow, which greatly affects the test efficiency.

[0008] Therefore, it is necessary to develop a new switching fixture for quartz crystal oscillator negative impedance test. UTILITY MODEL CONTENT

[0009] The utility model aims at the shortage of prior art, and provides a switching fixture for quartz oscillator IC negative impedance test.

[0010] The technical scheme of the utility model is as follows:

[0011] A switching fixture for quartz oscillator IC negative impedance test, comprising: a placing groove module, a cover plate module and a PCB board, the placing groove module and the cover plate module are arranged above the PCB board;

[0012] Wherein, the placing groove module comprises: n placing grooves arranged from bottom to top, and four metal columns are arranged around each placing groove; n represents a natural number greater than or equal to 2; the plane area of the placing groove of the next layer is smaller than that of the last layer; the bottom of the metal column penetrates through the PCB board and protrudes a connecting segment on the bottom surface of the PCB board;

[0013] The cover plate module comprises a fixing rod, a fixing shaft and a cover plate assembly, the fixing shaft is fixedly arranged on the fixing rod, the fixing rod is fixedly arranged on the upper surface of the PCB, and the middle part of the cover plate assembly is provided with a circular hole, the cover plate assembly is sleeved on the fixing shaft, and the circular hole is matched with the size of the fixing shaft.

[0014] The cover plate assembly further comprises n cover plates, and a pressing table is arranged below each cover plate and used for pressing a quartz crystal oscillator placed in a placing groove.

[0015] Further, the centers of the n placing grooves are on the same vertical line.

[0016] Further, the metal column is vertically arranged.

[0017] Further, n is 3, and the three placing grooves are respectively used for placing a 2016 type quartz crystal oscillator, a 3225 type quartz crystal oscillator and a 7050 type quartz crystal oscillator.

[0018] Further, the materials of the placing grooves and the cover plate module are both insulating materials.

[0019] Further, the materials of the placing grooves and the cover plate module are both plastics.

[0020] Further, the n placing grooves are sequentially called first to nth placing grooves from top to bottom, and the depths of the first to nth placing grooves are sequentially recorded as h1 to hn; the pressing tables below the n cover plates are sequentially called first to nth pressing tables, the first to nth pressing tables correspond to the first to nth placing grooves respectively, the height of the first pressing table is greater than h1, the height of the second pressing table is greater than h1+h2, and the height of the nth pressing table is greater than h1+h2+…+hn.

[0021] The application has the following beneficial effects:

[0022] Firstly, the application provides a switching jig applied to negative impedance testing of a quartz oscillator IC. Each time the negative impedance testing of a quartz crystal oscillator is performed, the quartz crystal oscillator only needs to be placed in a corresponding placing groove, and then the quartz crystal oscillator is pressed down by a corresponding cover plate, thereby avoiding the problem of welding connection between the quartz crystal oscillator and the negative impedance tester, and greatly improving the testing efficiency and testing accuracy.

[0023] Second, the key design of the application is that: "n placement slots arranged from bottom to top, the plane area of the next layer of placement slot is smaller than the plane area of the last layer of placement slot (the two adjacent placement slots: the next layer of placement slot is used for smaller size quartz crystal oscillator, and the last layer of placement slot is used for larger size quartz crystal oscillator)", "the cover plate assembly is sleeved on the fixed shaft, and the cover plate corresponds to the placement slot in size". BRIEF DESCRIPTION OF DRAWINGS

[0024] The application will be further described in detail below with reference to the embodiments in the drawings, but does not constitute any limitation on the application.

[0025] Figure 1 is a three-dimensional structure diagram of a switching fixture applied to quartz oscillator IC negative impedance test according to embodiment one.

[0026] Figure 2 is a three-dimensional structure design diagram of the placement slot module and the PCB board according to embodiment one.

[0027] Figure 3 is a top view design diagram of the placement slot module and the PCB board according to embodiment one.

[0028] Figure 4 is a design diagram of the metal column and the PCB board according to embodiment one.

[0029] Figure 5 is a bottom view of the PCB board according to embodiment one.

[0030] Figure 6 is a three-dimensional design schematic diagram of the cover plate module and the PCB board according to embodiment one.

[0031] Figure 7 is a bottom view of the cover plate module according to embodiment one.

[0032] The following is a description of the reference signs:

[0033] Switching fixture 1000;

[0034] Placement slot module 100, placement slot 101, metal column 102;

[0035] Cover plate module 200, fixed rod 201, fixed shaft 202, cover plate assembly 203, round hole 203-1, pressing table 204;

[0036] PCB board 300. DETAILED DESCRIPTION

[0037] In order to explain the technical content, structural features, purposes and effects of the application in detail, the following will be described in detail in combination with the embodiments and the drawings.

[0038] <Embodiment one: a switching fixture applied to the negative impedance test of quartz oscillator IC>

[0039] Figure 1 A three-dimensional structure diagram of a switching fixture 1000 applied to the negative impedance test of quartz oscillator IC is shown. A switching fixture 1000 applied to the negative impedance test of quartz oscillator IC, comprising: a placement slot module 100, a cover plate module 200, a PCB board 300, the placement slot module 100 and the cover plate module 200 are arranged above the PCB board 300.

[0040] Figure 2 A three-dimensional structure design diagram of the placement slot module and the PCB board is shown, Figure 3 A top view design diagram of the placement slot module and the PCB board is shown. The placement slot module 100 comprises: a plurality of placement slots 101 arranged from bottom to top (different sizes of quartz crystal oscillators are placed into different placement slots 101), and 4 metal columns 102 are arranged around each placement slot. The planar area of the placement slot of the next layer is smaller than that of the upper layer. The centers of the plurality of placement slots are on the same vertical line, i.e. the centers of the plurality of placement slots are the same point in the top view.

[0041] Each placement slot corresponds to a size of quartz crystal oscillator. For two adjacent placement slots above and below: the placement slot of the next layer is used for smaller size quartz crystal oscillator, and the placement slot of the upper layer is used for larger size quartz crystal oscillator.

[0042] Figure 4 A design diagram of the metal column 102 is shown. Figure 5 A bottom view of the PCB board is shown. From Figure 4 and Figure 5 It can be seen that the metal columns 102 are vertically arranged, the bottom of the metal column penetrates through the PCB board 300 and extends at the bottom of the PCB board 300 to be provided with a connecting section, and the connecting section is connected with a negative impedance tester (not shown in the figure). Figures 1-7

[0043] Figure 6 and Figure 7 ​The design of the cover plate module 200 is shown. The cover plate module 202 comprises a fixed rod 201, a fixed shaft 202, and a cover plate assembly 203. The fixed shaft 202 is fixedly arranged on the fixed rod 201. The cover plate assembly 203 is arranged with a circular hole 203-1 in the middle. The cover plate assembly 203 is sleeved on the fixed shaft, and the circular hole 203-1 is matched with the size of the fixed shaft 202. The cover plate assembly 203 further comprises a plurality of cover plates. The lower side of each cover plate is arranged with a pressing table 204. The planar shape of the pressing table of the lower side of each cover plate is different, which is matched with the planar shape of the placing groove.

[0044] The working process of the switching jig 1000 for testing the negative impedance of the quartz oscillator IC is as follows:

[0045] S1, placing the quartz crystal oscillator into the corresponding placing groove;

[0046] S2, manually rotating the cover plate module 202 so that the cover plate corresponding to the placing groove is vertically corresponding to the placing groove;

[0047] S3, manually pressing the cover plate module 202 downward so that the lower surface of the pressing table of the cover plate is in contact with the upper surface of the quartz crystal oscillator. The cover plate ensures that the quartz crystal oscillator is in contact with the four metal columns corresponding to the placing groove, avoiding poor contact during testing.

[0048] The quartz crystal oscillator only needs to be placed into the corresponding placing groove, and then the quartz crystal oscillator is pressed tightly downward by the cover plate during the negative impedance test of the quartz crystal oscillator. Thus, the problem of welding connection between the quartz crystal oscillator and the negative impedance tester is avoided.

[0049] It should be noted that the materials of the placing groove and the cover plate module are both insulating materials, such as plastic.

[0050] It should be noted that the plurality of placing grooves are designed in a stepped manner, which facilitates the placement of quartz crystal oscillators of different sizes.

[0051] It should be noted that the n placing grooves are sequentially referred to as the first to the nth placing grooves from top to bottom, and their depths are sequentially recorded as h1 to hn. The n pressing tables below the cover plates are sequentially referred to as the first to the nth pressing tables, which correspond to the first to the nth placing grooves respectively. The height of the first pressing table is greater than h1, the height of the second pressing table is greater than h1+h2, and the height of the nth pressing table is greater than h1+h2+…+hn. The above design is used to ensure that the pressing table presses the quartz crystal oscillator tightly.

[0052] The above-mentioned embodiments are preferred embodiments of the present application, which are only used for conveniently illustrating the present application, and do not limit the present application in any form, and any person with ordinary knowledge in the art can make equivalent embodiments with partial changes or modifications within the technical features disclosed by the present application without departing from the technical features of the present application, and the equivalent embodiments still belong to the scope of the technical features of the present application.

Claims

1. An adapter fixture for testing a negative impedance of a quartz oscillator IC, the adapter fixture comprising: The utility model relates to a quartz crystal oscillator placing device, including: The placing groove module and the cover plate module are arranged above the PCB board; The placing groove module includes n placing grooves arranged from bottom to top, and four metal columns are arranged around each placing groove; n represents a natural number greater than or equal to 2; the plane area of the placing groove of the next layer is smaller than that of the previous layer; the bottom of the metal column penetrates the PCB board and has a connecting section protruding from the bottom surface of the PCB board; The cover plate module includes a fixed rod, a fixed shaft and a cover plate assembly; the fixed shaft is fixedly arranged on the fixed rod, and the fixed rod is fixedly arranged on the upper surface of the PCB board; the middle part of the cover plate assembly is provided with a circular hole, the cover plate assembly is sleeved on the fixed shaft, and the size of the circular hole and the fixed shaft is matched; The cover plate assembly further includes n cover plates, and the lower part of each cover plate is provided with a pressing table for pressing a quartz crystal oscillator placed in the placing groove.

2. The adapter jig of claim 1, wherein, The centers of the n placing grooves are on the same vertical line.

3. The adapter of claim 1, wherein, The metal columns are vertically arranged.

4. The adapter of claim 1, wherein, n is 3, and the three placing grooves are respectively used for placing a 2016 type quartz crystal oscillator, a 3225 type quartz crystal oscillator and a 7050 type quartz crystal oscillator.

5. The adapter of claim 1, wherein, The materials of the placing groove and the cover plate module are both insulating materials.

6. The adapter jig of claim 5, wherein, The materials of the placing groove and the cover plate module are both plastics.

7. The adapter of claim 1, wherein, The n placing grooves are sequentially called first to nth placing grooves from top to bottom, and their depths are sequentially recorded as h1 to hn; the pressing tables below the n cover plates are sequentially called first to nth pressing tables, the first to nth placing grooves correspond to the first to nth pressing tables respectively, the height of the first pressing table is greater than h1, the height of the second pressing table is greater than h1+h2, and the height of the nth pressing table is greater than h1+h2+…+hn.

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