Wafer surface treatment device

Abstract

The utility model provides a wafer surface processing device, comprising a rotating mechanism unit comprising a first pedestal and a rotating table which is rotatably arranged on the first pedestal and is provided with a bearing surface used for placing a wafer; the gluing mechanism unit comprises a gluing spray head, and the gluing spray head is used for gluing the surface of the wafer on the rotating table; the drying mechanism comprises a drying lamp, the position of the drying lamp is adjustable, the drying lamp is provided with a first working position and a first avoiding position which are oppositely arranged, and the drying lamp is located on the outer side of the rotating table; and the grabbing mechanism is used for grabbing the wafer on the first station to the rotating table, and the grabbing mechanism is used for grabbing the wafer on the rotating table to the second station. The problems that in the prior art, the wafer is manually transferred to an independent heating table to be cured, new pollution or damage is easily caused in the transferring process of the wafer coated with a photoresist layer, and the consistency of the thickness of photoresist and the curing effect are affected are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer surface treatment device technical field, specifically, relate to a wafer surface treatment device. BACKGROUND

[0002] Wafer in the semiconductor manufacturing field refers to the thin disc-shaped semiconductor material substrate for manufacturing integrated circuits or other microelectronic devices. In the semiconductor manufacturing process, wafer surface spin coating is a key process, mainly used for forming a photoresist layer in the photoetching process to realize accurate transfer of microelectronic device circuit patterns. At present, most photoresists exist in the form of solution during coating, and the solution contains polymers and solvents. After coating, the glue solution needs to be heated by the drying mechanism for curing treatment to realize the curing of the photoresist film.

[0003] In the traditional method, the spin coating and heating curing process are separated, and the transfer medium is usually spin coated on a laboratory level spin coater, and then the operator manually transfers the wafer to an independent heating table for curing treatment. The above setting makes the wafer coated with glue layer extremely easy to introduce new pollution or damage during the transfer process, affecting the consistency of the photoresist thickness and the curing effect. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of wafer surface treatment device to solve the operator manually transfers wafer to independent heating table for curing treatment in prior art, it is easy to cause wafer coated with glue layer to introduce new pollution or damage during the transfer process, affect the consistency of the photoresist thickness and the curing effect problem.

[0005] The utility model provides a kind of wafer surface treatment device, it includes: rotating mechanism unit, including first base and rotating table, rotating table is rotatably arranged on first base, and rotating table has bearing surface, and bearing surface is used to place wafer;Glue coating mechanism unit, including glue coating nozzle, and glue coating nozzle is used to the surface of wafer on rotating table for glue coating;Drying mechanism, including drying lamp, the position of drying lamp is adjustable, and drying lamp has oppositely arranged first working position and first avoiding position, when drying lamp is in first working position, drying lamp is oppositely arranged with rotating table to dry the glue solution on wafer surface;When drying lamp is in first avoiding position, drying lamp is located at the outside of rotating table;Grabbing mechanism, grabbing mechanism is used to grab wafer on first station to rotating table, and grabbing mechanism is used to grab wafer on rotating table to second station.

[0006] Further, the drying mechanism further comprises a second base and a first support rod, the first support rod is parallel to the axis of the rotating table, the first support rod is located outside the rotating table, the first support rod is rotatably arranged on the second base, the drying lamp is perpendicular to the first support rod, and the drying lamp is arranged on one end of the first support rod away from the second base.

[0007] Further, the gluing mechanism unit comprises a third base and a gluing part, the gluing part has a gluing nozzle, the gluing part is movably arranged on the third base to adjust the position of the gluing nozzle, the gluing nozzle has a second working position and a second avoiding position arranged oppositely, when the gluing nozzle is in the second working position, the gluing nozzle is arranged opposite to the rotating table to glue the surface of the wafer, and when the gluing nozzle is in the second avoiding position, the gluing nozzle is located outside the rotating table.

[0008] Further, the gluing part comprises a second support rod and a gluing nozzle, the second support rod comprises a first rod segment and a second rod segment connected to each other, the first rod segment is perpendicular to the second rod segment, the first rod segment is parallel to the axis of the rotating table, the first rod segment is located outside the rotating table, and one end of the first rod segment away from the second rod segment is rotatably arranged on the third base, and the gluing nozzle is arranged on one end of the second rod segment away from the first rod segment.

[0009] Further, the wafer surface treatment device further comprises an aligning mechanism, the aligning mechanism comprises an aligning part, and the aligning part is used to adjust the coaxiality of the wafer and the rotating table.

[0010] Further, the aligning mechanism comprises a support frame and an aligning part, the aligning part is arranged outside the rotating table, the aligning part is movably arranged on the support frame, the distance between the aligning part and the rotating table is adjustable, and one side of the aligning part facing the rotating table has an abutting surface used to abut against the circumferential surface of the wafer.

[0011] Further, the first base has a mounting port and a negative pressure cavity connected to each other, the mounting port is connected to the top of the negative pressure cavity, the rotating table has a communication hole, a negative pressure channel and a suction port connected to each other in sequence, the bottom end of the rotating table is rotatably arranged in the negative pressure cavity, the rotating table is sealingly matched with the mounting port, the communication hole is connected to the negative pressure cavity, the top surface of the rotating table forms a bearing surface, and the suction port is arranged on the bearing surface.

[0012] Further, the first base has an avoiding port and an avoiding cavity connected to each other, the avoiding port is arranged at the top of the avoiding cavity, the cross-sectional area of the avoiding port is larger than the cross-sectional area of the wafer, and the rotating table is located in the avoiding cavity and is liftably arranged on the first base so that the bearing surface is located outside the first base or in the avoiding cavity.

[0013] Further, the wafer surface treatment device further comprises: a carrier table arranged at the first station and / or the second station, the carrier table having a containing space, one side of the containing space having a grabbing window, a plurality of partitions being arranged in the containing space, the plurality of partitions being distributed along an extension direction of the grabbing window, one wafer being placed between two adjacent partitions.

[0014] Further, the grabbing mechanism comprises: a fourth base; a lifting rod arranged on the fourth base in a liftable manner; a plurality of mechanical arms, the plurality of mechanical arms extending along a horizontal direction, the plurality of mechanical arms being connected in sequence, end portions of two adjacent mechanical arms being rotationally connected to each other, rotation axes of the two adjacent mechanical arms extending along a vertical direction, the mechanical arm at one end portion being rotationally arranged on the lifting rod, and the mechanical arm at the other end portion being used for grabbing the wafer.

[0015] The technical scheme of the utility model, through setting the position adjustable drying lamp, when the glue spraying head finishes coating glue on the surface of the wafer on the rotary table, the drying lamp moves to the first working position, the drying lamp is opposite to the rotary table, the drying lamp dries the glue liquid on the surface of the wafer, after drying, the drying lamp moves to the first avoiding position. By setting in this way, after spin coating, the wafer does not need to change the spatial position to carry out the drying process, the continuity of the spin coating process and the drying solidification process of the wafer is improved, the possibility of pollution and damage to the wafer due to wafer transfer after spin coating is reduced, and the consistency of photoresist thickness and the solidification effect are improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] The drawings accompanying the specification of this application form a part of the application and serve to further provide a further understanding of the application, the illustrative embodiments of the application and the explanations thereof serve to explain the application without constituting an improper limitation of the application. In the drawings:

[0017] Figure 1 A structure schematic view of a wafer surface treatment device provided by the utility model is shown;

[0018] Figure 2 A first perspective view of part of the structure of the wafer surface treatment device provided by the utility model is shown;

[0019] Figure 3 A second perspective view of part of the structure of the wafer surface treatment device provided by the utility model is shown;

[0020] Figure 4 A top view of the structure of the wafer surface treatment device provided by the utility model is shown;

[0021] Figure 5 A top view of part of the structure of the wafer surface treatment device provided by the utility model is shown.

[0022] Wherein, the above-mentioned drawings include the following reference signs:

[0023] 01, wafer;

[0024] 10, rotating mechanism unit; 11, first base; 111, avoiding opening; 112, avoiding cavity; 12, rotating table;

[0025] 20, gluing mechanism unit;

[0026] 21, gluing nozzle;

[0027] 22, gluing part; 221, second support rod; 2211, first rod segment; 2212, second rod segment;

[0028] 30, drying mechanism; 31, drying lamp; 32, first support rod;

[0029] 40, grabbing mechanism; 41, fourth base; 42, mechanical arm;

[0030] 50, support frame;

[0031] 60, aligning mechanism; 601, abutting surface; 61, aligning part;

[0032] 80, object table; 801, grabbing window; 81, separating part. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The description of the at least one exemplary embodiment is actually only illustrative, but not as any limitation on the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] As Figures 1 to 5The utility model provides a kind of wafer surface treatment device, it includes rotating mechanism unit 10, glue applying mechanism unit 20, drying mechanism 30 and grabbing mechanism 40, rotating mechanism unit 10 includes first base 11 and rotating table 12, rotating table 12 is rotatably arranged on first base 11, rotating table 12 has bearing surface, and bearing surface is used to place wafer 01;Glue applying mechanism unit 20 includes glue applying spray head 21, and glue applying spray head 21 is used to the surface of wafer 01 on rotating table 12 is glued;Drying mechanism 30 includes drying lamp 31, the position of drying lamp 31 is adjustable, drying lamp 31 has oppositely arranged first working position and first avoiding position, when drying lamp 31 is in first working position, drying lamp 31 is oppositely arranged with rotating table 12 to dry the glue solution on the surface of wafer 01;When drying lamp 31 is in first avoiding position, drying lamp 31 is located the outside of rotating table 12;Grabbing mechanism 40 is used to grab wafer 01 on first station to rotating table 12, and grabbing mechanism 40 is used to grab wafer 01 on rotating table 12 to second station.

[0035] The utility model discloses a technical scheme, through setting adjustable drying lamp 31 of position, when glue applying spray head 21 is glued to the surface of wafer 01 on rotating table 12 is completed, drying lamp 31 moves to first working position, and drying lamp 31 is oppositely arranged with rotating table 12, and drying lamp 31 is dried to the glue solution on the surface of wafer 01, and drying lamp 31 moves first avoiding position after drying ends.Such setting, after spin coating, it is not necessary to change the spatial position of wafer 01 and carry out drying process again, improve the coherence of the spin coating process and drying solidification process to wafer 01, reduce the possibility of pollution and damage to wafer 01 due to wafer 01 transfer after spin coating, improve the consistency of photoresist thickness and solidification effect.

[0036] Specifically, in the initial state, the wafer 01 is stored in the first station, when starting to process the surface of the wafer 01, the grabbing mechanism 40 grabs the wafer 01 in the first station to the bearing surface of the rotating table 12, then the grabbing mechanism 40 is separated from the wafer 01, the glue spraying head 21 sprays glue liquid to the surface of the wafer 01 on the rotating table 12; then the rotating table 12 starts to rotate with the wafer 01, with the rotation of the wafer 01, the surface of the wafer 01 is gradually coated with glue liquid; then the rotating table 12 stops rotating, the drying lamp 31 moves from the first avoiding position to the first working position, the drying lamp 31 heats and dries the glue liquid on the surface of the wafer 01, accelerates the solidification process of the glue liquid on the surface of the wafer 01; after drying, the drying lamp 31 moves to the first avoiding position, and the grabbing mechanism 40 grabs the wafer 01 from the rotating table 12 to the second station for temporary storage, so as to carry out subsequent processing. This process improves the efficiency and quality of wafer 01 surface processing, and has high automation. After the wafer 01 is coated with glue, the space position of the wafer 01 does not need to be changed before drying, which reduces the pollution and damage caused by manual operation.

[0037] As shown in Figure 3 Further, the drying mechanism 30 further comprises a second base and a first supporting rod 32, the extending direction of the first supporting rod 32 is parallel to the axis direction of the rotating table 12, the first supporting rod 32 is located outside the rotating table 12, the first supporting rod 32 is rotatably arranged on the second base, the drying lamp 31 is perpendicular to the first supporting rod 32, and the drying lamp 31 is arranged on one end of the first supporting rod 32 away from the second base. By arranging the second base and the first supporting rod 32, a flexible and stable operation platform is provided for the drying lamp 31, so that the drying lamp 31 can adjust the position according to the actual needs, thereby more effectively drying the glue liquid on the surface of the wafer 01, and improving the flexibility of the wafer surface processing device.

[0038] Specifically, when it is needed to dry the surface of the wafer 01, the first supporting rod 32 rotates, driving the drying lamp 31 perpendicular to the first supporting rod 32 to rotate around the axis of the first supporting rod 32 until the drying lamp 31 moves to the first working position, and then the drying lamp 31 dries the glue liquid on the surface of the wafer 01.

[0039] In the embodiment of the present scheme, the drying lamp 31 extends in the horizontal direction, and when the drying lamp 31 is in the first working position, the drying lamp 31 is arranged opposite to the wafer 01 on the rotating table 12.

[0040] Further, the device further comprises a first driving member, the first driving member is arranged on the second base and is drivingly connected with the first supporting rod 32, so as to rotate the first supporting rod 32.

[0041] As shown in Figure 2 and Figure 3As shown, further, the gluing mechanism unit 20 comprises a third base and a gluing part 22, the gluing part 22 is movably arranged on the third base to adjust the position of the gluing nozzle 21, the gluing nozzle 21 has a second working position and a second avoiding position arranged oppositely, when the gluing nozzle 21 is in the second working position, the gluing nozzle 21 is arranged oppositely to the rotary table 12 to glue the surface of the wafer 01; when the gluing nozzle 21 is in the second avoiding position, the gluing nozzle 21 is located outside the rotary table 12. By arranging the third base and the gluing part 22, the position of the gluing nozzle 21 can be accurately controlled and flexibly adjusted to smoothly glue the surface of the wafer 01.

[0042] Specifically, when it is needed to glue the surface of the wafer 01, the gluing part 22 drives the gluing nozzle 21 to move from the second avoiding position to the second working position, at this time, the gluing nozzle 21 is arranged oppositely to the rotary table 12, the rotary table 12 drives the wafer 01 to start rotating, and the gluing nozzle 21 sprays the glue liquid to the surface of the wafer 01. After gluing, the gluing nozzle 21 is located outside the rotary table 12. In this way, the grabbing mechanism 40 can grab and place the wafer 01, avoiding the possibility of interference between the gluing nozzle 21 and the grabbing mechanism 40.

[0043] In the embodiment of the present scheme, when the gluing nozzle 21 is in the second working position, the gluing nozzle 21 is coaxially arranged with the wafer 01. In this way, the uniformity of spin coating can be improved.

[0044] Further, the gluing part 22 comprises a second supporting rod 221 and the gluing nozzle 21, the second supporting rod 221 comprises a first rod segment 2211 and a second rod segment 2212 connected to each other, the first rod segment 2211 is perpendicular to the second rod segment 2212, the extension direction of the first rod segment 2211 is parallel to the axis direction of the rotary table 12, the first rod segment 2211 is located outside the rotary table 12, and the end of the first rod segment 2211 away from the second rod segment 2212 is rotatably arranged on the third base, and the gluing nozzle 21 is arranged at the end of the second rod segment 2212 away from the first rod segment 2211. By arranging the second supporting rod 221 and arranging the first rod segment 2211 and the second rod segment 2212 on the second supporting rod 221, the adjustment of the spatial position of the gluing nozzle 21 is more accurate and reliable.

[0045] In the embodiment of the present scheme, when it is needed to change the spatial position of the gluing nozzle 21, the first rod segment 2211 is first rotated, which drives the second rod segment 2212 to rotate around the axis of the first rod segment 2211, and thus drives the gluing nozzle 21 arranged at the end of the second rod segment 2212 away from the first rod segment 2211 to rotate around the axis of the first rod segment 2211, so as to adjust the spatial position of the gluing nozzle 21.

[0046] Further, the device further comprises a second driving member, the second driving member is arranged on the third base, and the second driving member is in driving connection with the first rod segment 2211 to drive the first rod segment 2211 to rotate.

[0047] As shown in Figures 1 to 3 Further, the wafer surface treatment device further comprises an aligning mechanism 60, the aligning mechanism 60 comprises an aligning part 61, and the aligning part 61 is used to adjust the coaxiality of the wafer 01 and the rotating table 12. The aligning part 61 can accurately adjust the position of the wafer 01 before the rotating table 12 drives the wafer 01 to rotate, so that the wafer 01 and the rotating table 12 have high coaxiality, and the stability of the rotating table 12 driving the wafer 01 to rotate is improved, so as to uniformly coat the surface of the wafer 01.

[0048] Further, the aligning mechanism 60 comprises a support frame 50 and the aligning part 61, the aligning part 61 is arranged outside the rotating table 12, the aligning part 61 is movably arranged on the support frame 50, the distance between the aligning part 61 and the rotating table 12 is adjustable, and the side of the aligning part 61 facing the rotating table 12 has an abutting surface 601, which is used to abut the peripheral surface of the wafer 01. In the embodiment of the present scheme, two aligning parts 61 are arranged, and the two aligning parts 61 are oppositely arranged on the two sides of the rotating table 12, and the shape of the abutting surface 601 is matched with the peripheral surface of the wafer 01.

[0049] The wafer surface treatment device further comprises a third driving member, the third driving member is arranged on the support frame 50, and the third driving member is in driving connection with the two aligning parts 61 respectively to adjust the distance between the two aligning parts 61. In this way, the positions of the two aligning parts 61 can be accurately and synchronously adjusted to realize accurate adjustment of the coaxiality of the wafer 01 and the rotating table 12.

[0050] Specifically, after the grabbing mechanism 40 places the wafer 01 on the rotating table 12, the third driving member drives the two aligning parts 61 to gradually and synchronously approach the rotating table 12. As the two aligning parts 61 gradually approach the rotating table 12, the abutting surfaces 601 of the two aligning parts 61 contact the peripheral surface of the wafer 01. The two aligning parts 61 are slightly moved to adjust the position of the wafer 01, so that the wafer 01 and the rotating table 12 have high coaxiality, the aligning operation is completed, and then the third driving member drives the two aligning parts 61 to synchronously move away from the rotating table 12, so as to perform the next step of coating the surface of the wafer 01.

[0051] In the scheme, the support frame 50 provides stable support for the alignment part 61, so that the movement process of the alignment part 61 is more accurate and stable. The two alignment parts 61 work together to adjust the coaxiality of the wafer 01 and the rotating table 12, ensure the good coaxiality of the wafer 01 and the rotating table 12, and improve the stability of the rotating table 12 driving the wafer 01 to rotate, which is conducive to the uniformity of the wafer 01 surface gluing, and also improves the safety of the wafer 01 rotation, reduces the instability of the wafer 01 rotation caused by the misalignment of the wafer 01 and the rotating table 12, and improves the reliability of the wafer surface treatment device.

[0052] Further, the first base 11 has a mounting port and a negative pressure cavity in communication with each other, the mounting port is in communication with the top of the negative pressure cavity, the rotating table 12 has a communication hole, a negative pressure channel and a suction port in turn, the bottom end of the rotating table 12 is rotatably arranged in the negative pressure cavity, the rotating table 12 is sealingly matched with the mounting port, the communication hole is in communication with the negative pressure cavity, the top surface of the rotating table 12 forms a bearing surface, and the suction port is arranged on the bearing surface. By such arrangement, the wafer 01 can be firmly adsorbed on the rotating table 12, and the stability of the wafer 01 rotation is improved.

[0053] Specifically, the grabbing mechanism 40 places the wafer 01 on the bearing surface of the rotating table 12, under the negative pressure action of the negative pressure cavity, the suction port on the bearing surface adsorbs the wafer 01, and the wafer 01 is firmly adsorbed on the bearing surface of the rotating table 12, so that the rotating table 12 can stably drive the wafer 01 to rotate, and the stability of the wafer 01 rotation is improved. The sealing cooperation between the rotating table 12 and the mounting port improves the air tightness between the negative pressure cavity and the negative pressure channel inside the rotating table 12, and ensures the stability and effectiveness of the negative pressure adsorption.

[0054] Further, the first base 11 has a mounting port and a negative pressure cavity in communication with each other, the mounting port is in communication with the top of the negative pressure cavity, the rotating table 12 has a communication hole, a negative pressure channel and a suction port in turn, the bottom end of the rotating table 12 is rotatably arranged in the negative pressure cavity, the rotating table 12 is sealingly matched with the mounting port, the communication hole is in communication with the negative pressure cavity, the top surface of the rotating table 12 forms a bearing surface, and the suction port is arranged on the bearing surface. By such arrangement, the wafer 01 can be firmly adsorbed on the rotating table 12, and the stability of the wafer 01 rotation is improved.

[0055] In the embodiment of the present scheme, the grabbing mechanism 40 places the wafer 01 to the rotating table 12 before the bearing surface of the rotating table 12 is located outside the first base 11, the bearing surface is located above the avoiding opening 111, and then the grabbing mechanism 40 places the wafer 01 on the bearing surface; the aligning part 61 aligns the wafer 01; after the aligning operation is completed, the rotating table 12 slowly descends, the bearing surface with the wafer 01 adsorbed gradually descends, and then descends into the avoiding cavity 112 through the avoiding opening until it descends to a preset position, and the rotating table 12 stops continuing to descend; then the glue coating nozzle 21 moves to the second working position from the second avoiding position and coats glue on the wafer 01, and the rotating table 12 starts to drive the wafer 01 to rotate. The cross-sectional area of the avoiding opening 111 is greater than the cross-sectional area of the wafer 01, so that the avoiding opening 111 does not interfere with the lifting of the wafer 01.

[0056] When the bearing surface is located outside the first base 11, the grabbing mechanism 40 can accurately place the wafer 01 on the bearing surface, and the aligning part 61 can also adjust the coaxiality of the wafer 01 and the rotating table 12. Then the rotating table 12 descends and drives the wafer 01 to descend into the avoiding cavity 112, and then rotates, so that the rotation of the wafer 01 is more stable, and if the wafer 01 falls off from the rotating table 12, the avoiding cavity 112 can block the fallen wafer 01, thereby improving the flexibility and safety of the wafer surface treatment device.

[0057] As shown in Figure 1 and Figure 4 Further, the wafer surface treatment device further comprises a carrier table 80, the carrier table 80 is arranged at the first working position and the second working position, and the carrier table 80 has a containing space, one side of the containing space has a grabbing window 801, and a plurality of partition parts 81 are arranged in the containing space, the plurality of partition parts 81 are distributed at intervals along the extension direction of the grabbing window 801, and one wafer 01 is arranged between adjacent two partition parts 81. In this way, accurate and stable storage spaces are provided for the wafers 01 before and after treatment.

[0058] In the present scheme, a plurality of partition parts 81 are arranged in the containing space, thereby improving the storage capacity of the wafers 01, making the treatment of the plurality of wafers 01 more convenient and fast, and improving the efficiency of the treatment of the plurality of wafers 01. Only one wafer 01 is arranged on each partition part 81, and each wafer 01 has a separate storage space. Therefore, each wafer 01 can be independently and accurately controlled, and the plurality of wafers 01 do not affect each other, and when a wafer 01 is damaged or has other conditions, only the wafer 01 needs to be treated, and other wafers 01 are not affected, thereby improving the safety and controllability of the wafer surface treatment device.

[0059] As shown in Figure 1As shown, further, the grabbing mechanism 40 comprises a fourth base 41, a lifting rod and a plurality of mechanical arms 42; the lifting rod is arranged on the fourth base 41 in a liftable manner; the plurality of mechanical arms 42 each extend in a horizontal direction, the plurality of mechanical arms 42 are connected in sequence, the end portions of the adjacent two mechanical arms 42 are rotationally connected, the rotation axes of the adjacent two mechanical arms 42 each extend in a vertical direction, the mechanical arm 42 at one end portion is rotationally arranged on the lifting rod, and the mechanical arm 42 at the other end portion is used for grabbing the wafer 01. In this way, the flexibility of the grabbing mechanism 40 is increased, the movement range of the mechanical arm 42 is improved, and the wafer 01 is conveniently and accurately grabbed and moved.

[0060] Specifically, the fourth base 41 provides stable support for the whole grabbing mechanism 40. During the grabbing of the wafer 01 by the grabbing mechanism 40, according to the specific position of the wafer 01, the lifting rod is lifted, and at the same time, the plurality of mechanical arms 42 are rotated, so that the mechanical arm 42 used for grabbing the wafer 01 moves to the most suitable grabbing position of the target wafer 01, and the target wafer 01 is grabbed; then, the lifting rod continues to be lifted, and the plurality of mechanical arms 42 are rotated, so as to transport the wafer 01 to the rotary table 12. The liftable lifting rod and the plurality of rotatable mechanical arms 42 expand the movement range and flexibility of the mechanical arm 42 used for grabbing the wafer 01, so that the grabbing mechanism 40 can more flexibly and accurately grab and transport the wafer 01, and the transportation efficiency and safety of the wafer 01 are improved, and the working efficiency of the wafer surface treatment device is improved.

[0061] In the embodiment of the present scheme, the plurality of wafers 01 in the accommodation space are spaced apart in a vertical direction, and there is a spacing between the adjacent two wafers 01. The end portion of the mechanical arm 42 used for grabbing the wafer 01 has a horizontal grabbing plate, and the end portion of the grabbing plate has a notch adapted to the peripheral surface of the rotary table 12. When the mechanical arm 42 grabs the wafer 01 from the accommodation space, the grabbing plate is inserted into the spacing at the bottom of the target wafer 01, and then the mechanical arm 42 rises, so that the wafer 01 is separated from the corresponding partition 81; when the mechanical arm 42 places the wafer 01 on the rotary table 12, the notch on the grabbing plate is inserted into the side portion of the rotary table 12, and the wafer 01 is placed on the bearing surface; and then the mechanical arm 42 descends and is separated from the wafer 01.

[0062] It should be noted that the terms used herein are only intended to describe specific embodiments and are not intended to limit the example embodiments according to the present application. As used herein, the singular form is intended to include the plural form, unless the context clearly indicates otherwise, and it should also be understood that, when the terms "comprise" and / or "include" are used in the specification, there is a presence of the features, steps, operations, devices, components and / or combinations thereof.

[0063] The foregoing description, for purposes of explanation, sets forth specific values and arrangements of components and steps that are subject to many options. The intent is to be accurate in describing the principles and novel features of the application. Thus, although the application has been described with reference to specific embodiments thereof, it will be apparent to those of ordinary skill in the art that a number of changes can be made to the embodiments described without departing from the spirit and scope of the application. For example, the various features of the application can be combined in any combination, where possible. Accordingly, the scope of the application is to be construed as encompassing modifications and variations of the specific examples described herein, subject only to the conditions of the prior art.

[0064] In the description of the present application, it needs to be understood that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship is usually based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0065] For the convenience of description, spatial relative terms such as "on", "above", "upper surface", "upper" and the like can be used herein to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawing is inverted, the device described as "above" or "on" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the example term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative description used herein is interpreted accordingly.

[0066] In addition, it needs to be explained that the use of "first", "second" and the like to limit parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore, it cannot be understood as a limitation on the scope of protection of the present application.

[0067] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer surface processing apparatus characterized by comprising: The application relates to a wafer coating and drying device. The device comprises a rotating mechanism unit (10), a glue coating mechanism unit (20), a drying mechanism (30) and a grabbing mechanism (40). The rotating mechanism unit (10) comprises a first base (11) and a rotating table (12), the rotating table (12) is rotatably arranged on the first base (11), and the rotating table (12) has a bearing surface for placing a wafer (01). The glue coating mechanism unit (20) comprises a glue coating nozzle (21) for coating the surface of the wafer (01) on the rotating table (12). The drying mechanism (30) comprises a drying lamp (31), the position of the drying lamp (31) is adjustable, the drying lamp (31) has oppositely arranged first working and avoiding positions, when the drying lamp (31) is in the first working position, the drying lamp (31) is oppositely arranged with the rotating table (12) to dry the glue layer on the surface of the wafer (01), and when the drying lamp (31) is in the first avoiding position, the drying lamp (31) is located outside the rotating table (12).

2. The wafer surface processing apparatus according to claim 1, wherein The grabbing mechanism (40) is used for grabbing the wafer (01) on a first station to the rotating table (12), and the grabbing mechanism (40) is used for grabbing the wafer (01) on the rotating table (12) to a second station.

3. The wafer surface processing apparatus according to claim 1, wherein The drying mechanism (30) further comprises a second base and a first supporting rod (32), the extending direction of the first supporting rod (32) is parallel to the axis direction of the rotating table (12), the first supporting rod (32) is located outside the rotating table (12), the first supporting rod (32) is rotatably arranged on the second base, the drying lamp (31) is perpendicular to the first supporting rod (32), and the drying lamp (31) is arranged on one end of the first supporting rod (32) away from the second base. The glue coating mechanism unit (20) comprises a third base and a glue coating part (22), the glue coating part (22) has the glue coating nozzle (21), the glue coating part (22) is movably arranged on the third base to adjust the position of the glue coating nozzle (21), the glue coating nozzle (21) has oppositely arranged second working and avoiding positions, when the glue coating nozzle (21) is in the second working position, the glue coating nozzle (21) is oppositely arranged with the rotating table (12) to coat the surface of the wafer (01), and when the glue coating nozzle (21) is in the second avoiding position, the glue coating nozzle (21) is located outside the rotating table (12).

4. The wafer surface processing apparatus according to claim 3, wherein The glue applying part (22) comprises a second support rod (221) and the glue applying nozzle (21), the second support rod (221) comprises a first rod segment (2211) and a second rod segment (2212) connected with each other, the first rod segment (2211) is perpendicular to the second rod segment (2212), the extending direction of the first rod segment (2211) is parallel to the axial direction of the rotating table (12), the first rod segment (2211) is located outside the rotating table (12), and one end of the first rod segment (2211) away from the second rod segment (2212) is rotatably arranged on the third base.

5. The wafer surface processing apparatus according to claim 1, wherein The wafer surface treatment device further comprises: An aligning mechanism (60) comprising an aligning part (61) for adjusting the coaxiality of the wafer (01) and the rotating table (12).

6. The wafer surface processing apparatus according to claim 5, wherein The aligning mechanism (60) comprises: A support frame (50); The aligning part (61) is arranged outside the rotating table (12), is movably arranged on the support frame (50), and has an adjustable spacing relative to the rotating table (12); and one side of the aligning part (61) facing the rotating table (12) has an abutting surface (601) for abutting with the peripheral surface of the wafer (01).

7. The wafer surface processing apparatus according to claim 1, wherein The first base (11) has a mounting port and a negative pressure cavity in communication with each other, the mounting port is in communication with the top of the negative pressure cavity, the rotating table (12) has a communication hole, a negative pressure channel and a suction port in communication with each other, the bottom end of the rotating table (12) is rotatably arranged in the negative pressure cavity, the rotating table (12) is in sealing fit with the mounting port, the communication hole is in communication with the negative pressure cavity, the top surface of the rotating table (12) forms the bearing surface, and the suction port is arranged on the bearing surface.

8. The wafer surface processing apparatus according to claim 7, wherein The first base (11) has an avoiding port (111) and an avoiding cavity (112) in communication with each other, the avoiding port (111) is arranged at the top of the avoiding cavity (112), the cross-sectional area of the avoiding port (111) is greater than that of the wafer (01), and the rotating table (12) is located in the avoiding cavity (112); and the rotating table (12) is movably arranged on the first base (11) so that the bearing surface is located outside the first base (11) or in the avoiding cavity (112).

9. The wafer surface processing apparatus according to claim 1, wherein The wafer surface treatment device further comprises: A carrier (80) is arranged at the first station and / or the second station, and has a receiving space with a grabbing window (801) on one side. A plurality of partitions (81) are arranged in the receiving space, and are distributed along the extension direction of the grabbing window (801). One wafer (01) is placed between two adjacent partitions (81).

10. The wafer surface processing apparatus according to claim 1, wherein The grabbing mechanism (40) comprises: a fourth base (41); a lifting rod arranged on the fourth base (41) in a liftable manner; a plurality of mechanical arms (42), each of which extends in a horizontal direction, and are sequentially connected. The end portions of two adjacent mechanical arms (42) are rotationally connected to each other, and the rotation axes of the two adjacent mechanical arms (42) extend in a vertical direction. The mechanical arm (42) at one end portion is rotationally arranged on the lifting rod, and the mechanical arm (42) at the other end portion is used for grabbing the wafer (01).

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