Thinning equipment platform deck structure with RFID function

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a thinning equipment carrying platform structure with an RFID (Radio Frequency Identification Device) function, which comprises a carrying platform provided with a wafer box; the end face of the carrying table is provided with a containing position, and an RFID reader is connected into the containing position through a clamping assembly. The end face of the carrying table is further provided with a wire bunching structure, and the wire bunching structure is used for guiding and restraining a connecting wire of the RFID reader. According to the utility model, the RFID reader is integrated on the carrying platform, and the label containing the information is arranged at the bottom of each wafer box, so that when the wafer boxes are transferred to the carrying platform, the information of the labels can be read through the RFID reader to obtain the information of the wafers in the current wafer boxes, thereby avoiding product station errors and processing program errors, and improving the production efficiency. The controller of the RFID reader is connected with the system, so that the position and processing information of a product can be tracked in real time, and a correct production instruction can be conveniently made to the thinning equipment.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor processing equipment technical field especially, relates to a kind of thinning equipment loading platform structure with RFID function. BACKGROUND

[0002] In the semiconductor production process, thinning equipment is a key link, for the accurate thickness treatment to wafer. At present, the front-end configuration of thinning equipment usually includes a loading platform, for placing wafer box to feed. Wafer box loading on loading platform can refer to the wafer box conveying loading equipment and conveying loading method disclosed in prior art Chinese patent publication number "CN115621178A".

[0003] However, the existing thinning equipment loading platform generally lacks radio frequency identification (RFID) function, in semiconductor manufacturing, wafer box information management is crucial, because it contains wafer identity information and processing state, lack of RFID function means that thinning equipment cannot read and verify information on wafer box when wafer box is connected therewith, which can cause product site error, and further cause processing program error, affect product quality and production efficiency.

[0004] Based on this, in order to realize the detection of wafer box by loading platform, we propose a kind of thinning equipment loading platform structure with RFID function. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the shortcomings in prior art, such as lack of RFID function means that thinning equipment cannot read and verify information on wafer box when wafer box is connected therewith, and proposes a kind of thinning equipment loading platform structure with RFID function.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A kind of thinning equipment loading platform structure with RFID function is designed, comprising:

[0008] Loading platform with wafer box mounted;

[0009] The end face of the loading platform has a containing position, and the RFID reader is connected in the containing position by clamping assembly;

[0010] The end face of the loading platform is further provided with a wire bundling structure, and the wire bundling structure is used for guiding and constraining the connecting line of the RFID reader;

[0011] Wherein the bottom of the wafer box is provided with a label, and the RFID reader is signal-connected with the label.

[0012] Further, the bottom of the RFID reader has several steps, a T-shaped column is detachably connected in the steps, and an inner retracted bayonet is formed between the bottom end of the T-shaped column and the steps.

[0013] Further, the clamping assembly comprises a sliding groove formed on the end face of the carrier, the sliding groove is in L-shaped structure, one end of the sliding groove is communicated into the accommodating position, and the other end penetrates to the upper side of the carrier.

[0014] The clamping piece is slidably connected in the sliding groove.

[0015] Further, the clamping piece comprises a sliding part and a clamping part, a bayonet is formed on the end face of the clamping part, and the bayonet is clamped and matched with the inner retracted bayonet.

[0016] The spring is fixedly connected between the sliding part and the inner wall of the sliding groove.

[0017] Further, a contact plate is movably connected to the inner side of the accommodating position, and the contact plate is located below the RFID reader.

[0018] The compression spring is fixedly connected between the contact plate and the bottom end of the accommodating position.

[0019] Further, the wire binding structure comprises a wire groove formed on the end face of the carrier, and the lead wire of the RFID reader extends to the outer side of the carrier along the wire groove.

[0020] Further, the wire groove cover is clamped on the upper end opening of the wire groove, and any cross section of the wire groove cover is in U-shaped structure.

[0021] Further, the top of the clamping assembly and the RFID reader is flush with the top of the carrier.

[0022] The thinning equipment carrier structure with the RFID function has the beneficial effects that in the utility model, an RFID reader is integrated on the carrier, a label containing information is installed at the bottom of each wafer box, when the wafer box is moved to the carrier, the information of the label can be read by the RFID reader to obtain the wafer information in the current wafer box, so that product site errors and processing program errors are avoided, the controller of the RFID reader is connected with the system to realize real-time tracking of the position and processing information of the product, and correct production instructions can be given to the thinning equipment. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a perspective view of the utility model;

[0024] Figure 2The label structure schematic view of the utility model;

[0025] Figure 3 The utility model discloses a bundle structure structure schematic view;

[0026] Figure 4 The RFID reader structure schematic view of the utility model;

[0027] Figure 5 The utility model discloses a contact plate structure schematic view.

[0028] In the drawing: 1, wafer box;11, label;2, table;21, containing site;22, contact plate;23, compression spring;3, clamping assembly;31, sliding groove;32, clamping piece;321, sliding part;322, clamping part;323, bayonet;324, spring;4, RFID reader;41, terrace part;42, T-shaped column;43, inner shrink bayonet;5, bundle structure;51, wiring slot;52, wire slot cover. Specific implementation

[0029] The technical scheme in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0030] Reference Figures 1-5 For an embodiment of the utility model, it discloses a thinning equipment table structure with RFID function, and specifically the table structure includes the table 2 of installing wafer box 1, and the wafer box 1 is used to place wafer, and in addition, the wafer box 1 and the table 2 are connected in detachable structure connection mode, such as through the cooperation mode of lock catch and lock slot, and are positioned with the positioning block, and its specific principle has been disclosed in prior art, and here is not too much elaboration.

[0031] The end face of the table 2 has a containing site 21, and the RFID reader 4 is connected in the containing site 21 through the clamping assembly 3;The end face of the table 2 is also provided with bundle structure 5, and the bundle structure 5 is used to guide and constrain the connecting line of the RFID reader 4, of course, the RFID reader 4 in the embodiment can be connected with the external controller through network cable, and can also be connected with power line to supply power, and the connecting line is guided and constrained through the bundle structure 5 to ensure the neatness of wiring;

[0032] The bottom of the wafer box 1 is provided with a label 11, and the RFID reader 4 is signal connected with the label 11, that is, the RFID reader 4 is arranged above the loading platform 2, and the label 11 with different information is arranged on the bottom of each wafer box 1, so that when the wafer box 1 is placed on the loading platform 2, the wafer information in the wafer box 1 can be quickly obtained by reading the label 11 through the RFID reader 4, and the information can include the size and quantity of the wafer, so that the product site error and the processing program error are avoided.

[0033] In some embodiments, the bottom of the RFID reader 4 has a plurality of stepped portions 41, and the T-shaped columns 42 are detachably connected to the stepped portions 41, wherein the bottom end of the T-shaped column 42 and the stepped portion 41 are formed with an inner shrinkage socket 43, and the stepped portion 41 is provided with four stepped portions 41, and the T-shaped column 42 is also provided with four T-shaped columns 42, and the T-shaped column 42 is provided with a bolt, which is threadedly connected with the stepped portion 41, and the inner shrinkage socket 43 is formed between the T-shaped column 42 and the stepped portion 41, so as to facilitate the connection and adaptation of the clamping assembly 3.

[0034] On the basis of the above-mentioned embodiments, the clamping assembly 3 comprises a sliding groove 31 formed in the end face of the loading platform 2, the sliding groove 31 is in an L-shaped structure, one end of the sliding groove 31 is communicated into the accommodating position 21, and the other end is penetrated to the upper side of the loading platform 2, wherein the part of the sliding groove 31 above the loading platform 2 is designed in a linear groove structure, so that the clamping piece 32 can be displaced by a small distance.

[0035] The clamping piece 32 is slidably connected in the sliding groove 31.

[0036] Specifically, the clamping piece 32 comprises a sliding portion 321 and a clamping portion 322, the sliding portion 321 and the clamping portion 322 form an L-shaped structure, a socket 323 is formed in the end face of the clamping portion 322, the socket 323 is adapted to be clamped with the inner shrinkage socket 43, and two sockets 323 are arranged on each clamping portion 322; wherein the spring 324 is fixedly connected between the sliding portion 321 and the inner wall of the sliding groove 31.

[0037] That is, when the RFID reader 4 is specifically connected, first, four T-shaped columns 42 are connected at the bottom of the RFID reader 4 to match the stepped portion 41 to form four inwardly recessed sockets 43, and then the RFID reader 4 is placed in the accommodation position 21, in the process, the two clamping members 32 on both sides are pushed outwardly to move, and after the RFID reader 4 is installed in place, the clamping members 32 are released, and under the pushing of the spring 324, the clamping members 32 are reset, and the sockets 323 at the clamping portions 322 are clamped at the inwardly recessed sockets 43, so that the up and down positioning of the RFID reader 4 is completed, and the stability of the installation of the RFID reader 4 is ensured.

[0038] Of course, when the RFID reader 4 needs to be disassembled, the clamping members 32 on both sides are only slid outwardly, and after the sockets 323 are separated from the inwardly recessed sockets 43, the RFID reader 4 can be taken out outwardly, which is simple and convenient to operate.

[0039] On the basis of the above embodiment, in order to improve the convenience of taking out the RFID reader 4 when disassembling the RFID reader 4, the resilient contact plate 22 is movably connected to the inner side of the accommodation position 21, and the resilient contact plate 22 is located below the RFID reader 4.

[0040] The resilient contact plate 22 and the bottom end of the accommodation position 21 are fixedly connected with the compression spring 23, that is, the resilient contact plate 22 is designed to be elastically floating, which is used to move downwardly and press the compression spring 23 when the RFID reader 4 is installed, and the RFID reader 4 is pushed outwardly by the counteracting force of the compression spring 23 when the RFID reader 4 is disassembled, so that the RFID reader 4 is conveniently taken out, and the convenience of maintenance and repair is improved.

[0041] In some embodiments, the wire harness structure 5 in the utility model includes a wire slot 51 opened on the end face of the table 2, and the wires of the RFID reader 4 extend to the outside of the table 2 along the wire slot 51, and specifically, the wire slot 51 in the embodiment has an L-shaped structure, one end of which extends to the outside of the table 2, and the other end penetrates and extends into the accommodation position 21.

[0042] In addition, in order to shield the wire slot 51 and protect the lines inside the wire slot 51, the upper end opening of the wire slot 51 is clamped with the wire slot cover 52, and any cross section of the wire slot cover 52 has a U-shaped structure.

[0043] It should be noted that the clamping assembly 3 and the top of the RFID reader 4 in the embodiment of the utility model are flush with the top of the table 2, and the upper flush design does not affect the installation of the wafer box 1, and the consistency of the overall appearance is ensured.

[0044] In conclusion, the utility model discloses a RFID reader 4 is integrated on the carrier 2, and the label 11 containing information is installed at the bottom of each wafer box 1, when the wafer box 1 is moved to the carrier 2, the information of the label 11 can be read by the RFID reader 4, so as to obtain the wafer information in the wafer box 1, so as to avoid the product site error, avoid the processing program error, the controller of the RFID reader 4 is connected with the system, the position and processing information of the product are tracked in real time, so as to make the correct production instruction to the thinning equipment.

[0045] The above is only the preferred embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art in the technical range disclosed by the utility model, according to the technical scheme and the utility model concept of the utility model, equivalent replacement or change are covered in the protection scope of the utility model.

Claims

1. A thinning equipment platform structure with RFID functionality, characterized in that, The application relates to a wafer box installation platform. The platform (2) is provided with a containing position (21) on the end face, and an RFID reader (4) is connected to the containing position (21) through a clamping assembly (3). The end face of the platform (2) is further provided with a wire bundling structure (5) for guiding and restraining the connecting wire of the RFID reader (4). The bottom of the wafer box (1) is provided with a label (11), and the RFID reader (4) is signal-connected with the label (11). The bottom of the RFID reader (4) is provided with a plurality of stepped portions (41), and a T-shaped column (42) is detachably connected to the stepped portions (41), and an inner retracted clamping opening (43) is formed between the bottom end of the T-shaped column (42) and the stepped portions (41).

2. The thinned device carrier structure with RFID functionality of claim 1, wherein: The clamping assembly (3) comprises a sliding groove (31) formed on the end face of the platform (2), the sliding groove (31) is in L-shaped structure, one end of the sliding groove (31) is communicated into the containing position (21), and the other end is penetrated to the upper side of the platform (2).

3. The thinned device carrier structure with RFID functionality of claim 2, wherein: The sliding groove (31) is slidably connected with a clamping piece (32). The clamping piece (32) comprises a sliding portion (321) and a clamping portion (322), a clamping opening (323) is formed on the end face of the clamping portion (322), the clamping opening (323) is clamped and matched with the inner retracted clamping opening (43), and the sliding portion (321) is fixedly connected with a spring (324) between the inner wall of the sliding groove (31).

4. The thinned device carrier structure with RFID functionality of claim 3, wherein: A contact plate (22) is movably connected to the inner side of the containing position (21), and the contact plate (22) is located below the RFID reader (4). The contact plate (22) is fixedly connected with a compression spring (23) between the bottom end of the containing position (21).

5. The thinned device carrier structure with RFID functionality of claim 1, wherein: The wire bundling structure (5) comprises a wire groove (51) formed on the end face of the platform (2), and the wire of the RFID reader (4) extends to the outer side of the platform (2) along the wire groove (51). The wire groove cover (52) is clamped on the upper end opening of the wire groove (51), and any cross section of the wire groove cover (52) is in U-shaped structure.

6. The thinned device carrier structure with RFID functionality of claim 1, wherein: The top of the clamping assembly (3) and the RFID reader (4) is flush with the top of the platform (2).

7. The thinned device carrier structure with RFID functionality of claim 6, wherein: ​ 8. The thinned device carrier structure having RFID functionality of any of claims 1-7, wherein: ​

Images