Wafer automatic centering device

Abstract

The utility model discloses a wafer automatic centering device, which comprises a carrying disc, a circle center detection part and a driving part, a wafer is flatly placed on the carrying disc, and the edge of the wafer protrudes out of the carrying disc; the circle center detection unit comprises a detector used for detecting the edge contour of the wafer and a processor used for determining the center position of the wafer according to the edge contour of the wafer; the driving part is used for driving the carrying disc and driving the wafer to adjust the center position of the wafer. According to the utility model, on one hand, the center position of the wafer is determined through wafer edge contour detection, and the center position of the wafer is adjusted through movement of the carrying disc, so that automatic centering of the wafer without external force is realized, the probability of deformation and damage of the wafer is greatly reduced, and the centering precision of the wafer is improved; on the other hand, the structure is simple and reliable and operation is convenient.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor, concretely relates to a wafer automatic centering device. BACKGROUND

[0002] The wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. After high-purity polysilicon is dissolved and added into a silicon crystal seed, a cylindrical monocrystalline silicon is formed by slowly pulling out. After the silicon rod is ground and polished, the silicon wafer is formed. Further, a conductive metal layer is plated on the wafer, and the conductive metal layer is processed to form a conductive circuit.

[0003] At present, the wafer grabbed by the mechanical hand needs to be centered when the next process step is performed, so that the wafer can be in the center position in the process, and the mechanical hand will not be offset when grabbing the wafer after plating or loading the wafer before plating. The existing Chinese patent with publication number CN107230657B discloses a wafer centering mechanism, which comprises a suction disc support and a suction disc mounted on the suction disc support. A clamping cylinder is arranged below the suction disc, and the output ends of the clamping cylinder on both sides are connected with centering blocks. A plurality of plunger spring centering assemblies are uniformly arranged on the centering blocks on both sides. The plunger spring centering assembly comprises a plunger cover plate, a spring plunger, a contact, a plunger mounting block and a contact gland. The plunger mounting block is mounted on the centering block, the spring plunger is accommodated in the plunger mounting block and is limited in the upward and downward directions by the plunger cover plate mounted on the plunger mounting block. The plunger cover plate is provided with a fixing device limiting the extension and retraction direction of the spring plunger. One side of the contact is accommodated in the plunger mounting block and abuts against the spring plunger, and the other side is located outside the plunger mounting block and contacts the wafer. A contact gland is arranged on the plunger mounting block above the contact and limits the upward and downward directions of the contact.

[0004] However, in actual use, the wafer needs to be centered by the pushing of the centering blocks on both sides. In this way, the wafer needs to bear the suction force of the bottom suction disc, the pushing force from the edge and the friction force generated during the relative movement with the suction disc, and the risk of deformation and damage of the wafer is high. SUMMARY

[0005] The technical problem to be solved by the utility model is to overcome the shortcomings of the prior art and provide an improved wafer automatic centering device.

[0006] To solve the above technical problems, the utility model adopts the following technical scheme:

[0007] The application discloses a wafer automatic centering device which comprises a carrier plate, a center detection component and a driving component, wherein the wafer is placed on the carrier plate and the edge of the wafer is arranged to project outwardly from the carrier plate; the center detection component comprises a detector for detecting the edge profile of the wafer and a processor for determining the center position of the wafer according to the edge profile of the wafer; and the driving component is used for driving the carrier plate and the wafer to adjust the center position of the wafer.

[0008] According to a specific embodiment and a preferred aspect of the application, the detector comprises a plurality of visual cameras which are arranged in a circumferential interval around the carrier plate, and the plurality of visual cameras synchronously detect the edge profile of the wafer.

[0009] Preferably, the plurality of visual cameras are arranged below the wafer, wherein each visual camera forms a detection port for acquiring the edge profile information of the wafer from the upper end.

[0010] Specifically, the plurality of detection ports are arranged in a flush manner.

[0011] Preferably, each visual camera is further provided with a shield which is arranged on the detection port, wherein the top of the shield is made of a transparent material, the side of the shield is made of a light-shielding material, and the top of the shield is arranged to extend outwardly and downwardly from the inner side.

[0012] According to another specific embodiment and a preferred aspect of the application, the wafer has a first radial direction and a second radial direction which are arranged to intersect each other; and the driving component comprises a first driver for driving the carrier plate to reciprocate along the first radial direction and a second driver for driving the carrier plate to reciprocate along the second radial direction.

[0013] Preferably, the first radial direction and the second radial direction are arranged to be perpendicular to each other.

[0014] According to another specific embodiment and a preferred aspect of the application, the driving component further comprises a third driver for driving the carrier plate to rotate around the center line of the carrier plate.

[0015] Preferably, the first driver comprises a first base, a second base slidingly connected to the first base along a first radial direction, a first power member driving the second base to reciprocate along the first radial direction, and the detector is fixed to the first base; the second driver comprises a third base slidingly connected to the second base along a second radial direction, and a second power member driving the third base to reciprocate along the second radial direction; the third driver comprises a rotating base vertically extending and rotatingly arranged on the third base, and a third power member fixedly arranged on the third base and used for driving the rotating base to rotate around a vertical center line, wherein an upper end of the rotating base is fixedly connected to a bottom of the carrier disc.

[0016] In addition, the carrier disc is provided with a plurality of vacuum adsorption holes arranged in a ring shape and spaced apart from each other, the wafer is placed flat and adsorbed on the carrier disc through the plurality of vacuum adsorption holes; a lifting channel is arranged in a middle portion of the carrier disc, and the centering device further comprises a lifting driving component, the lifting driving component comprising a lifting suction disc arranged in the lifting channel and a lifting power member driving the lifting suction disc to move up and down along the lifting channel; when the wafer is centered, the lifting suction disc is in the lifting channel; when the wafer is assembled, the lifting suction disc is adsorbed on a bottom surface of the wafer and moves upward to drive the wafer to be assembled onto the assembly carrier. Here, after the wafer is centered, the wafer can be directly assembled under the driving of the lifting driving component, without the need for a mechanical hand to transfer the wafer, thereby reducing errors.

[0017] Thanks to the above technical solutions, the present application has the following advantages compared with the prior art:

[0018] In the prior art, the wafer needs to be centered under the pushing of the two side centering blocks, so that the wafer needs to bear the adsorption force of the bottom surface suction disc, the pushing force from the edge, and the friction force generated in the relative movement with the suction disc, and the risk of deformation and damage of the wafer is high. The structure of the wafer automatic centering device is designed as a whole, and the deficiencies and defects of the prior art are ingeniously solved. After the centering device is adopted, the wafer is placed flat on the carrier disc, and the edge of the wafer is kept protruding outward from the carrier disc; then the edge profile of the wafer is detected by the detector, and the edge profile information of the wafer is obtained by the processor to calculate the center position of the wafer; finally, the carrier disc is driven by the driving component to adjust the center position of the wafer, thereby completing the automatic centering of the wafer. Therefore, compared with the prior art, on the one hand, the center position of the wafer is determined based on the edge profile detection, and the center position of the wafer is adjusted based on the movement of the carrier disc, so that the wafer is automatically centered without external force, the probability of deformation and damage of the wafer is greatly reduced, and the centering precision of the wafer is improved; on the other hand, the structure is simple, reliable, and easy to operate. BRIEF DESCRIPTION OF DRAWINGS

[0019] Fig. 1 FIG. 1 is a schematic view of a wafer automatic centering device according to the present application (first perspective view);

[0020] Fig. 2 It is the three-dimensional structure schematic view (first visual angle) of the wafer automatic centering device of the utility model;

[0021] Fig. 3 It is the main view schematic view of the wafer automatic centering device of the utility model;

[0022] Among them: 1, the carrier disc;t, the lifting channel;

[0023] 2, the center detection component;20, the detector;200, the vision camera;Z, the shield;

[0024] 3, the driving component;31, the first driver;311, the first base;312, the second base;32, the second driver;321, the third base;33, the third driver;331, the rotating seat;332, the third power element;

[0025] 4, the lifting driving component;40, the lifting suction cup;41, the lifting power element;

[0026] Y, the wafer. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0029] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0033] like Figs. 1 to 3 As shown, the automatic wafer alignment device of this embodiment includes a carrier disk 1, a center detection component 2, a driving component 3, and a lifting driving component 4.

[0034] Specifically, the carrier disk 1 is a horizontally arranged suction cup, wherein the carrier disk 1 has multiple vacuum adsorption holes distributed in a ring at intervals, the wafer Y is placed flat and adsorbed onto the carrier disk 1 through the multiple vacuum adsorption holes, and the edge of the wafer Y protrudes outward from the carrier disk 1.

[0035] In this example, the center detection component 2 includes a detector 20 for detecting the Y-edge contour of the wafer and a processor (not shown in the figure, but easy to imagine) for acquiring the Y-edge contour information of the wafer to calculate the center position of the wafer.

[0036] In some embodiments, the detector 20 comprises a plurality of visual cameras 200 circumferentially spaced around the carrier disc 1, and the plurality of visual cameras 200 synchronously detect the edge profile of the wafer Y. In this embodiment, three visual cameras 200 are provided; the processor adopts a conventional computer processing system, and the principle is to determine the center position of the wafer according to the arc-shaped profile of the wafer edge, so this will not be described in detail, and it is clear that it can be implemented.

[0037] For easy implementation, the plurality of visual cameras 200 are located below the wafer Y, wherein each visual camera 200 forms a detection port from the upper end for acquiring edge profile information of the wafer Y, and the plurality of detection ports are arranged in a flush manner; each visual camera 200 is further provided with a shield z arranged on the detection port, wherein the top of the shield z adopts a transparent material, the side adopts a light shielding material, and the top of the shield z extends from the inside edge to the outside and downwardly.

[0038] In this example, the driving component 3 is used to drive the carrier disc 1 and drive the wafer Y to adjust its center position.

[0039] In some embodiments, the wafer Y has a first radial direction and a second radial direction arranged perpendicularly; the driving component 3 comprises a first driver 31 driving the carrier disc 1 to reciprocate along the first radial direction, a second driver 32 driving the carrier disc 1 to reciprocate along the second radial direction, and a third driver 33 driving the carrier disc 1 to rotate around the center line direction of itself.

[0040] The first driver 31 comprises a first base 311, a second base 312 slidingly connected to the first base 311 along the first radial direction, a first power member driving the second base 312 to reciprocate along the first radial direction, and the detector 20 is fixed on the first base 311; the second driver 32 comprises a third base 321 slidingly connected to the second base 312 along the second radial direction, and a second power member driving the third base 321 to reciprocate along the second radial direction, wherein the first power member and the second power member both adopt a conventional air cylinder; the third driver 33 comprises a rotating seat 331 rotatingly arranged on the third base 321 and vertically extending, and a third power member 332 fixedly arranged on the third base 321 and driving the rotating seat 331 to rotate around the vertical center line, wherein the upper end of the rotating seat 331 is fixedly connected to the bottom of the carrier disc 1, and the third power member 332 adopts a belt drive. For easy implementation, the first base 311 forms an avoiding gap, the third base 321 is slidingly connected to the bottom of the second base 312, the third power member 332 is arranged on the bottom of the third base 321, and the second base 312 forms an avoiding gap, and the rotating seat 331 is connected to the third base 321 through the avoiding gap.

[0041] Further, the middle part of the carrier 1 is provided with a lifting channel t, and the lifting driving component 4 comprises a lifting suction cup 40 arranged in the lifting channel t and a lifting power 41 for driving the lifting suction cup 40 to move up and down along the lifting channel t.

[0042] In summary, after adopting the centering device, the wafer is placed flat on the carrier, and the edges of the wafer are kept protruding outward from the carrier; then the edge profile of the wafer is detected by the detector, and the edge profile information of the wafer is obtained by the processor to calculate the center position of the wafer; finally, the carrier is driven by the driving component to adjust the center position of the wafer, thereby completing the automatic centering of the wafer. Therefore, compared with the prior art, on the one hand, the center position of the wafer is determined by detecting the edge profile of the wafer, and the center position of the wafer is adjusted by the movement of the carrier, so that the wafer is automatically centered without external force, which greatly reduces the probability of wafer deformation and damage and improves the centering accuracy of the wafer; on the other hand, the structure is simple and reliable, and the operation is convenient; thirdly, the edge of the wafer is detected by multiple vision cameras, which enriches the detection data and improves the detection accuracy; fourthly, the movement of the carrier in the first radial direction and the second radial direction perpendicular to the wafer can quickly and accurately move to the centering position; fifthly, the carrier rotates around the center line thereof, and the edge of the wafer is simultaneously detected and calibrated; sixthly, after the wafer is centered, it can be directly assembled under the driving of the lifting driving component, without the need for a mechanical hand to transfer the wafer, thereby reducing errors.

[0043] The above has described the utility model in detail, the purpose is to let the person who is familiar with this field technology can understand the content of the utility model and implement, and cannot limit the protection scope of the utility model with this, all equivalent changes or modifications according to the spirit of the utility model should be covered in the protection scope of the utility model.

Claims

1. A wafer automatic centering device, characterized by comprising: The centering device comprises a carrier plate, a center detection component and a driving component, wherein the wafer is placed on the carrier plate and the edge of the wafer protrudes outwardly from the carrier plate; the center detection component comprises a detector for detecting the edge profile of the wafer and a processor for determining the center position of the wafer according to the edge profile of the wafer; the driving component is used to drive the carrier plate and adjust the center position of the wafer.

2. The wafer automatic centering device of claim 1, wherein The detector comprises a plurality of visual cameras which are circumferentially spaced around the carrier plate, and the plurality of visual cameras synchronously detect the edge profile of the wafer.

3. The wafer automatic centering device of claim 2, wherein The plurality of visual cameras are located below the wafer, wherein each of the visual cameras forms a detection port from the upper end for acquiring the edge profile information of the wafer.

4. The wafer automatic centering device of claim 3, wherein The plurality of detection ports are arranged in a flat manner.

5. The wafer automatic centering device of claim 3, wherein Each of the visual cameras is further provided with a shield which is arranged on the detection port, wherein the top of the shield is made of transparent material and the side of the shield is made of light shielding material, and the top of the shield extends outwardly and downwardly from the inner side.

6. The wafer automatic centering device of claim 1, wherein The wafer has a first radial direction and a second radial direction which are intersected; the driving component comprises a first driver for driving the carrier plate to reciprocate along the first radial direction and a second driver for driving the carrier plate to reciprocate along the second radial direction.

7. The wafer automatic centering device of claim 6, wherein The first radial direction and the second radial direction are arranged perpendicularly.

8. The wafer automatic centering device of claim 6, wherein The driving component further comprises a third driver for driving the carrier plate to rotate around the center line of the carrier plate.

9. The wafer automatic centering device of claim 8, wherein The first driver comprises a first base, a second base which is slidably connected to the first base along the first radial direction, and a first power member for driving the second base to reciprocate along the first radial direction, and the detector is fixed to the first base; the second driver comprises a third base which is slidably connected to the second base along the second radial direction, and a second power member for driving the third base to reciprocate along the second radial direction; the third driver comprises a rotating seat which is rotatably arranged on the third base and vertically extends, and a third power member which is fixed to the third base and is used to drive the rotating seat to rotate around the vertical center line, wherein the upper end of the rotating seat is fixedly connected to the bottom of the carrier plate.

10. The wafer automatic centering device of claim 1, wherein The carrier plate has a plurality of vacuum suction holes which are annularly spaced, the wafer is placed on the carrier plate and is suctioned by the plurality of vacuum suction holes; the middle part of the carrier plate is provided with a lifting channel, and the centering device further comprises a lifting driving component, the lifting driving component comprises a lifting suction cup which is arranged in the lifting channel and a lifting power member for driving the lifting suction cup to lift along the lifting channel, when the centering, the lifting suction cup is located in the lifting channel, and when the wafer is assembled, the lifting suction cup is suctioned to the bottom surface of the wafer and is lifted upwardly to drive the wafer to be assembled to the assembly carrier.

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