Packaging structure for preventing pressing damage of SOP (Small Outline Package) pin

Abstract

The utility model relates to the related technical field of electronic component packaging, in particular to a packaging structure for preventing an SOP pin from being crushed, which comprises a base, the upper surface of the base is fixedly connected with a fixing device chassis, the upper surface of the fixing device chassis is fixedly connected with a fixing groove, the upper surface of the fixing groove is fixedly connected with a limiting block, and the limiting block is fixedly connected with the upper surface of the fixing groove. And a pin crushing prevention mechanism is arranged on the surface of one side of the limiting block. According to the packaging structure capable of preventing the SOP pins from being crushed, through the arrangement of the pin crushing prevention mechanism, chips are grabbed and installed in a vacuum adsorption mode when the packaging structure is used, and the pins are effectively prevented from being damaged in the assembling process through the unique connection mode of the pins and the frame, so that the service life of the packaging structure is prolonged, and the service life of the packaging structure is prolonged. And the product reject ratio and the potential fault risk caused by pin damage are greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component packaging related technical field especially relates to a packaging structure of preventing SOP pin pressure injury. BACKGROUND

[0002] In the field of electronic component packaging, SOP packaging form is applied in various electronic products in large quantities because of its small shape and wide applicability, with the development of electronic equipment towards miniaturization, high performance and high reliability, the quality and stability requirement of SOP packaging component is also higher and higher, the traditional SOP packaging structure faces many problems in production, whether it is the operation of automatic equipment or manual installation, the pin can be damaged due to operation error, for example, the mechanical arm of automatic equipment has too large grabbing strength, or the pin is touched by tools by accident during manual installation, which can cause physical damage of the pin, thereby affecting the electrical performance of the electronic component and the normal operation of the entire electronic product, therefore, a packaging structure for preventing SOP pin pressure injury is particularly needed.

[0003] However, the existing packaging often uses the mechanical arm grabbing mode, however, the actual production environment is complex and changeable, the chip has manufacturing tolerance, the mechanical arm itself can have precision loss and working environment interference, etc., which can cause uneven and often excessive mechanical arm grabbing strength, once the grabbing strength exceeds the bearing limit of the SOP pin, pin damage such as pin bending, breaking or internal metal structure damage can be caused, which seriously affects the electrical performance of the electronic component, causes the entire electronic product to have operation failure, abnormal function and other problems, and hinders the improvement of product quality and production efficiency. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a packaging structure for preventing SOP pin pressure injury to solve the problem that the existing packaging often uses the mechanical arm grabbing mode, however, the actual production environment is complex and changeable, the chip has manufacturing tolerance, the mechanical arm itself can have precision loss and working environment interference, etc., which can cause uneven and often excessive mechanical arm grabbing strength, once the grabbing strength exceeds the bearing limit of the SOP pin, pin damage such as pin bending, breaking or internal metal structure damage can be caused, which seriously affects the electrical performance of the electronic component, causes the entire electronic product to have operation failure, abnormal function and other problems, and hinders the improvement of product quality and production efficiency.

[0005] In order to achieve the above object, the utility model provides the following technical scheme: A packaging structure of preventing SOP pin from being pressed, including base, the upper surface of base is fixedly connected with fixed device bottom disc, the upper surface of fixed device bottom disc is fixedly connected with fixed groove, the upper surface of fixed groove is fixedly connected with limiting block, the side surface of limiting block is provided with anti pin pressing mechanism, the upper surface of anti pin pressing mechanism is pasted with adsorption plate, the side surface of adsorption plate is equipped with main adsorption hole, the side surface of adsorption plate is equipped with secondary adsorption hole, the side surface of adsorption plate is fixedly connected with adsorption groove, the side surface of adsorption groove is fixedly connected with fixed block, the side surface of fixed block is fixedly connected with connecting air valve, the side surface of fixed block is fixedly connected with connecting column,

[0006] The anti pin pressing mechanism includes frame, fixed hole, foot hole, protective cover, guide groove, pin and chip, the side surface of fixed groove is clamped and is connected with frame, the side surface of frame is equipped with fixed hole, the side surface of frame is equipped with foot hole, the upper surface of foot hole is fixedly connected with protective cover, the inside surface of frame is equipped with guide groove, the upper surface of guide groove is slidably connected with pin, and the upper surface of pin is connected with chip.

[0007] Preferably, the fixed groove is symmetrically provided with four groups with the central axis of the fixed device bottom disc, and the limiting block is provided with two groups on the inside surface of the fixed groove.

[0008] Preferably, the fixed hole is provided with one group on each of the four surfaces of the frame, and each group is provided with two, and the foot hole is provided with one group on each of the four surfaces of the frame, and each group is provided with five.

[0009] Preferably, the protective cover is provided with one on the upper side of each foot hole, and the guide groove is provided with four groups on the inside of the frame, and each group is provided with five.

[0010] Preferably, the pin can be slidably displaced in the guide groove, and the outside dimension of the chip is consistent with the inside dimension of the guide groove.

[0011] Preferably, the main adsorption hole is provided on the central axis of the adsorption plate, the secondary adsorption hole is symmetrically provided with two groups on the adsorption plate with the main adsorption hole as the symmetric line.

[0012] Preferably, the connecting air valve is symmetrically provided with two groups on the outside surface of the fixed block, and each group is provided with two, and the adsorption plate is fixedly connected with the fixed block and the connecting column through the adsorption groove.

[0013] Compared with the prior art, the packaging structure for preventing SOP pin from being pressed has the advantages that when the packaging structure is used, the pins are connected in the frame and are in a contracted state, the bent part is hidden in the guide groove of the frame, and the chip is located above the frame, so that the whole structure is in an unassembled state and each component is ready, then the frame is precisely clamped with the fixing slots on the fixing device base through the fixing holes on the four surfaces of the frame, the two sets of limiting blocks in the fixing slots position and fix the frame, the frame is stably placed on the fixing device base, a solid foundation is provided for subsequent operation, then the connecting air valve is connected with the external air source, the adsorption plate generates suction force through the main adsorption hole and the secondary adsorption hole, when the adsorption plate approaches the chip, the chip is adsorbed and gradually moves downward, in this process, the chip is accurately dropped into the guide groove of the frame due to the adsorption force, and with the downward pressing of the chip, the bent part of the pin is straightened, the pin extends out of the foot hole along the guide groove, the chip and the frame are tightly combined, and the pin is in an extended state for normal work, the protection cover above each foot hole provides a protective barrier for the extended pin, no matter in the subsequent production process, such as mechanical arm operation and equipment vibration, or in the collision and extrusion in the transportation and assembly process, the protection cover can effectively reduce the direct impact of external factors on the pin, ensure the integrity of the pin and the stability of the electrical connection, and thus guarantee the normal operation and performance of the whole electronic component under various working conditions, and greatly reduce the product failure rate and potential failure risk caused by pin damage. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a side view structure schematic diagram of the utility model;

[0015] Figure 2 It is a base fixing structure schematic diagram of the utility model;

[0016] Figure 3 It is an adsorption device structure schematic diagram of the utility model;

[0017] Figure 4 It is a pin pressing prevention mechanism structure schematic diagram of the utility model; Figure 5 It is a structure schematic diagram of the utility model when the pin is pressed.

[0018] In the drawing: 1, base; 2, fixing device base; 3, fixing slot; 4, limiting block; 5, pin pressing prevention mechanism; 501, frame; 502, fixing hole; 503, foot hole; 504, protection cover; 505, guide groove; 506, pin; 507, chip; 6, adsorption plate; 7, main adsorption hole; 8, secondary adsorption hole; 9, adsorption groove; 10, fixing block; 11, connecting air valve; 12, connecting column. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the protection scope of the present application.

[0020] Please refer to Figures 1-5 The utility model provides a kind of technical scheme: a packaging structure for preventing SOP pin from being pressed, including base 1, the upper surface of base 1 is fixedly connected with fixed device bottom disc 2, the upper surface of fixed device bottom disc 2 is fixedly connected with fixed groove 3, the upper surface of fixed groove 3 is fixedly connected with limit block 4, the side surface of limit block 4 is provided with anti pin pressing mechanism 5, the upper surface of anti pin pressing mechanism 5 is attached with adsorption plate 6, the side surface of adsorption plate 6 is provided with main adsorption hole 7, the side surface of adsorption plate 6 is provided with secondary adsorption hole 8, the side surface of adsorption plate 6 is fixedly connected with adsorption groove 9, the side surface of adsorption groove 9 is fixedly connected with fixed block 10, the side surface of fixed block 10 is fixedly connected with connecting air valve 11, the side surface of fixed block 10 is fixedly connected with connecting column 12;

[0021] The anti-lead pin bruising mechanism 5 comprises a frame 501, a fixed hole 502, a foot hole 503, a protective cover 504, a guide groove 505, a lead 506 and a chip 507, one side surface of the fixed groove 3 is clamped and connected with the frame 501, one side surface of the frame 501 is provided with the fixed hole 502, one side surface of the frame 501 is provided with the foot hole 503, the upper surface of the foot hole 503 is fixedly connected with the protective cover 504, the inner side surface of the frame 501 is provided with the guide groove 505, the upper surface of the guide groove 505 is slidably connected with the lead 506, the upper surface of the lead 506 is connected with the chip 507, through the arrangement of the frame 501, the fixed hole 502, the foot hole 503, the protective cover 504, the guide groove 505, the lead 506 and the chip 507, in use, the lead 506 is connected in the frame 501, which is in a retracted state, the bent part is hidden in the guide groove 505 of the frame 501, and the chip 507 is located above the frame 501, at this time, the whole structure is in an unassembled state, and each component is ready, then the frame 501 is precisely clamped with the fixed groove 3 on the fixed device chassis 2 through the fixed holes 502 on the four surfaces thereof, the two sets of limiting blocks 4 in the fixed groove 3 play a positioning and fixing role on the frame 501, so that the frame 501 is stably placed on the fixed device chassis 2, and a solid foundation is provided for subsequent operation, then the air valve 11 is connected with the external air source, the suction plate 6 generates suction force through the main suction hole 7 and the secondary suction hole 8, when the suction plate 6 approaches the chip 507, the chip 507 is adsorbed and gradually moves downward, in this process, due to the action of the adsorption force, the chip 507 is accurately dropped into the guide groove 505 of the frame 501, and with the downward pressing of the chip 507, the bent part of the lead 506 is straightened, the lead 506 extends out of the foot hole 503 along the guide groove 505, so that the chip 507 and the frame 501 are combined closely, and the lead 506 is also in an extended state capable of normal work, the protective cover 504 above each foot hole 503 provides a protective barrier for the extended lead 506, whether in subsequent production processes, such as possible mechanical arm operation, equipment vibration and the like, or in the collision, extrusion and the like encountered in the transportation and assembly links, the protective cover 504 can effectively reduce the direct impact of external factors on the lead 506, ensure the integrity of the lead 506 and the stability of the electrical connection, and thus guarantee the normal operation and performance of the whole electronic component under various working conditions, greatly reducing the product failure rate and potential failure risk caused by the damage of the lead 506.

[0022] Further, the four sets of fixed grooves 3 are symmetrically arranged along the central axis of the fixing device base plate 2, and the two sets of limiting blocks 4 are arranged on the inner side surface of the fixed grooves 3. Through the arrangement of the fixed grooves 3, when in use, the two sets of fixed grooves 3 are symmetrically arranged along the central axis of the fixing device base plate 2, which can provide accurate installation position reference for the anti-pin crush mechanism. This symmetrical design allows the frame 501 to be quickly aligned with the fixed grooves 3 during installation, reducing the adjustment time during installation. Just like putting an object into a container with clear grooves, the symmetrical layout of the grooves makes it easier for the object to find the correct placement position, thereby improving the accuracy of installation. At the same time, the arrangement of the two sets of limiting blocks 4 on the inner side surface of the fixed grooves 3 can limit the frame 501 from multiple directions. When the frame 501 is installed in the fixed grooves 3, the limiting blocks 4 can prevent the frame 501 from shifting horizontally and keep it in the correct position, preventing it from moving due to slight external interference.

[0023] Further, each of the four surfaces of the frame 501 is provided with a set of fixed holes 502, and each set has two fixed holes 502. Each of the four surfaces of the frame 501 is also provided with a set of foot holes 503, and each set has five foot holes 503. Through the arrangement of the foot holes 503, when in use, this layout allows the pins 506 to be more evenly distributed after extending from the frame 501. The evenly distributed pins 506 can better connect with external circuits, and when subjected to external pressure, the pressure can be more evenly distributed on the entire frame 501, avoiding pressure concentration on a few pins 506, thereby reducing the risk of pin 506 being crushed.

[0024] Further, a protective cover 504 is provided above each foot hole 503, and four sets of guide grooves 505 are arranged on the inner side of the frame 501, with five guide grooves 505 in each set. Through the arrangement of the protective cover 504 and the guide grooves 505, when in use, the protective cover 504 provides direct and precise protection for the pins 506. During production, transportation, and assembly, external factors can easily damage the pins 506, thereby greatly reducing the risk of pin 506 damage.

[0025] Further, the pins 506 can slide in the guide grooves 505, and the outer size of the chip 507 matches the inner size of the guide grooves 505. Through the arrangement of the guide grooves 505, when in use, the guide grooves 505 can guide the pins 506 to slide in the correct direction, ensuring that the pins 506 accurately extend from the foot holes 503 and connect with external connection points, thereby improving production efficiency and product quality.

[0026] Further, the main adsorption hole 7 is arranged on the central axis of the adsorption plate 6, and the secondary adsorption hole 8 is symmetrically arranged on the adsorption plate 6 with the main adsorption hole 7 as the symmetric line, and there are two groups. Through the arrangement of the main adsorption hole 7 and the secondary adsorption hole 8, the adsorption force can be uniformly distributed on the surface of the chip 507 during use. When the adsorption operation is performed, the chip 507 can be subjected to relatively balanced suction force in each direction, so that the chip 507 can be more smoothly adsorbed below the adsorption plate 6, avoiding the inclination or displacement of the chip 507 due to uneven adsorption force, and ensuring the position accuracy of the chip 507 in the packaging process.

[0027] Further, the connecting air valve 11 is symmetrically arranged on the outer surface of the fixed block 10, and there are two groups, each group has two, the adsorption plate 6 is fixedly connected with the fixed block 10 and the connecting column 12 through the adsorption groove 9, and through the arrangement of the connecting air valve 11, in use, the connecting air valve 11 is symmetrically arranged on the outer surface of the fixed block 10, and there are two groups, each group has two, this symmetrical layout is helpful to uniformly control the adsorption force of the adsorption plate 6, and through the cooperative operation of these symmetrically distributed air valves during the adsorption process, it can be ensured that the adsorption force generated by each area of the adsorption plate 6 is more balanced, avoiding the inclination or adsorption of the chip due to uneven adsorption force. Loose situation, thereby improving the stability and reliability of adsorption.

[0028] Working principle: in use, the pin 506 is connected in the frame 501, which is in the retracted state, the bent part is hidden in the guide groove 505 of the frame 501, and the chip 507 is located above the frame 501, at this time the whole structure is in the unassembled state, and each part is ready, then the frame 501 is precisely clamped with the fixed slot 3 on the fixed device chassis 2 through the four surfaces of the fixed hole 502, the two sets of limiting blocks 4 in the fixed slot 3 play the role of positioning and fixing the frame 501, and the frame 501 is stably placed on the fixed device chassis 2, providing a solid foundation for subsequent operation, then the air valve 11 is connected with the external air source, the suction plate 6 generates suction force through the main suction hole 7 and the secondary suction hole 8, when the suction plate 6 is close to the chip 507, the chip 507 is adsorbed and gradually moves downward, in this process, due to the action of the adsorption force, the chip 507 is accurately dropped into the guide groove 505 of the frame 501, and with the downward pressing of the chip 507, the bent part of the pin 506 is straightened, the pin 506 is stretched out of the foot hole 503 along the guide groove 505, so that the chip 507 and the frame 501 are tightly combined, and the pin 506 is also in the stretched state that can normally work, the protective cover 504 located above each foot hole 503 provides a protective barrier for the stretched pin 506, whether in the subsequent production process, such as possible mechanical arm operation, equipment vibration, etc., or in the collision, extrusion and other situations encountered in the transportation and assembly links, the protective cover 504 can effectively reduce the direct impact of external factors on the pin 506, ensure the integrity of the pin 506 and the stability of the electrical connection, and thus protect the normal operation and performance of the whole electronic component under various working conditions, greatly reduce the product failure rate and potential failure risk caused by the damage of the pin 506.

[0029] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A packaging structure for preventing SOP pin from being pressed, comprising a base (1), characterized in that: The upper surface of the base (1) is fixedly connected with a fixing device base (2), the upper surface of the fixing device base (2) is fixedly connected with a fixing groove (3), the upper surface of the fixing groove (3) is fixedly connected with a limiting block (4), the side surface of the limiting block (4) is provided with a pin anti-pressing injury mechanism (5), the upper surface of the pin anti-pressing injury mechanism (5) is attached with an adsorption plate (6), the side surface of the adsorption plate (6) is provided with a main adsorption hole (7), the side surface of the adsorption plate (6) is provided with a secondary adsorption hole (8), the side surface of the adsorption plate (6) is fixedly connected with an adsorption groove (9), the side surface of the adsorption groove (9) is fixedly connected with a fixed block (10), the side surface of the fixed block (10) is fixedly connected with a connecting air valve (11), the side surface of the fixed block (10) is fixedly connected with a connecting column (12). The pin anti-pressing injury mechanism (5) comprises a frame (501), a fixing hole (502), a foot hole (503), a protective cover (504), a guide groove (505), a pin (506) and a chip (507), the side surface of the fixing groove (3) is clampedly connected with the frame (501), the side surface of the frame (501) is provided with the fixing hole (502), the side surface of the frame (501) is provided with the foot hole (503), the upper surface of the foot hole (503) is fixedly connected with the protective cover (504), the inner side surface of the frame (501) is provided with the guide groove (505), the upper surface of the guide groove (505) is slidably connected with the pin (506), and the upper surface of the pin (506) is connected with the chip (507).

2. The SOP pin pressure injury prevention packaging structure according to claim 1, wherein: The fixing groove (3) is symmetrically provided with four groups of the middle axis of the fixing device base (2), and the limiting block (4) is provided with two groups on the inner side surface of the fixing groove (3).

3. The SOP pin-pressing-preventing packaging structure according to claim 1, wherein: The fixing hole (502) is provided with one group on each surface of the frame (501), and each group is provided with two, and the foot hole (503) is provided with one group on each surface of the frame (501), and each group is provided with five.

4. The SOP pin-pressing-preventing packaging structure according to claim 1, wherein: The protective cover (504) is provided with one on the upper side of each foot hole (503), and the guide groove (505) is provided with four groups on the inner side of the frame (501), and each group is provided with five.

5. The SOP pin-pressing-preventing packaging structure according to claim 1, wherein: The pin (506) can be slidably displaced in the guide groove (505), and the outer size of the chip (507) is consistent with the inner size of the guide groove (505).

6. The SOP pin-pressing-preventing packaging structure according to claim 1, wherein: The main adsorption hole (7) is arranged on the middle axis of the adsorption plate (6), the secondary adsorption hole (8) is symmetrically arranged on the adsorption plate (6) with the main adsorption hole (7) as the symmetry line.

7. The SOP pin-pressing-preventing packaging structure according to claim 1, wherein: The connecting air valve (11) is symmetrically arranged on the outer side surface of the fixed block (10) and is provided with two groups, each group is provided with two, the adsorption plate (6) is fixedly connected with the fixed block (10) and the connecting column (12) through the adsorption groove (9).

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